KR102085696B1 - Cover sheet and organic electric device including the same - Google Patents

Abstract

Disclosed are a cover sheet used for encapsulating and / or protecting an organic electronic device such as an organic light emitting display device and an organic electronic device including the same. The cover sheet includes a lower bonding layer, a cover layer over the lower bonding layer, and a protective layer over the cover layer, the protective layer including a protective resin layer and a magnetic body disposed in the protective resin layer.

Description

Cover sheet and organic electronic device including the same {Cover sheet and organic electric device including the same}

The present invention relates to a cover sheet and an organic electronic device, and more particularly, to a cover sheet used for encapsulating and / or protecting an organic electronic device such as an organic light emitting display device and an organic light emitting display device including the same.

Recently, the interest in flexible electronic devices has been very high, and accordingly, development of organic electronic devices, for example, circuit boards, electronic components, and organic light emitting devices, which mainly use organic materials having excellent flexibility, has been actively performed. However, an organic electronic device is advantageously formed to have a sufficiently thin thickness with a small number of parts in order to have flexibility, and there is a need for a solution to this problem because the stability of water and oxygen is low due to the characteristics of the organic material. For example, in the case of an organic light emitting diode (OLED) display (hereinafter, referred to as an "organic light emitting display") using an organic material as a light emitting layer, the quality or lifespan of the organic light emitting diode may deteriorate rapidly due to the influence of moisture. As such, there is a need for an excellent encapsulation technique that can prevent external elements such as moisture or oxygen from penetrating into organic materials. In addition, there is a demand for a material having excellent flexibility, a sealing function, and a heat dissipation function and an improved quality of the organic light emitting device.

The problem to be solved by the present invention is to provide a cover sheet with an improved sealing function and heat dissipation effect.

Another object of the present invention is to provide an organic electronic device having an improved sealing function and heat dissipation effect.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

The cover sheet according to an embodiment of the present invention for solving the above problems is disposed in the protective resin layer and the protective resin layer as a lower bonding layer, a cover layer above the lower bonding layer, and a protective layer above the cover layer. And a protective layer including the magnetic material.

An organic electronic device according to another embodiment of the present invention for solving the above problems includes a cover sheet as described above.

Details of other embodiments are included in the detailed description and drawings.

According to the cover sheet according to the embodiment of the present invention, by arranging a cover layer having a high heat dissipation performance inside the cover sheet, it is possible to increase the heat dissipation effect and to prevent oxidation of the organic light emitting element.

According to the organic electronic device according to the embodiment of the present invention, the heat dissipation effect can be enhanced by disposing a cover sheet on the passivation layer and disposing a cover layer having high heat dissipation performance inside the cover sheet.

According to the organic electronic device according to the embodiment of the present invention, by including a protective layer on the outside of the cover sheet, the cover sheet according to the embodiments in the manufacturing process of the organic electronic device can have a sufficient magnetic force even with a small amount of magnetic material It can be conveyed by a conveying device operating as an electromagnet system.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a cross-sectional view of a cover sheet according to an embodiment.
FIG. 2 is an enlarged view of region A of FIG. 1.
3 is a cross-sectional view of the first core shell particles.
4 is a cross-sectional view illustrating the first core shell particles absorbing the deformation force inside the first bonding component layer.
5 is a cross-sectional view of second core shell particles according to one embodiment.
6A and 6B are cross-sectional views illustrating a cover layer and a third bonding layer according to various embodiments.
7A to 7C are cross-sectional views illustrating a method of forming a protective layer according to various embodiments.
8A through 8D are cross-sectional views illustrating an arrangement of a magnetic material in a protective layer according to various embodiments.
9A to 9D are cross-sectional views illustrating arrangement of magnetic bodies in a protective layer according to still another embodiment.
10A-10D are plan views of cover sheets according to various embodiments.
11A-11F are cross-sectional views of a cover sheet according to various embodiments.
12 is a cross-sectional view of an organic light emitting display device according to an embodiment.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the present embodiments make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims.

When an element or layer is referred to as another element or layer “on”, it includes any case where another element or layer is interposed over or in the middle of another element. On the other hand, when a device is referred to as "directly on", it means that no device or layer is intervened in the middle. Like reference numerals refer to like elements throughout. "And / or" includes each and all combinations of one or more of the items mentioned.

Although the first, second, etc. are used to describe various components, these components are of course not limited by these terms. These terms are only used to distinguish one component from another. Therefore, of course, the first component mentioned below may be the second component within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” does not exclude the presence or addition of one or more other components in addition to the mentioned components.

Unless otherwise defined, all terms used in the present specification (including technical and scientific terms) may be used in a sense that can be commonly understood by those skilled in the art. In addition, terms that are defined in a commonly used dictionary are not ideally or excessively interpreted unless they are specifically defined clearly.

The spatially relative terms " below ", " beneath ", " lower ", " above ", " upper " It can be used to easily describe the correlation of a component with other components. Spatially relative terms are to be understood as including terms in different directions of components in use or operation in addition to the directions shown in the figures. For example, when flipping a component shown in the drawing, a component described as "below" or "beneath" of another component may be placed "above" the other component. Can be. Thus, the exemplary term "below" can encompass both an orientation of above and below. The components can be oriented in other directions as well, so that spatially relative terms can be interpreted according to the orientation.

As used herein, the terms "~ sheet", "~ film" and the like may be used interchangeably. In addition, the term "bonding" of the present specification may be used in the sense including both adhesion and adhesion.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention. In the following embodiments, an organic light emitting display device will be described as an organic electronic device.

1 is a cross-sectional view of a cover sheet according to an embodiment.

Referring to FIG. 1, the cover sheet 100 is disposed on the first bonding layer 110, the second bonding layer 120 disposed below the first bonding layer 110, and the first bonding layer 110. The cover layer 130, a third bonding layer 150 disposed on the cover layer 130, and a protective layer 140 disposed on the third bonding layer 150 may be included. The cover sheet 100 may be attached to an upper portion of the organic light emitting device (see '300' of FIG. 12) of the organic light emitting display device (see '10' of FIG. 12) to protect the organic light emitting device.

The cover layer 130 of the cover sheet 100 may perform an encapsulation and heat dissipation function of the organic light emitting diode. The protective layer 140 protects the cover layer 130 and enables the transfer of the cover sheet 100 by the electromagnet system. The first bonding layer 110 and the second bonding layer 120 attach the cover sheet 100 to the organic light emitting diode. The first bonding layer 110 and the second bonding layer 120 may further play a role of blocking the penetration of moisture. The third bonding layer 150 serves to couple the cover layer 130 and the protective layer 140.

Hereinafter, each member of the cover sheet 100 will be described in more detail. FIG. 2 is an enlarged view of region A of FIG. 1. 3 is a cross-sectional view of the first core shell particles. 4 is a cross-sectional view illustrating the first core shell particles absorbing the deformation force inside the first bonding component layer. 5 is a cross-sectional view of the second core shell particle 122 according to one embodiment.

1 to 5, the cover sheet 100 includes a second bonding layer 120 and a first bonding layer 110 sequentially stacked in an upward direction. The lower surface of the first bonding layer 110 may directly contact the upper surface of the second bonding layer 120. Both the first bonding layer 110 and the second bonding layer 120 may contribute to attaching the cover layer 130 to the passivation layer (see '200' in FIG. 12) of the organic light emitting device or the organic light emitting display. Can be. When the cover sheet 100 is attached to the passivation layer, the attachment surface may be a lower surface of the second bonding layer 120.

