JP6416327B1 - Inkjet curable composition set, cured product, manufacturing method thereof, printed wiring board, and fan-out wafer level package - Google Patents

Abstract

A two-component ink-jet curable composition that can handle high-definition patterns, is tack-free, is suitable for correcting warpage of a pseudo wafer, has excellent heat resistance, and is excellent in dischargeability and storage stability. Provide a set of things. A two-component ink jet curable composition comprising a main agent and a curing agent, wherein the main agent includes a thermal crosslinking component, the curing agent includes a thermosetting catalyst component, and the main agent and the curing agent. All include a component that cures with active energy rays. [Selection figure] None

Description

  The present invention relates to a curable composition set for inkjet, and more particularly, to a curable composition set for two-component inkjet comprising a main agent and a curing agent. The present invention also relates to a cured product formed from the two-component inkjet curable composition set, a manufacturing method thereof, a printed wiring board having the cured product, and a fan-out type wafer level package.

  In recent years, there has been an increasing demand for miniaturization in the field of semiconductor circuits and the like, and in order to meet such demands, semiconductor circuits are sometimes mounted in a package (Chip Size Package) close to the chip size. As one means for realizing a chip size package, a package method called a wafer level package (hereinafter sometimes abbreviated as WLP) that is bonded and fragmented at a wafer level has been proposed. WLP is attracting attention because it can contribute to cost reduction and size reduction. The WLP is mounted face down on a circuit board on which electrodes are formed.

  By the way, with the miniaturization and high integration of the semiconductor chip, the number of electrodes (terminals and bumps) for external connection of the semiconductor chip tends to increase. Therefore, the pitch of the electrodes for external connection of the semiconductor chip is small. Tend to be. However, it is not always easy to directly mount a semiconductor chip on which bumps are formed at a fine pitch on a circuit board.

  In order to solve the above problems, a semiconductor encapsulant region is formed on the outer periphery of the semiconductor chip, and a rewiring layer connected to the electrode is also provided in the semiconductor encapsulant region, so that the bump pitch is reduced. It has been proposed to be larger. Such a WLP is called a fan-out type wafer level package (hereinafter sometimes abbreviated as FO-WLP) because the size of the bump arrangement area is larger than the size of the semiconductor chip.

  In FO-WLP, a semiconductor chip is embedded with a semiconductor sealing material. The circuit surface of the semiconductor chip is exposed to the outside, and a boundary between the semiconductor chip and the semiconductor sealing material is formed. A rewiring layer connected to the electrode of the semiconductor chip is also provided in the region of the semiconductor sealing material for embedding the semiconductor chip, and the bump is electrically connected to the electrode of the semiconductor chip through the rewiring layer. The pitch of the bumps can be set larger than the pitch of the electrodes of the semiconductor chip.

  In addition to a semiconductor chip, a plurality of electronic components may be arranged in one package, or a plurality of semiconductor chips may be embedded in a semiconductor sealing material to form one semiconductor component. In such a package, a plurality of electronic components are embedded with a semiconductor sealing material. The semiconductor sealing material for embedding a plurality of electronic components is provided with a rewiring layer connected to the electrodes of the electronic components, and the bumps are electrically connected to the electrodes of the electronic components via the rewiring layers. Also in this case, since the size of the bump arrangement area is larger than the size of the semiconductor chip, it can be said to be FO-WLP.

  In such a package, in general, a semiconductor chip or an electronic component is arranged at a certain interval on a support, embedded with a semiconductor sealing material, and the sealing material is heat-cured, and then the support. Pseudo wafer is produced by peeling from the wafer. Subsequently, a rewiring layer is formed from the semiconductor chip circuit surface of the pseudo wafer to the expanded semiconductor sealing material region. In this way, the pitch of the bumps can be set larger than the pitch of the electrodes of the semiconductor chip.

  In the formation of the rewiring layer, generally, a positive sensitive resin is applied to the semiconductor chip circuit surface of the pseudo wafer, pre-baked, and activated with UV light or the like in a region to be opened through a photomask or the like. Irradiate light, then develop using a developer such as TMAH (tetramethylammonium hydroxide), heat cure, oxygen plasma treatment, etc., metal electrode sputtering, and further form a photoresist layer The wiring is patterned to form a rewiring layer (for example, Patent Document 1).

  In WLP or FO-WLP, when a rewiring layer is formed on the semiconductor chip circuit surface, the circuit surface (that is, the surface on which the insulating film is formed) is mainly due to shrinkage during curing of the insulating film such as photosensitive polyimide between the wirings. Warping deformation that becomes concave occurs. In order to reduce the amount of warpage, a resin layer is formed on one surface of a substrate made of a wafer-like semiconductor, and the entire resin layer is warped and held in a spherical shape, and then the resin layer is cured. Has been proposed (for example, Patent Document 2).

  The resin layer for correcting the warp can be formed by applying a resin coating solution over the entire surface of the substrate, but an inkjet method is conceivable as a coating method that can be applied separately to a minute region such as a semiconductor chip. The ink jet method is a method in which a small amount of liquid droplets are applied to a coating surface from a nozzle and can be applied to a minute and partial application, and is therefore optimal for application to a semiconductor chip or the like. In the ink jet method, in order to facilitate the discharge by the ink jet head, the liquid is discharged from the nozzle after being heated to around 50 ° C. Moreover, in order to ensure the stability of the ink at this temperature, blocked isocyanate has been proposed as a thermosetting component (for example, Patent Document 3).

  However, since the thermosetting product of isocyanate has a low glass transition temperature, there is a problem that it is not tack-free when heated in a subsequent process and sticks to a transport device when mounted on a DRAM.

  In order to produce a tack-free warp correction material even at high temperatures, epoxy-based crosslinking is considered optimal from the viewpoint of reaction rate, glass transition temperature, and cost. However, in the epoxy curable composition, when the epoxy compound and the curing catalyst are made into one liquid, the pot life is short, and clogging of the nozzle and the tank due to gelation is likely to occur when used for a long time at around 50 ° C. . In addition, there is a drawback that the storage stability is shortened.

  In order to solve such problems, a two-pack type curable composition has also been proposed, and a solder resist using a two-pack type epoxy curable composition has also been proposed (for example, Patent Document 4). ). It has also been proposed to apply a two-pack type epoxy curable composition to an ink jet system (for example, Patent Documents 5 and 6). However, since the spread of the liquid at the time of adhesion of the droplet is not considered, it is not suitable for forming a high-definition pattern.

JP 2013-38270 A JP 2012-178422 A International Publication WO2013 / 146706 International Publication No. WO2004 / 048434 JP-A-2006-149488 JP 2007-229705 A

  Accordingly, an object of the present invention is a two-component ink jet that can cope with a high-definition pattern, is tack-free, is suitable for correcting a warp of a pseudo wafer, has excellent heat resistance, and is excellent in dischargeability and storage stability. It is to provide a curable composition set for use. Another object of the present invention is to provide a cured product formed from the two-component inkjet curable composition set, a manufacturing method thereof, a printed wiring board having the cured product, and a fan-out type wafer level package. It is to be.

  The present inventors applied a two-component curable composition having a thermal crosslinking component such as a cyclic ether compound as a main agent and a thermosetting catalyst component as a curing agent to an ink jet system, and separating the main agent and the curing agent separately. When the thermal crosslinking component and the thermosetting catalyst component are mixed by discharging from the nozzle and adhering to the same position to form a thermosetting coating film, both the main agent and the curing agent are difunctional ( It has been found that by adding a component that is cured with active energy rays such as a (meth) acrylic monomer component, it becomes easy to mix when both adhere to each other. Further, it has been found that the active energy ray is irradiated immediately after mixing the main agent and the curing agent, so that the mixing ratio of the main agent and the curing agent can be kept constant, and further, the adhering droplets can be prevented from spreading.

That is, the curable composition set for inkjet of the present invention is a two-component inkjet curable composition set comprising a main agent and a curing agent,
The main agent contains a thermal crosslinking component,
The curing agent includes a thermosetting catalyst component;
Each of the main agent and the curing agent contains a component that cures with active energy rays.

  In the curable composition set for inkjet according to the present invention, the thermal crosslinking component may include a cyclic ether compound, and the thermal curing catalyst component may include at least one selected from a basic catalyst and an acidic catalyst. .

  In the curable composition set for inkjet according to the present invention, the component that is cured by the active energy ray may be a bifunctional (meth) acrylic monomer.

  In the curable composition set for inkjet of the present invention, both the main agent and the curing agent may contain a photopolymerization initiator.

  In the curable composition set for inkjet according to the present invention, both the main agent and the curing agent may contain (meth) acrylic monomers having the same number of functional groups.

