KR102235435B1 - Inkjet curable composition set, cured product, its manufacturing method, printed wiring board and fan-out wafer level package - Google Patents

Abstract

[Problem] There is provided a two-component inkjet curable composition set that can cope with a high-precision pattern, has dry to touch, is suitable for warpage correction of a pseudo wafer, has excellent heat resistance, and has excellent ejection properties and storage stability. [Solution means] A two-component inkjet curable composition comprising a main material and a curing agent, wherein the main material contains a thermal crosslinking component, the curing agent contains a thermosetting catalyst component, and both the main material and the curing agent are active energy rays It characterized in that it comprises a component that is cured.

Description

Inkjet curable composition set, cured product, its manufacturing method, printed wiring board and fan-out wafer level package

The present invention relates to an inkjet curable composition set, and more particularly, to a two-component inkjet curable composition set comprising a main material and a curing agent. Further, the present invention relates to a cured product formed from the two-component inkjet curable composition set, a method for producing the same, a printed wiring board having the cured product, and a fan-out type wafer level package.

In recent years, the demand for miniaturization in fields such as semiconductor circuits is increasing, and in order to meet the demand, semiconductor circuits are sometimes mounted in a package close to the chip size thereof. As one of the means for realizing a chip size package, a package method called a wafer level package (hereinafter, sometimes abbreviated as WLP) has been proposed in which a wafer level package is bonded to be fragmented. WLP is attracting attention because it can contribute to lower cost and miniaturization. The WLP is mounted face-down on a circuit board on which electrodes are formed.

However, with the miniaturization and high integration of semiconductor chips, the number of external connection electrodes (terminals, bumps) of the semiconductor chip tends to increase, and therefore the pitch of the external connection electrodes of the semiconductor chip tends to decrease. . However, it is not always easy to directly mount a semiconductor chip having bumps formed at a fine pitch on a circuit board.

For the above-described problems, it is proposed to form a region of a semiconductor encapsulant on the outer circumference of a semiconductor chip, and to provide a rewiring layer connected to the electrode also in the region of the semiconductor encapsulant to increase the pitch of the bumps. Such a WLP is called a fan-out type wafer level package (hereinafter, abbreviated as FO-WLP in some cases) because the size of the bump arrangement area increases with respect to the size of the semiconductor chip.

In FO-WLP, a semiconductor chip is embedded with a semiconductor encapsulant. The circuit surface of the semiconductor chip faces outward, and a boundary between the semiconductor chip and the semiconductor encapsulant is formed. A redistribution layer connected to the electrode of the semiconductor chip is also provided in the region of the semiconductor encapsulant in which the semiconductor chip is embedded, and the bumps are electrically connected to the electrode of the semiconductor chip through the redistribution layer. The pitch of these bumps can be set large with respect to the pitch of the electrodes of the semiconductor chip.

It is also conceivable that not only the semiconductor chip but also a plurality of electronic components are arranged in one package, or a plurality of semiconductor chips are embedded in a semiconductor encapsulant to form one semiconductor component. In such a package, a plurality of electronic components are embedded by a semiconductor sealing material. A rewiring layer connected to the electrode of the electronic component is provided in the semiconductor encapsulant for embedding a plurality of electronic components, and the bump is electrically connected to the electrode of the electronic component through the rewiring layer. In this case as well, since the size of the bump placement area increases with respect to the size of the semiconductor chip, it can be referred to as FO-WLP.

In such a package, in general, a semiconductor chip or electronic component is disposed on a support at a certain interval, and is buried using a semiconductor encapsulant, the encapsulant is heat-cured, and then peeled from the support to produce a pseudo wafer. . Subsequently, a rewiring layer is formed over a region of the semiconductor encapsulation material extended from the semiconductor chip circuit surface of the pseudo wafer. In this way, the pitch of the bumps can be set larger with respect to the pitch of the electrodes of the semiconductor chip.

In the formation of the redistribution layer, in general, a positive-type sensitive resin is applied to the semiconductor chip circuit surface of a pseudo wafer, pre-baked, and active light such as UV rays is irradiated to an area to be opened through a photomask or the like, Subsequently, development is performed using a developer such as TMAH (tetramethylammonium hydroxide), heating curing, oxygen plasma treatment, etc., sputtering of the metal electrode is performed, and a photoresist layer is further formed to pattern the wiring. A wiring layer is formed (for example, Patent Document 1).

In WLP or FO-WLP, when a redistribution layer is formed on the circuit surface of a semiconductor chip, the circuit surface (i.e., the surface on which the insulating film is formed) is concave due to shrinkage during curing of the insulating film such as photosensitive polyimide between wirings. Deformation occurs. In order to reduce the amount of warpage, it is proposed to form a resin layer on one side of a substrate containing a wafer-shaped semiconductor, and cure the resin layer after holding the entire resin layer by bending it so that it swells in a spherical shape. (For example, Patent Document 2).

The resin layer for correcting the warpage can be formed by applying a resin coating solution to the entire surface of the substrate, but an inkjet method can be considered as a coating method that can be divided and coated into minute regions such as semiconductor chips. The inkjet method is a method of applying a small amount of droplets from a nozzle to a coated surface, and is suitable for application to a semiconductor chip or the like because it can cope with minute and partial divisional application. In the inkjet method, in order to facilitate ejection by the inkjet head, it is heated to around 50°C and then ejected from the nozzle. Further, in order to ensure the stability of the ink at this temperature, block isocyanate has been proposed so far as a thermosetting component (for example, Patent Document 3).

However, since the thermosetting product by isocyanate has a low glass transition temperature, there is a problem that it does not dry to touch during heating in a subsequent step, and adheres to the transfer device during DRAM mounting.

In order to produce a warp correction material that is dry to touch even at high temperatures, it is considered that epoxy-based crosslinking is optimal in terms of reaction speed, glass transition temperature, and cost. However, in the epoxy-based curable composition, when the epoxy compound and the curing catalyst are used as one solution, the pot life is short, and when used for a long time at around 50° C., clogging of the nozzle or tank due to gelation is likely to occur. In addition, there is a drawback that the storage stability is also shortened.

In order to solve such a problem, a two-component curable composition has also been proposed, and a solder resist using a two-component epoxy-based curable composition is also proposed (for example, Patent Document 4). Further, it has also been proposed to apply a two-component epoxy-based curable composition to an ink jet method (for example, Patent Documents 5 and 6). However, since spreading of the liquid at the time of attachment of the droplets or the like is not considered, it is unsuitable for high-precision pattern formation.

Japanese Patent Application Publication No. 2013-38270 Japanese Patent Application Publication No. 2012-178422 International Publication No. WO2013/146706 International Publication No. WO2004/048434 Japanese Patent Publication No. 2016-149488 Japanese Patent Publication No. 2007-229705

Therefore, an object of the present invention is to provide a set of two-pack inkjet curable compositions that can cope with high-precision patterns, dry to touch, are suitable for warpage correction of pseudo wafers, have excellent heat resistance, and have excellent ejection properties and storage stability. It is to do. Another object of the present invention is to provide a cured product formed by the two-component inkjet curable composition set, a method for producing the same, a printed wiring board having the cured product, and a fan-out wafer level package.

The inventors of the present invention apply a two-component curable composition having a thermal crosslinking component such as a cyclic ether compound as a main substance, and a thermosetting catalyst component as a curing agent in an inkjet method, and ejecting the main substance and the curing agent from separate nozzles, and at the same position. When the thermal crosslinking component and the thermal curing catalyst component are mixed by adhering to and forming a thermally curable coating film, a component that is cured with an active energy ray such as a bifunctional (meth)acrylic monomer component is contained in both the main material and the curing agent. It was found that by making it easier to mix when both adhere. Further, it was found that by irradiating an active energy ray immediately after mixing the main material and the curing agent, the mixing ratio of the main material and the curing agent can be kept constant, and the spread of the adhered droplets can be suppressed.

That is, the inkjet curable composition set of the present invention is a two-component inkjet curable composition set comprising a main material and a curing agent,

The subject includes a thermal crosslinking component,

The curing agent contains a thermosetting catalyst component,

Both the main material and the curing agent are characterized in that it contains a component that is cured with an active energy ray.

In the inkjet curable composition set of the present invention, the thermal crosslinking component may contain a cyclic ether compound, and the thermosetting catalyst component may contain at least any one selected from a basic catalyst and an acidic catalyst.

In the inkjet curable composition set of the present invention, the component cured with the active energy ray may be a bifunctional (meth)acrylic monomer.

In the inkjet curable composition set of the present invention, both the main material and the curing agent may contain a photoinitiator.

In the inkjet curable composition set of the present invention, both the main material and the curing agent may contain (meth)acrylic monomers having the same number of functional groups.

In the inkjet curable composition set of the present invention, the viscosity at 50° C. of the main material and the curing agent may be in the range of 5 to 100 mPa·s, respectively.

