TW201208169A - Film - Google Patents

Abstract

Disclosed is a film which comprises a supporting body, a protective resin composition layer, and a moisture-absorbing resin composition layer. This configuration enables the film to have sufficient moisture permeation resistance and damage resistance for an element (namely, a function of preventing damage to an element) at the same time. The film is particularly suitable for the sealing of an organic EL element, and not only damage to the organic EL element during the sealing operation but also thermal deterioration of the organic EL element can be sufficiently suppressed by using the film. As a result, an organic EL element device having high reliability can be obtained.

Description

201208169 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a specific film and an organic EL element device using the film. [Prior Art] An organic EL (Electroluminescence) element is a light-emitting material using an organic material, and can emit high-intensity light at a low voltage, and has attracted attention in recent years. However, the organic EL element is extremely weak in moisture, and the organic material itself is deteriorated by moisture, and the brightness is lowered or does not emit light, or the interface between the electrode and the organic EL layer is peeled off due to the influence of moisture, and the metal oxidation becomes a problem of high resistance. On the other hand, Patent Document 1 proposes to form an organic EL layer on a glass substrate, and then laminate the hardened resin layer to cover the entire organic EL layer, and then bond the non-permeable glass substrate. However, since the acrylic resin-based ultraviolet curable resin composition is used, the problem of deterioration of the organic EL element due to ultraviolet rays or the inability of ultraviolet rays to reach is caused, and an unhardened portion is generated, and a highly reliable closed structure is hardly obtained. Further, Patent Document 2 proposes to completely seal the thermosetting type curable resin composition of the organic EL element. However, the moisture permeability of the resulting cured layer is still insufficient. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. 2006-70221. Problem to be Solved by the Invention An object of the present invention is to provide a film which is excellent in moisture permeability resistance and damage resistance of a device, which is advantageous in forming a highly reliable sealing structure. [Means for Solving the Problem] The inventors of the present invention have found that the above problems can be solved by a film having a support, a protective resin composition layer, and a moisture-absorbing resin composition layer, and the present invention has been completed. In other words, the present invention contains the following aspects. (1) A film characterized by having a support, a protective resin composition layer, and a moisture-absorbing resin composition layer. (2) The film according to (1) above, wherein the moisture-absorbing resin composition layer contains a hygroscopic metal oxide. (3) The film according to the above item (1) or (2), wherein the moisture absorbing resin composition layer contains an inorganic chelating agent (but not including a hygroscopic metal oxide). (4) The film according to any one of the above (1) to (3) wherein the protective resin composition layer contains an inorganic chelating agent (but not including a hygroscopic metal oxide). (5) The film according to any one of the above items (1) to (4), which is set at a lamination temperature of -6 to 201208169 (the composition of the moisture absorbing resin composition layer and the protective resin at a lamination temperature in the range of TC) The difference in the melt viscosity of the layer (the melt viscosity of the moisture-absorbing resin composition layer - the melt viscosity of the protective resin composition layer) is 3 OOpoise~1〇〇〇〇〇p〇ise 〇(6) - an organic EL device' It is characterized by having a film according to any one of the above items (!) to (5). [Effect of the Invention] A film having a support, a protective resin composition layer, and a moisture-absorbing resin composition layer can be provided. A film having sufficient moisture permeability resistance and resistance to damage of components (that is, a function of preventing damage to components). [Mode for Carrying Out the Invention] The film of the present invention has a support, a moisture-absorbing resin composition layer, and a protective resin. [Support] The support system used in the present invention is a "substance supporting the protective resin composition layer or the moisture-absorbing resin composition layer", and is not particularly limited as long as the function can be exhibited. The support system is classified into a peeling system. Support and closed line support. The peeling support system refers to a peelable support (that is, a support which can be peeled off (separated) from the film of the present invention at the time of production of various devices) at the time of production of various devices. Specific examples of the release support are poly Ethylene, 201208169 Polyolefins such as polypropylene and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as "ΓρΕΤ"), polyethylene naphthalate (hereinafter sometimes abbreviated as r PEN) a film composed of a plastic such as polyester or polycarbonate, such as polyimine. From the viewpoint of cost, a polyethylene terephthalate film or a polyethylene naphthalate film is preferable. More preferably, it is polyethylene terephthalate. The thickness of the peeling support is not limited, and from the viewpoint of the usability of the film of the present invention, the upper limit of the thickness of the support is preferably 150 μm or less, more preferably In addition, the lower limit of the thickness is preferably ΙΟμηη or more 'more preferably 4 〇μηι or more, more preferably 7 from the viewpoint of the usability of the film of the present invention, moisture resistance, and the like. 〇μπι The release-off support is preferably a release-release treatment in advance, and a release agent used for the release treatment is exemplified by a fluorine-based release agent, a polyoxymethylene-based release agent, and an alkyd-based release agent. The release agent may be used alone or in combination of two or more. The surface of the release support may be subjected to matting treatment, corona treatment, or the like, and the surface of the treatment may be subjected to a release treatment. A support system refers to a support having a moisture-proof property that can be directly used as part of various devices (i.e., for the manufacture of various devices, and finally incorporated into the device to be fabricated). In the closed structure of various devices, the support system is used as a sealing material disposed on the outermost layer of the substrate formed by the element formed on the surface of the element (semiconductor element, LED element, organic EL element, etc.). The support includes, for example, a metal foil, a laminated film in which at least one side of a plastic film is laminated with a metal foil or an inorganic deposited film. The metal foil is, for example, a copper foil or an aluminum foil. -8 - 201208169 The inorganic vapor deposited film is, for example, a vapor deposited film of silica, tantalum nitride or SiCN 'amorphous sand. As the support, a commercially available plastic film having moisture resistance, for example, a techbarrier HX, AX, LX, L series (manufactured by Mitsubishi Plastics Co., Ltd.) or X-BARRIER (manufactured by Mitsubishi Plastics Co., Ltd.) having a moisture-proof effect can be used. Further, from the viewpoint of imparting rigidity, a glass plate 'metal plate or the like can be used. When an organic EL device is produced by using the film of the present invention using a closed support, the light-emitting surface of the organic EL device produced is a surface opposite to the surface of the organic EL element on which the element-forming substrate is formed. When the closed-type support is a metal foil or a laminated film in which at least one side of a plastic film is laminated with an inorganic vapor-deposited film or a metal foil, the thickness of the support is not particularly limited, and from the viewpoint of the usability of the film of the present invention, The upper limit of the thickness of the support is preferably 150 μm or less, more preferably 120 μm or less, and even more preferably 90 μm or less. In addition, the lower limit of the thickness is preferably 1 Ομηι or more, more preferably 40 μm or more, and still more preferably 70 μm or more from the viewpoints of the usability of the film of the present invention, moisture resistance and the like. The upper limit of the thickness of the support when the glass substrate or the metal plate is used for the closed-type support is preferably 5 mm or less, more preferably 1 mm or less, and even more preferably 1 from the viewpoint of making the organic EL device itself light and thin. 0 0 μ m or less. In addition, the lower limit of the thickness of the support is preferably 5 μm or more, more preferably ΙΟμηη or more, and even more preferably 20 μm or more from the viewpoint of preventing moisture permeation and the rigidity of the organic EL device. A laminated film in which at least one side of a plastic film is laminated with a metal foil is a coating head which can coat a film such as a gravure coater, and an adhesive is applied onto a plastic film such as a PET film, and the adhesive is used. Gold-coated 9-201208169, such as coated aluminum, is a foil. The thickness of the metal foil is preferably 5 μm or more from the viewpoints of lamination property, moisture permeability resistance, etc., and is preferably 125 μm or less from the viewpoint of usability. The total thickness of the laminated film of the three-layer structure is preferably in the range of 10 μπι to 150 μηι. [Moisture-absorbing resin composition layer] The moisture-absorbing resin composition layer used in the film of the present invention is composed of a thermosetting resin composition containing a thermosetting resin, a curing agent, and a hygroscopic metal oxide. And has moisture permeability. Thereby, in the closed structure of the intended device (organic EL device or the like), the moisture intrusion element (organic EL element or the like) can be blocked. (thermosetting resin and curing agent) The thermosetting resin and the curing agent are not particularly limited, and specific examples thereof include an epoxy resin, a cyanate resin, a phenol resin, a bismaleimide-triazine resin, and a polyfluorene. Various thermosetting resins such as an imide resin, an acrylic resin, and a vinyl styrene resin, and a curing agent thereof. In particular, from the viewpoints of low-temperature curability and adhesion of a cured product, etc., it is preferred that the epoxy resin and the curing agent 〇 epoxy resin have an epoxy group having two or more molecules per molecule. For example, there are bisphenol oxime type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F type epoxy resin, phosphorus containing Epoxy resin, bisphenol s type epoxy resin, aromatic glycidyl amine type epoxy resin (specifically, there are four shrinkage water - 201208169 glyceryl diaminodiphenylmethane, triglycidyl-p - Aminophenol, diglycidyltoluidine, diglycidylaniline, etc.), alicyclic epoxy resin, aliphatic lock epoxy resin, novolac epoxy resin, methylphenolic epoxy resin, double Phenol A phenolic epoxy resin, epoxy resin having butadiene structure, phenol aralkyl epoxy resin, epoxy resin having dicyclopentadiene structure, diglycidyl ether of bisphenol, naphthalene Diglycidyl ether of diol, glycidyl ether of phenol a glycidyl etherate of a compound and an alcohol, and an alkyl substituent, a halide, a hydride, and the like of the epoxy resin. These can be used in combination of two or more kinds. Among these, from the viewpoints of high heat resistance