KR102449287B1 - 이방 도전성 필름 및 접속 구조체 - Google Patents

이방 도전성 필름 및 접속 구조체 Download PDF

Info

Publication number
KR102449287B1
KR102449287B1 KR1020197032484A KR20197032484A KR102449287B1 KR 102449287 B1 KR102449287 B1 KR 102449287B1 KR 1020197032484 A KR1020197032484 A KR 1020197032484A KR 20197032484 A KR20197032484 A KR 20197032484A KR 102449287 B1 KR102449287 B1 KR 102449287B1
Authority
KR
South Korea
Prior art keywords
axis
conductive
particle
conductive particles
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197032484A
Other languages
English (en)
Korean (ko)
Other versions
KR20190126456A (ko
Inventor
세이이치로 시노하라
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20190126456A publication Critical patent/KR20190126456A/ko
Application granted granted Critical
Publication of KR102449287B1 publication Critical patent/KR102449287B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01315—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01333—Manufacture or treatment of die-attach connectors using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01335—Manufacture or treatment of die-attach connectors using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020197032484A 2015-05-27 2016-05-27 이방 도전성 필름 및 접속 구조체 Active KR102449287B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPJP-P-2015-120627 2015-05-27
JP2015120627 2015-05-27
JPJP-P-2015-108662 2015-05-28
JP2015108662 2015-05-28
KR1020177032131A KR102042400B1 (ko) 2015-05-27 2016-05-27 이방 도전성 필름 및 접속 구조체
PCT/JP2016/065802 WO2016190432A1 (ja) 2015-05-27 2016-05-27 異方導電性フィルム及び接続構造体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177032131A Division KR102042400B1 (ko) 2015-05-27 2016-05-27 이방 도전성 필름 및 접속 구조체

Publications (2)

Publication Number Publication Date
KR20190126456A KR20190126456A (ko) 2019-11-11
KR102449287B1 true KR102449287B1 (ko) 2022-09-29

Family

ID=57392975

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197032484A Active KR102449287B1 (ko) 2015-05-27 2016-05-27 이방 도전성 필름 및 접속 구조체
KR1020177032131A Active KR102042400B1 (ko) 2015-05-27 2016-05-27 이방 도전성 필름 및 접속 구조체

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177032131A Active KR102042400B1 (ko) 2015-05-27 2016-05-27 이방 도전성 필름 및 접속 구조체

Country Status (6)

