KR102522727B1 - 밀봉용 수지 조성물 - Google Patents

밀봉용 수지 조성물 Download PDF

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Publication number
KR102522727B1
KR102522727B1 KR1020177030477A KR20177030477A KR102522727B1 KR 102522727 B1 KR102522727 B1 KR 102522727B1 KR 1020177030477 A KR1020177030477 A KR 1020177030477A KR 20177030477 A KR20177030477 A KR 20177030477A KR 102522727 B1 KR102522727 B1 KR 102522727B1
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KR
South Korea
Prior art keywords
resin
sealing
resin composition
modified
meth
Prior art date
Application number
KR1020177030477A
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English (en)
Korean (ko)
Other versions
KR20170132225A (ko
Inventor
마이 다카세
유키 야마모토
다츠야 홈마
사토시 나카지마
에이지 바바
사토루 오하시
Original Assignee
아지노모토 가부시키가이샤
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Publication of KR20170132225A publication Critical patent/KR20170132225A/ko
Application granted granted Critical
Publication of KR102522727B1 publication Critical patent/KR102522727B1/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/12Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869Acids or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/16Applications used for films
    • C08L2203/162Applications used for films sealable films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020177030477A 2015-03-27 2016-03-25 밀봉용 수지 조성물 KR102522727B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015066859 2015-03-27
JPJP-P-2015-066859 2015-03-27
PCT/JP2016/059664 WO2016158770A1 (ja) 2015-03-27 2016-03-25 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
KR20170132225A KR20170132225A (ko) 2017-12-01
KR102522727B1 true KR102522727B1 (ko) 2023-04-19

Family

ID=57005130

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177030477A KR102522727B1 (ko) 2015-03-27 2016-03-25 밀봉용 수지 조성물

Country Status (5)

Country Link
JP (1) JP6680295B2 (zh)
KR (1) KR102522727B1 (zh)
CN (1) CN107406639B (zh)
TW (1) TWI769977B (zh)
WO (1) WO2016158770A1 (zh)

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* Cited by examiner, † Cited by third party
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TWI716467B (zh) * 2015-09-30 2021-01-21 日商味之素股份有限公司 密封用樹脂組成物
JP6903992B2 (ja) * 2017-03-27 2021-07-14 味の素株式会社 封止用樹脂組成物および封止用シート
WO2018181664A1 (ja) * 2017-03-31 2018-10-04 味の素株式会社 封止用の組成物
JP7248572B2 (ja) * 2017-05-31 2023-03-29 リンテック株式会社 接着剤組成物、接着シート、及び封止体
WO2018221571A1 (ja) * 2017-05-31 2018-12-06 リンテック株式会社 接着シート、及び封止体
KR102483012B1 (ko) * 2017-05-31 2022-12-29 린텍 가부시키가이샤 접착제 조성물, 접착 시트, 및 봉지체
KR102468900B1 (ko) * 2017-05-31 2022-11-18 린텍 가부시키가이샤 시트상 접착제, 가스 배리어성 적층체, 및 봉지체
CN111727231B (zh) * 2018-02-16 2023-07-04 三井化学株式会社 图像显示装置密封材料及图像显示装置密封片
WO2019181336A1 (ja) * 2018-03-22 2019-09-26 東洋紡株式会社 水性分散体組成物
CN111868162A (zh) * 2018-03-30 2020-10-30 味之素株式会社 密封用组合物
US20220128735A1 (en) * 2019-02-21 2022-04-28 Panasonic Intellectual Property Management Co., Ltd. Optical-waveguide-clad composition, optical-waveguide-clad dry film, and optical waveguide
CN110286055A (zh) * 2019-07-26 2019-09-27 深圳飞世尔新材料股份有限公司 一种胶粘剂的透水率测试方法
TWI768742B (zh) * 2020-03-03 2022-06-21 韓商利諾士尖端材料有限公司 黏結膜、其黏結膜附著層疊體及其金屬箔層疊體
CN111423824B (zh) * 2020-06-15 2020-09-22 杭州福斯特应用材料股份有限公司 胶膜及包含其的电子器件
CN116438649A (zh) 2020-11-13 2023-07-14 味之素株式会社 密封用片材
CN117120535A (zh) 2021-04-15 2023-11-24 H.B.富乐公司 用于薄膜光伏模块中的处于膜形式的热熔融组合物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002173514A (ja) * 2000-09-29 2002-06-21 Nippon Paper Industries Co Ltd 変性ポリオレフィン樹脂と変性ポリオレフィン樹脂組成物及びその用途
JP2008248055A (ja) 2007-03-30 2008-10-16 Kaneka Corp シール材用組成物及びシール材
JP2011124458A (ja) 2009-12-14 2011-06-23 Kaneka Corp 太陽電池封止材料および太陽電池モジュール

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JP4473500B2 (ja) * 2002-11-15 2010-06-02 日本製紙ケミカル株式会社 バインダー樹脂組成物及びその用途
JP2005206779A (ja) * 2003-12-26 2005-08-04 Toyo Ink Mfg Co Ltd 粘着剤用複合樹脂組成物水性分散体及び粘着剤組成物
JP5003218B2 (ja) * 2007-03-14 2012-08-15 星光Pmc株式会社 変性ポリオレフィン樹脂の製造方法及び変性ポリオレフィン樹脂水性分散体組成物
CN102428138B (zh) * 2009-05-19 2014-03-26 法国阿科玛 封装剂组合物、其制造方法和用途
JP5628499B2 (ja) 2009-09-18 2014-11-19 日本水産株式会社 塩味増強剤を含有する低食塩醤油又は低食塩醤油調味料
JP2011102350A (ja) * 2009-11-11 2011-05-26 Kaneka Corp 変性ポリオレフィン樹脂組成物およびその製造方法
JP2011254022A (ja) * 2010-06-03 2011-12-15 Kaneka Corp 太陽電池封止材料およびこれを用いた太陽電池モジュール
JP5931415B2 (ja) 2011-11-24 2016-06-08 三菱重工業株式会社 微粉炭バーナ
WO2013108731A1 (ja) * 2012-01-16 2013-07-25 味の素株式会社 封止用樹脂組成物
JP2013221124A (ja) * 2012-04-18 2013-10-28 Tosoh Corp ポリアリーレンスルフィド樹脂組成物及びそれよりなる複合体
JP6408788B2 (ja) * 2013-05-07 2018-10-17 ユニチカ株式会社 環状ポリオレフィン材料用塗工剤及び積層体
WO2016152756A1 (ja) * 2015-03-20 2016-09-29 味の素株式会社 封止体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002173514A (ja) * 2000-09-29 2002-06-21 Nippon Paper Industries Co Ltd 変性ポリオレフィン樹脂と変性ポリオレフィン樹脂組成物及びその用途
JP2008248055A (ja) 2007-03-30 2008-10-16 Kaneka Corp シール材用組成物及びシール材
JP2011124458A (ja) 2009-12-14 2011-06-23 Kaneka Corp 太陽電池封止材料および太陽電池モジュール

Also Published As

Publication number Publication date
WO2016158770A1 (ja) 2016-10-06
JPWO2016158770A1 (ja) 2018-01-18
TWI769977B (zh) 2022-07-11
JP6680295B2 (ja) 2020-04-15
CN107406639B (zh) 2022-03-15
TW201708486A (zh) 2017-03-01
CN107406639A (zh) 2017-11-28
KR20170132225A (ko) 2017-12-01

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