CN106797081A - 各向异性导电膜及连接结构体 - Google Patents

各向异性导电膜及连接结构体 Download PDF

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Publication number
CN106797081A
CN106797081A CN201580055622.7A CN201580055622A CN106797081A CN 106797081 A CN106797081 A CN 106797081A CN 201580055622 A CN201580055622 A CN 201580055622A CN 106797081 A CN106797081 A CN 106797081A
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anisotropic conductive
conductive film
arrangement
conducting particles
terminal
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CN106797081B (zh
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筱原诚郎
筱原诚一郎
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract

一种各向异性导电膜(1A)，其包含绝缘粘接剂层(3)、和配置于该绝缘粘接剂层(3)的导电粒子(2)，导电粒子(2)通过沿第1方向和第2方向排列而格子状地配置，在至少一个方向的排列(S)、(T)中，在相邻的排列的间隔a、b、c设置宽窄。由此，即使在凸块间距精细化了的FOG连接等中，也可以使用各向异性导电膜将对置的端子稳定地连接，进一步可以容易地进行连接后的检查，此外，使不参与连接的导电粒子的数目降低而使各向异性导电膜的制造成本降低。

Description

各向异性导电膜及连接结构体
技术领域
本发明涉及各向异性导电膜、使用各向异性导电膜的连接方法以及用各向异性导电膜连接而得的连接结构体。
背景技术
各向异性导电膜在将IC芯片等电子部件安装于基板时被广泛使用。近年来，在便携电话、笔记本个人电脑等小型电子设备中要求配线的高密度化，作为使各向异性导电膜适应该高密度化的方法，已知在各向异性导电膜的绝缘粘接剂层中矩阵状地均等地配置导电粒子的技术。
然而，即使均等地配置导电粒子也会产生连接电阻偏差这样的问题。这是因为，有时位于端子的周缘上的导电粒子未被上下对置的端子夹着。针对该问题，提出了使导电粒子的第1排列方向为各向异性导电膜的长度方向，使与第1排列方向交叉的第2排列方向相对于与各向异性导电膜的长度方向正交的方向以5°以上15°以下倾斜(专利文献1)。
现有技术文献
专利文献
专利文献1：日本特许4887700号公报
发明内容
发明所要解决的课题
然而，在将液晶面板与FPC进行连接的FOG(玻璃上的FPC(FPC on Glass))连接等中，如果要连接的凸块尺寸进一步变小且凸块间距精细化，则上述以往的各向异性导电膜难以确实地取得导通。对此，考虑到提高各向异性导电膜中的导电粒子的配置密度，但仅仅提高导电粒子的配置密度，有时也不能在要各向异性导电连接的对置的端子充分地捕集导电粒子，另一方面，通过提高导电粒子的配置密度也产生变得易于发生短路这样的问题。此外，产生不参与连接的导电粒子没有必要地变多、各向异性导电膜的制造成本上升这样的问题。
因此，本发明的课题是，即使在凸块间距精细化了的FOG连接等中，也可以使用各向异性导电膜稳定地连接对置的端子，进一步可以容易地进行连接后的检查，此外，使不参与连接的导电粒子的数目降低而使各向异性导电膜的制造成本降低。
用于解决课题的方法