  In the curable composition set for inkjet according to the present invention, the main agent and the curing agent may each have a viscosity at 50 ° C. of 5 to 100 mPa · s.

  In the curable composition set for inkjet of the present invention, the main agent and the curing agent are all silica, alumina, titanium oxide, aluminum hydroxide, zinc oxide, zirconium oxide, magnesium oxide, mica, bismuth oxychloride, It may contain at least one inorganic filler selected from the group consisting of talc, kaolin, barium sulfate, silicic anhydride, calcium carbonate, magnesium carbonate, magnesium silicate, aluminum silicate, and aluminum magnesium silicate.

  In the curable composition set for inkjet of the present invention, it may be used as a fan-out type warp correction material for wafer level packages.

  Moreover, the hardened | cured material of another embodiment of this invention is a hardened | cured material of the mixture of the said main ingredient and the said hardening | curing agent of the said curable composition set for inkjet.

Moreover, the manufacturing method of the hardened | cured material using the curable composition set for inkjets of another embodiment of this invention discharges the said main agent and the said hardening | curing agent from a separate nozzle, and is substantially the same position on a to-be-coated article. Adhering and mixing the main agent and the curing agent,
Irradiating active energy rays to the main agent and the curing agent attached on the coated object,
Curing the main agent and the curing agent to obtain a cured product;
Including things.

  In the manufacturing method of the hardened | cured material of this invention, a printed wiring board may be sufficient as the said to-be-coated object.

  Moreover, the printed wiring board of another embodiment of this invention has the said hardened | cured material.

  In addition, a fan-out type wafer level package according to another embodiment of the present invention has the cured product.

  According to the present invention, high-definition patterns such as high-definition through-holes required for connection to DRAM can be handled, tack-free, suitable for correcting warpage of pseudo wafers, and excellent in heat resistance. However, it is possible to realize a two-pack type curable composition set for ink jet which is excellent in dischargeability and storage stability. According to another aspect of the present invention, a cured product formed from the two-component inkjet curable composition set, a manufacturing method thereof, a printed wiring board having the cured product, and a fan-out type wafer level package Can be provided.

<Curable composition set for inkjet>
The inkjet curable composition set of the present invention is a two-component inkjet curable composition set comprising a main agent and a curing agent, wherein the main agent includes a thermal crosslinking component, and the curing agent includes a thermosetting catalyst component. The main agent and the curing agent are combined into one set. The main agent constituting the curable composition set for inkjet includes at least a thermal crosslinking component and a component that is cured by active energy rays. Moreover, the hardening | curing agent which comprises the curable composition set for inkjets contains at least the thermosetting catalyst component and the component hardened | cured with an active energy ray. In the present invention, “main agent” refers to a composition containing a thermal crosslinking component and no thermosetting catalyst, and “curing agent” refers to a composition that promotes crosslinking of the thermal crosslinking component of the main agent. And

  The inkjet curable composition set of the present invention includes a component in which both the main agent and the curing agent are cured with active energy rays (hereinafter sometimes referred to as an active energy ray curable component). The active energy ray curable component makes it easy to mix the main agent and the curing agent, and further, when the main agent and the curing agent are mixed, by pre-curing with active energy, the mixed liquid of the main agent and the curing agent is formed. It has the function of keeping the mixing ratio constant by suppressing wetting and spreading. In order to make the active energy ray-curable component function more effectively, the active energy ray-curable component is preferably a curable component that can be subjected to a radical addition polymerization reaction.

  Examples of the curable component capable of undergoing a radical addition polymerization reaction include a radical addition polymerization reactive component having at least one ethylenically unsaturated group in the molecule. Polyester (meth) acrylate, polyether (meth) acrylate, urethane (meth) acrylate, carbonate (meth) acrylate, epoxy (meth) acrylate, and the like. Specifically, glycol diacrylates such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; acrylamides such as N, N-dimethylacrylamide, N-methylolacrylamide, and N, N-dimethylaminopropylacrylamide Aminoalkyl acrylates such as N, N-dimethylaminoethyl acrylate and N, N-dimethylaminopropyl acrylate; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, tris-hydroxyethyl isocyanurate Or a polyvalent acrylate such as an ethylene oxide adduct, a propylene oxide adduct, or an ε-caprolactone adduct; Acrylates, bisphenol A diacrylates, and polyvalent acrylates such as ethylene oxide adducts or propylene oxide adducts of these phenols; glycerin diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, triglycidyl isocyanurate Polyglycerides of glycidyl ether such as, but not limited to, acrylates and melamines obtained by directly acrylated polyols such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadienes, polyester polyols, or urethane acrylates via diisocyanates Examples thereof include acrylates and methacrylates corresponding to the acrylates. These may be used alone or in combination of two or more.

  Among the above-mentioned, a bifunctional (meth) acrylate monomer is particularly preferable from the viewpoint of adjusting the viscosity of the main agent and the curing agent and the compatibility of each component contained in the main agent and the curing agent. The active energy ray-curable components contained in the main agent and the curing agent are preferably (meth) acrylate monomers having the same number of functional groups. By including the (meth) acrylate monomer having the same number of functional groups in the main agent and the curing agent, it becomes easier to mix the two.

In addition to the above, compounds such as the following (1) to (11) may be used as a curable component that can be cured by a radical addition polymerization reaction contained in the main agent and the curing agent.
(1) A reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with an alkylene oxide is reacted with an unsaturated group-containing monocarboxylic acid, and the resulting reaction product is converted to a polybasic acid. An unsaturated group-containing polymer obtained by reacting an anhydride,
(2) an acrylic-containing polymer obtained by reacting a bifunctional or higher polyfunctional epoxy resin with (meth) acrylic acid and adding a dibasic acid anhydride to a hydroxyl group present in the side chain;
(3) an acrylic-containing polymer in which (meth) acrylic acid is reacted with a polyfunctional epoxy resin obtained by epoxidizing the hydroxyl group of a bifunctional epoxy resin with epichlorohydrin, and a dibasic acid anhydride is added to the resulting hydroxyl group;
(4) A reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with a cyclic carbonate compound is reacted with an unsaturated group-containing monocarboxylic acid, and the resulting reaction product is a polybasic acid. An unsaturated group-containing polymer obtained by reacting an anhydride,
(5) Acrylic-containing urethane resin by polyaddition reaction between diisocyanate and (meth) acrylate of bifunctional epoxy resin or its partial acid anhydride modified product, carboxyl group-containing dialcohol compound and diol compound,
(6) an unsaturated group-containing polymer obtained by copolymerization of an unsaturated carboxylic acid and an unsaturated group-containing compound,
(7) During the synthesis of a resin by polyaddition reaction of a diisocyanate, a carboxyl group-containing dialcohol compound and a diol compound, a compound having one hydroxyl group and one or more (meth) acryloyl groups in the molecule is added. (Meth) acrylated acrylic-containing urethane resin,
(8) During the synthesis of a resin by polyaddition reaction of a diisocyanate with a carboxyl group-containing dialcohol compound and a diol compound, a compound having one isocyanate group and one or more (meth) acryloyl groups in the molecule is added, Terminal (meth) acrylated acrylic-containing urethane resin,
(9) An acrylic-containing urethane resin obtained by adding a compound having one hydroxyl group and one or more (meth) acryloyl groups in the molecule during the synthesis of the resin of (5), and terminal (meth) acrylated,
(10) An acrylic-containing urethane resin obtained by adding a compound having one isocyanate group and one or more (meth) acryloyl groups in the molecule during the synthesis of the resin of (5) above, and terminally (meth) acrylated; 11) An acrylic-containing polymer obtained by adding a compound having one epoxy group and one or more (meth) acryloyl groups in one molecule to the resins (1) to (10) above alone or 2 It can be used in combination of more than one species or in combination with a monomer having one or more ethylenically unsaturated groups in the molecule.

  The active energy ray-curable component is preferably contained in the main agent in an amount of 10% by mass to 90% by mass and in the curing agent in an amount of 10% by mass to 90% by mass. If it is in the range of 10% by mass to 90% by mass, curing by active energy rays may be good.