In the inkjet curable composition set of the present invention, the main material and the curing agent are all silica, alumina, titanium oxide, aluminum hydroxide, zinc oxide, zirconium oxide, magnesium oxide, mica, bismuth oxychloride, talc, kaolin, barium sulfate. , Silicic anhydride, calcium carbonate, magnesium carbonate, magnesium silicate, aluminum silicate, and at least one inorganic filler selected from the group consisting of magnesium aluminum silicate.

In the inkjet curable composition set of the present invention, it may be used as a fan-out type warp correcting material for wafer level packages.

Further, the cured product according to another embodiment of the present invention is a cured product of a mixture of the main substance of the inkjet curable composition set and the curing agent.

In addition, in another embodiment of the present invention, a method for producing a cured product using an inkjet curable composition set includes discharging the main material and the curing agent from separate nozzles and attaching the main material and the curing agent at substantially the same position on the object to be coated. Mix,

Irradiating active energy rays to the main material and the curing agent attached on the object to be coated,

Curing the main material and the curing agent to obtain a cured product

To include that.

In the method for producing a cured product of the present invention, the object to be coated may be a printed wiring board.

Further, a printed wiring board according to another embodiment of the present invention has the cured product.

Further, a fan-out type wafer-level package according to another embodiment of the present invention includes the cured product.

According to the present invention, it is possible to cope with high-precision patterns such as high-precision through-holes required for connection with a DRAM, and is dry to the touch, suitable for warpage correction of pseudo wafers, and has excellent heat resistance, and discharge properties and storage stability. An excellent two-component inkjet curable composition set can be realized. Further, according to another aspect of the present invention, a cured product formed by the two-component inkjet curable composition set, a method for producing the same, a printed wiring board having the cured product, and a fan-out wafer level package can be provided.

<Set of curable composition for inkjet>

The inkjet curable composition set of the present invention is a two-component inkjet curable composition set comprising a main material and a curing agent, wherein the main material includes a thermal crosslinking component, the curing agent includes a thermosetting catalyst component, and the main material and curing agent are combined. It was made into one set. The main subject constituting the inkjet curable composition set includes at least a thermal crosslinking component and a component cured with an active energy ray. Further, the curing agent constituting the inkjet curable composition set contains at least a thermosetting catalyst component and a component cured with an active energy ray. In addition, in the present invention, "subject" refers to a composition containing a thermal crosslinking component and not containing a thermal curing catalyst, and "curing agent" refers to a composition that accelerates crosslinking of the thermal crosslinking component of the subject.

The inkjet curable composition set of the present invention contains a component in which both the main material and the curing agent are cured with an active energy ray (hereinafter, sometimes referred to as an active energy ray-curable component). The active energy ray-curable component makes it easy to mix the main material and the curing agent, and when the main material and the curing agent are mixed, it is temporarily cured with active energy, thereby suppressing the spread of droplets mixed with the main material and the curing agent, thereby maintaining a constant mixing ratio. Has. In order to make the active energy ray-curable component function more effectively, the active energy ray-curable component is preferably a curable component obtainable by a radical addition polymerization reaction.

Examples of the curable component obtained by the radical addition polymerization reaction include a radical addition polymerization reactive component having one or more ethylenically unsaturated groups in the molecule. As a specific example, for example, a commonly known polyester (meth)acryl Rate, polyether (meth)acrylate, urethane (meth)acrylate, carbonate (meth)acrylate, and epoxy (meth)acrylate. Specifically, diacrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; Acrylamides such as N,N-dimethylacrylamide, N-methylolacrylamide, and N,N-dimethylaminopropylacrylamide; Aminoalkyl acrylates such as N,N-dimethylaminoethyl acrylate and N,N-dimethylaminopropyl acrylate; Polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, tris-hydroxyethyl isocyanurate, or ethylene oxide adducts thereof, propylene oxide adducts, or ε-caprolactone adducts, etc. Polyhydric acrylates; Polyhydric acrylates such as phenoxyacrylate, bisphenol A diacrylate, and ethylene oxide adducts or propylene oxide adducts of these phenols; Polyhydric acrylates of glycidyl ethers such as glycerin diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanurate; Not limited to the above, acrylates and melamine acrylates obtained by directly acrylated polyols such as polyether polyol, polycarbonate diol, hydroxyl-terminated polybutadiene, polyester polyol, or urethane acrylate through diisocyanate, and And each methacrylate corresponding to the acrylate. These may be used alone or in combination of two or more.

Among the above, a bifunctional (meth)acrylate monomer is particularly preferred from the viewpoint of adjusting the viscosity of the main material and the curing agent and the compatibility of each component contained in the main material and the curing agent. In addition, it is preferable that the active energy ray-curable component contained in the main body and the curing agent is a (meth)acrylate monomer having the same number of functional groups, respectively. By including the (meth)acrylate monomer of the same number of functional groups as the main material and the curing agent, it becomes easier to mix both.

In addition to the above, compounds such as the following (1) to (11) may be used as the curable component that can be cured by a radical addition polymerization reaction contained in the main material and the curing agent.

(1) An unsaturated group obtained by reacting a monocarboxylic acid containing an unsaturated group to a reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with an alkylene oxide, and reacting a polybasic acid anhydride to the reaction product obtained. Polymer,

(2) an acrylic-containing polymer obtained by reacting (meth)acrylic acid with a bifunctional or higher polyfunctional epoxy resin to add a dibasic acid anhydride to a hydroxyl group present in the side chain,

(3) an acrylic-containing polymer in which (meth)acrylic acid is reacted with a polyfunctional epoxy resin in which the hydroxyl group of a bifunctional epoxy resin is further epoxidized with epichlorohydrin, and dibasic acid anhydride is added to the resulting hydroxyl group,

(4) An unsaturated group-containing polymer obtained by reacting a monocarboxylic acid containing an unsaturated group with a reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with a cyclic carbonate compound, and reacting a polybasic acid anhydride with the reaction product obtained. ,

(5) an acrylic urethane resin obtained by polyaddition reaction of a diisocyanate and a (meth)acrylate of a bifunctional epoxy resin or a partial acid anhydride modified product thereof, a carboxyl group-containing dialcohol compound and a diol compound,

(6) an unsaturated group-containing polymer obtained by copolymerization of an unsaturated carboxylic acid and an unsaturated group-containing compound,

(7) During the synthesis of a resin by polyaddition reaction of a diisocyanate and a carboxyl group-containing dialcohol compound and a diol compound, a compound having one hydroxyl group and one or more (meth)acryloyl groups in the molecule is added, and the terminal ( Meth)acrylated acrylic-containing urethane resin,

(8) During the synthesis of a resin by polyaddition reaction of a diisocyanate and a carboxyl group-containing dialcohol compound and a diol compound, a compound having one isocyanate group and one or more (meth)acryloyl groups is added in the molecule, and the terminal ( Meth)acrylated acrylic-containing urethane resin,

(9) During synthesis of the resin of (5), an acrylic-containing urethane resin obtained by adding a compound having one hydroxyl group and one or more (meth)acryloyl groups in the molecule to form a terminal (meth)acrylate,

(10) During the synthesis of the resin of (5), an acrylic-containing urethane resin obtained by adding a compound having one isocyanate group and one or more (meth)acryloyl groups in the molecule to form a terminal (meth)acrylate, and

(11) In addition to the resins of (1) to (10), an acrylic-containing polymer formed by adding a compound having one epoxy group and one or more (meth)acryloyl groups in one molecule alone or two or more It can be used in combination or in combination with a monomer having one or more ethylenically unsaturated groups in the above molecule.

It is preferable that an active energy ray-curable component is contained in 10 mass%-90 mass% in a main material, and 10 mass%-90 mass% in a hardener. If it is in the range of 10 mass% to 90 mass %, hardening by active energy rays may become favorable.

