TWI629448B - 角度解析反射計及用於量測之方法、系統及電腦程式產品 - Google Patents
角度解析反射計及用於量測之方法、系統及電腦程式產品 Download PDFInfo
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- TWI629448B TWI629448B TW102122770A TW102122770A TWI629448B TW I629448 B TWI629448 B TW I629448B TW 102122770 A TW102122770 A TW 102122770A TW 102122770 A TW102122770 A TW 102122770A TW I629448 B TWI629448 B TW I629448B
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- measurement
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- 238000000034 method Methods 0.000 title claims abstract description 107
- 238000004590 computer program Methods 0.000 title claims description 6
- 238000005259 measurement Methods 0.000 claims abstract description 259
- 230000003287 optical effect Effects 0.000 claims abstract description 102
- 210000001747 pupil Anatomy 0.000 claims abstract description 75
- 238000009826 distribution Methods 0.000 claims abstract description 62
- 238000012937 correction Methods 0.000 claims abstract description 58
- 238000012545 processing Methods 0.000 claims abstract description 20
- 239000002131 composite material Substances 0.000 claims abstract description 10
- 238000012360 testing method Methods 0.000 claims description 76
- 230000007547 defect Effects 0.000 claims description 19
- 230000009467 reduction Effects 0.000 claims description 17
- 238000009795 derivation Methods 0.000 claims description 7
- 230000010287 polarization Effects 0.000 claims description 7
- 238000004364 calculation method Methods 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 2
- 238000000691 measurement method Methods 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 description 32
- 230000001427 coherent effect Effects 0.000 description 25
- 230000000694 effects Effects 0.000 description 24
- 238000010586 diagram Methods 0.000 description 21
- 239000000835 fiber Substances 0.000 description 15
- 238000012935 Averaging Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 7
- 238000012549 training Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 238000013213 extrapolation Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261664477P | 2012-06-26 | 2012-06-26 | |
| US61/664,477 | 2012-06-26 | ||
| US201361764435P | 2013-02-13 | 2013-02-13 | |
| US61/764,435 | 2013-02-13 | ||
| PCT/US2013/047691 WO2014004564A1 (en) | 2012-06-26 | 2013-06-25 | Scanning in angle-resolved reflectometry and algorithmically eliminating diffraction from optical metrology |
| ??PCT/US13/47691 | 2013-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201418661A TW201418661A (zh) | 2014-05-16 |
| TWI629448B true TWI629448B (zh) | 2018-07-11 |
Family
ID=49783807
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102122770A TWI629448B (zh) | 2012-06-26 | 2013-06-26 | 角度解析反射計及用於量測之方法、系統及電腦程式產品 |
| TW102122771A TWI609169B (zh) | 2012-06-26 | 2013-06-26 | 量測系統及方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102122771A TWI609169B (zh) | 2012-06-26 | 2013-06-26 | 量測系統及方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9958385B2 (enExample) |
| EP (1) | EP2865003A1 (enExample) |
| JP (3) | JP6353831B2 (enExample) |
| KR (3) | KR102231730B1 (enExample) |
| TW (2) | TWI629448B (enExample) |
| WO (1) | WO2014004564A1 (enExample) |
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| NZ711441A (en) | 2005-10-14 | 2017-05-26 | Resmed Ltd | Flow generator message system |
| EP3521209B1 (de) | 2010-07-22 | 2020-01-22 | K-fee System GmbH | Portionskapsel mit barcode |
| JP6063875B2 (ja) | 2011-02-24 | 2017-01-18 | エキシモ メディカル リミテッド | 組織切除のためのハイブリッドカテーテル |
| KR102231730B1 (ko) | 2012-06-26 | 2021-03-24 | 케이엘에이 코포레이션 | 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거 |
| US9851300B1 (en) | 2014-04-04 | 2017-12-26 | Kla-Tencor Corporation | Decreasing inaccuracy due to non-periodic effects on scatterometric signals |