  The main agent and the curing agent constituting the inkjet composition set of the present invention preferably further contain a photopolymerization initiator for causing the above-described active energy curable component to undergo a polymerization reaction with active energy rays. Examples of the photopolymerization initiator include bis- (2,6-dichlorobenzoyl) phenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -2,5-dimethylphenylphosphine oxide, and bis- (2,6- Dichlorobenzoyl) -4-propylphenylphosphine oxide, bis- (2,6-dichlorobenzoyl) -1-naphthylphosphine oxide, bis- (2,6-dimethoxybenzoyl) phenylphosphine oxide, bis- (2,6-dimethoxy) Benzoyl) -2,4,4-trimethylpentylphosphine oxide, bis- (2,6-dimethoxybenzoyl) -2,5-dimethylphenylphosphine oxide, bis- (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (IGM Res Omnirad 819), 2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylphosphinic acid methyl ester, 2-methylbenzoyldiphenylphosphine Acylphosphine oxides such as oxide, pivaloylphenylphosphinic acid isopropyl ester, 2,4,6-trimethylbenzoyldiphenylphosphine oxide (IRGACURE TPO manufactured by BASF Japan); 1-hydroxy-cyclohexyl phenyl ketone, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2 Hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, hydroxyacetophenones such as 2-hydroxy-2-methyl-1-phenylpropan-1-one; benzoin, benzyl, Benzoins such as benzoin methyl ether, benzoin ethyl ether, benzoin n-propyl ether, benzoin isopropyl ether, benzoin n-butyl ether; benzoin alkyl ethers; benzophenone, p-methylbenzophenone, Michler's ketone, methylbenzophenone, 4,4'-dichloro Benzophenones such as benzophenone and 4,4′-bisdiethylaminobenzophenone; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2 Phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl) -butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl) -1- [4- (4-morpholinyl) phenyl] -1-butanone, N Acetophenones such as N, dimethylaminoacetophenone, thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone, etc. Thioxanthones; Anne Anthraquinones such as laquinone, chloroanthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, 2-aminoanthraquinone; acetophenone dimethyl ketal, benzyldimethyl ketal, etc. Ketals; benzoic acid esters such as ethyl-4-dimethylaminobenzoate, 2- (dimethylamino) ethylbenzoate, and p-dimethylbenzoic acid ethyl ester; 1,2-octanedione, 1- [4- (phenylthio)- , 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) and other oximes Esters; bis (Η5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) phenyl) titanium, bis (cyclopentadienyl) -bis [2, Titanocenes such as 6-difluoro-3- (2- (1-pyr-1-yl) ethyl) phenyl] titanium; phenyl disulfide 2-nitrofluorene, butyroin, anisoin ethyl ether, azobisisobutyronitrile, tetra And methyl thiuram disulfide. These photoinitiators may be used individually by 1 type, and may be used in combination of 2 or more type.

  Among the photopolymerization initiators described above, oxime esters (hereinafter referred to as “oxime ester photopolymerization initiators”) and α-aminoacetophenones (hereinafter referred to as “α-aminoacetophenone light”), which is one of acetophenones. It is preferable to use one or more photopolymerization initiators selected from the group consisting of “polymerization initiators” and acylphosphine oxides (hereinafter referred to as “acylphosphine oxide photopolymerization initiators”).

  Examples of the oxime ester photopolymerization initiator include CGI-325, IRGACURE OXE01, IRGACURE OXE02 manufactured by BASF Japan, and N-1919 manufactured by ADEKA Co., Ltd. as commercially available products. Moreover, the photoinitiator which has two oxime ester groups in a molecule | numerator can also be used suitably.

  As the α-aminoacetophenone photopolymerization initiator, specifically, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone, N , N-dimethylaminoacetophenone and the like. Examples of commercially available products include Omnirad 907 manufactured by IGM Resins, IRGACURE 369, IRGACURE 379 manufactured by BASF Japan.

  Examples of the acylphosphine oxide photopolymerization initiator include the above-mentioned compounds. Examples of commercially available products include IRGACURE TPO manufactured by BASF Japan, Omnirad 819 manufactured by IGM Resins, and the like.

  Using an oxime ester photopolymerization initiator as a photopolymerization initiator that causes radical addition polymerization reaction with active energy rays, not only can a sufficient amount be obtained, but also when a thermosetting component is blended. Since there is little volatilization of the photopolymerization initiator in the post-heating process during thermosetting and mounting, contamination of a device such as a drying furnace can be reduced.

  In addition, when an acylphosphine oxide photopolymerization initiator is used, the deep curability at the time of photoreaction is improved, so that a favorable opening (through hole) shape can be obtained in terms of resolution.

  It is effective to use either an oxime ester photopolymerization initiator or an acyl phosphine oxide photopolymerization initiator. However, from the viewpoint of the resist line shape and opening balance as described above, and photocurability, oxime The combined use of an ester photopolymerization initiator and an acylphosphine oxide photopolymerization initiator is more preferred.

  Commercially available photopolymerization initiators that cause radical addition polymerization reaction with active energy rays may be used. For example, IRGACURE 389 and IRGACURE 784 manufactured by BASF Japan can be suitably used.

  The main component of the curable composition set for inkjet of the present invention contains a thermal crosslinking component. Examples of the thermal crosslinking component include thermosetting components having at least one selected from the group consisting of two or more cyclic ether groups and cyclic thioether groups (hereinafter abbreviated as cyclic (thio) ether groups). It is done. Among them, the cyclic ether compound is particularly preferable in that a tack-free coating film is obtained by advancing the thermal crosslinking reaction and increasing the glass transition temperature (hereinafter sometimes abbreviated as Tg).

  Such a thermosetting component having two or more cyclic (thio) ether groups in the molecule is either one of the three-, four- or five-membered cyclic ether groups in the molecule, or the cyclic thioether group, or two of them. A compound having at least two epoxy groups in the molecule, that is, a polyfunctional epoxy compound, a compound having at least two oxetanyl groups in the molecule, that is, a polyfunctional compound. Examples include oxetane compounds, compounds having two or more thioether groups in the molecule, that is, episulfide resins. Among these, a polyfunctional epoxy compound is preferable in that crosslinking easily proceeds.

  As the polyfunctional epoxy compound, for example, jER828, jER834, jER1001, jER1004 manufactured by Mitsubishi Chemical Corporation, Epicron 840 manufactured by DIC Corporation, Epicron 850, Epicron 1050, Epicron 2055, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Epototo YD-011, YD-013, YD-127, YD-128, D.C. E. R. 317, D.E. E. R. 331, D.D. E. R. 661, D.D. E. R. 664, Sumitomo Chemical Industries, Ltd. Sumi-Epoxy ESA-011, ESA-014, ELA-115, ELA-128, A.A. E. R. 330, A.I. E. R. 331, A.I. E. R. 661, A.I. E. R. 664 etc. (all trade names) bisphenol A type epoxy resin; jERYL903 manufactured by Mitsubishi Chemical Corporation, Epicron 152 manufactured by DIC Corporation, Epicron 165, Epototo YDB-400 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., YDB- 500, D.C. E. R. 542, Sumitomo Epoxy ESB-400, ESB-700, manufactured by Sumitomo Chemical Co., Ltd., A. E. R. 711, A.I. E. R. Brominated epoxy resins such as 714 (both trade names); jER152 and jER154 manufactured by Mitsubishi Chemical Corporation, and D.C. E. N. 431, D.D. E. N. 438, Epicron N-730, Epicron N-770, Epicron N-865 manufactured by DIC Corporation, Epototo YDCN-701, YDCN-704 manufactured by Tohto Kasei Nippon Steel & Sumitomo Chemical Co., Ltd., EPPN- manufactured by Nippon Kayaku Co., Ltd. 201, EOCN-1025, EOCN-1020, EOCN-104S, RE-306, Sumitomo Chemical Co., Ltd. Sumi-epoxy ESCN-195X, ESCN-220, Asahi Kasei K.K. E. R. ECN-235, ECN-299, etc. (both trade names) novolak type epoxy resin; Epicron 830 manufactured by DIC Corporation, jER807 manufactured by Mitsubishi Chemical Corporation, Epototo YDF-170 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Bisphenol F type epoxy resin such as YDF-175, YDF-2004, etc. (all are trade names); water such as Epototo ST-2004, ST-2007, ST-3000 (trade names) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Bisphenol A type epoxy resin; jER604 manufactured by Mitsubishi Chemical Corporation, Epototo YH-434 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., Sumitomo Epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd. (all trade names) Glycidylamine type epoxy resin; hydantoin type epoxy resin; Mitsubishi Chemical Co., Ltd. of YL-933, manufactured by Dow Chemical Co., T.; formula company manufactured by Daicel of Celloxide 2021P, etc. alicyclic epoxy resin (trade name) E. N. , EPPN-501, EPPN-502, etc. (all trade names) trihydroxyphenylmethane type epoxy resin; Mitsubishi Chemical Corporation YL-6056, YX-4000, YL-6121 (all trade names), etc. Bisphenol S type epoxy such as xylenol type or biphenol type epoxy resin or a mixture thereof; EBPS-200 manufactured by Nippon Kayaku Co., Ltd., EPX-30 manufactured by Asahi Denka Kogyo Co., Ltd., EXA-1514 manufactured by DIC Co., Ltd. Resin; Bisphenol A novolac type epoxy resin such as jER157S (trade name) manufactured by Mitsubishi Chemical Corporation; Tetraphenylolethane type epoxy resin such as jERYL-931 (all trade name) manufactured by Mitsubishi Chemical Corporation; Nissan Chemical Industries Heterocyclic Epoxy (trade name) manufactured by TEPIC, Inc. Diglycidyl phthalate resin such as Bremer DGT manufactured by Nippon Oil &Fats; tetraglycidyl xylenoylethane resin such as ZX-1063 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd .; ESN-190, ESN- manufactured by Nippon Steel Chemical Co., Ltd. 360, naphthalene group-containing epoxy resins such as HP-4032, EXA-4750 and EXA-4700 manufactured by DIC Corporation; epoxy resins having a dicyclopentadiene skeleton such as HP-7200 and HP-7200H manufactured by DIC Corporation; Glycidyl methacrylate copolymer epoxy resin such as CP-50S, CP-50M manufactured by company; Copolymer epoxy resin of cyclohexylmaleimide and glycidyl methacrylate; Epoxy-modified polybutadiene rubber derivative (for example, PB-3 manufactured by Daicel Corporation) 00, etc.), CTBN modified epoxy resin (e.g., Tohto Kasei Co. YR-102, YR-450, etc.) and others as mentioned, is not limited thereto. These epoxy resins can be used alone or in combination of two or more. Among these, a novolac type epoxy resin, a heterocyclic epoxy resin, a bisphenol A type epoxy resin or a mixture thereof is particularly preferable.