本发明人发现如下内容，并完成了本发明：(i)在将均等地配置了导电粒子并且仅仅提高了导电粒子的配置密度的各向异性导电膜使用于FOG连接的情况下无法取得导通或发生短路是因为，在各向异性导电连接时熔融的绝缘性树脂沿着端子的长度方向流动，由此，本来位于端子上的导电粒子流动而从端子上脱落，从而端子变得不能捕集导电粒子，或者，导电粒子流入在水平方向上相邻的端子间，导电粒子彼此连结而使相邻的端子短路，(ii)为了防止这种情况，如下的操作是有效的：在绝缘粘接剂层格子状地配置导电粒子时，在格子间隔设置宽窄而在各向异性导电膜形成导电粒子的疏区域和密区域，将对置的端子进行各向异性导电连接时，以在对置的端子间包含导电粒子的密区域的方式配置，并且导电粒子的疏区域配置在对置的端子外，(iii)通过这样形成导电粒子的疏区域，从而可以降低不参与连接的没有必要的导电粒子的数目，因此各向异性导电膜的制造成本降低，此外(iv)如果预先在各向异性导电膜中形成导电粒子的疏区域和密区域，则连接后通过观察导电粒子的密度分布从而制品检查变得容易。
即，本发明提供一种各向异性导电膜，是包含绝缘粘接剂层、和配置于该绝缘粘接剂层的导电粒子的各向异性导电膜，导电粒子通过沿第1方向和第2方向排列从而格子状地配置，在至少一个方向的排列中，在相邻的排列的间隔具有宽窄。
此外，本发明提供一种连接方法，是使用上述各向异性导电膜将第1电子部件的端子与第2电子部件的端子进行各向异性导电连接的连接方法，在对置的端子间配置：通过在各向异性导电膜中的导电粒子的排列的间隔具有宽窄而形成的导电粒子的配置的疏区域和密区域之中的密区域。
进一步，本发明提供一种连接结构体，通过上述连接方法而第1电子部件与第2电子部件各向异性导电连接着。
发明的效果
根据本发明的各向异性导电膜，导电粒子格子状地配置，在形成该格子状地配置的导电粒子的排列的间隔具有宽窄，从而形成了导电粒子的疏区域和密区域。因此，在使用各向异性导电膜将对置的端子进行各向异性导电连接时，在对置的端子之间配置导电粒子的密区域，将疏区域配置在对置的端子外的区域，从而即使导电粒子由于各向异性导电连接时熔融的绝缘性树脂而沿端子的长度方向流动，也可以在端子上捕集对于导通而言足够的导电粒子，可以防止在相邻的端子间短路。
此外，通过预先在各向异性导电膜上形成导电粒子的疏区域和密区域，从而在连接后通过观察导电粒子的密度分布而使制品检查变得容易。这样的检查可以通过例如利用图像解析软件，测量导电粒子从预先设定位置的偏移来容易地进行。另外，使用图像解析软件的检查可以在各向异性导电膜的制造时进行，也可以在各向异性导电连接的前后进行。
进一步，根据本发明的各向异性导电膜，通过形成导电粒子的疏区域，从而可以使不参与连接的没有必要的导电粒子减少，可以使各向异性导电膜的制造成本降低。
附图说明
图1是实施例的各向异性导电膜1A中的导电粒子的配置图。
图2是使用了实施例的各向异性导电膜1A的各向异性导电连接时的截面图。
图3是实施例的各向异性导电膜1B中的导电粒子的配置图。
图4是实施例的各向异性导电膜1C中的导电粒子的配置图。
具体实施方式
以下，参照附图详细地说明本发明。另外，各图中，同一符号表示相同或相同要素。
图1是本发明的一实施例的各向异性导电膜1A中的导电粒子2的配置图。对于该各向异性导电膜1A，在绝缘粘接剂层3，导电粒子2通过沿第1方向和第2方向排列从而格子状地配置。更具体而言，导电粒子2配置成与各向异性导电膜1A的长度方向L1平行的第1方向的排列S(S1、S2、S3、S4、…)、和与各向异性导电膜1A的宽度方向L2平行的第2方向的排列T(T1、T2、T3、T4、…)。
其中，在第1方向的排列S中，在相邻的排列的间隔具有宽窄，并且该宽窄重复地存在。即，在将相邻的3个排列间的距离设为a、b、c的情况下，满足a＜b＜c的排列间的单元U重复地存在。这里，a≥0，在a＝0的情况下，相邻的导电粒子接触。
另一方面，第2方向的排列T等间隔地形成。
通过这样的第1方向的排列和第2方向的排列，从而各向异性导电膜1A具有导电粒子2的配置密度疏的区域和密的区域。
