KR102235435B1 - 잉크젯용 경화성 조성물 세트, 경화물, 그의 제조 방법, 프린트 배선판 및 팬아웃형의 웨이퍼 레벨 패키지 - Google Patents

잉크젯용 경화성 조성물 세트, 경화물, 그의 제조 방법, 프린트 배선판 및 팬아웃형의 웨이퍼 레벨 패키지 Download PDF

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Publication number
KR102235435B1
KR102235435B1 KR1020197028998A KR20197028998A KR102235435B1 KR 102235435 B1 KR102235435 B1 KR 102235435B1 KR 1020197028998 A KR1020197028998 A KR 1020197028998A KR 20197028998 A KR20197028998 A KR 20197028998A KR 102235435 B1 KR102235435 B1 KR 102235435B1
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KR
South Korea
Prior art keywords
curing agent
main material
inkjet
curable composition
component
Prior art date
Application number
KR1020197028998A
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English (en)
Korean (ko)
Other versions
KR20190120361A (ko
Inventor
히데유키 이토
가즈야 사토
야스아키 아라이
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20190120361A publication Critical patent/KR20190120361A/ko
Application granted granted Critical
Publication of KR102235435B1 publication Critical patent/KR102235435B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/54—Inks based on two liquids, one liquid being the ink, the other liquid being a reaction solution, a fixer or a treatment solution for the ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0023—Digital printing methods characterised by the inks used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Ink Jet (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Epoxy Resins (AREA)
KR1020197028998A 2017-06-06 2018-06-06 잉크젯용 경화성 조성물 세트, 경화물, 그의 제조 방법, 프린트 배선판 및 팬아웃형의 웨이퍼 레벨 패키지 KR102235435B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-112032 2017-06-06
JP2017112032A JP6416327B1 (ja) 2017-06-06 2017-06-06 インクジェット用硬化性組成物セット、硬化物、その製造方法、プリント配線板およびファンアウト型のウェハレベルパッケージ
PCT/JP2018/021683 WO2018225779A1 (ja) 2017-06-06 2018-06-06 インクジェット用硬化性組成物セット、硬化物、その製造方法、プリント配線板およびファンアウト型のウェハレベルパッケージ

Publications (2)

Publication Number Publication Date
KR20190120361A KR20190120361A (ko) 2019-10-23
KR102235435B1 true KR102235435B1 (ko) 2021-04-02

Family

ID=64017201

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197028998A KR102235435B1 (ko) 2017-06-06 2018-06-06 잉크젯용 경화성 조성물 세트, 경화물, 그의 제조 방법, 프린트 배선판 및 팬아웃형의 웨이퍼 레벨 패키지

Country Status (5)

Country Link
JP (1) JP6416327B1 (zh)
KR (1) KR102235435B1 (zh)
CN (1) CN110494510A (zh)
TW (1) TWI772433B (zh)
WO (1) WO2018225779A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7366552B2 (ja) * 2019-02-06 2023-10-23 日東電工株式会社 粘着剤層付き反射防止フィルム、自発光型表示装置およびその製造方法
JP7325038B2 (ja) * 2019-07-12 2023-08-14 パナソニックＩｐマネジメント株式会社 金属張積層板の製造方法
JP7372090B2 (ja) * 2019-09-13 2023-10-31 株式会社ミマキエンジニアリング インクジェット印刷方法

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JP2006159746A (ja) 2004-12-09 2006-06-22 Konica Minolta Medical & Graphic Inc 光硬化型インクジェット記録方法
JP2009272609A (ja) * 2008-05-09 2009-11-19 Samsung Electro Mech Co Ltd インクジェット吐出装置
WO2013157271A1 (ja) 2012-04-18 2013-10-24 コニカミノルタ株式会社 インクジェットインクセット、及びこれを用いた画像形成方法
JP2017003967A (ja) * 2015-06-05 2017-01-05 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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JP3678301B2 (ja) * 1998-11-24 2005-08-03 セイコーエプソン株式会社 樹脂硬化型の二液を用いたインクジェット記録方法
TW200417294A (en) 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP4911349B2 (ja) 2006-01-31 2012-04-04 ブラザー工業株式会社 複合金属酸化物膜の形成方法
JP2007238648A (ja) * 2006-03-03 2007-09-20 Fujifilm Corp インクジェット記録用インクセット、及びインクジェット画像記録方法
JP5137315B2 (ja) * 2006-03-31 2013-02-06 富士フイルム株式会社 インクジェット記録用インクセット及びインクジェット記録方法
JP2008174713A (ja) * 2006-12-19 2008-07-31 Seiko Epson Corp ２液型光硬化インク組成物セット、これを用いたインクジェット記録方法、並びにインクジェット記録装置及び印刷物
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KR102325678B1 (ko) * 2014-11-17 2021-11-12 세키스이가가쿠 고교가부시키가이샤 잉크젯용 광 및 열경화성 접착제, 반도체 장치의 제조 방법 및 전자 부품
JP5986701B1 (ja) * 2015-02-12 2016-09-06 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
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WO2017056663A1 (ja) * 2015-09-30 2017-04-06 太陽インキ製造株式会社 インクジェット用硬化性組成物、これを用いた硬化塗膜およびプリント配線板

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Publication number Priority date Publication date Assignee Title
JP2006159746A (ja) 2004-12-09 2006-06-22 Konica Minolta Medical & Graphic Inc 光硬化型インクジェット記録方法
JP2009272609A (ja) * 2008-05-09 2009-11-19 Samsung Electro Mech Co Ltd インクジェット吐出装置
WO2013157271A1 (ja) 2012-04-18 2013-10-24 コニカミノルタ株式会社 インクジェットインクセット、及びこれを用いた画像形成方法
JP2017003967A (ja) * 2015-06-05 2017-01-05 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
TWI772433B (zh) 2022-08-01
TW201905116A (zh) 2019-02-01
KR20190120361A (ko) 2019-10-23
CN110494510A (zh) 2019-11-22
JP2018203912A (ja) 2018-12-27
WO2018225779A1 (ja) 2018-12-13
JP6416327B1 (ja) 2018-10-31

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