JP6680295B2 - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物 Download PDFInfo
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- JP6680295B2 JP6680295B2 JP2017509913A JP2017509913A JP6680295B2 JP 6680295 B2 JP6680295 B2 JP 6680295B2 JP 2017509913 A JP2017509913 A JP 2017509913A JP 2017509913 A JP2017509913 A JP 2017509913A JP 6680295 B2 JP6680295 B2 JP 6680295B2
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- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
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- 229910052623 talc Inorganic materials 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- XMRSTLBCBDIKFI-UHFFFAOYSA-N tetradeca-1,13-diene Chemical compound C=CCCCCCCCCCCC=C XMRSTLBCBDIKFI-UHFFFAOYSA-N 0.000 description 1
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- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
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- XDKMXYYPKSWJNR-UHFFFAOYSA-N thiocyanic acid;triphenylphosphane Chemical compound SC#N.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 XDKMXYYPKSWJNR-UHFFFAOYSA-N 0.000 description 1
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- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
- C08L2203/162—Applications used for films sealable films
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015066859 | 2015-03-27 | ||
| JP2015066859 | 2015-03-27 | ||
| PCT/JP2016/059664 WO2016158770A1 (ja) | 2015-03-27 | 2016-03-25 | 封止用樹脂組成物 |
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| Publication Number | Publication Date |
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| JPWO2016158770A1 JPWO2016158770A1 (ja) | 2018-01-18 |
| JP6680295B2 true JP6680295B2 (ja) | 2020-04-15 |
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| JP (1) | JP6680295B2 (zh) |
| KR (1) | KR102522727B1 (zh) |
| CN (1) | CN107406639B (zh) |
| TW (1) | TWI769977B (zh) |
| WO (1) | WO2016158770A1 (zh) |
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| JP6683204B2 (ja) * | 2015-09-30 | 2020-04-15 | 味の素株式会社 | 封止用樹脂組成物 |
| JP6903992B2 (ja) * | 2017-03-27 | 2021-07-14 | 味の素株式会社 | 封止用樹脂組成物および封止用シート |
| WO2018181664A1 (ja) * | 2017-03-31 | 2018-10-04 | 味の素株式会社 | 封止用の組成物 |
| JP6590451B2 (ja) * | 2017-05-31 | 2019-10-16 | リンテック株式会社 | シート状接着剤、ガスバリア性積層体、及び封止体 |
| KR102469843B1 (ko) * | 2017-05-31 | 2022-11-22 | 린텍 가부시키가이샤 | 접착 시트, 및 봉지체 |
| KR102487141B1 (ko) * | 2017-05-31 | 2023-01-10 | 린텍 가부시키가이샤 | 접착제 조성물, 접착 시트, 및 봉지체 |
| TWI794234B (zh) * | 2017-05-31 | 2023-03-01 | 日商琳得科股份有限公司 | 黏著劑組合物、黏著薄片及密封體 |
| KR20200081457A (ko) * | 2018-02-16 | 2020-07-07 | 미쯔이가가꾸가부시끼가이샤 | 화상 표시 장치 밀봉재 및 화상 표시 장치 밀봉 시트 |
| WO2019181336A1 (ja) * | 2018-03-22 | 2019-09-26 | 東洋紡株式会社 | 水性分散体組成物 |
| CN111868162A (zh) * | 2018-03-30 | 2020-10-30 | 味之素株式会社 | 密封用组合物 |
| KR20200070140A (ko) * | 2018-12-07 | 2020-06-17 | 주식회사 엘지화학 | 봉지 조성물 |
| US20220128735A1 (en) * | 2019-02-21 | 2022-04-28 | Panasonic Intellectual Property Management Co., Ltd. | Optical-waveguide-clad composition, optical-waveguide-clad dry film, and optical waveguide |
| CN110286055A (zh) * | 2019-07-26 | 2019-09-27 | 深圳飞世尔新材料股份有限公司 | 一种胶粘剂的透水率测试方法 |
| CN113355032B (zh) * | 2020-03-03 | 2023-02-28 | 利诺士尖端材料有限公司 | 粘结膜、包括其的粘结膜附着层叠体及金属箔层叠体 |
| CN111423824B (zh) * | 2020-06-15 | 2020-09-22 | 杭州福斯特应用材料股份有限公司 | 胶膜及包含其的电子器件 |
| KR20230104692A (ko) | 2020-11-13 | 2023-07-10 | 아지노모토 가부시키가이샤 | 밀봉용 시트 |
| EP4323447A1 (en) | 2021-04-15 | 2024-02-21 | H.B. Fuller Company | Hot melt composition in the form of a film for use in thin film photovoltaic modules |
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| JP4441151B2 (ja) * | 2000-09-29 | 2010-03-31 | 日本製紙株式会社 | 変性ポリオレフィン樹脂と変性ポリオレフィン樹脂組成物及びその用途 |
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| TWI738641B (zh) * | 2015-03-20 | 2021-09-11 | 日商味之素股份有限公司 | 封裝體之製造方法 |
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| CN107406639B (zh) | 2022-03-15 |
| JPWO2016158770A1 (ja) | 2018-01-18 |
| CN107406639A (zh) | 2017-11-28 |
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