KR102515877B1 - 워크 가공용 시트 및 가공된 워크의 제조방법 - Google Patents

워크 가공용 시트 및 가공된 워크의 제조방법 Download PDF

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Publication number
KR102515877B1
KR102515877B1 KR1020207008253A KR20207008253A KR102515877B1 KR 102515877 B1 KR102515877 B1 KR 102515877B1 KR 1020207008253 A KR1020207008253 A KR 1020207008253A KR 20207008253 A KR20207008253 A KR 20207008253A KR 102515877 B1 KR102515877 B1 KR 102515877B1
Authority
KR
South Korea
Prior art keywords
sensitive adhesive
pressure
sheet
adhesive layer
workpiece
Prior art date
Application number
KR1020207008253A
Other languages
English (en)
Korean (ko)
Other versions
KR20200094728A (ko
Inventor
타카후미 오가사와라
미사키 사카모토
나오야 사이키
Original Assignee
린텍 가부시키가이샤
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Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20200094728A publication Critical patent/KR20200094728A/ko
Application granted granted Critical
Publication of KR102515877B1 publication Critical patent/KR102515877B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Details Of Cutting Devices (AREA)
KR1020207008253A 2017-12-07 2018-09-12 워크 가공용 시트 및 가공된 워크의 제조방법 KR102515877B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017235377 2017-12-07
JPJP-P-2017-235377 2017-12-07
PCT/JP2018/033767 WO2019111481A1 (ja) 2017-12-07 2018-09-12 ワーク加工用シートおよび加工済みワークの製造方法

Publications (2)

Publication Number Publication Date
KR20200094728A KR20200094728A (ko) 2020-08-07
KR102515877B1 true KR102515877B1 (ko) 2023-03-30

Family

ID=66750873

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207008253A KR102515877B1 (ko) 2017-12-07 2018-09-12 워크 가공용 시트 및 가공된 워크의 제조방법
KR1020207008252A KR102579064B1 (ko) 2017-12-07 2018-11-27 워크 가공용 시트 및 가공된 워크의 제조방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207008252A KR102579064B1 (ko) 2017-12-07 2018-11-27 워크 가공용 시트 및 가공된 워크의 제조방법

Country Status (5)

Country Link
JP (2) JP7162612B2 (zh)
KR (2) KR102515877B1 (zh)
CN (2) CN111149191B (zh)
TW (2) TWI783085B (zh)
WO (2) WO2019111481A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021095449A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 粘着シート剥離方法
JP7490399B2 (ja) * 2020-03-13 2024-05-27 日東電工株式会社 再剥離粘着テープ
JP2024010412A (ja) * 2022-07-12 2024-01-24 日東電工株式会社 保護シート

Citations (4)

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Publication number Priority date Publication date Assignee Title
WO2012032907A1 (ja) 2010-09-07 2012-03-15 リンテック株式会社 粘着シート、及び電子デバイス
JP2013067708A (ja) 2011-09-21 2013-04-18 Nitto Denko Corp 塗膜保護シートおよびその製造方法
WO2016199787A1 (ja) 2015-06-12 2016-12-15 東亞合成株式会社 粘着剤組成物及びその製造方法、並びに粘着製品
JP2017069476A (ja) 2015-10-01 2017-04-06 リンテック株式会社 ダイシングダイボンディングシート

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JPS5352496Y2 (zh) 1973-06-21 1978-12-15
JPH09213663A (ja) * 1996-02-06 1997-08-15 Mitsui Toatsu Chem Inc 半導体ウエハの加工方法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP2007069476A (ja) * 2005-09-07 2007-03-22 Toppan Printing Co Ltd インク吐出ヘッドのノズル面インク付着低減方法およびインク吐出ヘッド
CN102245379B (zh) * 2008-12-12 2015-06-24 琳得科株式会社 叠层体、其制造方法、电子设备构件和电子设备
JP5027321B2 (ja) * 2010-09-24 2012-09-19 古河電気工業株式会社 半導体加工用テープ
JP2011046964A (ja) 2010-11-19 2011-03-10 Nitto Denko Corp 粘着テープ及び粘着テープ用基材
JP5117630B1 (ja) * 2012-07-06 2013-01-16 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよびそれを用いた半導体ウェハの製造方法
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012032907A1 (ja) 2010-09-07 2012-03-15 リンテック株式会社 粘着シート、及び電子デバイス
JP2013067708A (ja) 2011-09-21 2013-04-18 Nitto Denko Corp 塗膜保護シートおよびその製造方法
WO2016199787A1 (ja) 2015-06-12 2016-12-15 東亞合成株式会社 粘着剤組成物及びその製造方法、並びに粘着製品
JP2017069476A (ja) 2015-10-01 2017-04-06 リンテック株式会社 ダイシングダイボンディングシート

Also Published As

Publication number Publication date
KR20200094727A (ko) 2020-08-07
TWI809030B (zh) 2023-07-21
CN111149192B (zh) 2023-09-15
JPWO2019111760A1 (ja) 2020-12-17
CN111149191B (zh) 2023-08-29
KR102579064B1 (ko) 2023-09-15
WO2019111481A1 (ja) 2019-06-13
TW202010807A (zh) 2020-03-16
CN111149191A (zh) 2020-05-12
CN111149192A (zh) 2020-05-12
KR20200094728A (ko) 2020-08-07
TWI783085B (zh) 2022-11-11
JPWO2019111481A1 (ja) 2020-12-24
JP7162614B2 (ja) 2022-10-28
WO2019111760A1 (ja) 2019-06-13
JP7162612B2 (ja) 2022-10-28
TW201927964A (zh) 2019-07-16

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