  Polyfunctional oxetane compounds include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3-methyl- 3-Oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-oxetanyl) In addition to polyfunctional oxetanes such as methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin, poly (P-hydroxystyrene), cardo bisphenol , Calixarenes, calix resorcin arenes, or the like ethers of a resin having a hydroxyl group such as silsesquioxane and the like. In addition, a copolymer of an unsaturated monomer having an oxetane ring and an alkyl (meth) acrylate is also included.

  Examples of the episulfide resin that is a compound having two or more cyclic (thio) ether groups in the molecule include bisphenol A type episulfide resin YL7000 manufactured by Mitsubishi Chemical Corporation. Moreover, episulfide resin etc. which replaced the oxygen atom of the epoxy group of the novolak-type epoxy resin with the sulfur atom using the same synthesis method can be used.

  Other thermosetting components may include known and commonly used thermosetting resins such as isocyanate compounds, blocked isocyanate compounds, cyclocarbonate compounds, polyfunctional epoxy compounds, polyfunctional oxetane compounds, polyimide compounds, and episulfide resins. .

  It is preferable that 1 mass%-70 mass% of a thermal crosslinking component is contained in a main ingredient. When the thermal crosslinking component is contained in the range of 1% by mass to 50% by mass, the viscosity may be low and the ejection property may be good.

  The curing agent constituting the curable composition set for inkjet of the present invention includes a thermosetting catalyst component. As the thermosetting catalyst component, a compound that advances the curing reaction when mixed with the above-described main agent and heated can be used. Moreover, it is preferable from a point which includes at least any 1 type of a basic catalyst and an acidic catalyst among thermosetting catalyst components to perform thermal crosslinking rapidly. Furthermore, among these, it is more preferable to include a basic catalyst because crosslinking is likely to proceed. Examples of the basic catalyst include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1- Imidazole derivatives such as (2-cyanoethyl) -2-ethyl-4-methylimidazole; dicyandiamide, melamine, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N- Examples thereof include amine compounds such as dimethylbenzylamine and 4-methyl-N, N-dimethylbenzylamine, phosphine compounds such as tributylphosphine and triphenylphosphine, and hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide. . Examples of commercially available products include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (both trade names of imidazole compounds), DBU, DBN, U-CATSA102, manufactured by Shikoku Kasei Kogyo Co., Ltd. U-CAT5002 (both bicyclic amidine compounds and salts thereof). These basic catalysts may be used individually by 1 type, or may be used in combination of 2 or more types as appropriate.

  Examples of the acid catalyst for the thermosetting catalyst include novolak resin-based and acid anhydride-based catalysts. Examples of the novolak resin system include phenol novolak resin, cresol novolak resin, bisphenol novolak resin, poly p-vinylphenol, and the like. These novolak resin-based acidic catalysts may be used alone or in combination of two or more.

  Examples of the acid anhydride-based acidic catalyst include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, -3-chlorophthalic anhydride, and -4-chlorophthalic anhydride. Acid, benzophenone tetracarboxylic anhydride, succinic anhydride, methyl succinic anhydride, dimethyl succinic anhydride, dichlor succinic anhydride, methyl nadic acid, dodecyl succinic acid, chlorendec anhydride, maleic anhydride, 3,6-endomethylenetetrahydro anhydride Phthalic acid, hexachloroendomethylenetetrahydrophthalic anhydride, methyl-3,6-endomethylenetetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexene-1 , 2-Dicarboxylic anhydride, ethylene Recall bisanhydrotrimellitate, glycerin bis (anhydrotrimellitate) monoacetate, and the like. These acid anhydride acid catalysts may be used alone or in combination of two or more.

  The inkjet curable composition set of the present invention is composed of a main component containing a thermal crosslinking component and a curing agent containing a thermosetting catalyst as separate compositions, so that it is preserved compared to a one-component curable type. Excellent stability.

  It is preferable from the viewpoint of controlling the physical properties of the coating film that the main agent and the curing agent constituting the curable composition set for inkjet of the present invention contain an inorganic filler component. As the inorganic filler component, conventionally known ones can be used without limitation, for example, silica, alumina, titanium oxide, aluminum hydroxide, zinc oxide, zirconium oxide, magnesium oxide, mica, bismuth oxychloride, as the inorganic filler, Talc, kaolin, barium sulfate, silicic anhydride, calcium carbonate, magnesium carbonate, magnesium silicate, aluminum silicate, magnesium aluminum silicate, silicon carbide, silicon nitride, boron nitride, glass powder, metal oxide, metal powder, etc. 1 type can be used individually or in mixture of 2 or more types. In addition, the inorganic filler component does not necessarily need to be included in both the main agent and the curing agent, and may be included in either one.

  The inorganic filler component preferably has an average particle size of 0.01 to 5 μm, more preferably 0.02 to 2 μm. In the present specification, the average particle diameter is the number average particle diameter calculated as an arithmetic average value obtained by measuring the major axis diameter of 20 inorganic fillers randomly selected with an electron microscope.

  The main agent and the curing agent constituting the curable composition set for inkjet of the present invention preferably contain a colorant component. Including a colorant component prevents the semiconductor device from malfunctioning due to infrared rays or the like generated from surrounding devices when a semiconductor chip on which a cured product formed from the ink-jet curable composition set is placed in a device. can do. In addition, when a cured product is engraved by means such as laser marking, marks such as characters and symbols can be easily recognized. In other words, for semiconductor chips formed with a cured product of a curable composition set for inkjet as a protective film, the product number is usually printed on the surface of the protective film by a laser marking method (a method in which the surface of the protective film is scraped off and printed by laser light). However, since the main agent and the curing agent contain a colorant, a sufficient difference in contrast between the portion of the protective film scraped by the laser beam and the portion not removed is obtained, and the visibility is improved. The colorant component is not necessarily included in both the main agent and the curing agent, and may be included in either one.

  As the colorant component, organic or inorganic pigments and dyes can be used alone or in combination of two or more. Among these, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. Examples of the black pigment include carbon black, perylene black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but are not limited thereto. Carbon black is particularly preferable from the viewpoint of preventing malfunction of the semiconductor device. Further, instead of carbon black, pigments or dyes such as red, blue, green, and yellow can be mixed to obtain black or a black color close thereto.

  Examples of red colorants include monoazo, disazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone. Specific examples include the following: It is done. Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269 and other monoazo red colorants, Pigment Red 37, 38, 41 and other disazo red colorants, Pigment Red 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53: 1, 53: 2, 57: 1, 58: 4, 63: 1 Monoazo lake red colorants such as 63: 2, 64: 1, 68, Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 85, benzimidazolone red colorant such as PigmentRed208, SolventRed135, SolventRed179, PigmentRed123, PigmentRed149, PigmentRed166, PigmentRed178, PigmentRed179, PigmentRed190, PigmentRed194, perylene-based red coloring agents such as PigmentRed224, PigmentRed254, PigmentRed255, PigmentRed264, PigmentRed270, PigmentRed272 Diketopyrrolopyrrole red colorant such as PigmentRed220, PigmentRed144, PigmentRed166, PigmentRed214, Pi mentRed220, PigmentRed221, condensed azo red colorant such as PigmentRed242, PigmentRed168, PigmentRed177, PigmentRed216, SolventRed149, SolventRed150, SolventRed52, anthraquinone-based red coloring agents such as SolventRed207, PigmentRed122, PigmentRed202, PigmentRed206, PigmentRed207, quinacridone such PigmentRed209 red-colored Agents.