and low moisture permeability of the resin composition, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, and biphenyl are preferable. An aralkyl type epoxy resin, a phenol aralkyl type epoxy resin, an aromatic glycidyl amine type epoxy resin, an epoxy resin having a dicyclopentadiene structure, or the like. The epoxy resin may be in a liquid or solid shape, or both liquid and solid shapes may be used. "Liquid" and "solid shape" refer to the state of the epoxy resin under 251. From the viewpoints of coating, workability, adhesion, and the like, it is preferred that 1% by weight or more of the entire epoxy resin used is liquid. The epoxy resin is preferably in the range of from 1 to 1000 in terms of reactivity, and more preferably in the range of from 120 to 1,000. The epoxy equivalent is the number of grams (g/eq) of a resin containing 1 gram equivalent of an epoxy group, and is measured according to the method specified in JIS K-7 2 3 6 . The epoxy resin hardener is not particularly limited as long as it has a function of curing the epoxy resin, and is thermally degraded from the element 11 - 201208169 (especially an organic EL element) during the hardening treatment of the resin composition. In view of the above, the hardening treatment of the resin composition is preferably 140 ° C or lower, more preferably 120 ° C or lower, and the curing agent is preferably cured in the temperature region with an epoxy resin. Specifically, a primary amine, a secondary amine, a tertiary amine hardener, a polyamine amide amine hardener, dicyandiamide, an organic acid bismuth or the like, and among them, an amine addition is preferred from the viewpoint of quick-curing property. Compounds (AJICUREPN-23, AJICUREMY-24, AJICUREPN-D, A JICUREM YD, AJICUREPN-H, A JICUREMY-H, AJICUREPN-3 1 , AJICUREPN-40, AJICUREPN-40J, etc. (ajinomoto-fine-techno )), organic acid diterpene (AJICUREVDH-J, AJICUREUDH, AJICURELDH, etc. (manufactured by ajinomoto-fine-techno)). These may be used alone or in combination of two or more. Further, it is particularly preferable to use an ionic liquid capable of curing an epoxy resin at a temperature of 1 40 ° C or lower, preferably 1 20 ° C or lower, that is, a temperature region of 140 ° C or lower, preferably 120 ° C or lower. A meltable salt having a hardening effect of an epoxy resin. The ionic liquid can be used to improve the moisture permeability of the cured product of the moisture absorbing resin composition layer. The ionic liquid is preferably used in a state in which the ionic liquid is uniformly dissolved in an epoxy resin. The cation constituting the ionic liquid, for example, an ammonium cation such as an imidazole key ion, a piperidine key ion, a pyrrolidine key ion, a pyrazole key ion, a sulfonium ion, a pyridinium ion or the like; a tetraalkyl scaly cation (specifically There are iron-based cations such as tetrabutyl sulfonium ions and tributylhexyl scaly ions; and lanthanoid cations such as triethylsulfonium ions. The anion constituting the ionic liquid is, for example, a fluoride ion of a fluoride ion, a chlorinated -12-201208169 ion, a bromide ion, or an iodide ion; an alkylsulfate anion such as a methanesulfonate ion; Methanesulfonate ion, hexafluorophosphonic acid ion, trifluorotris(pentafluoroethyl)phosphonate ion, bis(trifluoromethanesulfonyl)phosphonium ion, trifluoroacetate ion, tetrafluoroboric acid ion, etc. Fluorine compound anion; phenolic anion such as phenol ion, 2-methoxyphenol ion, 2,6-di-tert-butylphenol ion; acid amine group such as aspartate ion, glutamic acid ion or the like Acid ion; neutral amino acid ion such as glycine ion, alanine ion, phenylalanine ion; N-benzamide ionic acid ion, N-ethyl phenyl phenylalanine ion, N · acetamidine N-mercaptoamino acid ion represented by the following general formula (1) such as glucosamine ion; formic acid ion, acetic acid ion, citric acid ion, 2-pyrrolidone-5-carboxylic acid ion, α-lipoic acid ion , lactate ion, tartaric acid ion, hippuric acid ion, Ν-methyl horse urine Carboxylic acid ion, benzoic acid ion, etc. Anion.化人

0丫ΝΗ R (1) (wherein R-CO- is a thiol group derived from a linear or branched fatty acid having a carbon number of 1 to 5 or a substituted or unsubstituted benzamidine group, -nh-chx- Co2·aspartic acid's acid amino acid ion such as glutamic acid or neutral amino acid ion such as glycine acid, alanine acid or phenylalanine acid.) The above-mentioned 'cation is preferably ammonium-based The cation and the money cation are more preferably an imidazolium ion or a cerium ion. More closely, the imidazole key ion has 丨_ethyl-3 _ -13- 201208169 methyl imidazole key ion, 1-butyl-3-methylimidazole key ion, 1-propyl-3-methylimidazole key ion and the like. The anion is preferably a phenol anion, an N-decylamino acid ion represented by the general formula (1) or a carboxylic acid anion, more preferably an N-decylamino acid ion or a carboxylic acid anion. A specific example of the phenolic anion is 2,6-di-tert-butylphenol ion. Further, specific examples of the carboxylic acid anion include acetate ion, citric acid ion, 2-pyrrolidone-5-carboxylic acid ion, formate ion, α-lipoic acid ion, lactate ion, tartaric acid ion, hippuric acid ion, Ν-methyl group The horse uric acid ion or the like is more preferably an acetate ion, a 2-pyrrolidone-5-carboxylic acid ion, a formic acid ion, a lactate ion, a tartaric acid ion, a hippuric acid ion, or a quinone-methyl hippuric acid ion. Further, specific examples of the fluorenyl-mercaptoamino acid ion represented by the general formula (1) include hydrazine-benzylidene propylamine ion, hydrazine-ethyl phenyl phenylalanine ion, aspartate ion, and glycine An acid ion, a ruthenium-ethionylglycine ion, or the like, preferably an oxime-benzylidene propylamine ion, a ruthenium-ethenyl phenylalanine ion, a ruthenium-ethionylglycine ion, and more Jia is a Ν-acetylglycolate ion. The specific ionic liquid is preferably 1-butyl-3-methylimidazolium lactate, tetrabutylscale-2-pyrrolidone-5-carboxylate, tetrabutylselenate, tetrabutylselenate , tetrabutyl sulphate trifluoroacetate, tetrabutyl iron α-lipoic acid salt, tetrabutyl sulphate sulphate, tetrabutyl sulphate, bis (tetrabutyl tartaric acid) salt, tetrabutyl sulphate Salt, Ν-methyl horse urate tetrabutyl sulphate, benzhydryl-DL-alanine tetrabutyl sulphate, Ν-acetyl phenylalanine tetrabutyl sulphate, 2,6-di- Tert-butyl phenol tetrabutyl sulfonium salt, L-aspartic acid monotetrabutyl sulfonium salt, tetrabutyl glutamate glutamate salt, N-acetyl glutamic acid tetrabutyl-14- 201208169 scale salt , 1-ethyl-3-methylimidazolium lactate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium formate, i-ethyl hippurate 3-methylimidazolium salt, N-methyluric acid 1-ethyl-3-methylimidazolium salt, bis(1-ethyl-3-methylimidazolium) tartaric acid, N-ethylidene base Amino acid 1-ethyl-3-methylimidazolium iron salt, more preferably N-acetyl glutamic acid tetrabutyl phosphonium salt, 1-ethyl-3-methylimidazole Key acetate, 1-ethyl-3-methylimidazolium formate, lipoic acid 1-ethyl-3-methylimidazolium, N-methyluric acid 1-ethyl-3-methylimidazole gun salt. The method for synthesizing the ionic liquid includes, for example, a precursor composed of a cation moiety such as an alkylimidazole, an alkylpyridyl, an alkylammonium or an alkylphosphonium ion and an anion containing a halogen, and NaBF4, NaPF6, CF3S03Na. Or an anion exchange method of a reaction such as LiN(S02CF3)2, an amine-based substance reacting with an acid ester, introducing an alkyl group, an organic acid residue being an anion ester method, and an amine being neutralized with an organic acid to obtain a salt. Neutralization method, etc., but is not limited to this. Anion and cation, the solvent in the obtained reaction liquid is distilled off by using an equal amount of anions and cations in a solvent neutralization system, or may be used as it is, or an organic solvent (methanol, toluene, ethyl acetate, Acetone, etc.) is concentrated in a liquid. The hardener is preferably used in an amount of not less than 1% by weight relative to the resin composition. 1~50% by weight, more preferably 〇. The range of 5 to 25% by weight, more preferably 1 to 15% by weight, more preferably 1. 5 to 10% by weight range. When the amount is less than this range, sufficient curability may not be obtained, and when it is more than 50% by weight, not only the storage stability of the resin composition is impaired, but also the moisture permeability and heat resistance of the cured product may be lowered. When the ionic liquid is used, from the viewpoint of the moisture permeability resistance of the cured product of the resin composition of -15 to 201208169, the nonvolatile content of the epoxy resin is 100% by weight, preferably 0. 1 to 1% by weight, more preferably 0. 5 to 8 wt%, more preferably 1 to 6 wt%, more preferably 1. 5 to 5 wt%. In the resin composition constituting the moisture-absorbing resin composition layer in the present invention, a curing accelerator may be further contained in order to adjust the curing temperature, the curing time, and the like. The hardening accelerator is, for example, a tetra-ammonium salt such as tetramethylammonium bromide or tetrabutylammonium bromide, a tetradecyl phosphonium salt such as tetraphenylsulfonium bromide or tetrabutylphosphonium bromide, or DBU (1,8). - diazabicyclo (5. 4. 0) undecene-7), DBN (1,5-diazabicyclo (4. 3. 0) decene-5), DBU-phenolate, DBU-octanoate, DBU-p-toluenesulfonate, DBU-formate, DBU-novolac resin salt, etc., diazabicyclo compound, 1-benzyl Imidazole compound such as benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-ethyl-4-methylimidazole, tris(dimethylaminomethyl)phenol, benzyl dimethyl A dimethyl urea compound such as a tertiary amine such as a base amine, an aromatic dimethyl urea, an aliphatic dimethyl urea or an aromatic dimethyl urea. The content of the hardening accelerator is 0. 01 to 7 wt% range. (Hygroscopic Metal Oxide) The term "hygroscopic metal oxide" as used in the present invention means a metal oxide which has the ability to absorb moisture and chemically reacts with moisture-absorbing water to form a hydroxide, as long as the cost is high. The object of the invention is not particularly limited, and specifically, for example, one selected from the group consisting of calcium oxide, magnesium oxide, cerium oxide, aluminum oxide, and cerium oxide, or two or more metal oxides selected from the above - 16- 201208169 Mixture or solid solution. Examples of a mixture or solid solution of two or more kinds of metal oxides include, in particular, calcined dolomite (mixture containing calcium oxide and magnesium oxide) and calcined hydrotalcite (solid solution of calcium oxide and aluminum oxide) Things). Such a hygroscopic metal oxide is known as a moisture absorbing material in various technical fields, and a commercially available product can be used. Specifically, for example, fired dolomite ("KT" manufactured by Yoshizawa Lime Co., Ltd.), calcium oxide ("moistop #10" manufactured by Sankyo Powder Co., Ltd.), and magnesium oxide (KYOWAMAG MF-1 5 manufactured by Kyowa Chemical Industry Co., Ltd.) 0", "Κ Υ Ο WAMAGMF - 3 0", "PUREMAG FNMG" manufactured by Tateho Chemical Industries Co., Ltd.), lightly burned magnesia ("#500", "#1〇〇〇", "# by tateho Chemical Industry Co., Ltd." 5000", etc.). The average particle diameter of the hygroscopic metal oxide is not particularly limited, but is preferably ΙΟμηι or less, more preferably 5 μηι or less, and more preferably Ιμηι or less. When such a minute size is used, not only the hardened layer of the moisture absorbing resin composition but also the high moisture permeability resistance can be imparted, and the adhesion can be improved. When the average particle diameter of the hygroscopic metal oxide is too small, the particles aggregate with each other, the sheet processing tends to be difficult, and the like, and therefore the average particle diameter of the hygroscopic metal oxide is preferably 0. 