It is preferable that the main material and the curing agent constituting the inkjet composition set of the present invention further contain a photopolymerization initiator for subjecting the above-described active energy curable component to a polymerization reaction with an active energy ray. As a photoinitiator, for example, bis-(2,6-dichlorobenzoyl)phenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-2,5-dimethylphenylphosphine oxide, bis-(2,6- Dichlorobenzoyl)-4-propylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-1-naphthylphosphine oxide, bis-(2,6-dimethoxybenzoyl)phenylphosphine oxide, bis-( 2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bis-(2,6-dimethoxybenzoyl)-2,5-dimethylphenylphosphine oxide, bis-(2,4, 6-trimethylbenzoyl)-phenylphosphine oxide (Omnirad 819 manufactured by IGM Resins), 2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,4,6-trimethyl Benzoylphenylphosphinic acid methyl ester, 2-methylbenzoyldiphenylphosphine oxide, pivaloylphenylphosphinic acid isopropyl ester, 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO manufactured by IGM Resins), etc. Acylphosphine oxides; 1-hydroxy-cyclohexylphenylketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1 -{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 2-hydroxy-2-methyl-1-phenylpropane- Hydroxyacetophenones such as 1-one; Benzoins, such as benzoin, benzyl, benzoin methyl ether, benzoin ethyl ether, benzoin n-propyl ether, benzoin isopropyl ether, and benzoin n-butyl ether; Benzoin alkyl ethers; Benzophenones such as benzophenone, p-methylbenzophenone, Michler's ketone, methylbenzophenone, 4,4'-dichlorobenzophenone, and 4,4'-bisdiethylaminobenzophenone; Acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexylphenylketone, 2-methyl- 1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2- Acetophenones such as (dimethylamino)-2-[(4-methylphenyl)methyl)-1-[4-(4-morpholinyl)phenyl]-1-butanone and N,N-dimethylaminoacetophenone; Thioxanthone, 2-ethyl thioxanthone, 2-isopropyl thioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone, 2-chloro thioxanthone, 2,4-di Thioxanthones such as isopropyl thioxanthone; Anthraquinones such as anthraquinone, chloroanthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, and 2-aminoanthraquinone; Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; Benzoic acid esters such as ethyl-4-dimethylaminobenzoate, 2-(dimethylamino)ethylbenzoate, and p-dimethylbenzoic acid ethyl ester; 1,2-octanedione, 1-[4-(phenylthio)-,2-(O-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-car Oxime esters such as bazol-3-yl]-,1-(O-acetyloxime); Bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium, bis(cyclopentadienyl)- Titanocenes such as bis[2,6-difluoro-3-(2-(1-pil-1-yl)ethyl)phenyl]titanium; Phenyl disulfide 2-nitrofluorene, butyloin, anisoin ethyl ether, azobisisobutyronitrile, tetramethyl thiuram disulfide, etc. are mentioned. These photoinitiators may be used individually by 1 type, and may be used in combination of 2 or more types.

Among the photopolymerization initiators described above, oxime esters (hereinafter referred to as ``oxime ester photopolymerization initiators''), α-aminoacetophenones as one of acetophenones (hereinafter referred to as ``α-aminoacetophenone photopolymerization initiators''), And acylphosphine oxides (hereinafter referred to as “acylphosphine oxide-based photopolymerization initiators”). It is preferable to use at least one photopolymerization initiator selected from the group consisting of.

As a commercially available oxime ester photoinitiator, CGI-325 by BASF Japan, IRGACURE OXE01, IRGACURE OXE02, N-1919 by ADEKA, etc. are mentioned. Further, a photoinitiator having two oxime ester groups in the molecule can also be suitably used.

As an α-aminoacetophenone-based photoinitiator, specifically, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl)-butan-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1- Butanone, N,N-dimethylaminoacetophenone, etc. are mentioned. As a commercial item, Omnirad 907, Omnirad 369, Omnirad 379 etc. manufactured by IGM Resins are mentioned.

Examples of the acylphosphine oxide-based photoinitiator include the above compounds. As a commercial item, Omnirad TPO, Omnirad 819, etc. made by IGM Resins are mentioned.

If an oxime ester photopolymerization initiator is used as a photopolymerization initiator that performs a radical addition polymerization reaction by an active energy ray, not only a small amount can obtain sufficient sensitivity, but also at the time of thermal curing and mounting when a thermosetting component is mixed. Since there is little volatilization of the photopolymerization initiator in the post-heating step of, contamination of equipment such as a drying furnace can be reduced.

In addition, when an acylphosphine oxide-based photopolymerization initiator is used, since the deep curing property during photoreaction is improved, a good opening (through hole) shape can be obtained in terms of resolution.

Although it is effective to use either an oxime ester photopolymerization initiator or an acylphosphine oxide photopolymerization initiator, in terms of the balance of the line shape and opening of the resist as described above, and photocurability, the oxime ester photopolymerization initiator and the acylphosphine The combination of an oxide-based photopolymerization initiator is more suitable.

In addition, a commercially available one may be used as a photoinitiator for causing a radical addition polymerization reaction with an active energy ray, and for example, JMT-784 manufactured by Yueyang Kimoutain Sci-tech Co., Ltd. can be suitably used.

The subject of the inkjet curable composition set of the present invention includes a thermal crosslinking component. As the thermal crosslinking component, a thermosetting component having at least any one selected from two or more cyclic ether groups and cyclic thioether groups in the molecule (hereinafter, abbreviated as cyclic (thio) ether groups) can be mentioned. Among them, it is particularly preferable from the viewpoint of allowing a cyclic ether compound to advance a thermal crosslinking reaction to increase the glass transition temperature (hereinafter, sometimes abbreviated as Tg) to obtain a touch-drying coating film.

The thermosetting component having two or more cyclic (thio) ether groups in the molecule is a compound having two or more groups of either one or two types of 3, 4 or 5 membered cyclic ether groups or cyclic thioether groups in the molecule, For example, a compound having at least 2 or more epoxy groups in the molecule, i.e. a polyfunctional epoxy compound, a compound having at least 2 or more oxetanyl groups in the molecule, i.e. a polyfunctional oxetane compound, a compound having 2 or more thioether groups in the molecule That is, episulfide resin etc. are mentioned. Among these, a polyfunctional epoxy compound is preferable because crosslinking easily proceeds.

As a polyfunctional epoxy compound, for example, Mitsubishi Chemical Corporation jER828, jER834, jER1001, jER1004, DIC Corporation Epiclon 840, Epiclon 850, Epiclon 1050, Epiclon 2055, Shinnittetsu Sumkin Epotot YD-011, YD-013, YD-127, YD-128 manufactured by Kagaku Corporation, DER317, DER331, DER661, DER664 manufactured by Dow Chemical, Sumitomo Chemical High School Kabushiki ESA-011, ESA-014, ELA-115, ELA-128 manufactured by the company, bisphenol A type epoxy manufactured by Asahi Kasei Kogyo AER330, AER331, AER661, AER664, etc. (all are brand names) Suzy; JERYL903 manufactured by Mitsubishi Chemical Co., Ltd., Epiclon 152 by DIC, Epiclon 165, Ephotote YDB-400 by Shinnittetsu Sumikin Chemical Co., Ltd., YDB-500, DER542 by Dow Chemical Co., Ltd., Brominated epoxy resins such as Sumi Epoxy ESB-400 and ESB-700 manufactured by Sumitomo Chemical High School Co., Ltd., and AER711 and AER714 manufactured by Asahi Kasei High School Co., Ltd. (all are brand names); JER152, jER154 manufactured by Mitsubishi Chemical Co., Ltd., DEN431, DEN438 manufactured by Dow Chemical, Epiclon N-730 manufactured by DIC Corporation, Epiclone N-770, Epiclone N-865, Shinnittetsu Sumikin Epotot YDCN-701, YDCN-704, manufactured by Kagaku Corporation EPPN-201, EOCN-1025, EOCN-1020, EOCN-104S, RE-306, Sumitomo Chemical manufactured by Nippon Kayaku Corporation Novolac-type epoxy resins such as Sumiepoxy ESCN-195X, ESCN-220 manufactured by Kogyo Kogyo, AERECN-235, ECN-299 manufactured by Asahi Kasei Kogyo Corporation (all are brand names); Bisphenols such as Epiclon 830 manufactured by DIC Corporation, jER807 manufactured by Mitsubishi Chemical Corporation, and Ephotote YDF-170, YDF-175, YDF-2004 manufactured by Shinnittetsu Sumikin Chemical Corporation (all brand names) F-type epoxy resin; Hydrogenated bisphenol A type epoxy resins, such as Ephotote ST-2004, ST-2007, and ST-3000 (trade name) manufactured by Shinnittetsu Sumikin Chemical Co., Ltd.; Glycidyl from Mitsubishi Chemical Co., Ltd. jER604, Shinnittetsu Sumikin Chemical Co., Ltd. Epot YH-434, Sumitomo Chemical Co., Ltd. Sumiepoxy ELM-120, etc. (all brand names) Amine type epoxy resin; Hydantoin type epoxy resin; Alicyclic epoxy resins such as Celoxide 2021P (trade name) manufactured by Daicel Co., Ltd.; Trihydroxyphenylmethane type epoxy resins such as YL-933 manufactured by Mitsubishi Chemical Co., Ltd., T.E.N. manufactured by Dow Chemical Corporation, EPPN-501, EPPN-502 (all are brand names); Bixylenol-type or biphenol-type epoxy resins such as YL-6056, YX-4000, and YL-6121 (all brand names) manufactured by Mitsubishi Chemical Co., Ltd., or mixtures thereof; Bisphenol S-type epoxy resins such as EBPS-200 manufactured by Nippon Kayaku Corporation, EPX-30 manufactured by Asahi Denka Kogyo, and EXA-1514 (brand name) manufactured by DIC Corporation; Bisphenol A novolac type epoxy resins such as jER157S (trade name) manufactured by Mitsubishi Chemical Co., Ltd.; Tetraphenylolethane type epoxy resins such as jERYL-931 (all are brand names) manufactured by Mitsubishi Chemical Co., Ltd.; Heterocyclic epoxy resins such as TEPIC (trade name) manufactured by Nissan Chemical Industry Co., Ltd.; Diglycidyl phthalate resins such as Blemmer DGT manufactured by Nippon Yushi Co., Ltd.; Tetraglycidyl xylenoylethane resin, such as ZX-1063 manufactured by Shinnittetsu Sumikin Chemical Co., Ltd.; Naphthalene group-containing epoxy resins, such as ESN-190, ESN-360, and DIC Corporation HP-4032, EXA-4750, EXA-4700 manufactured by Shinnittetsu Sumikin Chemical Co., Ltd.; Epoxy resins having a dicyclopentadiene skeleton such as HP-7200 and HP-7200H manufactured by DIC Corporation; Glycidyl methacrylate copolymerized epoxy resins such as CP-50S and CP-50M manufactured by Nippon Yushi Co., Ltd.; Further, a copolymerized epoxy resin of cyclohexylmaleimide and glycidyl methacrylate; Epoxy-modified polybutadiene rubber derivatives (e.g., PB-3600 manufactured by Daicel, etc.), CTBN-modified epoxy resins (e.g., YR-102 YR-450 manufactured by Shinnittetsu Sumikin Chemical Co., Ltd.), etc. Although it can be mentioned, it is not limited to these. These epoxy resins may be used alone or in combination of two or more. Among these, a novolak type epoxy resin, a heterocyclic epoxy resin, a bisphenol A type epoxy resin, or a mixture thereof is particularly preferable.