在使用该各向异性导电膜1A将第1电子部件的端子与第2电子部件的端子进行各向异性导电连接的情况下，优选使图1中虚线所示的端子4的长度方向与第2方向的排列T平行，使第1方向的排列S为与端子4的长度方向交叉的方向。在各向异性导电连接时，如图2所示，以用第1电子部件的端子4a与第2电子部件的端子4b夹着各向异性导电膜1A的导电粒子2的密区域的方式配置端子4a、4b和各向异性导电膜1A，用具有覆盖端子4a、4b的排列的大小的加压面的加热器5加热加压。在该加热加压期间形成了绝缘粘接剂层3的树脂熔融。通过在加热器5的加压面的端部侧存在端子4a、4b，从而如果熔融的树脂沿端子4的长度方向(箭头A)流动，则位于端子4a、4b上的导电粒子2、位于水平方向上相邻的端子间(相邻的端子4a彼此之间、或相邻的端子4b彼此之间)的导电粒子2都沿箭头A的方向移动。然而，由于用端子4a、4b夹着各向异性导电膜1A的导电粒子的密区域，因此即使因为树脂的流动而产生从端子4a、4b上脱落的导电粒子2，端子4a、4b也可以捕集对于确保导通而言足够的导电粒子2。因此，端子4a、4b通过导电粒子2以虚线的方式被连接。此外，在相邻的端子间和端子并列而形成的区域的外侧，在箭头A的方向上存在导电粒子2的疏区域，因此与仅由导电粒子2的密区域而形成的情况相比，可以防止因为导电粒子2沿A方向移动而导电粒子2彼此连结，特别是，可以防止3个以上连结。因此，可以防止在水平方向上相邻的端子间因连结的导电粒子2而短路。
这里，为了在各向异性导电连接时在各端子4确实地捕集导电粒子2，优选使相邻的3个排列间的距离a、b、c之和比端子4的长度方向的长度短。这是因为，在端子上存在3个以上导电粒子在各向异性连接的稳定性方面是优选的。
此外，如果导电粒子2的疏密平衡崩溃，则形成为规定间距的端子列整体发生相同倾向，因此担心发生局部接触等，对可靠性等产生不良影响。因此，为了确保压入时的导电粒子的均匀性，优选使距离b为导电粒子2的粒径的0.5倍以上，更优选为0.5～150倍，进一步更优选为0.75～100倍。距离c相对于距离b优选为0.5×整数倍。其原因是，与距离b的比较变得容易。
进一步，为了使连接前后的好坏判定变得容易，优选使距离a、b、c具有等比的关系。例如，b/a＝c/b＝1.2～5。或者，如果为粒径的1/2的整数倍，则使粒子成为一个基准(尺度)。由此，即使是各向异性导电连接后也易于把握压入的均匀性，因此连接结构体的连接不良的判定变得容易。
另一方面，关于与各向异性导电膜1A的宽度方向平行的第2方向的排列T1、T2、T3、T4、…的间隔，从抑制短路和提高导通可靠性方面考虑，优选为导电粒子的平均直径的0.5倍以上。该距离根据各向异性连接的凸块铺设而适当设计。其原因是，不能完全预测在各向异性导电连接时熔融的树脂流动的方向，有时在端子上或其附近树脂的流动变得随机。
在各向异性导电膜1A中，关于导电粒子2的粒径D，从防止短路和对置的端子的接合的稳定性方面考虑，优选为1～10μm。
导电粒子2的密度优选为2000～250000个/mm2。该粒子密度根据导电粒子2的粒径和配置方向而适当调整。
在各向异性导电膜1A中，关于导电粒子2本身的构成原材料、绝缘粘接剂层3的层构成或构成树脂，可以采用各种形态。
即，作为导电粒子2，可以从公知的各向异性导电膜所用的导电粒子中适当选择而使用。可举出例如镍、钴、银、铜、金、钯等金属粒子、金属被覆树脂粒子等。也可以并用2种以上。
作为绝缘粘接剂层3，可以适当采用公知的各向异性导电膜中使用的绝缘性树脂层。例如，可以使用包含丙烯酸酯化合物和光自由基聚合引发剂的光自由基聚合型树脂层、包含丙烯酸酯化合物和热自由基聚合引发剂的热自由基聚合型树脂层、包含环氧化合物和热阳离子聚合引发剂的热阳离子聚合型树脂层、包含环氧化合物和热阴离子聚合引发剂的热阴离子聚合型树脂层等。此外，这些树脂层根据需要可以为分别聚合而得的树脂层。此外，也可以由多个树脂层形成绝缘粘接剂层3。
本发明的各向异性导电膜可以采用各种形态。例如，如图3所示的各向异性导电膜1B那样，在上述各向异性导电膜1A中，可以使与各向异性导电膜的长度方向L1平行的第1方向的排列S等间隔，使与各向异性导电膜1A的宽度方向平行的第2方向的排列T的间隔具有宽窄。即，在第2方向的排列T中在将相邻的3个排列间的距离设为a、b、c的情况下，可以在第2方向的排列T重复设置满足a＜b＜c的单元U。
在该情况下，与上述各向异性导电膜1A中的排列S间的距离a、b、c同样地，优选使排列T间的距离b为导电粒子2的粒径的0.5倍以上，更优选为0.5～150倍，进一步更优选为0.75～100倍。此外，优选使距离a、b、c之和小于0.4mm。
在该各向异性导电性膜1B中，第1方向的排列S的间隔优选为导电粒子2的粒径的0.5倍以上，更优选为粒径的1/2的整数倍。其原因是，可以使导电粒子的排列成为各向异性导电连接后的状态的判断的一个基准(尺度)。