0 1 μηι or more, more preferably 〇.  1 μΐΏ or more. When the average particle diameter of the commercially available product of the hygroscopic metal oxide is 1 ΟμίΏ or less, it can be used as it is. However, when the average particle size of the commercially available product exceeds 1 Ομηι, the average particle diameter of pulverization and classification is 1 〇μπι or less. After the granules, it is preferably used. Here, the "average particle diameter" is an equal diameter of the particle size distribution when the particle size distribution of the measurement target (granular material) is prepared on a volume basis. Volume group -17- 201208169 The particle size distribution can be determined by laser diffraction and scattering method according to the Mie scattering theory. The laser diffraction type particle size distribution measuring device can be specifically made by Horiba Co., Ltd. LA-5 00. The measurement of the sample is preferably carried out by dispersing the hygroscopic metal oxide in water by ultrasonic waves. The hygroscopic metal oxide can be surface treated with a surface treating agent. By using such a surface-treated hygroscopic metal oxide, the storage stability of the resin composition constituting the moisture absorbing resin composition layer can be improved, and the moisture in the resin and the hygroscopic metal oxide can be prevented at the stage before the hardening. The surface treatment agent used for the surface treatment of the reaction oxime may specifically be a higher fatty acid, a alkyl decane, a decane coupling agent or the like, and among them, a higher fatty acid or a alkyl decane is preferable. The higher fatty acid is preferably a higher fatty acid having a carbon number of 18 or more, such as stearic acid, octadecanoic acid, myristic acid or palmitic acid, and more preferably stearic acid. These may be used alone or in combination of two or more. The alkyl decanes are, for example, methyltrimethoxydecane, ethyltrimethoxydecane, hexyltrimethoxydecane, octyltrimethoxydecane, decyltrimethoxydecane 'octadecyltrimethoxydecane, and Methyldimethoxydecane, octyltriethoxydecane, octadecyldimethyl(3-(trimethoxycarbinyl)propyl)ammonium chloride, and the like. These may be used alone or in combination of two or more. The decane coupling agent is specifically, for example, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-glycidyloxypropyl (dimethoxy) Epoxy decane coupling agent such as methyl decane and 2-(3,4-epoxy-18-201208169 cyclohexyl)ethyltrimethoxydecane: 3-hydrothiopropyltrimethoxydecane, 3 -Hexylthiopropyltriethoxydecane, 3.  Hydrogenthio-based decane coupling agent such as thiopropylpropyldimethoxydecane and 11-fluorenylundecyltrimethoxydecane; 3-aminopropyltrimethoxydecane, 3-amine Propyltriethoxydecane, 3-aminopropyldimethoxymethyltrimethoxydecane, N-methylaminoethyl)-3-aminopropyltrimethoxy-aminopropyl a styryl decane coupling agent of a vinyl decane coupling agent such as methoxyoxydecane or vinyltriethoxysilane such as methoxymethyl decyl propyl triethoxy decane; and 3-methyl group Propyleneoxypropyltriene coupling agent; 3-isocyanate propyl trioxane coupling agent, bis(triethoxymethyltriethoxymethyl methacrylate) four-agent; phenyltrimethoxy decane, methane, imidazolium , triazine decane, etc. are used. The known hygroscopic metal oxide is a known mixer which is sprayed with a surface treatment agent, specifically, a mixer such as a type 1 mixer, a mixer such as a ball mill, a decyl decane, or an N-phenyl group. 3-aminopropylpropyltrimethoxydecane, N-(2-aminodecane) and N-(2-aminoethyl)-3, etc., amine-based decane coupling agent; 3-ureido-based decane Mixture, vinyl trimethyl decane and vinyl methyl diethoxy fluorene; P-styryl trimethoxy decane and other acrylate decane methoxy groups such as 3-propenyloxypropyltrimethoxydecaneoxydecane Isocyanate-based decyl-propyl propyl disulfide such as decane or bismuth (sulfide-based decane-coupled propylene oxypropyltrimethoxy sulfonate such as sulfide. These may be used alone or in combination with two kinds of surfaces. Specifically, the treatment is carried out by mixing without using a mixer at normal temperature, and stirring for 5 to 60 minutes. The mixer can be, for example, a V mixer, a belt mixer, a Henshell mixer, and a cement mixer -19-201208169. Etc. Also, when the absorbent material is pulverized by a ball mill or the like, it can be mixed before a method for surface treatment of a higher fatty acid, an alkyl decane or a decane coupling agent. The amount of the surface treatment agent to be treated varies depending on the type of the hygroscopic metal oxide or the type of the surface treatment agent, and is relative to the hygroscopic metal. The oxide is preferably from 1 to 10% by weight. The upper limit of the content of the hygroscopic metal oxide in the resin composition is such that when the content of the hygroscopic metal oxide is too large, the viscosity of the resin composition increases. The viewpoint that the strength of the cured product is lowered and becomes brittle is preferably 40% by weight or less, more preferably 35% by weight or less, still more preferably 30% by weight or less, based on 100% by weight of the nonvolatile matter in the resin composition. It is preferably 25% by weight or less, and particularly preferably 20% by weight or less. The lower limit of the content of the hygroscopic metal oxide is relative to the resin composition from the viewpoint of sufficiently obtaining the effect of containing the hygroscopic metal oxide. The nonvolatile matter is preferably 100% by weight, preferably 1% by weight or more, more preferably 5% by weight or more, still more preferably 10% by weight or more. (Inorganic cerium filling material) Resin constituting the moisture absorbing resin composition layer composition Further, the inorganic ruthenium filler (but not the hygroscopic metal oxide) may be further contained, and the inorganic ruthenium filler may be used to improve the moisture permeability of the cured product of the resin composition and prevent the composition at the time of film formation. The small depression can improve the adhesion with the support or the sealing material. The inorganic cerium filling material is specifically, for example, cerium oxide, cerium sulfate, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, Aluminum borate, barium titanate, barium titanate 'calcium titanate, magnesium titanate, barium titanate, titanium oxide, barium zirconate, calcium calcium citrate, talc, clay, mica, boehmite, zeolite, -20- 201208169 Apatite, kaolin, mullite, spinel, olivine, sericite, etc. The inorganic cerium filler may be used alone or in combination of two or more. From the viewpoint of the fact that the inorganic cerium filling material is not easily transferred to the other layer during lamination, it is preferable that the particle form of the stone, clay, mica, and boehmite is a flat plate-shaped 塡', and the sputum in which the particle shape is a flat plate is used. The filler can further improve the moisture permeability of the hardened layer obtained by hardening the moisture-absorbing resin composition layer. The upper limit of the average particle diameter of the inorganic cerium filler is not easily transferred from the viewpoint of improving the dispersibility or the reduction of the mechanical strength or the lamination, and is preferably Ιμηι or less, more preferably 0. 8 μιη or less, more preferably 0 or less. The lower limit of the average particle diameter of the inorganic cerium filler is preferably 0_01 μπι or more, more preferably Ο, from the viewpoint of preventing a decrease in the dispersibility due to aggregation or preventing an increase in the viscosity of the resin composition. Ίμιη above, why?  3 μηι or more. The average particle diameter therein means the same meaning as the average particle diameter in the above-mentioned hygroscopic metal. The upper limit of the content of the inorganic cerium filling material in the resin composition is such that the viscosity of the resin composition increases when the content of the cerium filling material is too large, and the curing strength is lowered and becomes brittle, and the resin composition is not colored. The weight% is preferably 50% by weight or less, more preferably 40% by weight or more, more preferably 35% by weight or less, still more preferably 30% by weight or less. The lower limit of the content of the inorganic material is preferably from 1% or more, more preferably not more than 5% by weight, more preferably from 5% by weight or more, from the viewpoint of sufficiently obtaining the effect of the inorganic cerium material to the non-volatile content in the resin composition. Preferably it is 10% by weight or more. (Rubber particles), 澎 These are the sliding fillers, and the 6 μηι of the stopper layer is better. The oxidized inorganic matter is divided, the filling point, the weight of -21 - 201208169 constitutes the moisture absorbing resin composition layer. The resin composition may further contain rubber particles, and the rubber particles may increase the mechanical strength and stress relaxation of the cured product of the resin composition. The rubber particles are not dissolved in the organic solvent in the varnish of the resin composition, and are also incompatible with the components in the resin composition such as an epoxy resin, and are present in a dispersed state in the varnish of the resin composition. Better. In general, such rubber particles are obtained by increasing the molecular weight of the rubber component to such an extent that it is not dissolved in an organic solvent or a resin, and specifically, for example, a core-shell type rubber particle or a cross-linked acrylonitrile Ethylene rubber particles, crosslinked styrene butadiene rubber particles, acrylic rubber particles, and the like. The core-shell type rubber particle-based particles have rubber particles of a core layer and a shell layer, and specific examples thereof include a two-layer structure in which a shell layer of an outer layer is a glassy polymer, a core layer of an inner layer is a rubber-like polymer, or an outer layer. The shell layer is a glassy polymer, the intermediate layer is a rubbery polymer, and the core layer is a three-layer structure composed of a glassy polymer. Specifically, the glass layer is composed of a polymer of methyl methacrylate or the like, and the rubber-like polymer layer is specifically composed of a butyl acrylate polymer (butyl acrylate rubber) or the like. The upper limit of the average particle diameter of the primary particles of the rubber particles is preferably 2 μm or less from the viewpoint of maintaining the effect of stress relaxation or preventing damage to the element when the resin composition blocks the organic EL element. Further, the lower limit of the average particle diameter of the primary particles of the rubber particles is preferably from the viewpoint of preventing the viscosity from increasing when mixed with the resin and causing deterioration in usability. 〇 5 μηι or more. Specific examples of the core-shell type rubber particles include Staphyloid AC3 8 3 2, AC3816N (manufactured by GANZ Chemical Co., Ltd.), metablen KW-4426 (manufactured by Mitsubishi Rayon Co., Ltd.), and F351 (manufactured by Japan -22-201208169 ΖΕΟΝ). Examples of the acrylonitrile butadiene rubber (NBR) granules include XER-91 (manufactured by JSR Corporation). Specific examples of the styrene butadiene SBR particles include XSK-500 (manufactured by JSR Corporation). Specific examples of the rubber particles include metablen W300A and W450A (manufactured by the three companies). In the measurement of the average particle diameter of the rubber particles, the rubber particles are uniformly dispersed in an appropriate agent by ultrasonic wave or the like, and FPRA-1 000 (manufactured by Otsuka Electronics Co., Ltd.) is used to reproduce the rubber particles. The particle size distribution, which is the upper limit of the content of the average particle diameter 〇 rubber particles, and the non-volatile content of the absorbent resin composition is 1% by weight from the viewpoint of preventing the heat resistance and moisture permeability resistance of the moisture absorbing resin composition from being lowered. It is preferably 20% by weight or less, more preferably 5% by weight or less. The lower limit of the content of the rubber particles is not more than 100% by weight, preferably 0%, from the viewpoint of sufficiently obtaining the effect of the compound. 