The first bonding layer 110 includes the first bonding component layer 111, the moisture absorbent 113, and the first core shell particles 112. The moisture absorbent 113 and the first core shell particles 112 are disposed in the first bonding component layer 111. The moisture absorbent 113 and the first core shell particles 112 may be uniformly dispersed in the first bonding component layer 111.

The first bonding component layer 111 may impart bonding performance to the first bonding layer 110, and may provide a space in which the moisture absorbent 113 and the first core shell particles 112 are dispersed. The thickness of the first bonding component layer 110 may be 10 μm to 100 μm.

The first bonding component layer 110 may include a material including any one or more functional groups of glycidyl group, isocyanate group, hydroxy group, carboxyl group, alkenyl group, alkynyl group and acrylate group which can be thermoset or photocurable. have. The first bonding component layer 110 may preferably include a polyolefin-based resin.

The moisture absorbent 113 is disposed inside the first bonding component layer 111 to absorb moisture. The size of the moisture absorbent 113 may be 0.1 to 5 μm, but is not limited thereto.

The moisture absorbent 113 may include a metal powder such as alumina, a metal oxide, a metal salt, or a mixture of one or more kinds of phosphorus pentoxide (P 2 O 5). Specific examples of the metal oxides include lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), magnesium oxide (MgO), and the like. Lithium (Li2SO4), sodium sulfate (Na2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), cobalt sulfate (CoSO4), gallium sulfate (Ga2 (SO4) 3), titanium sulfate (Ti (SO4) 2) or nickel sulfate Sulfates such as (NiSO4), calcium chloride (CaCl2), magnesium chloride (MgCl2), strontium chloride (SrCl2), yttrium chloride (YCl3), copper chloride (CuCl2), cesium fluoride (CsF), tantalum fluoride (TaF5), niobium fluoride (NbF5), lithium bromide (LiBr), calcium bromide (CaBr2), cesium bromide (CeBr3), selenium bromide (SeBr4), vanadium bromide (VBr3), magnesium bromide (MgBr2), barium iodide (BaMgI2) or Metal halides such as; Or metal chlorates such as barium perchlorate (Ba (ClO 4) 2) or magnesium perchlorate (Mg (ClO 4) 2), and the like, but is not limited thereto. As the moisture absorbent 113, a physical adsorbent such as silica, zeolite, titania, zirconia or montmorillonite may be used.

In a preferred embodiment, calcium oxide (CaO) may be applied as the moisture absorbent 113. As the calcium oxide becomes transparent while absorbing moisture, the degree of moisture absorption can be visually checked, thereby preventing defects caused by the encapsulant during display panel manufacturing.

When the first core shell particles 112 absorb or adsorb moisture into the first bonding layer 110, the first core shell particles 112 increase the volume of the first bonding layer 110 to mitigate separation from the adherend.

The first core shell particle 112 includes a first shell 112a and a first core 112b. The first shell 112a surrounds the first core 112b. The first shell 112a may completely surround the first core 112b but may also partially surround it.

The first shell 112a may include a material such as polyvinylidene chloride (PVDC) or polymethyl methacrylate (PMMA).

The first core 112b may be empty or filled with a gas such as a hydrocarbon. The first core shell particles 112 may be foam particles.

The first core shell particles 112 may have a larger diameter C1 of the first core 112b than the thickness d1 of the first shell 112a. For example, the thickness d1 of the first shell 112a may be 0.1 μm to 2 μm, and the average diameter C1 of the first core 112b may be 10 μm to 40 μm. The size R1 of the first core shell particles 112 may be 10.2 μm to 44 μm.

In one embodiment, at least some of the first coreshell particles 112 may be impregnated in the first bonding component layer 111. For example, when the first core shell particles 112 have a sufficient specific gravity, at least some of the first core shell particles 112 are impregnated during the manufacturing process and disposed at or near the interface with the second bonding layer 120. Can be. When the first core shell particles 112 are disposed at the interface between the first bonding layer 110 and the second bonding layer 120, the first core shell particles 112 may protrude toward the second bonding layer 120. As a result, an area of the bonding interface may be increased to increase the bonding force with the second bonding layer 120. In order to increase the amount of impregnation, the specific gravity of the first core shell particles 112 is advantageously greater than that of the first bonding component layer 111, but the specific gravity of the first core shell particles 112 is greater than the first bonding component layer 111. Some of the dispersed first core shell particles 112 may be disposed at or near the interface with the second bonding layer 120.

In some embodiments, the first coreshell particles 112 may further include a surface coating layer 112c. The surface coating layer 112c may be formed on the surface of the first shell 112a. The surface coating layer 122c may include, for example, calcium carbonate (CaCO 3). When the first core shell particles 112 include the surface coating layer 112c, the specific gravity of the first core shell particles 112 may further increase. For example, when the first core shell particle 112 does not include the surface coating layer 112c and the specific gravity is 0.1 or less, when the first core shell particle 112 includes the surface coating layer 112c, the specific gravity may increase by about 1.5 times or more to about 0.15. . Therefore, as described above, the impregnation may be well performed in the first bonding component layer 111 to further increase the bonding force between the first bonding layer 110 and the second bonding layer 120. In addition, when the surface coating layer 112c is formed, the first core shell particles 112 are prevented from agglomerating and thus the dispersibility of the first core shell particles 112 is improved, whereby the first core shell particles 112 are formed. Productivity and handleability can be improved.

In one embodiment, the surface coating layer 112c may further include a silane material. The silane group of the silane material may be interposed between the calcium carbonate and the surface of the first shell 112a to bond them. In addition, the silane group may serve to bind calcium carbonate to each other. When the first core shell particles 112 have a surface coating layer 112c including calcium carbonate (CaCO 3) and / or a silane group, the first core shell particles 112 may be hydrophilic.

When the first core shell particles 112 are foamed particles, the surface coating layer 112c may be formed by coating after the foaming process.

As shown in FIG. 4, when the moisture 500 penetrates into the first bonding layer 110, the penetrated moisture 500 is absorbed into the first bonding component layer 111 or the moisture absorbent 113. Can be adsorbed by. When the moisture 500 is absorbed or adsorbed inside the first bonding layer 110, the moisture 500 pushes out the periphery by the corresponding volume, that is, the swelling causes deformation force to deform the peripheral shape. If the deformation force due to the water 500 is not alleviated or absorbed, stress is transmitted to the first bonding component layer 111 and the like, and the surface shape of the first bonding layer 110 is changed to decrease the bonding strength with the adherend. have.

The first core shell particles 112 absorb the deformation force due to the moisture 500 described above to prevent the stress from being transferred to the first bonding component layer 111 and the like, and further, the surface shape of the first bonding layer 110. It serves to prevent the deformation of the. The deformation force generated by the moisture 500 is transmitted along the first bonding component layer 111. When the deformation force reaches the first core shell particle 112, the portion of the first shell 112a is the first core 112b. It can be bent to the side to absorb some of the deformation force. For this purpose, it is preferable that the first shell 112a of the first core shell particle 112 is not strong in deformation strength. Specifically, the shrinkage deformation force of the first core shell particles 112 is preferably smaller than the surface deformation force of the first bonding component layer 111 so as to be more easily deformed. Since the first core 112b of the first core shell particles 112 is hollow or formed of gas, as described above, the shrinkage deformation of the first core shell particles 112 can be easily performed, and thus the moisture content of the first core shell particles 112 can be reduced. It absorbs strain well. The first core 112b of the first core shell particle 112 absorbing the deformation force may have a reduced volume, and the first shell 112a may have a shape crushed toward the first core 112b.