Examples of the polyfunctional oxetane compound include bis[(3-methyl-3-oxetanylmethoxy)methyl]ether, bis[(3-ethyl-3-oxetanylmethoxy)methyl]ether, and 1,4-bis[( 3-methyl-3-oxetanylmethoxy)methyl]benzene, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, (3-methyl-3-oxetanyl)methylacrylic Rate, (3-ethyl-3-oxetanyl)methylacrylate, (3-methyl-3-oxetanyl)methylmethacrylate, (3-ethyl-3-oxetanyl)methylmethacrylate and their In addition to polyfunctional oxetanes such as oligomers or copolymers, oxetane alcohol and novolac resins, poly(p-hydroxystyrene), cardo-type bisphenols, calixarenes, calixresorcin arenes, or silsesqui And ether products with resins having a hydroxyl group such as oxane. In addition, a copolymer of an unsaturated monomer having an oxetane ring and an alkyl (meth)acrylate, etc. may be mentioned.

Examples of the episulfide resin, which is a compound having two or more cyclic (thio) ether groups in the molecule, includes, for example, bisphenol A episulfide resin YL7000 manufactured by Mitsubishi Chemical Corporation. Further, an episulfide resin obtained by substituting a sulfur atom for an oxygen atom in the epoxy group of a novolak type epoxy resin can also be used using the same synthesis method.

As other thermosetting components, known and conventional thermosetting resins such as isocyanate compounds, block isocyanate compounds, cyclocarbonate compounds, polyfunctional epoxy compounds, polyfunctional oxetane compounds, polyimide compounds, episulfide resins, etc. may also be included.

It is preferable that a thermal crosslinking component is contained in 1 mass%-70 mass% in a main body. When the thermal crosslinking component is contained in the range of 1% by mass to 50% by mass, the viscosity is low and the discharge property is sometimes improved.

The curing agent constituting the inkjet curable composition set of the present invention contains a thermosetting catalyst component. As the thermosetting catalyst component, a compound that advances a curing reaction when mixed with the above-described main substance and heated can be used. In addition, among the thermosetting catalyst components, it is preferable to contain at least any one of a basic catalyst and an acidic catalyst from the viewpoint of rapid thermal crosslinking. In addition, among these, when a basic catalyst is included, the crosslinking easily proceeds, and thus, it is more preferable. Examples of the basic catalyst include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1 -Imidazole derivatives such as cyanoethyl-2-phenylimidazole and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; Dicyandiamide, melamine, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc. Amine compounds, phosphine compounds such as tributylphosphine and triphenylphosphine, and hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide. In addition, as commercially available ones, for example, 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (all are brand names of imidazole-based compounds), DBU, DBN, U-CATSA102 manufactured by Shikoku Chemicals Co., Ltd. , U-CAT5002 (all bicyclic amidine compounds and salts thereof), and the like. These basic catalysts may be used alone or in combination of two or more as appropriate.

Examples of the acidic catalyst of the thermosetting catalyst include novolac resins and acid anhydrides. As a novolac resin system, a phenol novolak resin, a cresol novolak resin, a bisphenol novolak resin, a polyp-vinylphenol, etc. are mentioned, for example. These novolac resin acidic catalysts may be used alone or in combination of two or more as appropriate.

In addition, as an acid anhydride type acidic catalyst, for example, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-chlorophthalic anhydride, -4-chlorophthalic anhydride, anhydrous Benzophenonetetracarboxylic acid, succinic anhydride, methylsuccinic anhydride, dimethyl succinic anhydride, dichlorosuccinic anhydride, methylnadic acid, dodecylsuccinic acid, chlorendic anhydride, maleic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, Hexachloroendomethylenetetrahydrophthalic anhydride, methyl-3,6-endomethylenetetrahydrophthalic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1 ,2-dicarboxylic anhydride, ethylene glycol bis anhydrotrimelitate, glycerin bis (anhydrotrimelitate) monoacetate, and the like. These acid anhydride-based acid catalysts may be used singly or in combination of two or more as appropriate.

The inkjet curable composition set of the present invention is superior in storage stability compared to the one-component curing type because the main material containing the thermal crosslinking component and the curing agent containing the thermal curing catalyst are constituted as separate compositions.

It is preferable from the viewpoint of controlling the physical properties of the coating film that the main material and the curing agent constituting the set of the curable composition for inkjet of the present invention contain an inorganic filler component. As the inorganic filler component, conventionally known ones can be used without limitation. For example, silica, alumina, titanium oxide, aluminum hydroxide, zinc oxide, zirconium oxide, magnesium oxide, mica, bismuth oxychloride, talc, kaolin, as inorganic fillers, Barium sulfate, anhydrous silicic acid, calcium carbonate, magnesium carbonate, magnesium silicate, aluminum silicate, aluminum magnesium silicate, silicon carbide, silicon nitride, boron nitride, glass powder, metal oxide, metal powder, etc., and one type alone or Two or more types can be mixed and used. In addition, the inorganic filler component does not necessarily need to be included in both the main material and the curing agent, and may be included in either one.

The inorganic filler component preferably has an average particle diameter of 0.01 to 5 µm, more preferably 0.02 to 2 µm. In addition, in this specification, the average particle diameter measures the major axis diameter of 20 inorganic fillers randomly selected with an electron microscope, and is set as the number average particle diameter calculated as the arithmetic average value.

It is preferable that the main material and the curing agent constituting the set of the curable composition for inkjet of the present invention contain a colorant component. By including the colorant component, it is possible to prevent malfunction of the semiconductor device due to infrared rays or the like generated from surrounding devices when a semiconductor chip on which a cured product formed by the inkjet curable composition set is disposed is assembled into a device. In addition, when engraving is performed on the cured product by means of laser marking or the like, marks such as characters and symbols become easier to recognize. That is, in a semiconductor chip in which a cured product of an inkjet curable composition set is formed as a protective film, a product number, etc., is usually printed on the surface of the protective film by laser marking method (a method in which the surface of the protective film is cut off by laser light to perform printing). , When the main material and the curing agent contain a colorant, a difference in contrast between the portion cut out by the laser light of the protective film and the portion not cut out by the laser light is sufficiently obtained, and the visibility is improved. In addition, the colorant component does not necessarily need to be included in both the main material and the curing agent, and may be included in either one.

As the colorant component, organic or inorganic pigments and dyes can be used alone or in combination of two or more, but among them, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. As the black pigment, carbon black, perylene black, iron oxide, manganese dioxide, aniline black, activated carbon and the like are used, but are not limited thereto. Carbon black is particularly preferred from the viewpoint of preventing malfunction of the semiconductor device. In addition, instead of carbon black, pigments or dyes such as red, blue, green, and yellow may be mixed to obtain black or a black-based color close thereto.

