KR102314255B1 - 열경화성 수지 조성물 - Google Patents

열경화성 수지 조성물 Download PDF

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Publication number
KR102314255B1
KR102314255B1 KR1020170038742A KR20170038742A KR102314255B1 KR 102314255 B1 KR102314255 B1 KR 102314255B1 KR 1020170038742 A KR1020170038742 A KR 1020170038742A KR 20170038742 A KR20170038742 A KR 20170038742A KR 102314255 B1 KR102314255 B1 KR 102314255B1
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KR
South Korea
Prior art keywords
resin composition
thermosetting resin
layer
mass
component
Prior art date
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KR1020170038742A
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English (en)
Korean (ko)
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KR20170113297A (ko
Inventor
시게오 나카무라
Original Assignee
아지노모토 가부시키가이샤
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Publication of KR20170113297A publication Critical patent/KR20170113297A/ko
Application granted granted Critical
Publication of KR102314255B1 publication Critical patent/KR102314255B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020170038742A 2016-03-29 2017-03-27 열경화성 수지 조성물 KR102314255B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016066010A JP6690356B2 (ja) 2016-03-29 2016-03-29 熱硬化性樹脂組成物
JPJP-P-2016-066010 2016-03-29

Publications (2)

Publication Number Publication Date
KR20170113297A KR20170113297A (ko) 2017-10-12
KR102314255B1 true KR102314255B1 (ko) 2021-10-20

Family

ID=60009112

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170038742A KR102314255B1 (ko) 2016-03-29 2017-03-27 열경화성 수지 조성물

Country Status (3)

Country Link
JP (1) JP6690356B2 (zh)
KR (1) KR102314255B1 (zh)
TW (1) TWI796291B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019106953A1 (ja) * 2017-11-30 2019-06-06 京セラ株式会社 樹脂シート、半導体装置及び半導体装置の製造方法
JP6874867B2 (ja) * 2018-02-09 2021-05-19 Dic株式会社 接着テープ、物品及び物品の製造方法
CN111770964B (zh) * 2018-03-30 2022-12-02 日本瑞翁株式会社 树脂组合物和电子部件
KR102160657B1 (ko) * 2018-12-26 2020-09-29 주식회사 심텍 열경화성 절연재를 이용한 초박형 인쇄회로기판 및 그 제조 방법
CN111825947B (zh) * 2019-04-22 2021-08-27 广东生益科技股份有限公司 一种用于金属基板的树脂组合物、包含其的树脂胶液以及金属基覆铜箔层压板
JP2021091793A (ja) * 2019-12-10 2021-06-17 パナソニックＩｐマネジメント株式会社 エポキシ樹脂組成物及び樹脂封止基板
JPWO2021200757A1 (zh) * 2020-03-30 2021-10-07
WO2022024510A1 (ja) * 2020-07-30 2022-02-03 古河電気工業株式会社 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
US20230422393A1 (en) * 2020-11-27 2023-12-28 Kyocera Corporation Wiring board
CN118019817A (zh) * 2021-09-28 2024-05-10 琳得科株式会社 片状固化性粘接剂及光学构件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013071960A (ja) * 2011-09-27 2013-04-22 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
JP2014040533A (ja) 2012-08-23 2014-03-06 Mitsubishi Electric Corp 熱硬化性樹脂組成物、熱伝導性樹脂シートの製造方法と熱伝導性樹脂シート、並びに電力用半導体装置
JP2016032022A (ja) 2014-07-29 2016-03-07 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール

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JPH04202402A (ja) * 1990-11-30 1992-07-23 Nippon Oil Co Ltd フェノール類付加ブタジエン重合体あるいは共重合体の製造方法および硬化性エポキシ樹脂組成物
JPH05179108A (ja) * 1991-12-28 1993-07-20 Kobe Steel Ltd 熱硬化性樹脂組成物
JPH10120753A (ja) * 1996-10-17 1998-05-12 Hitachi Chem Co Ltd 封止用成形材料及び電子部品
JP3550923B2 (ja) * 1996-12-13 2004-08-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料
JP2001302823A (ja) * 2000-04-24 2001-10-31 Nippon Mitsubishi Oil Corp 繊維強化複合材料用樹脂組成物、プリプレグおよび繊維強化複合材料
JP2002080693A (ja) * 2000-06-28 2002-03-19 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP2003026773A (ja) * 2001-07-17 2003-01-29 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料
JP2003213083A (ja) * 2002-01-24 2003-07-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
US7849591B2 (en) * 2005-10-14 2010-12-14 Fujikura Ltd. Method of manufacturing a printed wiring board
TWI412560B (zh) * 2007-06-14 2013-10-21 Ajinomoto Kk And a resin composition for interlayer insulation of a multilayer printed wiring board
JP5486891B2 (ja) * 2009-10-08 2014-05-07 三菱レイヨン株式会社 連鎖硬化性樹脂組成物および繊維強化複合材料
JP5544927B2 (ja) * 2010-02-26 2014-07-09 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
WO2014098099A1 (ja) * 2012-12-18 2014-06-26 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
JP6427861B2 (ja) * 2013-10-21 2018-11-28 味の素株式会社 回路基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013071960A (ja) * 2011-09-27 2013-04-22 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
JP2014040533A (ja) 2012-08-23 2014-03-06 Mitsubishi Electric Corp 熱硬化性樹脂組成物、熱伝導性樹脂シートの製造方法と熱伝導性樹脂シート、並びに電力用半導体装置
JP2016032022A (ja) 2014-07-29 2016-03-07 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール

Also Published As

Publication number Publication date
TW201805325A (zh) 2018-02-16
JP6690356B2 (ja) 2020-04-28
JP2017179055A (ja) 2017-10-05
KR20170113297A (ko) 2017-10-12
TWI796291B (zh) 2023-03-21

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