The first core shell particles 112 are disposed in the first bonding component layer 111 together with the moisture absorbent 113. Therefore, the deformation force by the moisture 500 absorbed / adsorbed by the moisture absorbent 113 can be directly alleviated at a close distance. In addition, when the first core shell particles 112 are uniformly disposed in the first bonding component layer 111, the first bonding layer 110 may absorb the deformation force by the moisture 500 penetrating through various paths. The deformation of the surface shape of can be prevented or alleviated more effectively. In addition, as described above, some of the first core shell particles 112 are disposed on the lower surface of the first bonding component layer 111 that interfaces with the second bonding layer 120 in the first bonding component layer 111. As a result, the bonding interface area with the second bonding layer 120 increases, thereby increasing the bonding force.

In the present exemplary embodiment, since the first core shell particles 112 at least partially absorb the deformation force due to the moisture 500, even if the content of the moisture absorbent 113 is increased, the surface deformation of the first bonding layer 110 is increased. It can prevent. In other words, when the first core shell particles 112 are not present, the content of the moisture absorbent 113 should be limited to a certain amount in order to avoid swelling due to the absorption of the moisture 500. When included, the surface swelling shape is relaxed, so that more moisture absorbent 113 may be added. Therefore, the water absorption ability and the water penetration velocity (WTV) characteristics of the first bonding layer 110 may be further improved.

The content of the moisture absorbent 123 in the first bonding layer 110 may be 10 to 80 wt% or 30 to 60 wt% based on the total weight of the first bonding component layer 111. The content of the moisture absorbent 123 may be increased due to the presence of the first core shell particles 112.

The content of the first core shell particles 112 is related to the content of the moisture absorbent 113. If the content of the moisture absorbent 113 is high, the content of the first core shell particles 112 may be increased. If the content of the moisture absorbent 113 is low, the content of the first core shell particles 112 may also be lowered. The content of the first core shell particles 112 in the first bonding layer 110 may be 0.01 to 3% by weight based on the weight of the moisture absorbent 113. When the content of the first core shell particles 112 is 0.01% by weight or more of the moisture absorbent 113, the deformation force due to the absorbed / adsorbed moisture may be significantly alleviated. By satisfying the above range, the content of the moisture absorbent 113 in the first bonding layer 110 can be further increased. On the other hand, excessively high content of the first core shell particles 112 may cause a decrease in the bonding strength of the first bonding layer 110, the content of the first core shell particles 112 is 3 of the moisture absorbent 113 When the weight percentage is less than or equal, the bonding strength of the first bonding layer 110 may be maintained to some extent. More preferably, the content of the first core shell particles 112 may be 0.05 to 2% by weight based on the weight of the moisture absorbent 113 in view of the relaxation of the absorbed / adsorbed moisture and the maintenance of bonding strength.

The second bonding layer 120 is disposed below the first bonding layer 110. Specifically, it is disposed on the lower surface of the first bonding layer 110. The second bonding layer 120 may completely overlap the first bonding layer 110.

The second bonding layer 120 may include the second bonding component layer 121 and the second core shell particles 122. The upper surface of the second bonding component layer 121 may be in contact with and attached to the lower surface of the first bonding component layer 111. The second bonding component layer 121 may impart bonding performance to the second bonding layer 120.

The second bonding component layer 121 may include a material including any one or more functional groups of glycidyl group, isocyanate group, hydroxy group, carboxyl group, alkenyl group, alkynyl group and acrylate group which can be thermoset or photocurable. have. The second bonding component layer 121 may preferably include a polyolefin-based resin. Unlike the first bonding layer 110, the second bonding layer 120 may not include the moisture absorbent 113 and the first core shell particles 112. The second bonding component layer 121 may be made of the same material as the first bonding component layer 111, but may be made of a different material.

Specifically, the second bonding component layer 121 may include a material having a lower molecular weight and a smaller viscosity and hardness than the first bonding component layer 111. The first bonding component layer 111 is attached to a cover substrate made of metal or the like. The higher the molecular weight of the binder, the better the moisture barrier property and the better heat resistance. Thus, the first bonding component layer 111 has a molecular weight of about 1 million. It may include a material having a binder. On the other hand, since the second bonding component layer 121 is attached to the passivation layer 200, the bonding strength with the stepped edge portion is important. If the molecular weight is high, the gap with the stepped corner may occur. These low binders may be included, such as binders having a molecular weight of about 150,000.

The thickness of the second bonding layer 120 may be smaller than the thickness of the first bonding layer 110. For example, the thickness of the first bonding layer 110 may be 5 μm to 50 μm. In an exemplary embodiment, the thickness of the first bonding layer 110 may be about 40 μm, and the thickness of the second bonding layer 120 may be about 10 μm. However, the present invention is not limited thereto, and the second bonding layer 120 may have the same thickness or thicker than the first bonding layer 110.

The second core shell particles 122 may be dispersedly disposed in the second bonding component layer 121.

The second core shell particle 122 includes a second core 122b and a second shell 122a. The second shell 122a surrounds the second core 122b. The second shell 122a may completely surround the second core 122b, but may also partially surround it.

The second shell 122a may include a polymer material. When the second shell 122a is made of a polymer material, damage to structures adjacent to each other, for example, a structure of the second bonding component layer 121 and / or mutual bonding, may be reduced than that of the inorganic particles. The second shell 122a may also be made of a material having a high transition temperature. When the constituent material of the second shell 122a has a high transition temperature, high temperature heat resistance of the second core shell particles 122 may be improved. In view of the above, the second shell 122a may be made of, for example, polystyrene (PS) or polymethylmethacrylate (PMMA) material.

The second core 122b may be empty or filled with a fluid material. For example, the second core 122b may be filled with a gas such as air, nitrogen, argon, or the like.

The second core shell particle 122 may be manufactured by inducing a polymer chain in a circular shape when synthesizing a polymer material.

The second core shell particles 122 may be smaller than the size of the first core shell particles 112. When the second core shell particles 122 are as large as the first core shell particles 112, the structure (passivation layer, glass, etc.) to which the cover sheet 100 is attached and / or the cracks of the mutual joints when the high temperature heat resistance evaluation is performed Damage may be caused, which may result in a drop in moisture penetration rate characteristics. In addition, when the size of the second core shell particles 122 is too large, it is disadvantageous to fill the step of the panel circuit to which the cover sheet 100 is attached. Accordingly, by relatively reducing the size of the second core shell particles 122, it is possible to increase high temperature heat resistance, minimize cracks or damage of structures (passivation layer, glass, etc.) and / or mutual joints, and fill the panel circuit steps well. can do.

Based on the thickness of the bonding layers 110 and 120, the relative size of the core shell particles 112 and 122 in the bonding layers 110 and 120 may be larger than that of the first bonding layer 110. . That is, the ratio of the average size of the first core shell particles 112 and the thickness of the first bonding layer 110 is greater than the ratio of the average size of the second core shell particles 122 and the thickness of the second bonding layer 120. Can be large. In addition, the ratio of the average size of the first core shell particles 112 and the second core shell particles 122 may be greater than the ratio of the thickness of the first bonding layer 110 and the thickness of the second bonding layer 120. .

The second core shell particle 122 may have a thickness d2 of the second shell 122a greater than or equal to the diameter C2 of the second core 122b. For example, the thickness d2 of the second shell 122a may be 0.1 μm to 0.8 μm, and the average diameter C2 of the second core 122b may be 0.1 μm to 0.2 μm. The size R2 of the second core shell particles 122 may be 0.3 μm to 1.8 μm. The specific gravity of the second core shell particles 122 may be greater than the specific gravity of the first core shell particles 112.

