JP7162612B2 - ワーク加工用シートおよび加工済みワークの製造方法 - Google Patents
ワーク加工用シートおよび加工済みワークの製造方法 Download PDFInfo
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- JP7162612B2 JP7162612B2 JP2019558016A JP2019558016A JP7162612B2 JP 7162612 B2 JP7162612 B2 JP 7162612B2 JP 2019558016 A JP2019558016 A JP 2019558016A JP 2019558016 A JP2019558016 A JP 2019558016A JP 7162612 B2 JP7162612 B2 JP 7162612B2
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- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Details Of Cutting Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017235377 | 2017-12-07 | ||
| JP2017235377 | 2017-12-07 | ||
| PCT/JP2018/033767 WO2019111481A1 (ja) | 2017-12-07 | 2018-09-12 | ワーク加工用シートおよび加工済みワークの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2019111481A1 JPWO2019111481A1 (ja) | 2020-12-24 |
| JP7162612B2 true JP7162612B2 (ja) | 2022-10-28 |
Family
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|---|---|---|---|
| JP2019558016A Active JP7162612B2 (ja) | 2017-12-07 | 2018-09-12 | ワーク加工用シートおよび加工済みワークの製造方法 |
| JP2019558150A Active JP7162614B2 (ja) | 2017-12-07 | 2018-11-27 | ワーク加工用シートおよび加工済みワークの製造方法 |
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| JP2019558150A Active JP7162614B2 (ja) | 2017-12-07 | 2018-11-27 | ワーク加工用シートおよび加工済みワークの製造方法 |
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| Country | Link |
|---|---|
| JP (2) | JP7162612B2 (zh) |
| KR (2) | KR102515877B1 (zh) |
| CN (2) | CN111149191B (zh) |
| TW (2) | TWI783085B (zh) |
| WO (2) | WO2019111481A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7523216B2 (ja) * | 2019-12-13 | 2024-07-26 | 日東電工株式会社 | 粘着シート剥離方法 |
| JP7490399B2 (ja) * | 2020-03-13 | 2024-05-27 | 日東電工株式会社 | 再剥離粘着テープ |
| JP2024010412A (ja) * | 2022-07-12 | 2024-01-24 | 日東電工株式会社 | 保護シート |
Citations (5)
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|---|---|---|---|---|
| JP2013067708A (ja) | 2011-09-21 | 2013-04-18 | Nitto Denko Corp | 塗膜保護シートおよびその製造方法 |
| WO2015190432A1 (ja) | 2014-06-12 | 2015-12-17 | 東レ株式会社 | 積層体およびその製造方法 |
| WO2016199787A1 (ja) | 2015-06-12 | 2016-12-15 | 東亞合成株式会社 | 粘着剤組成物及びその製造方法、並びに粘着製品 |
| JP2017069474A (ja) | 2015-10-01 | 2017-04-06 | イビデン株式会社 | 回路基板及びその製造方法 |
| JP2018172596A (ja) | 2017-03-31 | 2018-11-08 | 株式会社クレハ | フッ化ビニリデン共重合体粒子及びその利用 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5019657B2 (zh) | 1972-02-08 | 1975-07-09 | ||
| JPS5352496Y2 (zh) | 1973-06-21 | 1978-12-15 | ||
| JPH09213663A (ja) * | 1996-02-06 | 1997-08-15 | Mitsui Toatsu Chem Inc | 半導体ウエハの加工方法 |
| JP4800778B2 (ja) * | 2005-05-16 | 2011-10-26 | 日東電工株式会社 | ダイシング用粘着シート及びそれを用いた被加工物の加工方法 |
| JP2007069476A (ja) | 2005-09-07 | 2007-03-22 | Toppan Printing Co Ltd | インク吐出ヘッドのノズル面インク付着低減方法およびインク吐出ヘッド |
| JP5666311B2 (ja) * | 2008-12-12 | 2015-02-12 | リンテック株式会社 | 積層体、その製造方法、電子デバイス部材および電子デバイス |
| WO2012032907A1 (ja) * | 2010-09-07 | 2012-03-15 | リンテック株式会社 | 粘着シート、及び電子デバイス |
| JP5027321B2 (ja) * | 2010-09-24 | 2012-09-19 | 古河電気工業株式会社 | 半導体加工用テープ |