  Examples of blue colorants include phthalocyanine series and anthraquinone series, and pigment series are compounds classified as Pigment, specifically: Pigment Blue 15, Pigment Blue 15: 1, Pigment Blue 15: 2, Pigment Blue 15: 3, Pigment Blue 15: 4. Pigment Blue 15: 6, Pigment Blue 16, Pigment Blue 60, and the like. Examples of the dye system include Solvent Blue 35, Solvent Blue 63, Solvent Blue 68, Solvent Blue 70, Solvent Blue 83, Solvent Blue 87, Solvent Blue 94, Solvent Blue 97, Solvent Blue 122, Solvent Blue 70, Solvent Blue 70, and Solvent Blue 70 In addition to these, metal-substituted or unsubstituted phthalocyanine compounds can also be used.

  Similarly, the green colorant includes phthalocyanine, anthraquinone, perylene, and the like. Specifically, PigmentGreen 7, PigmentGreen 36, SolventGreen 3, SolventGreen 5, SolventGreen 20, SolventGreen 28, and the like can be used. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.

  Similarly, the green colorant includes phthalocyanine, anthraquinone, perylene, and the like. Specifically, PigmentGreen 7, PigmentGreen 36, SolventGreen 3, SolventGreen 5, SolventGreen 20, SolventGreen 28, and the like can be used. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.

  Examples of yellow colorants include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, and anthraquinone, and specific examples include the following. SolventYellow163, PigmentYellow24, PigmentYellow108, PigmentYellow193, PigmentYellow147, PigmentYellow199, anthraquinone-based yellow colorant such as PigmentYellow202, PigmentYellow110, PigmentYellow109, PigmentYellow139, PigmentYellow179, isoindolinone-based yellow colorant such as PigmentYellow185, PigmentYellow93, PigmentYellow94, PigmentYellow95, PigmentYellow128, PigmentYellow155, Pigment Yellow 166, Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, Pigment Yellow 181, Yield 6, 61, yellow 9 62, 62: 1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116, 167, 168, 169, 182, 183, and the like, Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188 Etc. can be used disazo-based yellow colorant such as 198.

  Moreover, you may add colorants, such as purple, orange, brown, and black, in order to adjust a color tone. Specifically, PigmentViolet 19, 23, 29, 32, 36, 38, 42, Solvent Violet 13, 36, C.I. I. Pigment orange 1, C.I. I. Pigment orange 5, C.I. I. Pigment orange 13, C.I. I. Pigment orange 14, C.I. I. Pigment orange 16, C.I. I. Pigment orange 17, C.I. I. Pigment orange 24, C.I. I. Pigment orange 34, C.I. I. Pigment orange 36, C.I. I. Pigment orange 38, C.I. I. Pigment orange 40, C.I. I. Pigment orange 43, C.I. I. Pigment orange 46, C.I. I. Pigment orange 49, C.I. I. Pigment orange 51, C.I. I. Pigment orange 61, C.I. I. Pigment orange 63, C.I. I. Pigment orange 64, C.I. I. Pigment orange 71, C.I. I. Pigment orange 73, C.I. I. Pigment brown 23, C.I. I. Pigment brown 25, C.I. I. Pigment black 1, C.I. I. Pigment black 7 and the like.

  The main agent and the curing agent constituting the curable composition set for inkjet of the present invention may contain a coupling agent component having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group. At least one of the adhesion of the warp correction layer to the adherend (pseudo wafer), the adhesion, and the cohesiveness of the warp correction layer when the warp correction layer is provided on the FO-WLP using the curable composition set for inkjet. One can be improved. In addition, by including a coupling agent component, when a coating film of a mixture composed of a main agent and a curing agent is formed on FO-WLP and the mixture is cured to form a warp correction layer, the heat resistance of the warp correction layer is reduced. The water resistance can be improved without impairing the properties. Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, silane coupling agents, and the like. Of these, silane coupling agents are preferred. The coupling agent is not necessarily included in both the main agent and the curing agent, and may be included in either one.

  Examples of organic groups contained in the silane coupling agent include vinyl groups, epoxy groups, styryl groups, methacryloxy groups, acryloxy groups, amino groups, ureido groups, chloropropyl groups, mercapto groups, polysulfide groups, and isocyanate groups. Can be mentioned. Commercially available silane coupling agents can be used, for example, KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403. , KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-9103, KBM -573, KBM-575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007 (all trade names; manufactured by Shin-Etsu Silicon Chemical Co., Ltd.) Can be mentioned. These may be used alone or in combination of two or more.

  In addition to the above-described components, various additives may be blended in the main agent and the curing agent constituting the curable composition set for inkjet according to the present invention, if necessary. Various additives include leveling agents, plasticizers, antioxidants, ion scavengers, gettering agents, chain transfer agents, release agents, rust inhibitors, adhesion promoters, UV absorbers, thermal polymerization inhibitors, thickening agents. You may contain a well-known and usual additive in the field | areas of electronic materials, such as an agent and an antifoamer. These additives are not necessarily contained in both the main agent and the curing agent, and may be contained in either one.

  The main agent and the curing agent constituting the curable composition set for inkjet according to the present invention may contain an organic solvent. The organic solvent is used to adjust the viscosity when synthesizing a polyether compound containing an ethylenically unsaturated group in the molecule, mixing each component, and applying the obtained curable resin composition to a substrate or a support film. Can be used for.

  Examples of the organic solvent include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like. More specifically, ketones such as methyl ethyl ketone and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ethers such as ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether, ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate , Esters such as propylene glycol butyl ether acetate, ethanol, propanol Ethylene glycol, or propylene glycol, octane, can be exemplified aliphatic hydrocarbons decane, petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, petroleum solvents such as solvent naphtha. An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more type.

<The manufacturing method of the hardened | cured material using the curable composition set for inkjet>
The main component and the curing agent containing each of the above components can be applied to a high-definition desired pattern by using an inkjet method, and a cured product can be obtained by curing the coating film. From the viewpoint of application to an inkjet method, the main agent and the curing agent preferably have a viscosity at 50 ° C. of 5 to 100 mPa · s, particularly 5 to 50 mPa · s. Thereby, smooth printing can be performed without applying an unnecessary load to the ink jet printer. The viscosity of the main agent and the curing agent can be adjusted mainly by the content of the active energy ray-curable component such as the above-described bifunctional (meth) acrylic monomer.

  The method for adhering the main agent and the curing agent to the object to be coated by the ink jet method is not particularly limited. However, from the viewpoint of high-definition patterning and physical properties of the coating film, the main agent starts from a separate nozzle of the ink jet printer. It is preferable to discharge the curing agent and the curing agent so as to adhere to substantially the same position on the object to be coated. The main agent and the curing agent adhere to substantially the same position on the object to be coated, so that both are mixed. In addition, “substantially the same position” refers to a state in which when the droplets ejected from separate inkjet nozzles adhere to the object to be coated, both droplets overlap and the main agent and the curing agent can be mixed. It is not intended to cause the droplets to adhere to exactly the same location.

  As described above, the active energy ray is irradiated after the main agent and the curing agent are attached to substantially the same position on the coated object. The active energy ray curable component contained in the main agent and the curing agent is cured by irradiation with the active energy ray, and the coating film in which the main agent and the curing agent are mixed is cured or the viscosity of the coating film is increased. It is possible to prevent the attached coating film from spreading. Therefore, it is preferable that the irradiation with the active energy ray is performed as soon as possible after the main agent and the curing agent are attached to the object to be coated. For example, after discharging the main agent and the curing agent from the nozzles of the ink jet printer, the active energy rays are preferably irradiated within 1.0 second, more preferably within 0.5 second. High-definition patterning can be performed by irradiating active energy rays promptly after ejection. The direction of irradiating the active energy ray to the coating film to which the main agent and the curing agent are attached is not particularly limited, but from the oblique side of the coated object or when the coated object is transparent, Active energy rays can be irradiated from the back surface direction.

  As the irradiation source of the active energy ray, an LED, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is appropriate. In addition, electron beams, α rays, β rays, γ rays, X rays, neutron rays, and the like can also be used. Note that the number of irradiation light sources is one, or two or more. In the case of two or more, light sources having different wavelengths can be used in combination.

The dose of active energy rays, varies depending on the thickness of the coating film, generally 10 to 10000 mJ / cm ^2, preferably 20~2000mJ / cm ^2, more preferably in the range of 100 to 2000 mJ / cm ² be able to.