The content of the second core shell particles 112 may be included in the second bonding layer 120 in an amount of 20 wt% or more based on the weight of the moisture absorbent 113 of the first bonding layer 110. The content of the second core shell particles 122 may be greater than the content of the first core shell particles 112 based on the entire cover sheet 100.

In some embodiments, the bonding layers 110 and 120 may include a predetermined pattern on one surface thereof before bonding. For example, an intaglio pattern may be disposed on one surface of the bonding layers 110 and 120. As the intaglio pattern is formed, bubble generation at the bonding interface can be reduced. Thereby, the fall of the bonding force caused by a junction interface bubble, water penetration, etc. can be suppressed. Even when the bonding layers 110 and 120 have an intaglio pattern on one surface, after the bonding is completed, the intaglio pattern may be extinguished by the restoration characteristics of the resin to have a flat surface. After the bonding is completed, the density of the intaglio pattern or the viscosity of the bonding layer may be adjusted to secure a flat surface.

The intaglio pattern may have, for example, a depth of 1 to 10 μm and a width of 1 to 100 μm. The bottom area of the intaglio pattern may be 50% or less of the total bonding area of the bonding layers 110 and 120, and the top area of the intaglio pattern to be bonded may be 50% or more of the entire bonding area of the bonding layers 110 and 120. Surface roughness of the bonding layers 110 and 120 formed by the intaglio pattern may be 1 to 20 μm. In the numerical range as described above, the intaglio pattern disappears after the completion of the bonding, and the planarization of the surface may proceed smoothly.

As another example of suppressing bubble generation, a hot melt adhesive having a viscosity of 10 ⁴ to 10 ⁷ cPs may be applied to the bonding layers 110 and 120. In the case of the hot-melt type, since the form is firmly bonded by applying a high temperature heat, even if the bonding in a flat plane state without a separate intaglio pattern as described above can be suppressed bubble generation. Therefore, a flat surface can be secured after completion of the bonding.

Referring back to FIG. 1, the cover layer 130 is disposed on the first bonding layer 110. The cover layer 130 may be formed of a metal film having a low moisture absorption rate. When the cover layer 130 is made of a metal film, durability of the organic light emitting display device against external impact may be further improved. The cover layer 130 may have a thickness of about 10 μm to about 150 μm or about 70 μm, but is not limited thereto.

The cover layer 130 may include a thermally conductive metal material having a thermal conductivity of 100 W / mK or more or 150 to 450 W / mK or less. When the cover layer 130 includes a thermally conductive material, heat dissipation may be improved when applied to the organic light emitting display. Examples of the thermally conductive metal material may include, but are not limited to, iron, iron alloys, nickel, nickel alloys, stainless steels, aluminum alloys, copper, copper alloys, and the like.

In one embodiment, cover layer 130 may comprise aluminum or an aluminum alloy. Aluminum or an aluminum alloy has high moisture absorption and high thermal conductivity, and is excellent in heat dissipation characteristics. Therefore, the cover layer 130 made of aluminum or an alloy thereof not only has an excellent encapsulation function, but also smoothly discharges heat transferred to the cover layer 130 to the outside to extend the lifespan of the organic light emitting diode, Afterimage and burn-in of the display device may be improved. The aluminum is not limited thereto, but hard aluminum may be applied. The thermal conductivity of hard aluminum may be about 180 to 300 W / mK, or about 218 to 225 W / mK. When the cover layer 130 includes hard aluminum, not only the thermal conductivity is excellent, but also the strength is relatively superior to the soft aluminum may be more suitable for the cover layer 130.

Although not shown in the drawings, at least one surface of the cover layer 130 may be formed with fine irregularities by corona treatment or physical scratch, or a primer layer may be disposed. Accordingly, a strong bonding force with the first bonding layer 110 and / or the third bonding layer 150 disposed adjacent to the cover layer 130 can be ensured.

In some embodiments, the cover sheet 100 may further include a magnetic body 131 in the vicinity of the cover layer 130. The magnetic material 131 included in the cover layer 130 may be the same magnetic material as the magnetic material 142 of the protective layer 140 to be described later, but is not limited thereto. The content of the magnetic body 131 included in the cover layer 130 may be less than the content of the magnetic body 142 included in the protective layer 140.

6A and 6B are cross-sectional views illustrating a cover layer and a third bonding layer according to various embodiments. The magnetic body 131 may be disposed inside the cover layer 130 as shown in FIG. 6A, but may be attached to one surface of the cover layer 130 as shown in FIG. 6B. When the magnetic body 131 is attached to one surface of the cover layer 130, the magnetic body 131 may have a structure protruding toward the interface of the third bonding layer 150, thereby increasing the bonding area. The bonding force with the three bonding layers 150 may be further increased.

As shown in FIGS. 6A and 6B, when the cover sheet further includes a magnetic body 131 inside or on the cover layer 130, the cover sheet works together with the magnetic body 142 of the protective layer 140 described below. It is possible to increase the overall magnetic strength of the sheet. Therefore, the transfer by the electromagnet system described later can be facilitated.

Referring back to FIG. 1, the protective layer 140 is disposed on the cover layer 130.

The protective layer 140 functions to protect the cover sheet 100 including the cover layer 130 and the organic light emitting device disposed under the cover sheet from physical and chemical factors. In one embodiment, the protective layer 140 may be made of a fluorine compound, in this case it can prevent the corrosion of the cover layer 130.

The protective layer 140 may also serve to facilitate the transfer of the cover sheet 100 or the organic light emitting display device by the electromagnet system. In detail, in the manufacturing process of the organic light emitting display device, the transfer of the cover sheet 100 or the organic light emitting display device to which the cover sheet 100 is attached may be performed by a transfer device operating as an electromagnet system. In order to be utilized in an electromagnet system, the cover sheet 100 needs to include a ferromagnetic material. Since the cover layer is mainly applied to a paramagnetic material having high thermal conductivity, the cover layer alone is not easy to be transferred by the electromagnet system. Although the cover layer may be provided with a ferromagnetic material, in this case, the thermal conductivity is generally low, making it difficult to secure heat dissipation characteristics. Laminating a ferromagnetic metal film, for example, iron and nickel-containing films on the cover layer may be considered. However, unlike the cover layer including aluminum, the metal film is not easily cut, and thus the cutting process of the cover sheet is complicated. Can be done.

Thus, the cover sheet 100 according to the embodiment is operable in the electromagnet system by including the magnetic material 142 in the protective layer 140, while the protective resin layer 141 of the protective layer 140 to the base base As a result, the cutting layer is easily cut together with the cover layer 130 including aluminum, thereby increasing manufacturing efficiency.

The protective layer 140 may include a protective resin layer 141 and a plurality of magnetic bodies 142 dispersed therein. The protective layer 140 may be manufactured in the form of a film. When the protective layer 140 is manufactured in the form of a film, cutting may be easier, and thus process efficiency may be improved. The thickness of the protective layer 140 is not limited thereto, but may be 30 μm to 150 μm, or 80 μm to 100 μm.

The protective resin layer 141 may include a polymer material such as high density polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, polyacrylate, polystyrene, or the like.

The magnetic material 142 included in the protective layer 140 may be a ferromagnetic material. The ferromagnetic material may include at least one of iron, nickel, cadmium, sendust, MPP. In addition, it may have a shape of stick, wire, spherical, oval, plate, amorphous, dendrite, etc., but is not limited thereto. In addition, the magnetic body 142 may include a magnetic fluid made of iron oxide (Fe 2 O 3, Fe 3 O 4, CoFe 2 O 4, MnFe 2 O 4, etc.) having a size of several tens to several nm.