1% by weight or more. The rubber particles are dispersed in the state of the primary particles in the epoxy resin. The particle-dispersed epoxy resin is commercially available, and the epoxy resin is a rubber particle epoxy resin, and the resin composition may contain rubber particles. Specifically, the sub-dispersed epoxy resin is, for example, Japanese catalyst company BPA3 2 8" (rubber particles: acrylic core-shell resin, average particle diameter of rubber: 〇·3μηι, rubber particle content: 17% by weight, ring) : epoxide equivalent 185 bisphenol oxime type epoxy resin), kaneka MX120" (rubber particles: SBR resin, rubber particles of flat rubber) (acrylic acid rhodium. Specific organic solvent basis to determine the resistance of the layer In the layer of the rubber, the rubber particles are dispersed in rubber particles of 10 weights of rubber particles, and the rubber particles are made of oxygen resin. The average particle size is -23-201208169:0. 1 μηι, rubber particle content: 25% by weight, epoxy resin: ring 185 bisphenol A type epoxy resin) and the like. (Thermoplastic resin) The resin composition constituting the moisture absorbing resin composition layer may further contain a plastic resin. By containing a thermoplastic resin, flexibility can be imparted to the resin resin composition, and the workability in coating the resin composition can be imparted. Specific examples of the thermoplastic resin include a phenoxy resin alkenyl acetal resin, a polyimide resin, a polyamide amide resin, a maple resin, and a polyfluorene resin. These thermoplastic resins can be used singly or in combination of two or more. The thermoplastic resin preferably has a weight average molecular weight of preferably 10,000 or more from the viewpoint of imparting flexibility and preventing dents. However, when the weight average molecular weight is too large, the compatibility with the fat tends to decrease, and therefore the weight average molecular weight is 1,000,000 or less, and more preferably 800,000 or less. The "weight average molecular weight of the thermoplastic resin" is measured by a gel permeation chromatography (GPC) method (in terms of polystyrene). Specifically, the weight average molecular weight is, for example, LC-9A/RID-6A manufactured by Shimadzu Corporation, K-800P/K-804L/K-804L manufactured by Showa Denko Co., Ltd., and chloroform or the like in the mobile phase. The measurement was carried out at 40 ° C using a calibration curve of standard polystyrene. In the above-mentioned examples, the thermoplastic resin is particularly preferably a phenoxyphenoxy resin having good compatibility with an "epoxy resin" and having less influence on the adhesion and moisture resistance of the cured product of the resin. good. The oxygen equivalent is a hard acid, a polyethylene, a polyether or a mixed coating, and the epoxy resin is preferably a S h 〇 d e X column temperature resin by a coagulation GPC method. Composition-24- 201208169 The phenoxy resin has, for example, a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton 'phenolic skeleton' biphenyl skeleton, an anthracene skeleton, a dicyclopentane The olefin skeleton is one or more kinds of skeletons of a norbornene skeleton, a naphthalene skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, and a trimethylcyclohexane skeleton. The phenoxy resin may be used in combination of two or more kinds. A commercial product of a phenoxy resin is specifically 1256, 4250 (a phenoxy resin containing a bisphenol A skeleton) manufactured by Japan Epoxy Resins Co., Ltd., and YX8100 (a benzene containing a bisphenol S skeleton) manufactured by Japan Epoxy Resins Co., Ltd. Oxygen resin] YX6954 (a phenoxy resin containing a bisphenol acetophenone skeleton) manufactured by Japan Epoxy Resins Co., Ltd., PKHH (weight average molecular weight (Mw) 42600, number average molecular weight (Mn) 11200) manufactured by Union Carbide Co., Ltd., etc. In addition, FX280 5 3 BH30, YL6794, YL7213, YL7290, YL7482, etc., manufactured by Dongdu Chemical Co., Ltd., FX280, FX293, and Japan Epoxy Resins. The upper limit of the content of the thermoplastic resin is preferably 100% by weight or less, more preferably 50% by weight or less, based on the non-volatile content in the moisture-absorbing resin composition layer from the viewpoint of preventing deterioration of moisture permeability of the cured product. 2 5 wt% or less. In addition, the lower limit of the content of the thermoplastic resin is preferably 1% by weight or more, more preferably 1% by weight or more, based on 100% by weight of the nonvolatile matter in the moisture-absorbing resin composition layer from the viewpoint of obtaining a sufficient effect of containing the thermoplastic resin. It is 3% by weight or more, more preferably 5% by weight or more, still more preferably 10% by weight or more. (Coupling Agent) The moisture-absorbing resin composition layer used in the present invention further contains a coupling agent -25 - 201208169 to improve the adhesion of the adherend (support, protective resin composition layer, sealing material, etc.) to the cured product. The moisture permeability of the sexual or hardened material. Specifically, the coupling agent is, for example, a titanium coupling agent, an aluminum coupling agent, a decane coupling agent or the like. Among them, a decane coupling agent is preferred. These may be used alone or in combination of two or more. The decane coupling agent is specifically, for example, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-glycidyloxypropyl (dimethoxy) Epoxy decane coupling agent such as methyl decane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane; 3-hydrothiopropyltrimethoxydecane, 3-hydrogenthio Hydrogen-sulfur-based sand chamber coupling agent such as propyl triethoxy decane, 3-hydrothiopropylmethyldimethoxy decane and 11-hydrothio-undecyltrimethoxy sand; 3 - Aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, 3-aminopropyldimethoxymethylnonane, N-phenyl-3-aminopropyltrimethoxydecane , N-methylaminopropyltrimethoxydecane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane and N-(2-aminoethyl)-3-amine Amino decane coupling agent such as propyldimethoxymethyl decane; urea-based decane coupling agent such as 3-ureidopropyltriethoxy decane, vinyl trimethoxy decane, vinyl triethyl Oxydecane and vinylmethyldiethoxyanthracene Vinyl decane coupling agent; styryl decane coupling agent such as P-styryl trimethoxy decane; 3-propenyloxypropyltrimethoxy decane and 3-methacryloxypropyltrimethyl Acrylate-based decane coupling agent such as oxydecane; isocyanate-based decane coupling agent such as 3-isocyanate propyl trimethoxy decane, bis(triethoxymethyl sulfonylpropyl) disulfide, bis (triethoxy) Sulfhydryl propyl sulfonyl sulfonate cyclane coupling agent; phenyl trimethoxy decane, methacryloxypropyl trimethoxy decane, imidazolium, triazine decane, etc. . Among these, an epoxy decane coupling agent is particularly preferred. The upper limit of the content of the coupling agent is preferably 10% by weight or less, more preferably 10% by weight or less, based on 100% by weight of the nonvolatile matter in the moisture-absorbing resin composition layer, from the viewpoint of obtaining the adhesion improving effect by the coupling agent. 5% by weight or less. Further, the lower limit of the content of the coupling agent is preferably from 0% by weight to 0% by weight based on the non-volatile content in the moisture-absorbing resin composition layer from the viewpoint of obtaining the adhesion improving effect by the coupling agent. More than 5 wt%. In the hygroscopic resin composition layer used in the present invention, various additives other than the above components may be optionally contained within the range in which the effects of the present invention are exerted. Specific examples of such additives include organic ruthenium powders such as polyfluorene oxide powder, nylon powder, and fluorine powder, viscous agents such as olben and benton, polyfluorene, fluorine, and polymers. An antifoaming agent such as an antifoaming agent or a flat agent, a triazole compound, a thiazole compound, a triazine compound or a porphyrin compound. The thickness of the moisture-absorbent resin composition layer used in the present invention is not particularly limited to the structure in which the support layer is laminated on the resin composition layer, and the moisture is immersed only on the side of the resin composition layer, thereby lowering the moisture-absorbing resin composition. The thickness of the layer is preferably 200 μm or less, more preferably 150 μm or less, and still more preferably 1 μm or less, from the viewpoint of reducing the contact area with the outside air and blocking the water. The lower limit of the thickness from the viewpoint of ensuring the concentration of the moisture absorbing material for obtaining a sufficient moisture absorbing effect is preferably 3 μm or more, more preferably 5 μm or more, and still more preferably 10 μm or more. -27-201208169 [Protective Resin Composition Layer] The protective resin composition layer used in the film of the present invention is composed of a thermosetting resin composition containing a thermosetting resin or a curing agent, and is intended for use in a device ( In the closed structure of an organic EL device or the like, a direct-coated element (organic EL element or the like) has a function of preventing a hygroscopic metal oxide contact element in the moisture-absorbing resin composition layer from damaging the element. (Thermosetting resin and the curing agent) The thermosetting resin and the curing agent are the same as those of the thermosetting resin and the curing agent used in the moisture-absorbing resin composition layer. The thermosetting resin and the curing agent used for the protective resin composition layer may be different from the thermosetting resin and the curing agent used in the moisture-absorbing resin composition layer, and the adhesion between the two layers and the hardening shrinkage may be suppressed. Or a thermosetting resin used for protecting the resin composition layer, a thermosetting resin used for protecting the resin composition layer, and a thermosetting resin used for the moisture absorbing resin composition layer, and the viewpoint of the interface stress between the two layers after hardening due to the difference in the curing speed. The same hardener is preferred. (Hygroscopic metal oxide) The protective resin composition layer used in the present invention may further contain a hygroscopic metal oxide insofar as it does not affect the damage prevention function of the organic EL element. The moisture permeability resistance can be improved by containing a hygroscopic metal oxide. When the protective resin composition layer contains a hygroscopic metal oxide, the upper limit of the content of the hygroscopic metal oxide is not observed in the protective resin composition layer from the point of view of the damage prevention of the organic EL element. The volatile matter is 1% by weight, preferably 5% by weight or less. Further, the lower limit of the content of the hygroscopic metal oxide is preferably 〇% by weight based on the non-volatile content of the protective resin composition layer from the viewpoint of obtaining an effect of improving moisture permeability resistance.  