Examples of the red colorant include monoazo-based, disazo-based, azolake-based, benzimidazolone-based, perylene-based, diketopyrrolopyrrole-based, condensed azo-based, anthraquinone-based, quinacridone-based, and the like. Can be mentioned. Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170 , 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269, etc. Red 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 52:2, 53:1, 53:2, 57:1, 58 :4, 63:1, 63:2, 64:1, 68 Monoazo Lake red colorants, Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 185, Pigment Red 208, etc. Benzimidazolone Red Colorant, Solvent Red 135, Solvent Red 179, Pigment Red 123, Pigment Red 149, Pigment Red 166, Pigment Red 178, Pigment Red 179, Pigment Red 190, Pigment Red Perylene-based red colorants such as 194 and Pigment Red 224, Pigment Red 254, Pigment Red 255, Pigment Red 264, Pigment Red 270, Pigment Red 272, and other diketopyrrolopyrrole-based red colorants, Pigment Red Condensed azo red colorants such as 220, Pigment Red 144, Pigment Red 166, Pigment Red 214, Pigment Red 220, Pigment Red 221 and Pigment Red 242, Pigment Red 168, Pigment Red 177, Pigment Anthraquinone red colorants such as Ment Red 216, Solvent Red 149, Solvent Red 150, Solvent Red 52, and Solvent Red 207, Pigment Red 122, Pigment Red 202, Pigment Red 206, Pigment Red 207, Pigment Red Quinacridone type red colorants, such as 209, are mentioned.

Examples of the blue colorant include phthalocyanine-based, anthraquinone-based, and the like, and pigment-based compounds classified as pigments, specifically: Pigment Blue 15, Pigment Blue 15:1, Pigment Blue 15:2, Pigment Blue 15:3, Pigment Blue 15:4, Pigment Blue 15:6, Pigment Blue 16, Pigment Blue 60, and the like. As a dye system, solvent blue 35, solvent blue 63, solvent blue 68, solvent blue 70, solvent blue 83, solvent blue 87, solvent blue 94, solvent blue 97, solvent blue 122, solvent blue 136, solvent blue 67, solvent blue 70, etc. can be used. Further, in addition to these, a metal substituted or unsubstituted phthalocyanine compound may also be used.

As the green colorant, similarly, there are phthalocyanine-based, anthraquinone-based, perylene-based, and the like. Specifically, Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28, etc. may be used. I can. In addition to the above, a metal substituted or unsubstituted phthalocyanine compound may also be used.

As the green colorant, similarly, there are phthalocyanine-based, anthraquinone-based, perylene-based, and the like. Specifically, Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28, etc. may be used. I can. In addition to the above, a metal substituted or unsubstituted phthalocyanine compound may also be used.

Examples of the yellow colorant include monoazo-based, disazo-based, condensed azo-based, benzimidazolone-based, isoindolinone-based, and anthraquinone-based, and specifically the following. Anthraquinone yellow colorants such as Solvent Yellow 163, Pigment Yellow 24, Pigment Yellow 108, Pigment Yellow 193, Pigment Yellow 147, Pigment Yellow 199, and Pigment Yellow 202, Pigment Yellow 110, Pigment Yellow 109 , Pigment Yellow 139, Pigment Yellow 179, Pigment Yellow 185 and other isoindolinone-based yellow colorants, Pigment Yellow 93, Pigment Yellow 94, Pigment Yellow 95, Pigment Yellow 128, Pigment Yellow 155, Pigment Benzimida such as condensed azo yellow colorants such as Pigment Yellow 166 and Pigment Yellow 180, Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, and Pigment Yellow 181 Jolon yellow colorant, Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62: 1, 65, 73, 74, 75, 97, 100, 104, 105, Monoazo yellow colorants such as 111, 116, 167, 168, 169, 182, 183, Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, Disazo yellow colorants, such as 170, 172, 174, 176, 188, 198, and the like can be used.

Further, for the purpose of adjusting color tone, colorants such as purple, orange, brown, and black may be added. Specifically, pigment violet 19, 23, 29, 32, 36, 38, 42, solvent violet 13, 36, C.I. Pigment Orange 1, C.I. Pigment Orange 5, C.I. Pigment Orange 13, C.I. Pigment Orange 14, C.I. Pigment Orange 16, C.I. Pigment Orange 17, C.I. Pigment Orange 24, C.I. Pigment Orange 34, C.I. Pigment Orange 36, C.I. Pigment Orange 38, C.I. Pigment Orange 40, C.I. Pigment Orange 43, C.I. Pigment Orange 46, C.I. Pigment Orange 49, C.I. Pigment Orange 51, C.I. Pigment Orange 61, C.I. Pigment Orange 63, C.I. Pigment Orange 64, C.I. Pigment Orange 71, C.I. Pigment Orange 73, C.I. Pigment Brown 23, C.I. Pigment Brown 25, C.I. Pigment Black 1, C.I. Pigment Black 7 etc. are mentioned.

The main body and the curing agent constituting the set of the curable composition for inkjet of the present invention may contain a coupling agent component having a functional group reacting with an inorganic substance and a functional group reacting with an organic functional group. When a warpage correction layer is provided on the FO-WLP using an inkjet curable composition set, at least one of adhesion of the warpage correction layer to the adherend (pseudo wafer), adhesion, and cohesiveness of the warpage correction layer can be improved. have. In addition, by including a coupling agent component, when a coating film of a mixture containing a main material and a curing agent is formed on FO-WLP, and the mixture is cured to form a warpage correction layer, the heat resistance of the warpage correction layer is not impaired, Its water resistance can be improved. Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, and silane coupling agents. Among these, a silane coupling agent is preferable. In addition, the coupling agent does not necessarily need to be contained in both the main material and the curing agent, and may be contained in either one.

As an organic group contained in the silane coupling agent, for example, a vinyl group, an epoxy group, a styryl group, a methacryloxy group, an acryloxy group, an amino group, a ureide group, a chloropropyl group, a mercapto group, a polysulfide group, an isocyanate group And the like. Commercially available ones can be used as the silane coupling agent, for example KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, KBM-502 , KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-9103, KBM-573, KBM -575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007 (all brand names; manufactured by Shin-Etsu Silicon Chemicals High School, Ltd.), etc. . These may be used individually by 1 type, and may use 2 or more types together.

In addition to the above-described components, various additives may be blended as necessary in the main material and the curing agent constituting the inkjet curable composition set of the present invention. As various additives, known in the field of electronic materials such as leveling agents, plasticizers, antioxidants, ion scavengers, gettering agents, chain transfer agents, release agents, rust inhibitors, adhesion promoters, ultraviolet absorbers, thermal polymerization inhibitors, thickeners, and antifoaming agents. You may contain commonly used additives. In addition, these additives do not necessarily need to be contained in both the main material and the curing agent, and may be contained in either one.

The main material and the curing agent constituting the inkjet curable composition set of the present invention may contain an organic solvent. The organic solvent can be used for synthesizing a polyether compound containing an ethylenically unsaturated group in the molecule, mixing each component, and adjusting the viscosity when applying the obtained curable resin composition to a substrate or a support film.

Examples of the organic solvent include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum solvents. More specifically, ketones such as methyl ethyl ketone and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methylcarbitol, butyl Glycol ethers such as carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether, ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol Esters such as methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate, alcohols such as ethanol, propanol, ethylene glycol and propylene glycol, aliphatic hydrocarbons such as octane and decane, petroleum ether, petroleum naphtha, hydrogenation Petroleum solvents, such as petroleum naphtha and solvent naphtha, etc. are mentioned. An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more types.

<Method of producing a cured product using an inkjet curable composition set>

A cured product can be obtained by applying the main material and the curing agent containing each of the above components to a high-precision desired pattern using an ink jet method, and curing the coating film. From the viewpoint of application to the inkjet method, the main material and the curing agent preferably have a viscosity at 50° C. of 5 to 100 mPa·s, particularly 5 to 50 mPa·s. Thereby, smooth printing becomes possible without giving an unnecessary load to the inkjet printer. The viscosity of the main body and the curing agent can be adjusted mainly by the content of the active energy ray-curable component such as the above-described bifunctional (meth)acrylic monomer.

The method of attaching the main material and the curing agent to the object to be coated by the ink jet method is not particularly limited, but from the viewpoint of high-precision patterning and physical properties of the coating film, the main material and the curing agent are respectively discharged from separate nozzles of the inkjet printer, It is preferable to attach them at almost the same position on the object to be coated. Both are mixed by adhering the main material and the curing agent at almost the same position on the object to be coated. In addition, ``nearly the same position'' refers to a state in which when droplets ejected from separate inkjet nozzles are adhered to the object to be coated, both droplets overlap and the main material and the curing agent can be mixed, and strictly at the same position. It is not intended to attach the droplet.

As described above, an active energy ray is irradiated after attaching the main material and the curing agent at substantially the same position on the object to be coated. By irradiation with active energy rays, the active energy ray-curable component contained in the main material and the curing agent is cured, and the coating film in which the main material and the curing agent are mixed is cured or the viscosity of the coating film increases, so that the coating film adhered to the object to be coated is suppressed from spreading. can do. Therefore, it is preferable to irradiate the active energy ray as quickly as possible after attaching the main material and the curing agent to the object to be coated. For example, after discharging the main material and the curing agent from the nozzle of the inkjet printer, the active energy ray is irradiated preferably within 1.0 second, more preferably within 0.5 second. High-precision patterning can be performed by rapidly irradiating active energy rays after discharge. The direction in which the active energy ray is irradiated to the coating film with the main material and the curing agent is not particularly limited, but the active energy ray is irradiated from the side oblique direction of the object to be coated or from the direction of the back surface of the object to be coated if the object to be coated is transparent. can do.