By including the magnetic material 142 in the protective layer 140, the cover sheet 100 may have a predetermined magnetic strength. Magnetic strength of the cover sheet 100 may be 40gf to 200gf, or 50gf to 100gf. When having the above magnetic strength, it may be possible to transfer by the electromagnet system. In order to secure the magnetic strength of the cover sheet 100, the content of the magnetic body 142 in the protective layer 140 may be 40 wt% to 70 wt%. When the content of the magnetic body 142 is less than 40% by weight, the magnetism of the cover sheet 100 may not be sufficient, so that the cover sheet 100 may be difficult to transfer using the electromagnet system. In addition, when the content of the magnetic body 142 is greater than 70% by weight, the content of the protective resin layer 141 is relatively reduced, it may be difficult to form the protective layer 140 itself.

In order to have a strong magnetic force, the protective layer 140 has a high content of the magnetic body 142. However, in order to prevent electrical short defects caused by the magnetic body, the specific resistance of the protective layer 140 is preferably 10 ⁶ Ω or more. . The surface resistance of the protective layer 140 for suppressing the generation of static electricity may have a value of 10 ¹³ Ω / m ² or less.

7A to 7C are cross-sectional views illustrating a method of forming a protective layer according to various embodiments.

As shown in FIG. 7A, the protective layer 140 may be formed by directly coating a mixture of a plurality of magnetic bodies 142 on a polymer resin on one surface of the cover layer 130.

As another example, the protective layer 140 may be formed by simultaneously extruding the polymer resin and the magnetic body through an extruder, as shown in FIG. 7B. For example, the protective layer 140 having a thickness of 30 μm to 150 μm may be formed by compounding 1% to 80% of the polymer resin and the magnetic body 142 on one surface of the substrate through a twin screw extruder. In this case, as illustrated in FIGS. 7C and 1, the third bonding layer 150 may be further disposed on the lower surface of the protective layer 140, and may be laminated with the cover layer 130. Detailed description of the third bonding layer 150 will be described later.

8A through 8D are cross-sectional views illustrating an arrangement of a magnetic material in a protective layer according to various embodiments.

The plurality of magnetic bodies 142 may be uniformly disposed in the protective resin layer 141 as shown in FIG. 8A, but may have different concentrations for each region. For example, as illustrated in FIG. 8B, at least 50% of the magnetic body 142 may be disposed to face one surface of the protective layer 140 in the protective resin layer 141. In particular, when the magnetic body 142 is disposed to be adjacent to the outside of the cover sheet 100 in the protective layer 140, a greater magnetic force may be applied to the cover sheet 100. Further, the magnetic body 142 may be disposed with a concentration gradient in the thickness direction of the protective layer 140. In this case, the protective layer 140 not only has a higher magnetic force, but when the magnetic bodies 142 are concentrated in a direction away from the cover layer 130 disposed adjacent to the protective layer 140, the protective layer 140. Damage to the cover layer 130 due to the magnetic body 142 protruding out of the surface of the) can be prevented to minimize the deterioration of the heat radiation function.

The magnetic body 142 may extend in one direction or have an ellipsoid shape, as shown in FIGS. 8C and 8D. For example, the magnetic body 142 may have a long axis and a short axis. When the magnetic body 142 has a long axis and a short axis, as shown in FIG. 8C, the short axis direction of the magnetic body 142 coincides with the thickness direction of the protective layer 140, or as shown in FIG. 8D. The long axis direction of may be disposed to match the thickness direction of the protective layer 140. When the magnetic body 142 has a long axis and a short axis as shown in FIG. 8D, and the long axis is disposed in the thickness direction of the protective layer 140, the protective layer 140 may be cut to an appropriate size and shape in the thickness direction in a subsequent process. In this case, the cutting defect due to the magnetic body 142 or the occurrence of the magnetic debris due to the breakage of the magnetic body 142 may be minimized. In FIG. 8D, the length of the long axis of the magnetic body 142 is similar to the thickness of the protective layer 140, but the thickness of the protective layer 140 is not less than twice the length of the long axis of the magnetic body 142. In addition, the magnetic body 142 having the long axis facing the thickness direction may be arranged in two or more layers in the protective layer 140.

The magnetic body 142 may have a size of 0.1 to 100㎛. In a special case, the magnetic body 142 may have a size of several tens to several tens of nm, and in this case, by adsorbing a surfactant on the surface of the magnetic body, a stable colloidal state may be maintained in a dispersion medium such as hydrocarbon-based, ester-based, or fluorine-based. Magnetic fluid can be constructed.

The size of the magnetic body 142 may be uniform throughout the protective layer 140, but may have a normal distribution function.

9A to 9D are cross-sectional views illustrating arrangement of magnetic bodies in a protective layer according to still another embodiment.

9A to 9D illustrate that the protective layer 140_1 may include two or more magnetic materials. Hereinafter, an example in which the protective layer 140_1 includes the first magnetic body 142a and the second magnetic body 142b will be described.

The average particle size of the first magnetic body 142a and the second magnetic body 142b may be different. In detail, the first magnetic body 142a may have a larger size than the second magnetic body 142b and a second magnetic body 142b having a relatively small size in the empty space between the first magnetic bodies 142a may be disposed. As the second magnetic body 142b having a small size is disposed in a space between the first magnetic bodies 142a having a large size, a larger magnetic force may be applied. For example, when Fe having a mean size of 5 to 100 μm is generally applied to the first magnetic body 142a, and Ni having an average size of 0.5 to 10 μm is generally applied together as the second magnetic body 142b. When only Fe is disposed in the protective layer 140, Ni particles having a relatively small size may be disposed in the pores between the Fe particles, and thus the pores of the protective layer may be minimized to have a large magnetic force. Heat dissipation characteristics of the OLED display may be further improved. In the case of applying Fe and Ni as the magnetic body 142, Fe may be mixed in a large proportion or applied in the form of an alloy powder, and Fe and Ni of different sizes may be applied in a ratio of 6: 4 to 9: 1.

The first magnetic body 142a and the second magnetic body 142b having different sizes may be uniformly dispersed in the protective resin layer 141 as shown in FIG. 9A, or the first magnetic body (as shown in FIG. 9B). The 142a and the second magnetic body 142b may be disposed to face one surface of the protective resin layer 141. In particular, when the first magnetic body 142a and the second magnetic body 142b are disposed to be adjacent to the outside of the cover sheet 100 in the protective layer 140_1, a greater magnetic force may be applied to the cover sheet 100. have.

The first magnetic body 142a and / or the second magnetic body 142a may have a long axis and a short axis. 9C and 9D illustrate a case in which the first magnetic body 142a has a long axis and a short axis, and the second magnetic body 142a is formed in a spherical shape, but is not limited thereto.

Although the first magnetic body 142a and the second magnetic body 142b are separated from each other in the drawing, the present invention is not limited thereto, and the second magnetic body 142b having a relatively small size is the first magnetic body 142a having a large size. It may be disposed within the protective layer 140_1 as a structure adjacent to, attached to or bonded to the surface of the.

In addition, although not shown in the drawings, a plurality of magnetic materials may be arranged in the protective layer in a direction of thickness (z-axis) and / or in a plane direction (x-axis, y-axis) even if the magnetic body has a long axis and a short axis.

Referring back to FIG. 1, a third bonding layer 150 may be disposed between the cover layer 130 and the protective layer 140. The thickness of the third bonding layer 150 may be 5 to 25 μm or about 10 μm.