| JP2011046964A (ja) * | 2010-11-19 | 2011-03-10 | Nitto Denko Corp | 粘着テープ及び粘着テープ用基材 |
| JP5117630B1 (ja) * | 2012-07-06 | 2013-01-16 | 古河電気工業株式会社 | 半導体ウェハ表面保護用粘着テープおよびそれを用いた半導体ウェハの製造方法 |
| JP6343883B2 (ja) * | 2013-07-29 | 2018-06-20 | 東亞合成株式会社 | 活性エネルギー線硬化型樹脂組成物 |
| JP6210827B2 (ja) * | 2013-10-04 | 2017-10-11 | リンテック株式会社 | 半導体加工用シート |
| JP6140066B2 (ja) * | 2013-12-10 | 2017-05-31 | リンテック株式会社 | 半導体加工用シート |
| JP6424205B2 (ja) * | 2014-03-03 | 2018-11-14 | リンテック株式会社 | 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法 |
| JP6019054B2 (ja) * | 2014-03-24 | 2016-11-02 | 富士フイルム株式会社 | ガスバリアフィルムおよびガスバリアフィルムの製造方法 |
| JP6272109B2 (ja) * | 2014-03-31 | 2018-01-31 | リンテック株式会社 | 粘着剤組成物、粘着シート、および粘着シートの製造方法 |
| JP6610256B2 (ja) * | 2014-07-22 | 2019-11-27 | 三菱ケミカル株式会社 | 活性エネルギー線硬化性粘着剤組成物、これを用いてなる粘着剤、及び粘着シート |
| JP6521823B2 (ja) * | 2015-10-01 | 2019-05-29 | リンテック株式会社 | ダイシングダイボンディングシート |
| JP2017132874A (ja) | 2016-01-27 | 2017-08-03 | リンテック株式会社 | 電子部品貼付用アースラベル |
-
2018
- 2018-09-12 CN CN201880063272.2A patent/CN111149191B/zh active Active
- 2018-09-12 WO PCT/JP2018/033767 patent/WO2019111481A1/ja active Application Filing
- 2018-09-12 JP JP2019558016A patent/JP7162612B2/ja active Active
- 2018-09-12 KR KR1020207008253A patent/KR102515877B1/ko active IP Right Grant
- 2018-11-27 WO PCT/JP2018/043553 patent/WO2019111760A1/ja active Application Filing
- 2018-11-27 JP JP2019558150A patent/JP7162614B2/ja active Active
- 2018-11-27 KR KR1020207008252A patent/KR102579064B1/ko active IP Right Grant
- 2018-11-27 CN CN201880063344.3A patent/CN111149192B/zh active Active
- 2018-11-30 TW TW107142910A patent/TWI783085B/zh active
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2019
- 2019-01-15 TW TW108101471A patent/TWI809030B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013067708A (ja) | 2011-09-21 | 2013-04-18 | Nitto Denko Corp | 塗膜保護シートおよびその製造方法 |
| WO2015190432A1 (ja) | 2014-06-12 | 2015-12-17 | 東レ株式会社 | 積層体およびその製造方法 |
| WO2016199787A1 (ja) | 2015-06-12 | 2016-12-15 | 東亞合成株式会社 | 粘着剤組成物及びその製造方法、並びに粘着製品 |
| JP2017069474A (ja) | 2015-10-01 | 2017-04-06 | イビデン株式会社 | 回路基板及びその製造方法 |
| JP2018172596A (ja) | 2017-03-31 | 2018-11-08 | 株式会社クレハ | フッ化ビニリデン共重合体粒子及びその利用 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200094727A (ko) | 2020-08-07 |
| CN111149191B (zh) | 2023-08-29 |
| CN111149191A (zh) | 2020-05-12 |
| TWI809030B (zh) | 2023-07-21 |
| JP7162614B2 (ja) | 2022-10-28 |
| JPWO2019111481A1 (ja) | 2020-12-24 |
| JPWO2019111760A1 (ja) | 2020-12-17 |
| KR20200094728A (ko) | 2020-08-07 |
| TW202010807A (zh) | 2020-03-16 |
| WO2019111760A1 (ja) | 2019-06-13 |
| TWI783085B (zh) | 2022-11-11 |
| KR102515877B1 (ko) | 2023-03-30 |
| TW201927964A (zh) | 2019-07-16 |
| CN111149192A (zh) | 2020-05-12 |
| WO2019111481A1 (ja) | 2019-06-13 |
| KR102579064B1 (ko) | 2023-09-15 |
| CN111149192B (zh) | 2023-09-15 |
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