Country Link
US (2) US10546831B2 (https=)
JP (2) JP7233156B2 (https=)
KR (2) KR102449287B1 (https=)
CN (2) CN111640528B (https=)
TW (1) TWI711222B (https=)
WO (1) WO2016190432A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016190432A1 (ja) * 2015-05-27 2016-12-01 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
US12550783B2 (en) * 2016-05-17 2026-02-10 Taiwan Semiconductor Manufacturing Company, Ltd. Device and method for UBM/RDL routing
US11644717B2 (en) * 2018-01-17 2023-05-09 Sekisui Chemical Co., Ltd. Dimming laminate and resin spacer for dimming laminate
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
KR102519126B1 (ko) * 2018-03-30 2023-04-06 삼성디스플레이 주식회사 표시 장치
CN112166529A (zh) * 2018-06-06 2021-01-01 迪睿合株式会社 连接体、连接体的制造方法、连接方法
WO2019235596A1 (ja) * 2018-06-06 2019-12-12 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法
US11694988B2 (en) 2018-08-08 2023-07-04 Dexerials Corporation Anisotropic conductive film
JP2020095922A (ja) * 2018-12-14 2020-06-18 デクセリアルズ株式会社 異方性導電フィルム
US11488841B2 (en) * 2019-02-20 2022-11-01 Electronics And Telecommunications Research Institute Method for manufacturing semiconductor package
WO2021161934A1 (ja) * 2020-02-12 2021-08-19 デクセリアルズ株式会社 擬似ランダムドットパターン及びその作成方法
KR102774692B1 (ko) 2020-03-10 2025-03-05 삼성디스플레이 주식회사 표시장치
WO2021187591A1 (ja) * 2020-03-19 2021-09-23 デクセリアルズ株式会社 接続体、及び接続体の製造方法
CN113764468A (zh) * 2020-06-05 2021-12-07 三星显示有限公司 显示装置和制造显示装置的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003208931A (ja) * 2002-10-04 2003-07-25 Hitachi Chem Co Ltd 接続部材
JP2009076431A (ja) * 2007-01-31 2009-04-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
JP2011068913A (ja) * 2010-12-24 2011-04-07 Sony Chemical & Information Device Corp 異方性導電接着フィルム、接続構造体及びその製造方法
WO2014034741A1 (ja) * 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP2014044948A (ja) 2012-08-01 2014-03-13 Dexerials Corp 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE794600A (fr) 1972-01-28 1973-05-16 Usel Hubert Cartouche sans etui pour mise a feu electrique
JPH0574512A (ja) 1991-09-12 1993-03-26 Japan Aviation Electron Ind Ltd 電気接続用コネクタ
JPH09320345A (ja) * 1996-05-31 1997-12-12 Whitaker Corp:The 異方導電性フィルム
JP3624818B2 (ja) 1999-10-12 2005-03-02 ソニーケミカル株式会社 異方性導電接続材料、接続体、およびその製造方法
JP2005327509A (ja) 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP4887700B2 (ja) 2005-09-09 2012-02-29 住友ベークライト株式会社 異方導電性フィルムおよび電子・電機機器
CN101556838B (zh) * 2008-04-09 2011-06-01 北京京东方光电科技有限公司 各向异性导电膜
JP5185839B2 (ja) 2009-01-07 2013-04-17 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5583647B2 (ja) 2011-05-02 2014-09-03 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
JP2013018833A (ja) 2011-07-08 2013-01-31 Hitachi Chemical Co Ltd 回路部材接続用接続部材、回路部材接続構造体の製造方法及び回路部材接続構造体
JP2013077557A (ja) 2011-09-13 2013-04-25 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP5737278B2 (ja) 2011-12-21 2015-06-17 日立化成株式会社 回路接続材料、接続体、及び接続体を製造する方法
US9719407B2 (en) * 2012-08-03 2017-08-01 Ford Global Technologies, Llc Method for regulating engine temperature
KR101716945B1 (ko) 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6044254B2 (ja) * 2012-10-15 2016-12-14 日立化成株式会社 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体
JP6333626B2 (ja) 2013-05-29 2018-05-30 積水化学工業株式会社 突起粒子、導電性粒子、導電材料及び接続構造体
WO2016190432A1 (ja) * 2015-05-27 2016-12-01 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003208931A (ja) * 2002-10-04 2003-07-25 Hitachi Chem Co Ltd 接続部材
JP2009076431A (ja) * 2007-01-31 2009-04-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
JP2011068913A (ja) * 2010-12-24 2011-04-07 Sony Chemical & Information Device Corp 異方性導電接着フィルム、接続構造体及びその製造方法
JP2014044948A (ja) 2012-08-01 2014-03-13 Dexerials Corp 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体
WO2014034741A1 (ja) * 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法

Also Published As

Publication number Publication date
TW201717489A (zh) 2017-05-16
US10892243B2 (en) 2021-01-12
JP7233156B2 (ja) 2023-03-06
CN107534231B (zh) 2020-04-14
CN107534231A (zh) 2018-01-02
JP2022043193A (ja) 2022-03-15
KR20170134679A (ko) 2017-12-06
US20200161268A1 (en) 2020-05-21
TWI711222B (zh) 2020-11-21
CN111640528A (zh) 2020-09-08
WO2016190432A1 (ja) 2016-12-01
HK1246509A1 (zh) 2018-09-07
CN111640528B (zh) 2022-06-28
KR20190126456A (ko) 2019-11-11
US20180301432A1 (en) 2018-10-18
US10546831B2 (en) 2020-01-28
JP2016225296A (ja) 2016-12-28
KR102042400B1 (ko) 2019-11-08
JP7356046B2 (ja) 2023-10-04

Similar Documents

Publication Publication Date Title
KR102449287B1 (ko) 이방 도전성 필름 및 접속 구조체
JP7004058B2 (ja) 異方導電性フィルム及び接続構造体
JP2022133317A (ja) 異方導電性フィルム及び接続構造体
JP2022093343A (ja) フィラー含有フィルム
KR102243340B1 (ko) 이방성 도전 필름
KR102048695B1 (ko) 이방성 도전 필름 및 접속 구조체
CN112534650B (zh) 各向异性导电薄膜
CN106797081A (zh) 各向异性导电膜及连接结构体
CN112117257A (zh) 各向异性导电膜
KR20240025047A (ko) 이방 도전성 필름 및 접속 구조체
KR102267650B1 (ko) 이방성 도전 필름
KR102951569B1 (ko) 이방성 도전 필름, 접속 구조체, 접속 구조체의 제조 방법
KR20240051204A (ko) 도전 필름, 접속 구조체 및 그 제조 방법
HK40037297B (en) Anisotropic conductive film and connection structure
HK40037297A (en) Anisotropic conductive film and connection structure
HK1246509B (zh) 各向异性导电性膜及连接构造体
HK40050768A (en) Anisotropic electroconductive film

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 4