  In the embodiment of the present invention, using the two-component inkjet curable composition set of the present invention, the surface opposite to the surface on which the FO-WLP rewiring layer is provided by the inkjet method as described above. A warp correction layer provided on the surface can be formed. In another embodiment, a printed wiring board can be formed as a solder resist by an ink jet method as described above. In addition, the coating film irradiated with the active energy ray is finally cured by heat to become a cured product. The conditions (temperature, time, etc.) for thermosetting vary depending on the use of the cured product formed using the two-component inkjet curable composition set. Hereinafter, a fan-out type wafer level package will be described as an example.

<Manufacturing method of fan-out type wafer level package>
In the case of forming a FO-WLP warp correction layer using the two-component inkjet curable composition set of the present invention, an example of manufacturing a FO-WLP pseudo wafer provided with a warp correction layer will be described.

  First, a semiconductor wafer is prepared and a circuit is formed on one surface. The semiconductor wafer may be a silicon wafer or a compound semiconductor wafer such as gallium arsenide (GaAs). A circuit can be formed on the wafer surface by various methods including a widely used method such as an etching method and a lift-off method. The semiconductor wafer may be cut into individual semiconductor chips through a dicing process.

  The semiconductor chip obtained as described above is placed on a plate-like carrier having a smooth surface through an adhesive layer. Although it does not specifically limit as a carrier, A circular or square silicon wafer and a metal plate can be used. Further, as the adhesive layer, a layer capable of temporarily fixing a semiconductor chip and capable of being peeled off after manufacturing a pseudo wafer is used. As such an adhesive layer material, an acrylic adhesive, a rubber adhesive, a styrene / conjugated diene block copolymer, or the like can be used.

  Further, as the adhesive layer material, a carboxyl group-containing resin having an ethylenically unsaturated group and a radical polymerization initiator as described above can be contained. By containing such a resin, heating or active energy rays can be contained. The adhesiveness of the adhesive layer can also be changed by irradiation.

  When placing a semiconductor chip on the adhesive layer, a plurality of semiconductor chips are placed separately. The semiconductor chips to be mounted may be the same or different in the number of arrangement in the vertical and horizontal directions in plan view, and from various viewpoints such as improving the density and securing the terminal area per unit semiconductor chip, You may arrange | position in a grid | lattice form etc. The distance between the adjacent semiconductor chips is not particularly limited, but may be arranged so as to obtain a fan-out (FO) region necessary for forming a connection terminal of the finally obtained FO-WLP. desirable.

  Subsequently, the semiconductor chip placed on the plate-like carrier via the adhesive layer is sealed with a sealing material. The semiconductor chip is placed and the sealing material is applied or bonded onto the carrier so that the side wall surface and the upper surface of the semiconductor chip are sealed with the sealing material. At this time, the sealing material is molded so as to be embedded in the space between the semiconductor chips. The sealing step using such a sealing material can be formed by performing compression molding using a known semiconductor sealing resin composition that is liquid, granule, or sheet. Known resin encapsulating resin compositions mainly include epoxy resins, epoxy resin curing catalysts, curing accelerators, spherical fillers, and the like.

  After the sealing material is cured, the plate-like carrier is peeled off. Peeling is performed between the sealing material and the semiconductor chip and the adhesive layer. As a peeling method, heat treatment is performed to change (decrease) the adhesive strength of the adhesive layer and release, or first peeling is performed between the plate-like carrier and the adhesive layer, and then the adhesive layer is subjected to heat treatment or Examples of the method include a method of releasing after the irradiation treatment with an electron beam or ultraviolet rays.

  The pseudo wafer thus obtained may be post-cured. Post-curing is performed, for example, in a temperature range of 150 to 200 ° C. and in a range of 10 minutes to 8 hours. Subsequently, the pseudo wafer can be thinned by polishing the opposite side of the obtained pseudo wafer where the semiconductor is embedded. The grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. The thickness of the pseudo wafer after grinding is not particularly limited, but is usually about 50 to 500 μm.

  Subsequently, a rewiring layer is formed on the side of the pseudo wafer where the circuit of the semiconductor chip is exposed. First, a rewiring insulating resin is applied to the entire surface of the pseudo wafer where the semiconductor chip circuit is exposed by spin coating or the like, and prebaked at about 100 ° C. to form a rewiring insulating resin layer. To do. Next, in order to open the connection pads of the semiconductor chip, a pattern is formed on the insulating resin layer for rewiring using a photolithography method or the like, and heat treatment (curing) is performed. As the conditions for the heat treatment, for example, it is carried out in a temperature range of 150 to 250 ° C. and in a range of 10 minutes to 5 hours. Although it does not specifically limit as insulating resin for rewiring, From a heat resistant and reliable viewpoint, a polyimide resin, a polybenzooxide resin, a benzocyclobutene resin etc. are used. As described above, when the insulating resin for rewiring is heat-treated, the pseudo wafer may be warped due to heat shrinkage of the insulating resin.

  A power feeding layer is formed on the entire surface of the rewiring layer surface of the pseudo wafer by a method such as sputtering, then a resist layer is formed on the power feeding layer, exposed to a predetermined pattern and developed, and then via and copper are plated by electrolytic copper plating. A rewiring circuit is formed. After forming the rewiring circuit, the resist layer is peeled off and the power feeding layer is etched.

  Subsequently, flux is applied to the lands provided on the rewiring circuit, the solder balls are mounted, and then heated and melted to attach the solder balls to the lands. Further, a solder resist layer may be formed so as to cover a part of the rewiring circuit and the solder balls. The applied flux can be resin-based or water-based. As the heating and melting method, reflow, hot plate or the like can be used. In this way, a pseudo wafer of FO-WLP is obtained.

  Thereafter, the FO-WLP is obtained by dividing the pseudo wafer of FO-WLP by a method such as dicing.

  A warp correction layer is formed on the surface opposite to the surface on which the rewiring layer of the pseudo wafer thus obtained is formed. The warp correction layer is formed by an inkjet method using a two-component inkjet curable composition set. That is, the main agent and the curing agent are ejected from an ink jet nozzle and adhered to substantially the same position to form a coating film, and the coating film is cured by irradiation with active energy rays. After that, by heating as described later, the coating film is further cured to form a warp correction layer. At this time, the warp correction layer may be formed on the entire surface opposite to the surface on which the rewiring layer of the pseudo wafer is formed, or the warp correction layer may be formed so as to achieve a desired patterning. When the ink jet method is used, fine and partial printing is possible, and the location and size of the warp of the package can be flexibly dealt with.

  The coating amount of the warp correction material is preferably adjusted such that the thickness of the warp correction layer when cured to form the warp correction layer is in the range of 15 to 50 μm. If the thickness of the warp correction layer is 15 μm or more, it becomes easy to smooth the warp. Moreover, if it is 50 micrometers or less, the thinness which is one of the advantages of FO-WLP will not be impaired.

  In the present invention, the application amount of the warp correction material, that is, the adjustment of the thickness of the warp correction layer after curing the warp correction material, the irradiation amount of the active energy ray, and further, the selection of the whole surface irradiation and partial irradiation The amount of correction according to the degree of warpage of FO-WLP can be easily adjusted by appropriately adjusting the degree of cure of the warp correction layer of the pseudo wafer.

  In the present invention, the temperature and time for curing by heat are adjusted, or the temperature of the pseudo wafer is warped by performing a method of raising the temperature in one step to the target temperature or performing step heating that is heated to the final temperature via an intermediate temperature. The amount of correction can be easily adjusted by adjusting the degree of cure of the correction layer as appropriate and adjusting the warping of FO-WLP. The temperature for curing by heating is 100 ° C to 300 ° C, more preferably 120 ° C to 180 ° C. The time for curing by heating is preferably 30 seconds to 3 hours. Preferably, it is 30 minutes to 2 hours.

  In the present invention, it is also possible to form a cured coating on a printed wiring board using a two-component inkjet curable composition set. In this case, the temperature for curing by heating is 120 ° C to 180 ° C. The time for curing by heating is preferably 30 minutes to 2 hours.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. Unless otherwise specified, “parts” and “%” mean parts by mass.