凸块的长度有时超过膜的宽度方向(宽度)，因此在凸块的长度方向上存在的导电粒子的数目不需要特别设置上限，但优选为在连接时在各向异性导电膜的宽度方向(宽度)上具有3个以上导电粒子，更优选具有4个以上。
通过如该各向异性导电膜1B那样使第2方向的排列T的间隔具有宽窄，从而在各向异性导电连接时熔融的树脂沿端子4的宽度方向流动的情况下，可以确保端子4中的导电粒子2的捕集性，抑制短路的发生。
此外，如图4所示的各向异性导电膜1C那样，在上述各向异性导电膜1A中，可以使与各向异性导电膜的长度方向L1平行的第1方向的排列S的间隔具有宽窄，并且使与各向异性导电膜1A的宽度方向平行的第2方向的排列T的间隔也具有宽窄。
通过这样使第1方向的排列S的间隔、第2方向的排列T的间隔都具有宽窄，从而即使在各向异性导电连接时在端子4上或其附近熔融的树脂沿随机的方向流动，也可以确保端子4中的导电粒子2的捕集性，抑制短路的发生。
进一步，在上述各个各向异性导电膜1A、1B、1C中，在相邻的2个排列间的距离a、b具有宽窄，如果该排列间的宽窄重复存在，则重复的单元可以仅由2个排列间的距离a、b构成。
从容易把握各向异性导电膜上的导电粒子的排列(使检查工序的工作量减少)方面考虑，优选重复的单元遍及3个以上的排列间，并且包含排列间的距离a＜b＜c。其原因是，如果排列间的距离设定具有3个以上，则与2个的情况相比，长短的识别变得容易。这在距离a、b之差较小的情况下变得特别有效。
进一步，使排列间的距离c为不在排列间的距离设置宽窄的情况下的2份的排列间的距离，在格子状的导电粒子的配置中，可以使一个排列为重复消失的排列。
此外，第1方向的排列S与第2方向的排列T可以不正交。可以使一者或两者的排列相对于各向异性导电膜的长度方向倾斜。作为各向异性连接的端子列，一般而言同一矩形形状的端子4沿一个方向以规定间隔并列，因此通过成为使第1方向的排列S或第2方向的排列T的一者或两者相对于各向异性导电膜的长度方向倾斜的排列，将其与进行各向异性导电连接的端子列重叠，从而在导电粒子的格子状的排列具有异常的情况的检测变得比较容易。
作为将导电粒子2以上述配置固定于绝缘粘接剂层3的方法，只要通过机械加工、激光加工、光刻等公知的方法制作具有与导电粒子2的配置对应的凹陷的模，在该模中放入导电粒子，在其上填充绝缘粘接剂层形成用组合物，使其固化，从模中取出即可。由于是这样的模，因此可以用刚性更低的材质制成模。
此外，为了在绝缘粘接剂层3上以上述配置来放置导电粒子2，可以为在绝缘粘接剂层形成用组合物层上，设置以规定的配置形成贯通孔的构件，从其上供给导电粒子2，使其通过贯通孔等方法。
在使用本发明的各向异性导电膜将IC芯片、IC模块、液晶面板等第1电子部件的端子与柔性基板等第2电子部件的端子进行各向异性导电连接的情况下、将IC芯片、IC模块等第1电子部件的端子与玻璃基板等第2电子部件的端子进行各向异性导电连接的情况下，如图1所示，将密区域配置在对置的端子4间，该密区域是通过在各向异性导电膜中的导电粒子2的排列的间隔具有宽窄而形成的导电粒子2的疏区域和密区域之中的密区域。本发明也包含这样连接而得的连接结构体。
特别是，将在导电粒子的排列的间隔具有宽窄的排列以与端子的长度方向交叉的方式配置，这在连接结构体中防止端子间的短路方面是优选的。
实施例
以下，基于实施例，具体地说明本发明。
实施例1～10、比较例1、比较例2
为了研究各向异性导电膜中的导电粒子的配置与导通特性的关系，制造表1所示的配置的各向异性导电膜。在该情况下，作为导电粒子使用积水化学工业(株)制AUL704、粒径4μm，由包含新日铁住金化学(株)制TP-50(热塑性树脂)60质量份、三菱化学(株)制jER828(热固性树脂)60质量份和三新化学工业(株)制SI-60L(潜在性固化剂)2质量的混合溶液如下形成绝缘粘接剂层。即，将该混合液涂布在膜厚50μm的PET膜上，利用80℃的烘箱干燥5分钟，在PET膜上形成厚度20μm的粘接层。
另一方面，以表1所示的配置制成具有凸部的排列图案的模具，使公知的透明性树脂的颗粒在熔融的状态下注入该模具中，冷却而固化，从而形成凹部为表1所示的排列图案的树脂模。在该树脂模的凹部填充导电粒子，在其上被覆上述绝缘粘接剂层的粘接层，通过紫外线固化使该绝缘粘接剂层所包含的固化性树脂固化。而且，从模剥离绝缘粘接剂层，制造各实施例和比较例的各向异性导电膜。