More than 5 wt%. When the hygroscopic metal oxide contains a hygroscopic metal oxide in a range of not less than 5% by weight in the protective resin composition layer, the hygroscopic metal oxide may be damaged when the particle diameter of the hygroscopic metal oxide is large. The organic EL element, therefore, the average particle diameter of the hygroscopic metal oxide is preferably less than 1 μη. Further, even if the average particle diameter is less than 1 μm, when the particle size distribution is broad, coarse particles are contained, and the organic EL element may be damaged. Therefore, the average particle diameter is preferably less than Ιμηη, and particles having a particle diameter of 3 μm or more are not contained. By. Further, the hygroscopic metal oxide contained in the protective resin composition layer may be the same metal oxide as the hygroscopic metal oxide contained in the moisture-absorbing resin composition layer, or may be the same as the surface treatment. The situation is implemented. The commercially available product of the hygroscopic metal oxide may be used as long as the average particle diameter thereof is less than Ιμηη. However, when the average particle diameter of the commercially available product is Ιμηη or more, pulverization, classification, and the like are carried out to prepare an average particle diameter. The pellets of less than 1 μηι are used. The "average particle diameter" herein has the same meaning as the average particle diameter of the hygroscopic metal oxide contained in the moisture-absorbing resin composition layer. (Inorganic 塡 Filling Material) The protective resin composition layer used in the present invention further contains an inorganic cerium filling material (but not containing a hygroscopic metal oxide), and can retard the moisture permeable speed in the layer and the interface with the EL element side. Can improve the adhesion to the substrate. The inorganic -29 * 201208169 can be used in the same manner as the inorganic ruthenium filler used in the above-mentioned moisture absorbing resin composition layer. From the viewpoint of the fact that the inorganic cerium filler is not easily exposed at the time of lamination, it is preferable that the talc, the clay, the mica, the boehmite, and the like have a flat shape of the ceramium filler. When the inorganic cerium is used, the upper limit of the content of the inorganic cerium is increased from the viewpoint of the viscosity of the resin composition, the strength of the cured product, and the brittleness, compared with 100% by weight of the non-volatile content in the resin composition. Preferably, it is 15% by weight or less, and more preferably 10% by weight or less. The lower limit of the content of the inorganic ceramium filler is preferably 100% by weight based on the nonvolatile content in the resin composition, from the viewpoint of obtaining the effect of delaying the moisture permeability at the interface between the resin composition layer and the EL element side. 1% by weight or more, more preferably 3% by weight or more. When the inorganic cerium filler is used together with the hygroscopic metal oxide, the total amount of the inorganic cerium filler and the hygroscopic metal oxide is 15% by weight or less based on 100% by weight of the nonvolatile content in the resin composition. Used within the scope. (Rubber particles, thermoplastic resin, coupling agent, etc.) The protective resin composition layer used in the present invention further contains rubber particles to improve the mechanical strength and stress relaxation of the cured product. Further, in the moisture-absorbing resin composition layer used in the present invention, by further containing a thermoplastic resin, flexibility can be imparted to the cured product, and good workability in coating the resin composition can be imparted. Further, the moisture absorbing resin composition layer used in the present invention further contains a coupling agent to improve the adhesion of the adherend to the cured product and the moisture permeability resistance of the cured product. The rubber particles, the thermoplastic resin, the coupling agent, and the like may be the same as those of the rubber particles, the thermoplastic resin, the coupling agent, and the like used in the moisture-absorbing resin composition layer, and the coupling agent is preferably a decane coupling agent 'Hot-30- 201208169 The plastic resin is preferably a phenoxy resin. The content of the thermosetting resin composition is basically the same as that of the rubber particles, the thermoplastic resin, and the coupling agent in the thermosetting resin composition constituting the moisture absorbing resin composition layer. In the protective resin composition layer used in the present invention, various additives other than the above components may be optionally contained within the range in which the effects of the present invention are exerted. Specific examples of the additives include organic ruthenium powders such as polyfluorene oxide powder, nylon powder, and fluorine powder, viscous agents such as olben and benton, polyfluorene, fluorine, and polymer. An antifoaming agent, a flattening agent, a triazole compound, a thiazole compound, a triazine compound, a porphyrin compound, or the like. The thickness of the protective resin composition layer used in the present invention is not particularly limited. From the viewpoint of increasing the moisture permeability, the upper limit of the thickness is preferably 40 μm or less, more preferably 20 μm or less. Further, from the viewpoint of the thickness sufficient to have the damage preventing effect of the organic EL element, the lower limit of the thickness is preferably Ιμϊη or more. [Protective film] The film of the present invention is actually used until the formation of the closed structure. In order to prevent adhesion or scratches on the surface of the resin composition layer, it is preferable to protect the film. The protective film can be used as the release film support. The plastic film is exemplified. The protective film is preferably subjected to a release treatment in advance, and the release agent is specifically, for example, a fluorine-based release agent, a polyoxymethylene-based release agent, or an alkyd-based release agent. The release agent can be mixed with different types of people. The thickness of the protective film is not particularly limited, and is preferably 1 to ΙΟΟμηι, more preferably -31 - 201208169 10 to 75 μm, more preferably Ι5 to 50 μm. [Film Production Method] The film of the present invention is not particularly limited, and can be used for various devices such as semiconductors, solar cells, high-brightness LEDs, LCD seals, and organic ELs, and is particularly suitable for use in organic EL devices for sealing, and is applicable to organic EL devices. Further, when the film of the present invention is transported, a protective film can be additionally transported. In other words, the constitution of the film of the present invention includes the following six aspects. (1) Peeling support + moisture absorbing resin composition layer + protective resin composition layer + protective film (2) closed system support + moisture absorbing resin composition layer + protective resin composition layer + protective film (3) peeling Supporting body + protective resin composition layer + moisture absorbing resin composition layer + protective film (4) peeling support body + moisture absorbing resin composition layer + protective resin composition layer (5) closed system support + moisture absorbing resin Composition layer + protective resin composition layer (6) Release-type support + protective resin composition layer + moisture-absorbing resin composition layer The above-described system is not laminated. In the constitution of (1) and (2) of the film of the present invention, specifically, the first varnish in which the resin composition constituting the moisture absorbing resin composition layer is dissolved and the resin constituting the protective resin composition layer are separately prepared. The second varnish is coated on the peeling support or the closed support, and the organic solvent is dried to form a moisture absorbing resin composition layer, and the second varnish is applied thereon. The organic solvent is dried to form a protective resin composition layer, and a protective film is used. Further, the structure of the film (3) of the present invention is obtained by sequentially forming a protective resin composition layer and a moisture-absorbing resin composition layer. The configuration of (4), (5), and (6) of the film of the present invention is a configuration in which a protective film is not used when the film of the structures (1), (2), and (3) is produced. When the film of the present invention has the constitutions of (1) and (3), the relationship between the release-based support and the protective film is that the protective film must be peeled off first, and the protective film is thinner than the release-based support, or the release film is applied to the protective film. Processing or embossing is preferred. Further, the 'release layer support is preferably a polyethylene terephthalate (PET) film, and the protective film is preferably a 2-axis extended polypropylene. The organic solvent used for the varnish is exemplified by acetone, methyl ethyl hydrazine (hereinafter referred to as "MEK"), ketones such as cyclohexanone, ethyl acetate, butyl acetate, sucrose acetate, and propylene glycol monomethyl. Acetate acetates such as acetic acid vinegar and carbitol acetate, carbitol, celecoxib, butyl carbitol, etc. Indoleamine, dimethylacetamide, N-methyl sulphate, and the like. These may be used alone or in combination of two or more. The drying conditions are not particularly limited, and are preferably from 5 to 1 〇 、 and from 3 to 15 minutes. The method of producing the film of the present invention in the order of the moisture absorbing resin composition layer and the protective resin composition layer in the order of the moisture-absorbing resin composition layer and the protective resin composition layer In the boundary layer-33-201208169, a mixed layer in which two resin compositions are mixed is formed, and the protective resin composition layer may be damaged and the damage prevention effect of the organic EL element may be caused. Therefore, the first varnish is used to form the first resin composition sheet in which the moisture absorbing resin composition layer is formed, and the second varnish is used in the second support to form the protective resin. The second resin composition sheet of the composition layer is obtained by laminating the moisture-absorbing resin composition layer of the first resin composition sheet and the protective resin composition layer of the second resin composition sheet to obtain a film of the present invention. good. Further, at this time, any of the first support and the second support is a support of the film of the present invention, and the other is a protective film of the film of the present invention. When the film of the present invention is obtained by this method, the melt viscosity of the protective resin composition layer is preferably lower than the melt viscosity of the moisture-absorbing resin composition layer at the laminating temperature of the moisture-absorbing resin composition layer and the protective resin composition layer. In other words, at the laminating temperature of the moisture absorbing resin composition layer and the protective resin composition layer, the melt viscosity of the resin composition constituting the protective resin composition layer is lower than that of the moisture absorbing resin composition layer, and the hygroscopic resin can be avoided. The ruthenium contained in the composition layer moves to the protective resin composition layer at the time of lamination, or damages the EL element by protecting the resin composition layer. The term "melt viscosity" refers to the type of Rheosol-G3 000 manufactured by UBM, the amount of resin is lg, and a parallel plate of 18 mm in diameter is used. The starting temperature is 60 ° C, the heating rate is 5 ° C / min, and the measurement temperature is 6 ( TC to 200. The number of vibrations measured at a frequency of 1 Hz/deg. The lamination temperature is not particularly limited, and may be appropriately set in accordance with the required properties, and requires a hardening temperature higher than that of the moisture absorbing resin composition layer and the protective resin composition layer. -34- 201208169 degree is lower, so the upper limit of the lamination temperature is preferably 1 30 ° C or less, more preferably 120 ° C or less, more preferably 110 ° C or less, more preferably lOOt or less. The lower limit of the temperature is preferably 40 ° C or higher, more preferably 45 ° C or higher, more preferably 50 ° C or higher, and even more preferably 5 5 ° C or higher, from the viewpoint of good usability at normal temperature. 