As a light source for irradiating an active energy ray, an LED, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a xenon lamp, a metal halide lamp, and the like are suitable. In addition, electron beams, α-rays, β-rays, γ-rays, X-rays, neutron rays, and the like can also be used. Further, the number of irradiation light sources is one or two or more, and in the case of two or more, it is also possible to use a combination of light sources of different wavelengths.

The amount of active energy ray irradiation is also different depending on the thickness of the coating film, but is generally 10 to 10000 mJ/cm ² , preferably 20 to 2000 mJ/cm ² , and more preferably 100 to 2000 mJ/cm ² . I can.

In an embodiment of the present invention, using the two-component inkjet curable composition set of the present invention, by the inkjet method as described above, the deflection provided on the surface opposite to the surface on which the redistribution layer of FO-WLP is provided It is possible to form a correction layer. In addition, in another embodiment, a printed wiring board can be formed as a solder resist by the ink jet method as described above. In addition, the coating film irradiated with active energy rays is finally thermally cured to become a cured product. Conditions (temperature, time, etc.) at the time of thermal curing are also different depending on the use of a cured product formed using a two-component inkjet curable composition set. Hereinafter, a fan-out type wafer-level package will be described as an example.

<Manufacturing method of fan-out type wafer level package>

With respect to the case of forming the deflection correction layer of FO-WLP using the two-component inkjet curable composition set of the present invention, the preparation of a FO-WLP pseudo wafer provided with the deflection correction layer will be described as an example.

First, a semiconductor wafer is prepared, and a circuit is formed on one side. The semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as gallium arsenide (GaAs). The formation of the circuit on the wafer surface can be performed by various methods including general-purpose methods such as an etching method and a lift-off method. The semiconductor wafer may be cut into individual semiconductor chips through a dicing process.

The semiconductor chip obtained as described above is mounted on a plate-like carrier having a smooth surface through an adhesive layer. Although it does not specifically limit as a carrier, A circular or square silicon wafer or a metal plate can be used. In addition, as the adhesive layer, a semiconductor chip can be temporarily fixed and peelable after fabrication of a pseudo wafer is used. As such an adhesive layer material, an acrylic adhesive, a rubber adhesive, a styrene-conjugated diene block copolymer, or the like can be used.

In addition, as the adhesive layer material, a carboxyl group-containing resin having an ethylenically unsaturated group and a radical polymerization initiator as described above may be contained, and by containing such a resin, the adhesiveness of the adhesive layer is increased by heating or irradiation with active energy rays. You can change it.

When stacking semiconductor chips on the adhesive layer, a plurality of semiconductor chips are stacked apart from each other. The stacked semiconductor chips may be the same or different in the number of arrangements in the vertical and horizontal directions in plan view, and may be arranged in a point symmetrical or lattice shape from various viewpoints such as increasing density or securing a terminal area per unit semiconductor chip . The distance of the spaced portions between adjacent semiconductor chips is not particularly limited, but it is preferable to arrange them so as to obtain a fan-out (FO) region necessary for forming the finally obtained FO-WLP connection terminal.

Subsequently, the semiconductor chip mounted on the plate-shaped carrier through the adhesive layer is sealed with a sealing material. The semiconductor chip is loaded so that the sidewall and upper surfaces of the semiconductor chip are sealed with the sealing material, and the sealing material is applied or bonded on the carrier. At this time, it is molded so that the encapsulant is also embedded in the spaced portions between the semiconductor chips. The sealing process using such a sealing material can be formed by performing compression molding using a known resin composition for sealing semiconductors in a liquid, granular, or sheet form. In the known resin composition for encapsulating a semiconductor, an epoxy resin, a curing catalyst for an epoxy resin, a curing accelerator, a spherical filler, and the like are mainly used.

After curing the sealing material, the plate-shaped carrier is peeled off. Peeling is performed between the sealing material and the semiconductor chip and the adhesive layer. As a peeling method, a method of peeling by changing (decreasing) the adhesive force of the adhesive layer by performing heat treatment, first peeling between the plate-shaped carrier and the adhesive layer, and then heat treatment or irradiation treatment with electron beams or ultraviolet rays to the adhesive layer. A method of peeling after performing, etc. are mentioned.

The pseudo wafer thus obtained may be subjected to post-curing. As post-curing, it is performed in the range of 10 minutes to 8 hours at the temperature range of 150-200 degreeC, for example. Subsequently, the side opposite to the surface on which the semiconductor is embedded in the obtained pseudo wafer may be polished to make the pseudo wafer thinner. The method of grinding is not particularly limited, and grinding may be performed by a known means using a grinder or the like. The thickness of the pseudo wafer after grinding is not particularly limited, but is usually about 50 to 500 µm.

Subsequently, a rewiring layer is formed on the side of the surface of the pseudo wafer where the circuit of the semiconductor chip is exposed. First, an insulating resin for redistribution is applied to the entire surface of the surface where the circuit of the semiconductor chip of the pseudo wafer is exposed using a spin coating method or the like, and prebaked at about 100°C to form an insulating resin layer for redistribution. . Next, in order to open the connection pad of the semiconductor chip, a photolithography method or the like is used to form a pattern on the insulating resin layer for rewiring, and heat treatment (cure) is performed. As the conditions of the heat treatment, for example, it is performed in the range of 10 minutes to 5 hours at a temperature range of 150 to 250°C. Although it does not specifically limit as an insulating resin for redistribution, From the viewpoint of heat resistance and reliability, a polyimide resin, a polybenzooxide resin, a benzocyclobutene resin, etc. are used. As described above, when the insulating resin for rewiring is subjected to heat treatment, warpage may occur in the pseudo wafer due to heat shrinkage of the insulating resin.

A power supply layer is formed on the entire surface of the redistribution layer surface of the pseudo wafer by a method such as sputtering, and then a resist layer is formed on the power supply layer, exposed to a predetermined pattern, developed, and then vias and redistributions by electrolytic copper plating. Form a circuit After forming the rewiring circuit, the resist layer is peeled off and the power supply layer is etched.

Subsequently, the flux is applied to the land provided on the rewiring circuit, the solder ball is mounted, and then heated and melted to install the solder ball on the land. Further, a solder resist layer may be formed so as to cover a part of the rewiring circuit and the solder balls. As the applied flux, a resin-based or aqueous-based one can be used. Reflow, hot plate, etc. can be used as a heating melting method. In this way, a FO-WLP pseudo wafer is obtained.

After that, the FO-WLP is obtained by dicing or the like to separate the FO-WLP pseudo wafer into pieces.

A warpage correction layer is formed on the surface opposite to the surface on which the rewiring layer is formed of the thus obtained pseudo wafer. Formation of the warpage correction layer is performed by an inkjet method using a two-component inkjet curable composition set. That is, the main material and the curing agent are discharged from the inkjet nozzle and adhered at almost the same position to form a coating film, and the coating film is cured by irradiating an active energy ray. After that, by heating as described later, the coating film is further cured to form a warpage correction layer. At this time, a warp correction layer may be formed on the entire surface of the surface opposite to the surface on which the rewiring layer was formed of the pseudo wafer, or a warp correction layer may be formed so as to achieve desired patterning. If it is performed by the inkjet method, fine and partial printing is possible, and it is possible to flexibly cope with the bending location and size of the package.

It is preferable that the applied amount of the warpage correcting material is adjusted so that the thickness of the warp correcting layer when the warp correcting layer is formed by curing is in the range of 15 to 50 µm. When the thickness of the warpage correction layer is 15 μm or more, it becomes easy to smooth the warpage. In addition, if it is less than 50㎛, there is no case to impair the thinness, one of the advantages of FO-WLP.

In the present invention, the warpage correction layer of the pseudo-wafer by selecting the amount of the warpage correcting material applied, that is, the film thickness of the warpage correcting layer after curing the warp correcting material, the amount of active energy radiation, and the selection of full surface irradiation and partial irradiation. By appropriately adjusting the degree of hardening of the FO-WLP, the correction amount according to the deflection state of the FO-WLP can be easily adjusted.

In the present invention, the warpage of the pseudo wafer is corrected by adjusting the temperature or time when curing by heat, raising the temperature to a target temperature in one step, or by performing step heating of heating to the final temperature through an intermediate temperature. The curing degree of the layer is appropriately adjusted, and the correction amount can be easily adjusted by the deflection state of the FO-WLP. The temperature to be cured by heating is 100°C to 300°C, more preferably 120°C to 180°C. The time to harden by heating is preferably 30 seconds to 3 hours. It is preferably 30 minutes to 2 hours.

In the present invention, it is also possible to form a cured film on a printed wiring board using a two-component inkjet curable composition set, and in this case, the temperature to be cured by heating is 120°C to 180°C. The time to cure by heating is preferably 30 minutes to 2 hours.

Example

Hereinafter, the present invention will be described by way of examples, but the present invention is not limited to these examples. In addition, unless otherwise stated, "part" and "%" shall mean mass parts.