The third bonding layer 150 may be formed of a single layer or multiple layers. When the third bonding layer 150 is made of a single layer, the third bonding layer 150 is made of a hydrophobic material, thereby preventing moisture from entering the cover layer 130 and the organic light emitting device, which may be easily oxidized or corroded. You can block. In order to impart hydrophobicity, the third bonding layer 150 may include a polyolefin-based material which is not an acrylic or epoxy material, or may include clay, silica, titania, zirconia, and silicone oil. (silicon oil), hexamethyldisilazane (HMDS), trimethyl-chlorosilane (TMSCL), aminosilane (alkyl silane), alkyl silane (alkyl-silane), polydimethyl-siloxane (PDMS) and dimethyl dichlorosilane (DDS), high density polyethylene one or more of polyethylene, HDPE) and polyimide.

When the third bonding layer 150 is composed of two layers, the third bonding layer 150 may include a hydrophilic bonding layer and a hydrophobic bonding layer. In this case, the hydrophilic bonding layer may be disposed adjacent to the cover layer 130 to improve the bonding strength of the hydrophobic bonding layer, which may have a weak bonding force with the cover layer 130. In addition, the hydrophilic bonding layer and / or hydrophobic bonding layer may include an antistatic material.

The third bonding layer 150 may further include a moisture absorbent. By including the moisture absorbent, it is possible to prevent corrosion, oxidation, etc. of the cover layer 130, and further improve the WVTR characteristics of the cover sheet 100. In this case, it is preferable that a relatively small amount of the moisture absorbent is included so that the moisture absorbency of the third bonding layer 150 is equal to or less than that of the second bonding layer 120. When the amount of the moisture absorbent of the third bonding layer 150 is greater than the amount of the moisture absorbent of the second bonding layer 120, the moisture absorption is concentrated on the third bonding layer 150 disposed on the outer side, and the cover layer is concentrated. The heat dissipation function of the 130 may be degraded, and thus, the quality of the organic light emitting diode may be degraded or the life thereof may be shortened.

In addition, when the moisture absorbent is included in the third bonding layer 150, a moisture absorbent having a different moisture absorbent than the moisture absorbent of the second bonding layer 120 may be included. In this case, the material or size of the moisture absorbent may be different.

Similar to the first bonding layer 110 and the second bonding layer 120 described above, the third bonding layer 150 may have an intaglio pattern formed on the surface thereof, or a hot melt adhesive may be applied.

In some embodiments, the bonding layers 110, 120, and 150 including the moisture absorbent have a lower tensile modulus (hereinafter, 'elastic modulus') than the base substrate of the organic light emitting diode (see 400 in FIG. 12) and the cover layer 130. ) When the moisture absorbent reacts with water and expands in the bonding layers 110, 120, and 150, stress is generated, whereby the cover sheet 100 according to the present invention is peeled off from the base substrate 400 or organically. Problems such as bending of the light emitting display device and / or the components constituting the same may occur. Therefore, it is preferable that the bonding layers 110, 120, and 150 including the moisture absorbent have a sufficiently low elastic modulus to relieve the expansion stress due to the moisture absorption. Among the bonding layers 110, 120, and 150 including the moisture absorbent, the bonding layer having excellent moisture absorption power may have a relatively low elastic modulus. For example, when the moisture absorbent is included in the second bonding layer 120 and the moisture absorbent is not included in the first bonding layer 110, the elastic modulus of the second bonding layer 120 may be 0.01 MPa to 500 MPa. The elastic modulus of the first bonding layer 110 may be 500 MPa to 1,000 MPa. However, if the elastic modulus is too low, it may be rather easily deformed and may have an elastic modulus of 0.01 MPa or more based on room temperature (25 degrees). In order to have a low modulus of elasticity as described above, it can be achieved by adjusting the degree of curing of the bonding layer itself, but the WVTR characteristic may be lowered.

The bonding layer having a low elastic modulus property as described above may be a rubber-based resin, not an acrylic resin, for example, hydroxy group, carboxyl group, amine group, acrylic group, methacryl group, aldehyde group, epoxy group, maleic anhydride group, amide group and And isobutylene-isoprene rubber comprising at least one selected from the group consisting of combinations thereof.

In some embodiments, protective layer 140 and / or third bonding layer 150 may further include thermally conductive particles. The thermally conductive particles may be carbon materials such as carbon nanotubes, graphite, carbon fibers, or gold (Au), silver (Ag), nickel-phosphorous alloys (Ni-P alloys), nickel-boron alloys (Ni-B alloys), Beryllium (Be), chromium (Cr), zirconium (Zr), copper (Cu), cobalt (Co), aluminum (Al), magnesium (Mg), rhodium (Rh), zinc (Zn), tantalum (Ta), It may include at least one metal of iron (Fe), titanium (Ti), platinum (Pt), tungsten (W), molybdenum (Mo), manganese (Mn), iridium (Ir) and tin (Sn), but It is not limited, and may be a material having a thermal conductivity of at least 100 W / mK, such as beryllium oxide, aluminum nitride, and silicon carbide.

If nanoparticles such as carbon nanotubes (CNT) and silver (Ag) having a nanometer size among the thermally conductive particles are included in the protective layer 140, the protective layer 140 may further include an elastic polymer. In addition, the nanoparticles may be contained in a proportion of 0.1 to 10% by weight relative to the elastic polymer. If the content is less than 0.1% by weight, the thermal conductivity is significantly lowered. If the content is less than 10% by weight, the thermal conductivity is improved, but the buffering effect of the protective layer due to the elastic polymer is reduced, and the electrical short to the organic light emitting display device is reduced. May be caused.

When the third bonding layer 150 and / or the protective layer 140 including the thermally conductive particles are integrally formed with the cover layer 130, the cover sheet 100 has a vertical thermal conductivity or verticality of 100 to 500 W / mK. / May have a horizontal average thermal conductivity, but is not limited thereto.

Considering the encapsulation function of the cover sheet 100 and processability in manufacturing the cover sheet 100, the protective layer 140 is 80㎛ to 100㎛, the third bonding layer 150 is 10㎛, cover layer 130 Silver 70㎛, the sum of the second bonding layer 120 and the first bonding layer 110 may be formed to 50㎛. That is, the overall thickness of the cover sheet 100 may be 250 μm or less, or may be formed to a thickness of 210 μm to 230 μm.

As described above, the cover sheet 100 according to the exemplary embodiment includes a magnetic material 142 in the protective layer 140 while using a material having high heat dissipation and thermal conductivity in the cover layer 130, thereby transferring the sheet sheet 100 to operate as an electromagnet system. It can be transferred more easily using the device. Therefore, the productivity can be improved compared to the conventional method of cladding, plating, depositing, and joining ferromagnetic materials, improving problems such as thickness variation, pinholes, poor adhesion, and reducing the processing cost burden.

In addition, by arranging the cover layer 130 inside the organic light emitting diode display, the heat dissipation effect may be enhanced and the problem of oxidization may be minimized. The cover sheet 100 may have sufficient magnetic force during the manufacturing process of the organic light emitting display device. In addition, the heat transmitted from the cover layer 130 having a high heat dissipation performance may be more smoothly released to the outside, or heat may be rapidly spread on a plane to prevent thermal damage to the organic light emitting device 300.

10A-10D are plan views of cover sheets according to various embodiments, and FIGS. 11A-11F are cross-sectional views of cover sheets according to various embodiments.

The cover sheets 101-106 may further include a through hole h passing through the cover layer 130_1. As shown in FIG. 10A, the through holes h may be regularly arranged in a predetermined size on the cover layer 130, or through holes h of different sizes may be irregularly arranged as shown in FIG. 10B. have.