<Preparation of pseudo wafer>
A 4-inch, 150 μm thick P-type silicon wafer having a 100 nm SiO ₂ film formed on one side made by Canosis Co., Ltd. was diced using a dicing apparatus to obtain a 10 mm × 10 mm square semiconductor chip. A temporary fixing film was placed on a SUS flat substrate, and the above-mentioned semiconductor chips were placed 5 × 5 in length and breadth so that the SiO 2 surface was in contact with the temporarily fixing film and the distance between the semiconductor chips was 10 mm vertically and horizontally. A 100 mm × 100 mm square sheet-shaped semiconductor encapsulant was laminated thereon so that the center positions were approximately the same, and compression-molded at 150 ° C. for 1 hour using a heating type press crimping machine. As a semiconductor sealing material, a kneaded material having the following composition is placed between two 50 μm cover films (Teijin Purex film), and the kneaded material is formed into a sheet by a flat plate pressing method. What was formed into a 200 μm thick sheet was used.

<Preparation of semiconductor encapsulant composition>
The following components were blended, heated at 70 ° C. for 4 minutes in a roll kneader, then heated at 120 ° C. for 6 minutes, and melt-kneaded while reducing pressure (0.01 kg / cm 2) for a total of 10 minutes to prepare a kneaded product.
・ Naphthalene type epoxy resin (NC-7000, Nippon Kayaku Co., Ltd.) 30 parts by mass ・ Bisphenol type epoxy resin (YX-4000, manufactured by Mitsubishi Chemical Corporation) 10 parts by mass ・ Phenol novolac type epoxy resin (The Dow Chemical) D.E.N. 431) 10 parts by mass, anthraquinone 2 parts by mass, carbon black (carbon MA-100, manufactured by Mitsubishi Chemical Corporation) 10 parts by mass, spherical silica
(Admatechs Co., Ltd. Admafine SO-E2) 500 parts by mass / Silane coupling agent (Shin-Etsu Chemical Co., Ltd. KBM-403) 2 parts by mass / 2-phenylimidazole (Shikoku Chemicals Co., Ltd. 2PZ) 2 Parts by mass

  Next, the temporarily fixed film was peeled off from the obtained laminate, and the back side was polished to obtain a pseudo wafer having a size of 100 mm × 100 mm square and a thickness of 200 μm.

  A positive rewiring forming resin composition having the following composition was applied by spin coating to the semiconductor circuit surface side of the obtained pseudo wafer, and prebaked by heating at 100 ° C. for 20 minutes. The thickness of the photosensitive rewiring-forming resin layer formed on the pre-baked pseudo wafer was 10 μm.

<Preparation of resin composition for rewiring formation>
First, 2,2-bis (3-amino-4-hydroxyphenyl) -propane was dissolved in N-methylpyrrolidone, and 0-4, while N-methylpyrrolidone of 4,4′-diphenyl ether dicarboxylic acid chloride was added dropwise. Reaction was carried out at 0 ° C. to synthesize a polyhydroxyamide (polybenzoxazole precursor) resin having a weight average molecular weight of 1.3 × 10 4.
Next, the following components containing a polyhydroxyamide resin were blended, and this mixed solution was subjected to pressure filtration using a 3 μm pore Teflon (registered trademark) filter to prepare a resin composition for rewiring.
-Polyhydroxyamide resin (Z2) 100 parts by mass-Phenol novolac type epoxy resin (DEN 431 manufactured by The Dow Chemical Company) 10 parts by mass-1-naphthoquinone-2-diazide-5 Sulfonic acid ester (trade name: TPPA528, manufactured by AZ Electronic Materials) 10 parts by mass / Y-X-Y type block copolymer (Nano Strength M52N manufactured by Arkema) 5 parts by mass: Silane coupling agent (Shin-Etsu Chemical Co., Ltd.) Manufactured by KBM-403) 2 parts by mass, γ-butyrolactone 30 parts by mass, propylene glycol monomethyl ether acetate 120 parts by mass

Subsequently, using an HMW680GW (metal halide lamp) manufactured by ORC through a photomask in which a circular opening pattern of 100 μm is continuously formed vertically and horizontally at a pitch of 400 μm, an exposure amount of 500 mJ / cm ² is positive. The mold pattern was irradiated with light, and developed using a 2.38 wt% TMAH aqueous solution at 25 ° C. for 2 minutes to form a rewiring resin layer in which a round opening pattern was formed. Then, it baked at 200 degreeC for 1 hour, and cooled to room temperature. In the pseudo wafer thus obtained, a warp such that the rewiring resin layer side was concave occurred. The amount of warpage was a state in which the central portion was recessed by 6 mm with reference to a peripheral portion of 100 mm × 100 mm square.

<Preparation of warp correction layer>
A piezo ink jet printer was used, and an ink cartridge having a discharge amount of 10 pl (per discharge) was used. The main agent and the curing agent having the following composition were filled in separate cartridges, and the ejection amounts of the main agent and the curing agent were the same and the landing positions were the same. The exposure was performed within 0.5 seconds after landing with a high-pressure mercury lamp attached to the side. The exposure amount was 600 mJ / cm ² , and the coated film after irradiation was heated at 160 ° C. for 60 minutes in a BOX-type drying furnace to produce a warp correction layer.

<Adjustment of curable composition set for inkjet>
[Preparation of main agent 1]
The following ingredients were blended, mixed and dispersed by a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 μm to obtain main ingredient 1.
-Bisphenol A type epoxy resin (Mitsubishi Chemical Corporation: Epicoat 828) 40 parts by mass-HDDA: 1,6-hexanediol diacrylate 10 parts by mass (Daicel Ornex Co., Ltd.)
DPGDA: Dipropylene glycol diacrylate (manufactured by BASF Japan) 50 parts by mass Irg369: 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone (manufactured by BASF Japan) 8 parts by mass MA-100: Carbon black (manufactured by Mitsubishi Chemical Corporation) 1 part by mass • BYK-307: Silicone additive (manufactured by Big Chemie Japan) 0.1 part by mass

[Preparation of curing agent 1]
The following components were blended, mixed and dispersed with a bead mill, and filtered through a glass fiber filter having a pore size of 1 μm to obtain a curing agent 1.
HDDA: 1,6-hexanediol diacrylate (manufactured by Daicel Ornex Co., Ltd.) 10 parts by mass DPGDA: dipropylene glycol diacrylate (manufactured by BASF Japan) 50 parts by mass DICY7: DICY7 dicyandiamide (manufactured by Mitsubishi Chemical Corporation) 3 parts by mass · Irg 369: 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone (manufactured by BASF Japan) 8 parts by mass · MA-100: carbon black (manufactured by Mitsubishi Chemical Corporation) 1 part by mass. BYK-307: Silicone additive (by Big Chemie Japan) 0.1 part by mass

[Preparation of main agent 2]
The following components were blended, mixed and dispersed by a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 μm to obtain main ingredient 2.
・ Bisphenol A type epoxy resin (Mitsubishi Chemical Corporation: Epicoat 828) 40 parts by mass ・ HDDA: 1,6-hexanediol diacrylate (Daicel Ornex Co., Ltd.) 10 parts by mass ・ DPGDA: Dipropylene glycol diacrylate ( 50 parts by mass of DASFURE 1173: 2-hydroxy-2-methyl-1-phenyl-propan-1-one (manufactured by BASF Japan) 1 part by mass of 2-ethyl AQ: 2-ethylanthraquinone (BASF) 2 parts by mass / Omnirad 819: bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (manufactured by IGM Resin) 2 parts by mass / SO-E2: spherical silica (manufactured by Admatechs) 10 Mass part / BYK-307: Recon based additive (BYK Japan KK) 0.1 parts by weight

[Preparation of curing agent 2]
The following components were blended, mixed and dispersed by a bead mill, and filtered through a glass fiber filter having a pore diameter of 1 μm to obtain a curing agent 2.
-DICY7: DICY7 dicyandiamide (manufactured by Mitsubishi Chemical) 3 parts by mass-HDDA: 1,6-hexanediol diacrylate (manufactured by Daicel Ornex Co., Ltd.) 20 parts by mass-DPGDA: dipropylene glycol diacrylate (manufactured by BASF Japan) 50 Part by mass / Darocur 1173: 2-hydroxy-2-methyl-1-phenyl-propan-1-one (manufactured by BASF Japan) 1 part by mass / 2-ethyl AQ: 2-ethylanthraquinone (manufactured by BASF Japan) 2 mass Parts · Omnirad819: bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (manufactured by IGM Resin) 2 parts by mass · SO-E2: spherical silica (manufactured by Admatex Co., Ltd.) 10 parts by mass · BYK-307 : Silicone additive (Bi Kukemi Japan Co., Ltd.) 0.1 parts by weight

[Preparation of main agent 3 and curing agent 3]
Main agent 3 and curing agent 3 were prepared in the same manner except that HDDA and DPGDA contained in each of main agent 1 and curing agent 1 were replaced with 50 parts by mass of γ-butyllactone (manufactured by Mitsubishi Chemical Corporation).