60 ° C or more. From the viewpoint of preventing the hygroscopic metal oxide from moving to the protective resin composition layer from the viewpoint of preventing the hygroscopic resin composition layer from intermingling with the protective resin composition layer at the set lamination temperature, Melt viscosity of the wet resin composition layer and protective resin composition layer The lower limit of the difference in the melt viscosity (the melt viscosity of the moisture-absorbing resin composition layer - the melt viscosity of the protective resin composition layer) is preferably 300 sec or more, more preferably 1,000 poise or more, more preferably 5,000 poise or more, and more preferably l 〇. 〇〇〇p〇ise The above is particularly good at 15000 poise or more, preferably 30,000 poise or more. In addition, at the set lamination temperature, it is effective to fix the moisture-absorbing resin composition layer and the protective resin composition layer once. From the viewpoint of efficiently adhering the moisture absorbing resin composition layer and the protective resin composition layer, the difference between the melt viscosity of the moisture absorbing resin composition layer and the melt viscosity of the protective resin composition layer (melting viscosity of the moisture absorbing resin composition layer - The upper limit of the melt viscosity of the protective resin composition layer is preferably 1,000,000 poise or less, more preferably 500,000 poiSe or less, more preferably 1,000 or less. The method for adjusting the melt viscosity of the protective resin composition layer and the moisture absorbent resin composition layer, For example, there are a method of changing the degree of hardening by drying conditions, a method of changing the mixing ratio of the liquid resin, changing the particle size of the inorganic cerium, and containing A method such as a ratio, etc., can be carried out by combining two or more of them. Therefore, by adjusting the viscosity of the protective resin composition layer and the moisture-absorbing resin composition layer -35 to 201208169 by this method, the protective resin composition layer can be obtained. The melt viscosity at a predetermined temperature is lower than the melt viscosity at a predetermined temperature of the moisture-absorbing resin composition layer. The film of the present invention is suitable for forming various semiconductor elements (individual semiconductors, optical semiconductors, logic 1C, analog 1C, mere bodies, etc.) The closed structure of the organic EL device is particularly suitable for the sealing of the organic EL device. [Method for Producing Organic EL Device] A method for producing an organic EL device by using the film-sealed organic EL device of the present invention will be described below. In the closed structure of the apparatus, an element for forming a substrate by covering the element with the protective resin composition layer is disposed, and the moisture-absorbing resin composition layer is disposed on a surface opposite to the side surface of the element forming substrate of the protective resin composition layer. The structure of the film of the present invention contains the following six aspects as described above. (1) Peeling support + moisture absorbing resin composition layer + protective resin composition layer + protective film (2) closed system support + moisture absorbing resin composition layer + protective resin composition layer + protective film, (3) Peeling support + protective resin composition layer + moisture absorbing resin composition layer + protective film, (4) release system support + moisture absorbing resin composition layer + protective resin composition layer (5) closed system support + suction Wet resin composition layer + protective resin composition layer (6) release-type support body + protective resin composition layer + moisture-absorbing resin composition layer - 36 - 201208169 (a) When the film of the present invention is constituted by (1), First, the protective film is removed, and the protective resin composition layer is laminated on the transparent substrate on which the organic EL element is formed. Then, the release-type support is peeled off, and the sealing material is laminated on the exposed moisture-absorbing resin composition layer to perform a heat hardening operation of the protective resin composition layer and the moisture-absorbing resin composition layer, whereby an organic EL device can be produced. (b) When the film of the present invention has the constitution of (2), the protective film is first removed, and the protective resin composition layer is laminated on the transparent substrate on which the organic EL element is formed, and the protective resin composition layer and the moisture absorbing resin are formed. The organic EL device can be manufactured by a thermal hardening operation of the layer. (c) When the film of the present invention has the constitution (3), the protective film is first removed, and the moisture-absorbing resin composition layer is laminated on the sealing material. Then, the release-system support is peeled off, and the exposed protective resin composition layer is laminated on the transparent substrate on which the organic EL element is formed, and the protective resin composition layer and the moisture-absorbing resin composition layer are thermally hardened. An organic EL device is manufactured. (d) When the film of the present invention has the constitution (4), the protective resin composition layer is laminated on the transparent substrate on which the organic EL element is formed. Then, the release-type support is peeled off, and the sealing material is laminated on the exposed moisture-absorbing resin composition layer to perform a heat hardening operation of the protective resin composition layer and the moisture-absorbing resin composition layer, whereby an organic EL device can be produced. (e) When the film of the present invention is in the form of (5), the protective resin composition layer is laminated on the transparent substrate on which the organic EL element is formed, and the protective resin composition layer and the moisture absorbent resin composition layer are formed in this state. The organic EL device can be manufactured by a heat hardening operation. (f) When the film of the present invention has the constitution of (6), the moisture-absorbing resin group-37-201208169 is laminated on the sealing material, and then the release-system support is peeled off to form the exposed protective resin. The organic layer device can be produced by laminating the material layer on a transparent substrate on which an organic EL element is formed, and performing a heat hardening operation of the protective resin composition layer and the moisture-absorbing resin composition layer. In the organic EL device, it is preferable to produce an organic EL device by the method of (b), (c), (e) or (f) from the viewpoint of not applying the heat history more than necessary. The sealing material used in the methods (a), (c), (d) and (f) is different from the film of the present invention, and is additionally prepared to form a material for a closed structure, for example, having a moisture-proof property. Metal foil, glass plate, metal plate, etc. of plastic film, copper foil, aluminum foil, and the like. The upper limit of the thickness of the sealing material is preferably 5 mm or less, more preferably 1 mm or less, and even more preferably ΐΟΟμηι or less, from the viewpoint of making the organic EL device itself light and thin. In addition, the lower limit of the thickness of the sealing material is preferably 5 μm or more, more preferably ΙΟμηη or more, and still more preferably 20 μΐη or more from the viewpoint of preventing moisture permeation and the rigidity of the organic EL device. The sealing material may be used in combination of two or more sheets. In this case, the total thickness after lamination is preferably in the range of 5 μm or more and 5 mm or less, preferably in the method of the above (a) to (f). The process can be batchwise or continuous in rolls. The lamination conditions can be carried out under reduced pressure, and lamination can be preferably carried out using a vacuum laminator or the like. 10_3 (10hPa) under MPa under reduced pressure, temperature 50~130 °C, pressure 0. It is preferred to carry out lamination under conditions of 5 to 10 kgf/cm2. The vacuum laminating machine is, for example, a vacuum press laminator manufactured by a famous machine manufacturer, a vacuum coater manufactured by Nichigo-morton Co., Ltd., -38-201208169, a protective resin composition layer, and a moisture-absorbing resin composition layer. The method of thermosetting is not particularly limited, and a known method can be used. Specifically, there are, for example, a hot air circulation type oven, an infrared heater, a heat gun, a high frequency induction heating device, and a pressure heating of a heating tool. The film of the present invention has excellent low-temperature hardenability, and the upper limit of the curing temperature is preferably 1 40 ° C or lower, more preferably 1 2 ° C or lower, more preferably uo ° C or lower. Further, from the viewpoint of ensuring the adhesion of the cured product, the lower limit of the curing temperature is preferably 5 (TC or more, more preferably 5 5 t or more. The upper limit of the curing time is preferably 1 20 or less, more preferably 90 or less. More preferably, it is 60 or less. From the viewpoint of the hardening of the cured product, the lower limit of the curing time is preferably 20 minutes or more, more preferably 30 minutes or more, whereby the thermal deterioration of the organic EL element can be extremely reduced. In the organic EL device of the present invention, when the organic EL element is formed on the transparent substrate, when the transparent substrate side is the display surface of the display or the light-emitting surface of the lighting fixture, the sealing material support or the sealing material does not have to use a transparent material. A metal plate, a metal foil, an opaque plastic film or a plate, etc. are used. [Embodiment] [Embodiment] Hereinafter, the present invention will be more specifically described by way of Examples and Comparative Examples, but the present invention is not limited to the following examples. [Materials for use] The materials used in the following are described below. -39 - 201208169 (A) Epoxy resin and solid epoxy resin (HP7200H manufactured by DIC Corporation: Dicyclopentadiene type solid epoxy resin) Epoxy equivalent (278g / eq)) • rubber particle dispersion liquid epoxy resin (manufactured by Nippon Shokubai "BPA3 28" primary particle diameter: square. The acrylic resin particles having a two-layer structure of 3 μm contained a composition of 17% by weight in an epoxy equivalent of 185 bisphenol A type epoxy resin. Epoxy equivalent (23 0g/eq)) • Liquid epoxy resin (GOT manufactured by Nippon Kayaku Co., Ltd.: o-toluidine diglycidylamine, epoxy equivalent (135 g/eq)) (B) phenoxy Resin ・Japan Epoxy Resins YL7213-35M (weight average molecular weight 35,000) solid content 35 weight solution (C) hardener / epoxy resin latent accelerator ("------- ” • Ionic Liquid Hardener (“TBP/N-Ac-gly”, N-Ethyl Glycinate Tetrabutyl Squamous Salt) (D) Hygroscopic Metal Oxide • Burned Dolomite: Yoshizawa Lime Company The "light burnt dolomite" is used for wet pulverizer MEK cement (solid weight is 40% by weight, average particle size: -40 - 201208169 0. 