<Preparation of pseudo wafer>

_{A 4 inch, 150 μm-thick P-type silicon wafer with a 100 nm SiO 2} film formed on one side of Canopy Corporation was diced using a dicing device to obtain a square semiconductor chip having a size of 10 mm×10 mm. A temporary fixing film was disposed on a flat substrate made of SUS, and the semiconductor chips _{were placed in length and width 5×5 so that the SiO 2} surface was in contact with the temporary fixing film, and the semiconductor chips had a distance of 10 mm from the top, bottom, left and right. On this, a rectangular sheet-shaped semiconductor encapsulant having a size of 100 mm×100 mm was laminated so that the center position was substantially coincident, and compression molded at 150° C. for 1 hour using a heated press press. As a semiconductor encapsulant, a kneaded product having the following composition is sandwiched between two 50 µm cover films (Daisin Purex film), and the kneaded product is formed in a sheet form by a flat plate pressing method, What formed in a sheet shape was used.

<Preparation of sealing material composition for semiconductors>

The following components were blended, heated with a roll kneader at 70° C. for 4 minutes, and then heated at 120° C. for 6 minutes, and ^{melt-kneaded under reduced pressure (0.01 kg/cm 2} ) for a total of 10 minutes to prepare a kneaded product.

30 parts by mass of naphthalene epoxy resin (NC-7000 manufactured by Nippon Kayaku Co., Ltd.)

・10 parts by mass of bisphenol type epoxy resin (YX-4000 manufactured by Mitsubishi Chemical Co., Ltd.)

10 parts by mass of phenol novolak type epoxy resin (D.E.N.431 manufactured by The Dow Chemical Company)

・2 parts by mass of anthraquinone

Carbon black (Carbon MA-100 manufactured by Mitsubishi Chemical Co., Ltd.) 10 parts by mass

Spherical silica (Admafine SO-E2 manufactured by Admatex Co., Ltd.) 500 parts by mass

2 parts by mass of silane coupling agent (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.)

2 parts by mass of 2-phenylimidazole (2PZ manufactured by Shikoku Kasei Kogyo Co., Ltd.)

Subsequently, the temporary fixing film was removed from the obtained laminate, and the back side was polished to obtain a 100 mm×100 mm square and 200 µm-thick pseudo wafer.

On the semiconductor circuit side of the obtained pseudo wafer, a positive-type resin composition for rewiring formation having the following composition was applied by spin coating and heated at 100°C for 20 minutes to perform prebaking. The thickness of the resin layer for photosensitive rewiring formation formed on the pseudo wafer after prebaking was 10 µm.

<Preparation of resin composition for rewiring formation>

First, 2,2-bis(3-amino-4-hydroxyphenyl)-propane was dissolved in N-methylpyrrolidone, and N-methylpi of 4,4'-diphenyletherdicarboxylic acid chloride. The reaction was carried out at 0 to 5°C while dropwise addition of rolidone to synthesize a polyhydroxyamide (polybenzoxazole precursor) resin having a weight average molecular weight of 1.3×104.

Next, the following components containing a polyhydroxyamide resin were blended, and the mixed solution was filtered under pressure using a 3 µm-pore Teflon (registered trademark) filter to prepare a resin composition for rewiring.

100 parts by mass of polyhydroxyamide resin (Z2)

10 parts by mass of phenol novolak type epoxy resin (D.E.N.431 manufactured by The Dow Chemical Company)

1-naphthoquinone-2-diazide-5-sulfonic acid ester (trade name TPPA528 manufactured by AZ Electronic Materials) 10 parts by mass

5 parts by mass of Y-X-Y type block copolymer (Nanostrength M52N manufactured by Arqma Corporation)

2 parts by mass of silane coupling agent (KBM-403 manufactured by Shin-Etsu Chemical Co., Ltd.)

30 parts by mass of γ-butyrolactone

-Propylene glycol monomethyl ether acetate 120 parts by mass

Subsequently, through a photomask in which a 100 µm circular opening pattern is continuously formed vertically and horizontally at a pitch of 400 µm, using an HMW680GW (metal halide lamp) manufactured by ORC, a positive pattern with an ^{exposure amount of 500 mJ/cm 2} The image was irradiated with light, and developed at 25° C. for 2 minutes using a TMAH 2.38 wt% aqueous solution to form a rewiring resin layer having a circular opening pattern formed thereon. Thereafter, a bake treatment was performed at 200°C for 1 hour, and the mixture was cooled to room temperature. In the pseudo-wafer obtained in this way, warpage occurred in which the side of the rewiring resin layer was concave. The amount of warpage was in a state in which the central portion was concave by 6 mm based on the periphery of a square having a size of 100 mm×100 mm.

<Preparation of the warpage correction layer>

A piezo-type inkjet printer was used, and an ink cartridge having a discharge amount of 10 pl (per discharge) was used. The base material and the curing agent having the following composition were filled into individual cartridges, and the discharge amount of the base material and the curing agent were the same, and the impact position was set to be the same. The exposure was carried out within 0.5 seconds after impact with a high-pressure mercury lamp attached to the side. The exposure amount was 600 mJ/cm ² , and the coated film after irradiation was heated at 160° C. for 60 minutes in a BOX-type drying furnace to prepare a warpage correction layer.

<Adjustment of curable composition set for inkjet>

[Preparation of Topic 1]

The following components were blended, mixed and dispersed in a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 µm to be referred to as main material 1.

Bisphenol A type epoxy resin (Mitsubishi Chemical Co., Ltd.: Epicoat 828) 40 parts by mass

HDDA: 10 parts by mass of 1,6-hexanediol diacrylate (manufactured by Daicel Allnex Co., Ltd.)

DPGDA: 50 parts by mass of dipropylene glycol diacrylate (manufactured by BASF Japan Co., Ltd.)

Omnirad 369: 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone (manufactured by IGM Resins) 8 parts by mass

MA-100: 1 part by mass of carbon black (manufactured by Mitsubishi Chemical Co., Ltd.)

BYK-307: 0.1 parts by mass of silicone additive (manufactured by BIC Chemie Japan)

[Preparation of hardener 1]

The following components were blended, mixed and dispersed in a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 µm to obtain a curing agent 1.

HDDA: 10 parts by mass of 1,6-hexanediol diacrylate (manufactured by Daicel Allnex Co., Ltd.)

DPGDA: 50 parts by mass of dipropylene glycol diacrylate (manufactured by BASF Japan Co., Ltd.)

DICY7: DICY7 dicyandiamide (manufactured by Mitsubishi Chemical Co., Ltd.) 3 parts by mass

Omnirad 369: 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone (manufactured by IGM Resins) 8 parts by mass

MA-100: 1 part by mass of carbon black (manufactured by Mitsubishi Chemical Co., Ltd.)

BYK-307: 0.1 parts by mass of silicone additive (manufactured by BIC Chemie Japan)

[Preparation of topic 2]

The following components were blended, mixed and dispersed in a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 µm to be referred to as main material 2.

Bisphenol A type epoxy resin (Mitsubishi Chemical Co., Ltd.: Epicoat 828) 40 parts by mass

HDDA: 10 parts by mass of 1,6-hexanediol diacrylate (manufactured by Daicel Allnex Co., Ltd.)

DPGDA: 50 parts by mass of dipropylene glycol diacrylate (manufactured by BASF Japan Co., Ltd.)

Darocure 1173: 2-hydroxy-2-methyl-1-phenyl-propan-1-one (manufactured by BASF Japan Co., Ltd.) 1 part by mass

-2-ethyl AQ: 2-ethylanthraquinone (BASF Japan Co., Ltd. product) 2 parts by mass

Omnirad 819: 2 parts by mass of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (manufactured by IGM Resin)

SO-E2: 10 parts by mass of spherical silica (manufactured by Admatex Co., Ltd.)

BYK-307: 0.1 parts by mass of silicone additive (manufactured by BIC Chemie Japan)

[Preparation of hardener 2]

The following components were blended, mixed and dispersed in a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 µm to obtain a curing agent 2.

DICY7: 3 parts by mass of DICY7 dicyandiamide (manufactured by Mitsubishi Chemical)

HDDA: 20 parts by mass of 1,6-hexanediol diacrylate (manufactured by Daicel Allnex Co., Ltd.)

DPGDA: 50 parts by mass of dipropylene glycol diacrylate (manufactured by BASF Japan Co., Ltd.)

Darocure 1173: 2-hydroxy-2-methyl-1-phenyl-propan-1-one (manufactured by BASF Japan Co., Ltd.) 1 part by mass

-2-ethyl AQ: 2-ethylanthraquinone (BASF Japan Co., Ltd. product) 2 parts by mass

Omnirad 819: 2 parts by mass of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (manufactured by IGM Resin)

SO-E2: 10 parts by mass of spherical silica (manufactured by Admatex Co., Ltd.)

