KR102231730B1 - 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 - Google Patents
각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 Download PDFInfo
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- KR102231730B1 KR102231730B1 KR1020157002125A KR20157002125A KR102231730B1 KR 102231730 B1 KR102231730 B1 KR 102231730B1 KR 1020157002125 A KR1020157002125 A KR 1020157002125A KR 20157002125 A KR20157002125 A KR 20157002125A KR 102231730 B1 KR102231730 B1 KR 102231730B1
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
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- Physics & Mathematics (AREA)
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020217007857A KR102330743B1 (ko) | 2012-06-26 | 2013-06-25 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261664477P | 2012-06-26 | 2012-06-26 | |
| US61/664,477 | 2012-06-26 | ||
| US201361764435P | 2013-02-13 | 2013-02-13 | |
| US61/764,435 | 2013-02-13 | ||
| PCT/US2013/047691 WO2014004564A1 (en) | 2012-06-26 | 2013-06-25 | Scanning in angle-resolved reflectometry and algorithmically eliminating diffraction from optical metrology |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217007857A Division KR102330743B1 (ko) | 2012-06-26 | 2013-06-25 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150036214A KR20150036214A (ko) | 2015-04-07 |
| KR102231730B1 true KR102231730B1 (ko) | 2021-03-24 |
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| KR1020217019127A Active KR102330741B1 (ko) | 2012-06-26 | 2013-06-25 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
| KR1020217007857A Active KR102330743B1 (ko) | 2012-06-26 | 2013-06-25 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
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| KR1020217019127A Active KR102330741B1 (ko) | 2012-06-26 | 2013-06-25 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
| KR1020217007857A Active KR102330743B1 (ko) | 2012-06-26 | 2013-06-25 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
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| WO (1) | WO2014004564A1 (enExample) |
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| JP6063875B2 (ja) | 2011-02-24 | 2017-01-18 | エキシモ メディカル リミテッド | 組織切除のためのハイブリッドカテーテル |
| KR102231730B1 (ko) | 2012-06-26 | 2021-03-24 | 케이엘에이 코포레이션 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
| US9851300B1 (en) | 2014-04-04 | 2017-12-26 | Kla-Tencor Corporation | Decreasing inaccuracy due to non-periodic effects on scatterometric signals |
| EP3552571B8 (en) | 2014-05-18 | 2024-10-30 | Eximo Medical Ltd. | System for tissue ablation using pulsed laser |
| WO2015191543A1 (en) * | 2014-06-10 | 2015-12-17 | Applied Materials Israel, Ltd. | Scanning an object using multiple mechanical stages |
| TWI755987B (zh) * | 2015-05-19 | 2022-02-21 | 美商克萊譚克公司 | 具有用於疊對測量之形貌相位控制之光學系統 |
| KR102133320B1 (ko) * | 2015-10-09 | 2020-07-14 | 에이에스엠엘 네델란즈 비.브이. | 검사 및 계측을 위한 방법 및 장치 |
| US20180047646A1 (en) * | 2016-02-24 | 2018-02-15 | Kla-Tencor Corporation | Accuracy improvements in optical metrology |
| US11684420B2 (en) | 2016-05-05 | 2023-06-27 | Eximo Medical Ltd. | Apparatus and methods for resecting and/or ablating an undesired tissue |
| WO2017209544A1 (ko) * | 2016-06-02 | 2017-12-07 | 주식회사 더웨이브톡 | 패턴 구조물 검사 장치 및 검사 방법 |
| KR101971272B1 (ko) | 2016-06-02 | 2019-08-27 | 주식회사 더웨이브톡 | 패턴 구조물 검사 장치 및 검사 방법 |
| EP3318927A1 (en) * | 2016-11-04 | 2018-05-09 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of a lithographic process, computer program products for implementing such methods & apparatus |
| KR102650388B1 (ko) * | 2016-11-23 | 2024-03-25 | 삼성전자주식회사 | 검사 장치 및 그를 이용한 반도체 소자의 제조 방법 |
| TWI649635B (zh) * | 2017-01-24 | 2019-02-01 | 台灣積體電路製造股份有限公司 | 層疊誤差測量裝置及方法 |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| JP6942555B2 (ja) * | 2017-08-03 | 2021-09-29 | 東京エレクトロン株式会社 | 基板処理方法、コンピュータ記憶媒体及び基板処理システム |
| US11378451B2 (en) * | 2017-08-07 | 2022-07-05 | Kla Corporation | Bandgap measurements of patterned film stacks using spectroscopic metrology |
| US11156846B2 (en) | 2019-04-19 | 2021-10-26 | Kla Corporation | High-brightness illumination source for optical metrology |
| DE102019215972A1 (de) | 2019-10-17 | 2021-04-22 | Carl Zeiss Smt Gmbh | Verfahren zur Messung einer Reflektivität eines Objekts für Messlicht sowie Metrologiesystem zur Durchführung des Verfahrens |
| WO2021110391A1 (en) * | 2019-12-05 | 2021-06-10 | Asml Netherlands B.V. | Alignment method |
| US11168978B2 (en) * | 2020-01-06 | 2021-11-09 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
| WO2022051551A1 (en) * | 2020-09-02 | 2022-03-10 | Applied Materials Israel Ltd. | Multi-perspective wafer analysis |
| US12376904B1 (en) | 2020-09-08 | 2025-08-05 | Angiodynamics, Inc. | Dynamic laser stabilization and calibration system |
| CN116235026B (zh) * | 2020-11-18 | 2024-09-20 | 鲁姆斯有限公司 | 基于光学的系统 |
| US20240027913A1 (en) * | 2020-12-08 | 2024-01-25 | Asml Netherlands B.V. | Metrology system and coherence adjusters |
| US12085385B2 (en) | 2021-10-06 | 2024-09-10 | Kla Corporation | Design-assisted large field of view metrology |
| KR20230170217A (ko) | 2022-06-10 | 2023-12-19 | 삼성전자주식회사 | 반도체 계측 장치 |
| US12038322B2 (en) | 2022-06-21 | 2024-07-16 | Eximo Medical Ltd. | Devices and methods for testing ablation systems |
| KR20240108945A (ko) * | 2023-01-03 | 2024-07-10 | 삼성전자주식회사 | 기판 검사 장치 및 기판 검사 방법 |
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| EP2865003A1 (en) | 2015-04-29 |
| TWI609169B (zh) | 2017-12-21 |
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| US10533940B2 (en) | 2020-01-14 |
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| US20150116717A1 (en) | 2015-04-30 |
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| US20190094142A1 (en) | 2019-03-28 |
| KR102330741B1 (ko) | 2021-11-23 |
| US20180106723A1 (en) | 2018-04-19 |
| JP2015524555A (ja) | 2015-08-24 |
| JP7046898B2 (ja) | 2022-04-04 |
| TW201408988A (zh) | 2014-03-01 |
| US10126238B2 (en) | 2018-11-13 |
| JP2018179998A (ja) | 2018-11-15 |
| US9958385B2 (en) | 2018-05-01 |
| JP2020073888A (ja) | 2020-05-14 |
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