8 7 μιη ) (Ε) Inorganic 塡 filling material • Talc: MEK cement for wet pulverization “D_600” manufactured by Japan Talc Co., Ltd. (solid weight: 3〇% by weight, average particle size: 〇·72μιη) (F) surface Treatment agent, stearic acid (G) coupling agent, decane coupling agent: "ΚΒΜ-4〇3" (3-glycidoxypropyltrimethoxydecane) manufactured by Shin-Etsu Chemical Co., Ltd. [Measurement method] Next, the measurement method will be described. . [Adhesion between the support and the resin composition layer] Two sheets of the model (width 5 mm, length 50 mm, thickness 50 μm) were prepared, and the resin composition layer on the substrate was superposed on one surface of the first film foil ( Width 4〇mm, length 5〇mm) 'With a vacuum laminator, the temperature is 80. (:, the conditions of the pressure lkgf/cm2 (9·8χ 1 〇 4Pa) were laminated. The substrate was peeled off, and two aluminum foils were superposed on the exposed resin composition layer, and laminated under the same conditions. A test piece having a three-layer structure of a resin composition layer and an aluminum foil. The test piece was heat-hardened under conditions of 1 1 、, 3 〇 minutes, and then cut into -41 - 201208169 into a rectangular test piece having a width of 10 mm and a length of 50 mm. The T-peel test method measures the long peeling force of the test piece). [Evaluation Method] Next, the evaluation method will be described. [Evaluation of moisture permeability resistance] The organic E L device was evaluated for moisture permeability resistance at a temperature of 60 ° C / 90% R Η. The state of the initial (0 hour) and degree of relative change was evaluated by the state of the shrinkage of the light-emitting area of the film which is resistant to moisture permeability. In other words, the shrinkage or the word product is reduced, the brightness of the light-emitting portion is increased, and the relative change rate for the flawless brightness is increased. In addition, the brightness system was measured at 2 mA), and the average enthalpy was calculated. The relative change price is 〇, and the relative change rate is 1.  When it is 1 or more, evaluation| [Evaluation of damage resistance of components] The degree of damage of the organic EL elements was evaluated by the driving voltage. When the dark current 値 is less than 2 μA, the evaluation is X. The curable resin composition varnishes A to E in the following Table 1 were prepared in the order shown below. The name shown in Table 1 is based on JIS K-6 8 54 [Adhesive force in the direction (1 hour under the environment, from the organic EL element and DS (light spot after 1000 hours of bright DS), the light-emitting surface: The initial state of the trap is driven by a constant current (the rate is less than 1). At 1 o'clock, the dark current of 3 V is evaluated as 〇, in 〇. 2μΑ to : The composition of the composition of the ^ material mix -42 - 201208169 number of parts by weight. (Production Example 1) A mixture of a solid epoxy resin ("HP7200H" manufactured by Die Co., Ltd.) dissolved in a phenoxy resin (MEK solution of 35 wt% of a solid content of "YL7213- 3 5M" manufactured by Japan Epoxy Resins Co., Ltd.) was prepared and dissolved. In the mixed solution, a rubber fine particle dispersion liquid epoxy resin ("BPA328" manufactured by Nippon Chemical Co., Ltd.), a liquid epoxy resin ("GOT" manufactured by Nippon Kayaku Co., Ltd.), and a potential for epoxy resin are added to the mixed solution. Sex hardening accelerator ("U-CAT3 5 02T" manufactured by Sail-apro Co., Ltd.), decane coupling agent ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.), ionic liquid hardener (tetrabutyl N-acetylglycinate) The money salt) and MEK were uniformly dispersed using a high-speed rotary mixer to obtain varnish A. (Production Example 2) A mixture A in which a solid epoxy resin ("HP7200H" manufactured by DIC Corporation) was dissolved in a phenoxy resin (MEK solution of 35 wt% of a solid content of "YL7213-3 5M" manufactured by Japan Epoxy Resins Co., Ltd.) was prepared. . Further, stearic acid was added to the MEK dope (solid content: 40% by weight) of the fired dolomite (manufactured by Yoshizawa Lime Co., Ltd.) to prepare a mixture B. Blending mixture A, mixture B, talc (D-600 from Japan Talc Co., Ltd. for wet pulverization, 30% by weight of 2MEK cement), and rubber microparticle dispersion liquid epoxy resin ("BPA3" manufactured by Nippon Shokubai Co., Ltd. 28"), a latent curing accelerator for epoxy resin ("U-CAT3502T" manufactured by San-Apro Co., Ltd., Ltd.), liquid epoxy resin ("GOT" manufactured by Nippon Kayaku Co., Ltd.), decane coupling agent ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.) was mixed using an ultra-high-speed vacuum emulsifier type mixer (manufactured by PRIMIX Co., Ltd.). An ionic liquid hardener (N-acetic acid glycine tetrabutyl quaternary salt) was added thereto and uniformly dispersed using a high-speed rotary mixer to obtain a varnish B. (Production Example 3) The same method as the varnish A of Production Example 1 was carried out except that talc (manufactured by Nippon Talc Co., Ltd. "D-600" was wet-pulverized, and solid content of 30% by weight of MEK cement) was added. The formulation table of Table 1 modifies varnish C. (Production Example 4) The varnish D was prepared in accordance with the preparation table of the following Table 1 by the same method as the varnish B of Production Example 2. (Production Example 5) The varnish E was prepared in accordance with the preparation table of the following Table 1 by the same method as the varnish B of Production Example 2. (Test Examples 1 to 3) The respective resin composition layers produced by the varnishes B, D, and E were measured for the adhesion to the support. The results are shown in Table 2. From the results of Table 2, it was found that the resin composition layer of the film of the present invention was adjusted to have a talc of -44 to 201208169, and the adhesion of the resin composition layer to the support was greatly improved. (Test Examples 4 to 6) The varnish A was uniformly applied to a release-treated surface of a PET film (thickness: 38 μm) treated with an alkyd-based release agent using a die coater to form a dried resin composition layer. The thickness was 10 μm, and then dried at 60 to 95 ° C for 1 minute to obtain a protective resin composition layer A 1 . The molten resin of the protective resin composition layer A 1 had a melt viscosity of 6170 poise. The varnish A was uniformly applied to the release-treated surface of the PET film (thickness 38 μη!) treated with the alkyd-based release agent using a die coater, and the thickness of the dried resin composition layer was 1 Ομηι. Then, it was dried at 60 to 80 ° C for 6 minutes to obtain a protective resin composition layer A2. The protective resin composition layer A2 had a melt viscosity at 100 ° C of 1030 poise. The varnish B was uniformly applied to the release-treated surface of the PET film (thickness 38 μm) treated with the alkyd-based release agent using a die coater, and the thickness of the dried resin composition layer was 30 μm, and then The mixture was dried at 60 to 95 ° C for 12 minutes to obtain a moisture-absorbing resin composition layer B 1 . The moisture-absorbing resin composition layer B 1 had a melt viscosity at 100 ° C of 23,700 poise. The varnish B was uniformly applied to the release-treated surface of the PET film (thickness 38 μm) treated with the alkyd-based release agent using a die coater, and the thickness of the dried resin composition layer was 30 μm, and then 60 to 8 (TC dried for 6 minutes) to obtain a moisture-absorbing resin composition layer B2. The moisture-absorbing resin composition layer B2 had a melt viscosity of 4,460 poise at 100 ° C. In the combination shown in Table 3, a protective film of a PET film was attached. Composition layer -45- 201208169 and the moisture-absorbing resin composition layer with the PET film, the protective resin composition layer and the moisture-absorbing resin composition layer are opposed to each other, and the temperature is l〇〇°C by a vacuum laminator. Pressure lKg/cm2 ( 9. The conditions of 8xl04Pa) were laminated to prepare a film having a support and a protective resin composition layer and a moisture-absorbing resin composition layer (Test Examples 4 to 6). Then, the vicinity of the boundary between the protective resin composition layer and the moisture-absorbing resin composition layer of the cross section of each of the films produced by SEM (scanning electron microscope) was observed. Fig. 2 is a SEM photograph of a film cross section of Test Example 4, Fig. 3 is a SEM photograph of a film cross section of Test Example 5, and Fig. 4 is a SEM photograph of a film cross section of Test Example 6. The difference in the melt viscosity of the moisture absorbing resin composition layer and the protective resin composition layer in the film (the melt viscosity of the moisture absorbing resin composition layer - the melt viscosity of the protective resin composition layer) is the film of Test Example 4 being 17530 poise, test The film of Example 5 was 3 43 0 poise, and the film of Test Example 6 was - 1710 P〇iSe. In the film of Test Example 4 (Fig. 2), the interface between the moisture-absorbing resin composition layer (upper layer) and the protective resin composition layer (lower layer) was slightly horizontal, and the moisture-absorbing metal oxide layer was not found to be composed of the moisture-absorbing resin. (Upper layer) Move to the protective resin composition layer (lower layer). The film of Test Example 5 (Fig. 3) also showed that the hygroscopic metal oxide was moved from the moisture-absorbing resin composition layer (upper layer) to the protective resin composition layer (lower layer). On the film of Test Example 6 (Fig. 4), it was found that the hygroscopic metal oxide (light spot) 7 was moved from the moisture-absorbing resin composition layer (upper layer) to the protective resin composition layer (lower layer). Next, an organic EL device was produced by the following procedure. [Production of Organic EL Device] -46- 201208169 (Washing of ITO Substrate and Glass Plate for Sealing) The cleaning system of ITO (indium/tin oxide) substrate and sealing glass plate is in a quiet room of class 1 0000 and Level 100 in a quiet room. The washing solvent used was a semiconductor washing lotion and ultrapure water (18 Ω or more, total organic carbon (TOC): less than 10 ppb), and an ultrasonic cleaner and a UV washing machine were used. (Evaporation step) The degree of vacuum is 1~2xl〇-4Pa, and the evaporation rate is 1. 0~2. 〇A/s ’ in 30mm square (longitudinal 30mmx horizontal 30mm), 0. On a 7 mm thick glass substrate, Glass/SiO2 [53 nm] / ITO [55 nm] / PEDOT. PSS [40nm] / α-NPD [50nm] / Alq3 [50nm] / LiF [0. The composition of 8 nm]/Al [15 nm] was vapor-deposited to form an organic EL device. The area of the light-emitting portion is 1 〇χ 10 mm 2 . Also, "PEDOT. PSS" (poly(3,4-extended ethyldioxythiophene)) (short for polystyrene sulfonic acid), "α-NPD" system (double [N-(l-naphthyl)-N-benzene) Abbreviation for "diphenylamine" and "Alq3" is an abbreviation for tris(8-quinolinol)aluminum. (Enclosure of Organic EL Element) First, the film of the present invention was laminated on a glass plate of a sealing material (2 lmm x 28 mm > 0. 