BYK-307: 0.1 parts by mass of silicone additive (manufactured by BIC Chemie Japan)

[Preparation of topic 3 and hardener 3]

Subject 3 and curing agent 3 were prepared in the same manner except that HDDA and DPGDA contained in each of the subject 1 and the curing agent 1 were replaced with 50 parts by mass of γ-butyrolactone (manufactured by Mitsubishi Chemical Co., Ltd.).

<Preparation of curable composition 4 for inkjet>

The following components were blended, mixed and dispersed in a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 µm to obtain the curable composition 4 for inkjet.

-7802: 20 parts by mass of block isocyanate (manufactured by Baxenden)

-4HBA: 4-hydroxybutyl acrylate (made by Nippon Kasei Co., Ltd.) 3 parts by mass

HDDA: 10 parts by mass of 1,6-hexanediol diacrylate (manufactured by Daicel Allnex)

DPGDA: 50 parts by mass of dipropylene glycol diacrylate (manufactured by BASF Japan Co., Ltd.)

Omnirad 369: 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone (manufactured by IGM Resins) 8 parts by mass

MA-100: 1 part by mass of carbon black (manufactured by Mitsubishi Chemical)

BYK-307: 0.1 parts by mass of silicone additive (manufactured by BIC Chemie Japan)

<Preparation of curable composition 5 for inkjet>

The subject 1 obtained as described above and the curing agent 1 were mixed in a ratio of 1:1 based on the mass, and stirred for 5 minutes using a dissolver to obtain an inkjet curable composition 5.

<Evaluation of discharge properties>

Each composition obtained as described above, i.e., the main material 1 and the curing agent 1, are separately filled in the ink cartridge of the inkjet printer, and the main material and the curing agent are ejected from respective nozzles on the convex side on the pseudo wafer, and are substantially the same on the pseudo wafer. The subject and curing agent were attached in place. Exposure was performed within 0.5 seconds after the impact of the main material and the curing agent. Discharge and exposure were performed under the same conditions as in the above-described <Preparation of the warpage correction layer>. This was repeated for 20 pseudo wafers, and it was confirmed whether or not clogging of the nozzles of the inkjet printer occurred. Dischargeability was evaluated in the same manner for the set of the subject 2 and the curing agent 3, and the set of the subject 3 and the curing agent 3 as well. In addition, inkjet curable compositions 4 and 5 were filled in one ink cartridge, and the same discharge property was evaluated. The evaluation criteria were carried out in this way.

○: No nozzle clogging

×: There is clogging of the nozzle

<Evaluation of resolution>

Further, in the same manner as in the above <Evaluation of discharge properties>, the subjects 1 to 3, curing agents 1 to 3, and inkjet curable compositions 4 to 5 were discharged and exposed to form through holes having a diameter of 150 μm on the convex side of the pseudo wafer. , The shape of the through hole was observed. The evaluation criteria of resolution were carried out in this way.

○: A 150㎛ through hole could be formed

X: The periphery of the through hole was spread and the opening became small, or the opening was filled.

<Measurement of warpage of pseudo wafer>

The film thickness of the warpage correction layer formed in the same manner as in the above <Preparation of the warpage correction layer> was measured with a micrometer, and it was 30 μm. Further, the amount of warpage of the pseudo wafer on which the warp correction layer was formed was measured. The amount of warpage was measured at 25°C using a Longjo Nogis. Based on the arbitrary two points of the periphery of the pseudo wafer, it evaluated according to the following criteria.

○: The deflection of the center is ±2mm or less

×: The deflection of the center exceeds ±2 mm

<Evaluation of heat resistance>

The warpage correction layer formed as described above was immersed in a solder bath at 260°C for 10 seconds in accordance with the method of JIS C6481-1996, and then the surface condition of the warpage correction layer after performing a peeling test with a cellophane adhesive tape was visually examined. It was observed by looking, and evaluated according to the following criteria.

○: The surface does not peel off

×: the surface has been peeled off

<Confirmation of adhesiveness>

The pseudo wafer on which the warp correction layer was formed as described above was inserted with a 25 mm double clip (Kokuyo Co., Ltd., Klee 34), heated at 130° C. for 10 minutes, returned to room temperature, and then removed the double clip, and warped. The presence or absence of an adhesive mark at the time of heating of the correction layer was confirmed.

○: No adhesive mark

×: There is an adhesive mark

<Storage stability>

For the main subjects 1 to 3, curing agents 1 to 3, and inkjet curable compositions 4 to 5, the viscosity at 100 rpm was determined by using a cone plate viscometer (TVH-33H manufactured by Axes Sangyo Co., Ltd.) in accordance with JIS K2283. It was measured at 50°C (initial viscosity). As a result, it was confirmed that the initial viscosity of any composition was 5 to 50 mPa·s.

In addition, the main subjects 1 to 3, curing agents 1 to 3, and inkjet curable compositions 4 to 5 were stored in a sealed container at 50°C for 1 week, the viscosity was measured again, and the viscosity change rate (%) was calculated by the following equation. I did.

Viscosity change rate (%) =|{(Viscosity after storage for 1 week-Initial viscosity)/Initial viscosity}×100|

Based on the calculated viscosity change rate, storage stability was evaluated based on the following criteria.

○: Within 10% of viscosity change rate

X: Viscosity change exceeding 10%, or solidified, making measurement impossible

The evaluation results were as shown in Table 1 below.

As apparent from Table 1 above, as a set of a two-component inkjet curable composition comprising a main material and a curing agent, a thermal crosslinking component is included in the main material, the curing agent includes a thermosetting catalyst component, and in any of the main material and the curing agent In the inkjet curable composition set (Examples 1 and 2) containing a component cured with an active energy ray, ejection property, warpage correction of the pseudo wafer (from warpage result of pseudo wafer), heat resistance, dry to touch (adhesive property) From the result of confirmation), the storage stability was all good. In addition, since the resolution is also good, it turns out that it can cope with a high-precision pattern.

In contrast, as a one-component inkjet curable composition (Comparative Examples 1 and 2), and a two-component inkjet curable composition comprising a main material and a curing agent, the main material contains a thermal crosslinking component, and the curing agent contains a thermal curing catalyst component. However, in the inkjet curable composition set (Comparative Example 3) in which neither the main material nor the curing agent contains a component cured with an active energy ray, discharging property, resolution, warpage correction of pseudo wafers, heat resistance, dry to touch , It was difficult to achieve both storage stability.

Claims (14)

A set of curable compositions for a two-component inkjet comprising a main material and a curing agent,
The subject includes a thermal crosslinking component,
The curing agent contains a thermosetting catalyst component,
Both the main material and the curing agent are curable composition set for inkjet, characterized in that it contains a component that is cured with an active energy ray. The inkjet curable composition set according to claim 1, wherein the thermal crosslinking component contains a cyclic ether compound, and the thermosetting catalyst component contains at least any one selected from a basic catalyst and an acidic catalyst. The inkjet curable composition set according to claim 1, wherein the component cured with an active energy ray is a bifunctional (meth)acrylic monomer. The inkjet curable composition set according to claim 1, wherein both the main material and the curing agent contain a photopolymerization initiator. The inkjet curable composition set according to claim 1, wherein both the main material and the curing agent contain (meth)acrylic monomers having the same functional group number. The set of curable compositions for inkjet according to claim 1, wherein the viscosity of the main material and the curing agent at 50° C. is in the range of 5 to 100 mPa·s, respectively. The component according to claim 1, which is cured with an active energy ray included in the main material, and an active energy ray included in the curing agent so that the viscosity of the main material and the curing agent at 50° C. ranges from 5 to 100 mPa·s, respectively. The curable composition set for inkjet, wherein the components to be cured are adjusted in the range of 10 to 90% by mass, respectively. The method of claim 1, wherein the main material and the curing agent are all silica, alumina, titanium oxide, aluminum hydroxide, zinc oxide, zirconium oxide, magnesium oxide, mica, bismuth oxychloride, talc, kaolin, barium sulfate, silicic anhydride, carbonic acid. A set of curable compositions for inkjet comprising at least one inorganic filler selected from the group consisting of calcium, magnesium carbonate, magnesium silicate, aluminum silicate, and aluminum magnesium silicate. The inkjet curable composition set according to claim 1, which is used as a warpage correcting material for a fan-out type wafer-level package. A cured product of a mixture of the main material and the curing agent of the inkjet curable composition set according to any one of claims 1 to 9. As a method for producing a cured product using the inkjet curable composition set according to any one of claims 1 to 9,
The main material and the curing agent are mixed by discharging the main material and the curing agent from separate nozzles and attaching them at almost the same position on the object to be coated,
Irradiating active energy rays to the main material and the curing agent attached on the object to be coated,
Curing the main material and the curing agent to obtain a cured product
How to include that. The method according to claim 11, wherein the object to be coated is a printed wiring board. A printed wiring board comprising the cured product according to claim 10. A fan-out type wafer-level package comprising the cured product according to claim 10.