The planar shape of the through hole h may be circular as shown in FIGS. 10A and 10B, but is not limited thereto. The planar shape of the through hole h may be formed in the shape of a polygon such as a rectangle as shown in FIG. It may be formed in the form of a line extending to, or may be formed in a grid shape.

The through hole h may be formed to vertically penetrate the cover layer 130_1 in the thickness direction of the cover layer 130_1. In the portion where the through hole h is not formed, the cover layers 130_1 are formed to be connected to each other. The through hole h may be filled by at least one of the first bonding layer 110 and the third bonding layer 150 disposed on one surface and the other surface of the cover layer 130_1.

Specifically, as shown in FIG. 11A, the third bonding layer 150 may fill the through hole h of the cover layer 130_1 of the cover sheet 101, and as shown in FIG. 11B. Likewise, the lower first bonding layer 110 may fill the through hole h of the cover layer 130_1 of the cover sheet 102.

As another example, as illustrated in FIG. 11C, the third bonding layer of the cover sheet 103 may be omitted, and the first bonding layer 110 may fill the through hole h of the cover layer 130_1. In this case, the first bonding layer 110 filled with the through hole h may directly contact the protective layer 140.

As another example, through holes h may be formed in the bonding layers 110_1 and 150_1 disposed on one surface of the cover layer 130_1 as well as the cover layer 130_1 as in the cover sheets 104 and 105 of FIGS. 11D and 11E. Can be formed. In this case, the through hole h of the cover layer 130_1 and the bonding layers 110_1 and 150_1 may be integrally formed.

As illustrated in FIG. 11D, when the through hole h is formed in the first bonding layer 110_1, the third bonding layer 150 has the through hole h of the cover layer 130_1 and the first bonding layer 110_1. Is formed integrally with each other, and the third bonding layer 150 may contact the second bonding layer 120 by the through hole h.

As illustrated in FIG. 11E, when the through hole h is formed in the third bonding layer 150_1, the second bonding layer 120 includes the through hole h of the cover layer 130_1 and the third bonding layer 150_1. Filled and integrally formed, the first bonding layer 110 may contact the protective layer 140 by the through hole h.

As another example, the bonding layers 110 and 150 formed on both surfaces of the cover layer 130_1 of the cover sheet 106 may be integrally formed as the same bonding material. In this case, the cover layer 130_1 may be formed to be disposed inside the bonding layers 110 and 150, and the bonding layers 110 and 150 may be formed to have a structure surrounding the surface of the cover layer 130_1. The bonding layers 110 and 150 may be formed integrally with the through hole h. Upper surfaces of the bonding layers 110 and 150 may contact the protective layer 140 by the through hole h of the cover layer 130_1, and the lower surface may contact the second bonding layer 120.

As described above, when the cover layer 130_1 includes the plurality of through holes h, the bending property may be improved, and the bonding force between the cover layer 130_1 of the metal material and the layers of the adjacent nonmetal material may be increased. It is more robust when at least a portion of the bonding layers 110 and 150 are filled through the through holes h or when the bonding layers 110 and 150 are integrated on both sides of the cover layer 130_1 through the through holes h. It can have a bonding force. Therefore, even when the organic light emitting display is bent, the phenomenon in which adjacent layers are peeled off can be reduced.

The cover sheet 100 described above may be used to encapsulate the organic material of the organic electronic device. Hereinafter, an example of the organic light emitting display device 10 to which the cover sheet 100 is applied as the organic electronic device will be described.

12 is a cross-sectional view of an organic light emitting display device according to an embodiment.

Referring to FIG. 12, the organic light emitting display device 10 includes a base substrate 400, an organic light emitting device 300 disposed on the base substrate 400, and a passivation layer 200 disposed on the organic light emitting device 300. ), And a cover sheet 100 disposed on the passivation layer 200. The organic light emitting display device 10 may be a bottom light emitting display device.

The base substrate 400 may be made of a transparent material. For example, the base substrate 400 may be made of glass, plastic, or other polymer resin.

The organic light emitting diode 300 is disposed on the base substrate 400. The organic light emitting diode 300 includes an anode electrode, a cathode electrode, an organic light emitting layer disposed between the anode electrode and the cathode electrode. The organic light emitting layer emits light of a specific wavelength depending on the current provided. Although not illustrated in the drawings, a plurality of thin film transistors and signal wires for controlling a current flowing in the organic light emitting diode 300 may be further formed on the base substrate 400. In addition, a color filter may be disposed between the base substrate 400 and the organic light emitting diode 300.

The passivation layer 200 is disposed to cover the top surface of the organic light emitting device 300. The passivation layer 200 may be formed of an inorganic film or a laminated film of an organic film and an inorganic film. The water vapor transmission rate (WVTR) of the passivation layer 200 may be about 10 ⁻⁶ g / m ² / day.

The cover sheet 100 may be disposed on the passivation layer 200. The cover sheet 100 is disposed so that the second bonding layer 120 faces the passivation layer 200, and is attached on the top surface of the passivation layer 200 and / or the base substrate 400. Accordingly, as described above, the organic light emitting device 300 may be protected from moisture infiltration, heat dissipated from the organic light emitting device 300, and transfer may be facilitated by an electromagnet system.

More detailed information about the present invention will be described through the following specific preparation examples and experimental examples, and details not described herein will be omitted because they are sufficiently technically inferred by those skilled in the art.

<Manufacture example 1>

12 wt% of polyisobutylene (B100, Basf) as a binder (including 7 wt% of butyl rubber 268 (Exxon) as a compatibilizer) and hydrocarbon as a tackifier to prepare the first bonding layer. 24 wt% of resin (SU-640, Kolon Industries), 0.5 wt% of first core shell particles (461 DET 20D40, Expancel) having an outer diameter of 20 μm, 3 wt% of acrylic oligomers (BNO-2.0H, BNTM), moisture absorbent 31% by weight (CaO, Daejeong Chemical) and 0.5% by weight of photoinitiator (TPO, Irgacure) were added to 29% by weight of toluene as a solvent, mixed for 2 hours using a disk type stirrer, and 36㎛ silicone release PET (SG-31, SKC). ) Was applied using a slot die coater and dried at 125 ° C. in hot air to prepare a first bonding layer having a thickness of 40 μm.

12 wt% of polyisobutylene (B15FN, Basf) as a binder (including 7 wt% of butyl rubber 268, Exxon) as a binder to prepare a second bonding layer, and a hydrocarbon resin as a tackifier (SU-90 , 21% by weight of Kolon Industries), 2% by weight of acrylic oligomers (BNO-2.0H, BNTM), 0.5% by weight of photoinitiators (TPO, Irgacure), 11.5% by weight of the second core shell (SX866, JSR) having an outer diameter of 300 nm 53 wt% of toluene, a solvent, was mixed with a disk stirrer for 2 hours, applied to a 50 탆 silicon low-transfer releasing PET (RT42L, SKC H & M) using a slot die coater, and dried at 125 ° C. for hot air. A second bonding layer of 10 μm was prepared.

After laminating the prepared first bonding layer and the second bonding layer by using a 70 ° C. lamination, a cover sheet was prepared by irradiating 1,000mJ of UV light amount.