7mm thick). The lamination system was carried out by vacuum pressing at 80 ° C under a reduced pressure (1 X 1 0 - 3 Μ P a or less) for 20 seconds and pressing for 20 seconds. Next, the support is peeled off, and the resin composition exposed on the glass plate is -47-201208169. The material layer is in a toolbox having an oxygen concentration of 10 ppm or less and a water concentration of 10 〇pPm or less, at 80 ° C, 〇. Under the condition of 〇4 MPa load and reduced pressure (lxlO_3 MPa or less) for 20 seconds and pressing for 20 seconds, the substrate was formed into an organic EL element and vacuum-pressed. Thereafter, the film of the present invention was thermally hardened by heating on a hot plate at 10 ° C for 30 minutes in a kit. In the above resin composition layer, the protective resin composition layer and the moisture absorbing resin composition layer are laminated, and the laminate of the glass plate of the sealing material is laminated on the glass plate to the organic EL element. The laminate forming the substrate bonds the protective resin composition to the organic EL element forming substrate. (Example 1) The varnish A was uniformly applied to a release-treated surface of a PET film (thickness 38 μm) treated with an alkyd-based release agent using a die coater to adjust the thickness of the dried resin composition layer. ΙΟμιη was then dried at 60 to 95 ° C for 12 minutes to obtain a protective resin composition layer. Similarly, the varnish B was applied to a PET film treated with an alkyd-based release agent (a thickness of 38 μπ〇 on a release-treated surface using a die coater to make the thickness of the dried resin composition layer become 3 Ομηι, and then dried at 60 to 95 ° C for 12 minutes to obtain a moisture-absorbing resin composition layer. A protective resin composition layer with a PET film and a moisture-absorbing resin composition layer with a PET film to protect the resin composition layer Opposite to the moisture-absorbing resin composition layer, by a vacuum laminator, at a temperature of 8 〇t, a pressure of 1 kg/cm 2 (9. The film of the present invention was produced by laminating the conditions of 8 x 104 Pa. Protection -48- 201208169 The resin composition layer has a melt viscosity of 27500 poise at 80 ° C, and a moisture viscosity of 80 ° C at 63 ° Poise of the moisture-absorbing resin composition layer. Next, the PET film on the side of the moisture-absorbing resin composition layer of the film is peeled off, and the moisture-absorbing resin composition layer is laminated on the glass plate of the sealing material, and the PET film on the side of the protective resin composition layer is peeled off to make the protective resin. The composition layer was laminated on a glass plate having an organic EL element to fabricate an organic EL device. Fig. 1 (a) is a schematic cross-sectional view of the organic EL device produced in the form of a protective resin composition layer (inorganic chelating agent, on the surface of the organic EL element 4 on which the substrate 5 of the organic EL element 4 is formed. 3, moisture-absorbing resin composition layer (inorganic chelating agent, hygroscopic metal oxide-containing metal) 2 and sealing material (glass plate) 1 laminated in this order. (Comparative Example 1) The varnish B was uniformly applied to a release-treated surface of a PET film (thickness 38 μηα) treated with an alkyd-based release agent using a die coater to adjust the thickness of the dried resin composition layer. It was 40 μm, and then dried at 60 to 95 ° C for 12 minutes to obtain a resin composition layer. After the resin composition of the PET film was laminated on the glass plate of the sealing material, the PET film was peeled off, and the resin composition layer was laminated on a glass plate having an organic EL element to fabricate an organic EL device. Fig. 1 (b) is a schematic view showing a cross section of the organic EL device produced by the substrate, and a surface of the organic EL device 4 on which the organic EL device 4 is formed, according to a resin composition layer (inorganic chelating agent, containing The laminate of the hygroscopic metal oxide 2 and the sealing material (glass plate) 1 is laminated. -49-201208169 (Comparative Example 2) The varnish A was uniformly applied to a release-treated surface of a PET film (thickness: 38 μm) treated with an alkyd-based release agent using a die coater to form a dried resin. The thickness of the composition layer was 40 μm, and then dried at 60 to 95 ° C for 12 minutes to obtain a resin composition layer. After the resin composition of the PET film was laminated on the glass plate of the sealing material, the PET film was peeled off, and the resin composition layer was laminated on a glass plate having an organic EL element to fabricate an organic EL device. Fig. 1 (c) is a schematic view showing a cross section of an organic EL device produced by the substrate, and a surface of the organic EL element 4 on which the substrate 5 of the organic EL element 4 is formed, according to a resin composition layer (inorganic chelating agent, no The sequential laminate of the hygroscopic metal oxide 3 and the sealing material (glass plate) 1. (Comparative Example 3) A film was produced in the same manner as in Example 1 except that varnish C was used instead of varnish B. The PET film from the resin composition layer side of the varnish C of the film is peeled off, and the resin composition layer is laminated on the glass plate of the sealing material, and the PET film from the resin composition layer side of the varnish A is peeled off. This resin composition layer was laminated on a glass plate having an organic EL element to fabricate an organic EL device. Fig. 1 (d) is a schematic cross-sectional view of the organic EL device produced by the substrate, and the surface of the organic EL element 4 on which the substrate 5 of the organic EL element 4 is formed is formed by a resin composition layer (inorganic chelating agent, no Moisture-absorbing metal oxide) 3 -50- 201208169 'Resin composition layer (containing inorganic chelating agent, non-hygroscopic metal oxide) 封闭 and sealing material (glass plate) 1 laminated in this order. (Comparative Example 4) The varnish C was uniformly applied to a release-treated surface of a PET film (thickness 38 μηι) treated with an alkyd-based release agent using a die coater to adjust the thickness of the dried resin composition layer. It became 40 μm and then dried at 60 to 95 t for 12 minutes to obtain a resin composition layer. After the resin composition of the PET film was laminated on the glass plate of the sealing material, the PET film was peeled off, and the resin composition layer was laminated on a glass plate having an organic EL element to fabricate an organic EL device. Fig. 1 (e) is a schematic cross-sectional view of the organic EL device produced by the substrate, and the surface of the organic EL element 4 on which the substrate 5 of the organic EL element 4 is formed is composed of a resin composition layer (containing an inorganic chelating agent, The sequence laminate of the hygroscopic metal oxide 6 and the sealing material (glass plate) 1 is not included. The performance evaluation results of the organic EL devices of Example 1 and Comparative Examples 1 to 4 are shown in Table 4. -51 - 201208169 [Table i] Matching Table Manufacturing Example 1 Manufacturing Example 2 Manufacturing Example 3 Manufacturing Example 4 Manufacturing Example 5 BPA328 30 30 30 30 30 GOT 10 10 10 10 10 U-CAT3502T 3 3 3 3 3 KBM-403 1 1 1 1 1 HP7200H 60 60 60 60 60 YL7213-35M 60 60 60 60 60 Burnt dolomite slurry 40 40% by weight of MEK solution) 37. 5 37. 5 37. 5 stearic acid 0. 6 0. 6 0. 6 D-60 phenological slurry, 30% by weight of MEK solution) 50 50 33 17 MEK 25 20 TBP/N-Ac-gly 3 3 3 3 3 [Table 2] Determination of the adhesion force when talc is formulated Results Test Example 1 Test Example 2 Test Example 3 Adhesion between the support and the resin composition layer (N/cm) 3.  5 2.  4 1.  3 - 52 - 201208169 [Table 3] Group of Films Test Example 4 Test Example 5 Test Example 6 Hygroscopic resin composition layer B 1 B 2 B 2 Protective resin composition layer A 1 A2 A1 [Table 4] Organic EL device Performance Evaluation Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Relative change rate of moisture permeability resistance (after 500 hours) 0.  99 0. 99 1. 09 1. 02 1. 09 Relative change rate of brightness (after 1000 hours) 1. 03 1. 04 1. 24 1. 19 1. 28 evaluation 〇 〇 X X X component damage resistance dark current (μ A) 0. 18 0.  24 0. 11 0.  15 0. 15 Evaluation 〇 X 〇 〇 〇 In the first embodiment, the film of the present invention can be used to reduce the damage of the organic EL element, and to form a closed structure of the organic EL element which can form a high level of moisture in the organic EL element. Further, in the first embodiment, the moisture absorbing resin composition layer and the protective resin composition layer are hardened at a low temperature to block the organic EL element, so that not only the damage of the organic EL element in the sealing operation but also the heat of the organic EL element can be sufficiently suppressed. Degraded, and a highly reliable organic EL element device is obtained. Comparative Example 1 contained a large amount of hygroscopic metal oxide, and the EL element of the damage was -53-201208169. In Comparative Examples 2, 3, and 4, the hygroscopic metal oxide was not contained, and thus the organic EL element was not damaged by moisture. In Comparative Example 4, talc was contained, but it was difficult to move due to the flat ruthenium filling agent, and the damage resistance of the element was maintained. [Industrial Applicability] By providing a film having a support and a protective resin composition layer and a moisture-absorbing resin composition layer, a film having both moisture permeability resistance and resistance to damage of the element can be obtained. Highly reliable organic EL device. The present application is based on Japanese Patent Application No. 2009-182827, the entire contents of which are incorporated herein. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] Fig. 1 (a) is a schematic sectional view of an organic EL device of the first embodiment, and Fig. 1 (b) to Fig. 1 (e) are organic ELs of Comparative Examples 1 to 4. Schematic cross-sectional view of the apparatus [Fig. 2] SEM photograph of the film section of Test Example 4. Fig. 3 is a SEM photograph of a cross section of a film of Test Example 5. 4] A SEM photograph of a film cross section of Test Example 6. -54- 201208169 [Explanation of main component symbols] 1 : Sealing material (glass plate) 2 : Hygroscopic resin composition layer (inorganic chelating agent, containing hygroscopic metal oxide) 3 : Protective resin composition layer (inorganic bismuth) Filler, no hygroscopic metal oxide) 4 : Organic EL element 5 : Substrate 6 : Resin composition layer (containing inorganic chelating agent, no hygroscopic metal oxide) 7 : Hygroscopic metal oxide -55-

Claims (1)

201208169 VII. Patent application scope: 1. A film characterized by having a support, a protective resin composition layer and a moisture absorbing resin composition layer. 2. The film of claim 1, wherein the moisture absorbing resin composition layer contains a hygroscopic metal oxide. 3. The film according to claim 1 or 2, wherein the hygroscopic resin composition layer contains an inorganic chelating agent (but not a hygroscopic metal oxide). 4. The film according to claim 1 or 2, wherein the protective resin composition layer contains an inorganic chelating agent (but not a hygroscopic metal oxide). 5. The film of claim 1 or 2, which is a difference in melt viscosity between the moisture absorbing resin composition layer and the protective resin composition layer at a laminating temperature set to a range of 40 t to 130 ° C ( The melt viscosity of the moisture absorbing resin composition layer - the melt viscosity of the protective resin composition layer is 300 poiSe to 1 10000 poise ° 6. An organic EL device characterized by having a film as claimed in claim 1 or 2. 7. An organic EL device characterized by having a film as in the third item of the patent application. 8. An organic EL device characterized by having a film as in the fourth item of the patent application. 9. An organic EL device characterized by having a film as in the fifth item of the patent application. -56-