| EP3552571B8 (en) | 2014-05-18 | 2024-10-30 | Eximo Medical Ltd. | System for tissue ablation using pulsed laser |
| WO2015191543A1 (en) * | 2014-06-10 | 2015-12-17 | Applied Materials Israel, Ltd. | Scanning an object using multiple mechanical stages |
| TWI755987B (zh) * | 2015-05-19 | 2022-02-21 | 美商克萊譚克公司 | 具有用於疊對測量之形貌相位控制之光學系統 |
| KR102133320B1 (ko) * | 2015-10-09 | 2020-07-14 | 에이에스엠엘 네델란즈 비.브이. | 검사 및 계측을 위한 방법 및 장치 |
| US20180047646A1 (en) * | 2016-02-24 | 2018-02-15 | Kla-Tencor Corporation | Accuracy improvements in optical metrology |
| US11684420B2 (en) | 2016-05-05 | 2023-06-27 | Eximo Medical Ltd. | Apparatus and methods for resecting and/or ablating an undesired tissue |
| WO2017209544A1 (ko) * | 2016-06-02 | 2017-12-07 | 주식회사 더웨이브톡 | 패턴 구조물 검사 장치 및 검사 방법 |
| KR101971272B1 (ko) | 2016-06-02 | 2019-08-27 | 주식회사 더웨이브톡 | 패턴 구조물 검사 장치 및 검사 방법 |
| EP3318927A1 (en) * | 2016-11-04 | 2018-05-09 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of a lithographic process, computer program products for implementing such methods & apparatus |
| KR102650388B1 (ko) * | 2016-11-23 | 2024-03-25 | 삼성전자주식회사 | 검사 장치 및 그를 이용한 반도체 소자의 제조 방법 |
| TWI649635B (zh) * | 2017-01-24 | 2019-02-01 | 台灣積體電路製造股份有限公司 | 層疊誤差測量裝置及方法 |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| JP6942555B2 (ja) * | 2017-08-03 | 2021-09-29 | 東京エレクトロン株式会社 | 基板処理方法、コンピュータ記憶媒体及び基板処理システム |
| US11378451B2 (en) * | 2017-08-07 | 2022-07-05 | Kla Corporation | Bandgap measurements of patterned film stacks using spectroscopic metrology |
| US11156846B2 (en) | 2019-04-19 | 2021-10-26 | Kla Corporation | High-brightness illumination source for optical metrology |
| DE102019215972A1 (de) | 2019-10-17 | 2021-04-22 | Carl Zeiss Smt Gmbh | Verfahren zur Messung einer Reflektivität eines Objekts für Messlicht sowie Metrologiesystem zur Durchführung des Verfahrens |
| WO2021110391A1 (en) * | 2019-12-05 | 2021-06-10 | Asml Netherlands B.V. | Alignment method |
| US11168978B2 (en) * | 2020-01-06 | 2021-11-09 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
| WO2022051551A1 (en) * | 2020-09-02 | 2022-03-10 | Applied Materials Israel Ltd. | Multi-perspective wafer analysis |
| US12376904B1 (en) | 2020-09-08 | 2025-08-05 | Angiodynamics, Inc. | Dynamic laser stabilization and calibration system |
| CN116235026B (zh) * | 2020-11-18 | 2024-09-20 | 鲁姆斯有限公司 | 基于光学的系统 |
| US20240027913A1 (en) * | 2020-12-08 | 2024-01-25 | Asml Netherlands B.V. | Metrology system and coherence adjusters |
| US12085385B2 (en) | 2021-10-06 | 2024-09-10 | Kla Corporation | Design-assisted large field of view metrology |
| KR20230170217A (ko) | 2022-06-10 | 2023-12-19 | 삼성전자주식회사 | 반도체 계측 장치 |
| US12038322B2 (en) | 2022-06-21 | 2024-07-16 | Eximo Medical Ltd. | Devices and methods for testing ablation systems |
| KR20240108945A (ko) * | 2023-01-03 | 2024-07-10 | 삼성전자주식회사 | 기판 검사 장치 및 기판 검사 방법 |
| KR20250151074A (ko) | 2024-04-13 | 2025-10-21 | 이수연 | 지퍼가 달린 고무장갑 |
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2018
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6353831B2 (ja) | 2018-07-04 |
| EP2865003A1 (en) | 2015-04-29 |
| TWI609169B (zh) | 2017-12-21 |
| KR20210033063A (ko) | 2021-03-25 |
| KR20210080592A (ko) | 2021-06-30 |
| US10533940B2 (en) | 2020-01-14 |
| KR102330743B1 (ko) | 2021-11-23 |
| KR20150036214A (ko) | 2015-04-07 |
| KR102231730B1 (ko) | 2021-03-24 |
| JP6628835B2 (ja) | 2020-01-15 |
| US20150116717A1 (en) | 2015-04-30 |
| TW201418661A (zh) | 2014-05-16 |
| WO2014004564A1 (en) | 2014-01-03 |
| US20190094142A1 (en) | 2019-03-28 |
| KR102330741B1 (ko) | 2021-11-23 |
| US20180106723A1 (en) | 2018-04-19 |
| JP2015524555A (ja) | 2015-08-24 |
| JP7046898B2 (ja) | 2022-04-04 |
| TW201408988A (zh) | 2014-03-01 |
| US10126238B2 (en) | 2018-11-13 |
| JP2018179998A (ja) | 2018-11-15 |
| US9958385B2 (en) | 2018-05-01 |
| JP2020073888A (ja) | 2020-05-14 |
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