<Preparation of curable composition 4 for inkjet>
The following components were blended, mixed and dispersed by a bead mill, and filtered through a glass fiber filter having a pore size of 1 μm to obtain a curable composition 4 for inkjet.
7982: Blocked isocyanate (manufactured by Baxenden) 20 parts by mass 4HBA: 4-hydroxybutyl acrylate (manufactured by Nippon Kasei Co., Ltd.) 3 parts by mass HDDA: 1,6-hexanediol diacrylate (manufactured by Daicel Ornex) 10 Mass parts · DPGDA: Dipropylene glycol diacrylate (manufactured by BASF Japan) 50 parts by mass · Irg369: 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone (manufactured by BASF Japan) 8 masses Parts · MA-100: carbon black (manufactured by Mitsubishi Chemical Corporation) 1 part by mass · BYK-307: silicon-based additive (produced by Big Chemie Japan) 0.1 parts by mass

<Preparation of curable composition 5 for inkjet>
The main agent 1 and the curing agent 1 obtained as described above were mixed at a ratio of 1: 1 based on mass, and stirred for 5 minutes using a dissolver to obtain a curable composition 5 for inkjet.

<Evaluation of ejectability>
Each composition obtained as described above, that is, the main agent 1 and the curing agent 1 are separately filled in the ink cartridge of the ink jet printer, and the main agent and the curing agent are supplied from the respective nozzles on the convex side of the pseudo wafer. By discharging, the main agent and the curing agent were adhered to substantially the same position on the pseudo wafer. Exposure was performed within 0.5 seconds after landing of the main agent and curing agent. The ejection and exposure were performed under the same conditions as those described above in <Preparation of warp correction layer>. This was repeated for 20 pseudo wafers, and it was confirmed whether the nozzles of the inkjet printer were clogged. The ejection characteristics of the set of the main agent 2 and the curing agent 3 and the set of the main agent 3 and the curing agent 3 were similarly evaluated. Further, the ink jet curable compositions 4 and 5 were filled in one of the ink cartridges, and the same dischargeability evaluation was performed. The evaluation criteria were as follows.
○: No nozzle clogged ×: Nozzle clogged

<Evaluation of resolution>
In addition, as in the above <Evaluation of ejectability>, the main agents 1 to 3, the curing agents 1 to 3, and the inkjet curable compositions 4 to 5 are ejected and exposed to a 150 μm diameter on the convex side on the pseudo wafer. Through-holes were formed, and the shape of the through-holes was observed. The evaluation criteria for resolution were as follows.
○: A through hole of 150 μm was formed. ×: The periphery of the through hole was blurred and the opening was small or the opening was buried.

<Measurement of warpage of pseudo wafer>
When the film thickness of the warp correction layer formed in the same manner as in the above <Preparation of warp correction layer> was measured with a micrometer, it was 30 μm. Further, the amount of warpage of the pseudo wafer on which the warp correction layer was formed was measured. The amount of warpage was measured at 25 ° C. using a long caliper. Evaluation was made according to the following criteria, using any two points on the periphery of the pseudo wafer as a reference.
○: Warpage of the central portion is ± 2 mm or less ×: Warpage of the central portion exceeds ± 2 mm

<Evaluation of heat resistance>
The warp correction layer formed as described above is immersed in a solder bath at 260 ° C. for 10 seconds in accordance with the method of JIS C6481-1996, and then the surface of the warp correction layer is subjected to a peeling test using a cellophane adhesive tape. The state was visually observed and evaluated according to the following criteria.
○: The surface is not peeled ×: The surface is peeled

<Checking tackiness>
The pseudo wafer having the warp correction layer formed as described above is sandwiched between 25 mm double clips (manufactured by KOKUYO Co., Ltd., Kuri-34), heated at 130 ° C. for 10 minutes, returned to room temperature, and then the double clips are removed. The presence or absence of tack marks during heating of the warp correction layer was confirmed.
○: No tack mark ×: With tack mark

<Storage stability>
With respect to the main agents 1 to 3, the curing agents 1 to 3, and the curable compositions for inkjet 4 to 5, the respective viscosities are based on JIS K2283, and the viscosity at 100 rpm is determined as a cone plate viscometer (TVH manufactured by Toki Sangyo Co., Ltd.). (−33H) at 50 ° C. (initial viscosity). As a result, it was confirmed that all compositions had an initial viscosity of 5 to 50 mPa · s.
Further, the main agents 1 to 3, the curing agents 1 to 3, and the curable compositions for inkjet 4 to 5 were stored in a sealed container at 50 ° C. for 1 week, the viscosity was measured again, and the rate of change in viscosity according to the following formula: (%) Was calculated.
Viscosity change rate (%) = | {(viscosity after storage for 1 week−initial viscosity) / initial viscosity} × 100 |
Based on the calculated viscosity change rate, the storage stability was evaluated based on the following criteria.
○: Viscosity change rate within 10% ×: Viscosity change exceeds 10% or cannot be measured due to solidification The evaluation results were as shown in Table 1 below.

  As is clear from Table 1 above, it is a two-pack type curable composition set for an ink jet comprising a main agent and a curing agent, the main agent including a thermal crosslinking component, the curing agent including a thermosetting catalyst component, In any of the curing agents, the curable composition set for inkjets containing a component that is cured with active energy rays (Examples 1 and 2), ejection properties, and correction of the warpage of the pseudo wafer (from the result of the warpage of the pseudo wafer), Heat resistance, tack-free property (from the result of confirmation of tack property), and storage stability were all good. In addition, it was found that high resolution patterns can be handled due to good resolution.

  In contrast, a one-pack type curable composition for inkjet (Comparative Examples 1 and 2) and a two-part type curable composition for inkjet composed of a main agent and a curing agent, the main component including a thermal crosslinking component. In the curable composition set for ink jet (Comparative Example 3), the curing agent contains a thermosetting catalyst component but neither the main agent nor the curing agent contains a component that cures with active energy rays. It has been difficult to simultaneously correct the warpage of the pseudo wafer, heat resistance, tack-free property, and storage stability.

Claims (13)

A curable composition set for a two-component ink jet comprising a main agent and a curing agent,
The main agent contains a thermal crosslinking component,
The curing agent includes a thermosetting catalyst component;
The main agent and the curing agent are both seen including a component which is cured by active energy ray,
The main component and the curing agent are cured with active energy rays contained in the curing agent and a component that is cured with active energy rays contained in the main agent so that the viscosity at 50 ° C. of each of the main agent and the curing agent is 5 to 100 mPa · s. The component to perform is adjusted in the range of 10-90 mass%, respectively , The curable composition set for inkjet characterized by the above-mentioned.   The curable composition set for inkjet according to claim 1, wherein the thermal crosslinking component contains a cyclic ether compound, and the thermosetting catalyst component contains at least one selected from a basic catalyst and an acidic catalyst.   The curable composition set for inkjet according to claim 1 or 2, wherein the component cured by the active energy ray is a bifunctional (meth) acrylic monomer.   The said main ingredient and the said hardening | curing agent are curable composition sets for inkjets of any one of Claims 1-3 in which all contain a photoinitiator.   The said main ingredient and the said hardening | curing agent are the curable composition sets for inkjets of any one of Claims 1-4 in which all contain the (meth) acryl monomer of the same functional group number.   The curable composition set for inkjet according to any one of claims 1 to 5, wherein the main agent and the curing agent each have a viscosity at 50 ° C of 5 to 100 mPa · s.   The main agent and the curing agent are all silica, alumina, titanium oxide, aluminum hydroxide, zinc oxide, zirconium oxide, magnesium oxide, mica, bismuth oxychloride, talc, kaolin, barium sulfate, anhydrous silicic acid, calcium carbonate. The curable composition for inkjet according to any one of claims 1 to 6, comprising at least one inorganic filler selected from the group consisting of magnesium carbonate, magnesium silicate, aluminum silicate, and aluminum magnesium silicate. Things set.   The curable composition set for inkjet according to any one of claims 1 to 7, which is used as a fan-out type warpage correction material for a wafer level package.   Hardened | cured material of the mixture of the said main ingredient and the said hardening | curing agent of the curable composition set for inkjets of any one of Claims 1-8. A method for producing a cured product using the curable composition set for inkjet according to any one of claims 1 to 8,
The main agent and the curing agent are ejected from separate nozzles and adhered to substantially the same position on the object to be coated, and the main agent and the curing agent are mixed.
Irradiating active energy rays to the main agent and the curing agent attached on the coated object,
Curing the main agent and the curing agent to obtain a cured product;
Including the method.   The method of Claim 10 that the said to-be-coated article is a printed wiring board.   A printed wiring board comprising the cured product according to claim 9.   A fan-out type wafer level package having the cured product according to claim 9.