To prepare a protective layer, 24 parts by weight of polypropylene (MI 3.8, Lotte Chemical) and 70 parts by weight of carbonyl iron powder (MK) having an average size of 8 μm and 1 part by weight of silicone oil (TSF-0.3M, GE Toshiba) And 5 parts by weight of polyethylene wax (L-C102N, Lion Chemtech) were mixed with a stirrer. The mixed sample was put into a 42 mm twin screw extruder heated to 210 ° C. to prepare a ferromagnetic polymer chip in a masterbatch form containing 70% of carbonyl iron powder. 40 parts by weight of polypropylene (MI 3.8, Lotte Chemical) was mixed with 100 parts by weight of the ferromagnetic polymer chip manufactured by masterbatch, and fed into a 42 mm twin screw extruder heated to 210 ° C., and calendered through T-die to form carbonyl iron powder. A protective layer having a thickness of 100 μm containing 50% was prepared.

To prepare the cover layer and the third bonding layer, 1 part by weight of a thermosetting curing agent (45S, Burim Chemical) and 49 parts by weight of a diluting solvent methyl ethyl ketone were mixed with 50 parts by weight of an acrylic resin (BA8900, Burim Chemical), 70 µm aluminum foil ( 1,000 Serise, Lotte Aluminum) was applied using a slot die coater, and 125 ° C hot air drying, followed by thermal curing in an oven at 60 ° C for 24 hours to prepare a cover layer coated with a third bonding layer having a thickness of 10 μm.

After the protective layer and the cover layer coated with the third bonding layer are laminated, the bonding surface of the protective layer and the third bonding layer is laminated, and then the aluminum surface of the cover layer coated with the third bonding layer and the bonding surface of the first bonding layer are coated. The cover sheet was manufactured by laminating.

<Manufacture example 2-8>

A cover sheet was prepared in the same manner as in Preparation Example 1, except that 100 parts by weight of the ferromagnetic polymer chip was changed to parts by weight of polypropylene and carbonyl iron powder.

Polypropylene (parts by weight) Carbonyl Iron Powder (parts by weight) Carbonyl Iron Powder Content (wt%) in Protective Layer Preparation Example 1 40 0 50 Preparation Example 2 75 0 40 Preparation Example 3 133 0 30 Preparation Example 4 250 0 20 Preparation Example 5 600 0 10 Preparation Example 6 16 0 60 Preparation Example 7 0 0 70 Preparation Example 8 0 50 80

Comparative Example 1

A cover sheet was prepared in the same manner as in Preparation Example 1, except that the ferromagnetic polymer of Preparation Example 1 was changed to nickel powder.

Comparative Example 2

A cover sheet was manufactured in the same manner as in Preparation Example 1, except that the polypropylene of Preparation Example 1 was changed to a polystyrene-butadiene styrene (SBS) resin.

Comparative Example 3

Except for the protective layer in Preparation Example 1, a third die bonding layer was prepared by mixing 49 parts by weight of an acrylic oligomer (BNO-2.0H, BNTM), 1.0 part by weight of a photoinitiator (TPO, Irgacure), and 50 parts by weight of carbonyl iron powder. After coating the aluminum foil with a coater to a thickness of 100 ㎛ and irradiated with UV light amount of 1,000mJ to prepare a cover layer, the cover sheet was prepared by laminating the adhesion surface of the third bonding layer and the first bonding layer.

<Comparative Example 4>

In Comparative Example 3, 50 μm PET (V7000, SKC) was laminated to the third bonding layer of the cover sheet, and the aluminum surface of the cover layer and the adhesive side of the first bonding layer were laminated to prepare a cover sheet including a magnetic material.

Experimental Example 1 Moldability of Protective Layer

The thickness uniformity and the presence / absence of the pinholes were confirmed when forming the protective layer, and it was judged to be good when the thickness was ± 5% and there was no pinhole. In addition, when the protective layer was not formed, it described with X.

Experimental Example 2 Evaluation of Thermal Conductivity

 Thermal conductivity measurement was measured by the Laser Flash method, KS L 9016: 2010 (plate heat flow meter method) using a thermal conductivity measuring device (LFA-457, NETZCH). It was judged that it was favorable if it was 150 W / m.K or more. The thermal conductivity of the aluminum itself was measured at 218 W / m.k.

Experimental Example 3 Magnetic Strength Evaluation

 Magnetic strength evaluation was measured when the cover sheet was cut to 50mm x 50mm and then attached to the protective layer 10mm x 10mm size to the protective layer and peeled at a 90-degree angle at 60mm / min speed using a UTM. It was judged to be good up to 50% level compared to the magnetic strength of the existing metal foil, and less than that. The magnetic strength of the existing metal foil was measured at 60 gf.

Experimental Example 4 Evaluation of Moisture Penetration

After cutting the specimen of the cover sheet 90mm x 90mm, the release film on the surface of the second bonding layer was removed. The second bonding layer was centrally aligned on a well-cleaned 0.5T x 100mm x 100mm alkali-free glass and pressurized for 5 minutes with a 65 ° C vacuum laminator. After completion of the adhesion, the sample was placed in a reliability chamber (temperature 85 ° C / humidity 85%), and the length of water penetration up to 1,000 hours in 100 hours was observed with a 50x digital microscope, and the final penetration length was recorded. It was judged to be good if the final penetration length was similar to the sample measurement results laminated to glass to glass. The measurement result of the glass-to-glass laminated sample measured 1.5 mm / 1,000 hr.

Table 2 shows the results according to Experimental Examples 1 to 4.

Protective layer formability Thermal conductivity
(W / mK) Magnetic Century
(gf) Moisture penetration
(mm / 1,000hr) Preparation Example 1 Good 198 58 1.5 Preparation Example 2 Good 195 45 1.5 Preparation Example 3 Good 160 32 1.5 Preparation Example 4 Good 118 11 1.5 Preparation Example 5 Good 55 0 1.5 Preparation Example 6 Pinhole generation 199 70 1.5 Preparation Example 7 Pin Hole, Thickness Deviation 200 85 1.5 Preparation Example 8 X - - - Comparative Example 1 Good 173 21 1.5 Comparative Example 2 X - - - Comparative Example 3 - 200 48 1.9 Comparative Example 4 - 132 33 1.5

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

100: cover sheet
110: first bonding layer
120: second bonding layer
130: cover layer
140: protective layer
142: magnetic material
150: third bonding layer

Claims (10)

Bottom junction layer;
A cover layer on the lower bonding layer; And
A protective layer on the top of the cover layer, comprising a protective layer comprising a protective resin layer and a magnetic body disposed in the protective resin layer,
The lower bonding layer includes a first bonding layer and a second bonding layer disposed below the first bonding layer,
The first bonding layer comprises a first bonding component layer, a moisture absorbent and first core shell particles,
The second bonding layer includes a second core shell particles made of a material different from the first core shell particles,
The first core shell particles comprise a first shell and a first core surrounded by the first shell,
The second coreshell particles include a second shell and a second core surrounded by the second shell,
The shrinkage deformation force of the first core shell particles is less than the surface deformation force of the first bonding component layer, and thus deforms more easily,
And the first core is empty or filled with gas. According to claim 1,
The magnetic sheet includes at least one of iron (Fe), nickel (Ni), cadmium (Cd), and MPP. The method of claim 2,
The magnetic sheet is 40 to 70% by weight based on the total weight of the protective layer cover sheet. The method of claim 3, wherein
Magnetic strength of the cover sheet is 40gf to 200gf cover sheet. According to claim 1,
The cover sheet comprises aluminum cover sheet. According to claim 1,
The cover sheet has a thermal conductivity of 150 to 450 W / mK. delete delete According to claim 1,
The cover sheet further comprises a third bonding layer disposed between the cover layer and the protective layer. Board;
An organic light emitting device disposed on the substrate; And
An organic electronic device comprising a cover sheet according to any one of claims 1 to 6 and 9 disposed on the organic light emitting device.

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