另外，比较例1中将导电粒子分散于低沸点溶剂中进行喷雾而随机地在同一平面上配置。
评价
分别如下评价各实施例和比较例的各向异性导电膜的(a)初期导通电阻、(b)导通可靠性、(c)连结粒子块数。将结果示于表1中。
(a)初期导通电阻
将各实施例和比较例的各向异性导电膜夹在柔性基板(FPC)与玻璃基板之间，加热加压(180℃，80MPa，5秒)而获得各评价用连接物，测定该评价用连接物的导通电阻。
这里，关于FPC与玻璃基板，它们的端子图案对应，尺寸如下所述。
此外，使各向异性导电膜的长度方向和凸块的宽度方向一致地贴合。
FPC
凸块间距：32μm
凸块宽度：16μm，凸块间间隙：16μm
凸块长度：1mm
玻璃基板
ITO实地玻璃(beta glass)
(b)导通可靠性
将使用各实施例和比较例的各向异性导电膜在(a)中制作的评价用连接物置于温度85℃、湿度85％RH的恒温槽500小时后的导通电阻，与(a)同样地测定。另外，如果该导通电阻超过5Ω，则从连接的电子部件的实用导通稳定性方面考虑是不优选的。
(c)连结粒子块数
将使用各实施例和比较例的各向异性导电膜在(a)中制作的评价用连接物进行显微镜观察，对导电粒子2个以上连结的连结粒子块的个数进行计数，求出每100个导电粒子的连结粒子块的个数。
[表1]
由表1可知，实施例1～10的评价用连接物中的连结粒子块数与比较例1的评价用连接物中的连结粒子块数相比显著少，不易发生短路。实施例1～10的评价用连接物中的连结粒子块数与比较例2相比少。而且关于连结粒子的产生位置，在比较例2中随机，与此相对，在实施例中看到规则性。即，可以控制短路的发生位置，可以确认到使短路发生风险本身降低。
此外可知，实施例2、3、5、6、8、9、10的各向异性导电膜，虽然导电粒子的个数密度与比较例1、2的各向异性导电膜相比小，但都具有与比较例1、2的评价用连接物同等程度的初期导通性和导通可靠性，可以减少为了确保导通性而需要的导电粒子数，可以降低各向异性导电膜的制造成本。
符号的说明
1A、1B、1C 各向异性导电膜
2 导电粒子
3 绝缘粘接剂层
4、4a、4b 端子
5 加热器
a、b、c 排列间的距离
L1 各向异性导电膜的长度方向
L2 各向异性导电膜的宽度方向(连接端子的长度方向)
S、S1、S2、S2、S4 第1方向的排列
T、T1、T2、T3、T4 第2方向的排列
U 排列间的单元
D 导电粒子的粒径。

Claims (9)

1.一种各向异性导电膜，是包含绝缘粘接剂层、和配置于该绝缘粘接剂层的导电粒子的各向异性导电膜，导电粒子通过沿第1方向和第2方向排列而格子状地配置，在至少一个方向的排列中，在相邻的排列的间隔具有宽窄。
2.根据权利要求1所述的各向异性导电膜，在将相邻的3个排列间的距离设为a、b、c的情况下，在至少一个方向的排列具有满足a＜b＜c的排列间单元。
3.根据权利要求1或2所述的各向异性导电膜，在排列的间隔重复具有宽窄。
4.根据权利要求1～3的任一项所述的各向异性导电膜，在排列的间隔具有宽窄的排列与各向异性导电膜的长度方向平行。
5.根据权利要求2～4的任一项所述的各向异性导电膜，在排列间单元中排列间的距离等比地变化。
6.根据权利要求2～5的任一项所述的各向异性导电膜，距离b为导电粒子的粒径的0.5倍以上。
7.一种连接方法，是使用权利要求1～6的任一项所述的各向异性导电膜将第1电子部件的端子与第2电子部件的端子进行各向异性导电连接的连接方法，在对置的端子间配置：通过在各向异性导电膜中的导电粒子的排列的间隔具有宽窄而形成的导电粒子的疏区域和密区域之中的密区域。
8.根据权利要求7所述的连接方法，将在排列的间隔具有宽窄的排列，以与端子的长度方向交叉的方式配置。
9.一种连接结构体，通过权利要求7或8所述的连接方法而第1电子部件与第2电子部件各向异性导电连接着。
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US20170278820A1 (en) 2017-09-28
TW201627438A (zh) 2016-08-01
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