KR102228487B1 - 피가공물의 절삭 방법 - Google Patents

피가공물의 절삭 방법 Download PDF

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Publication number
KR102228487B1
KR102228487B1 KR1020170030446A KR20170030446A KR102228487B1 KR 102228487 B1 KR102228487 B1 KR 102228487B1 KR 1020170030446 A KR1020170030446 A KR 1020170030446A KR 20170030446 A KR20170030446 A KR 20170030446A KR 102228487 B1 KR102228487 B1 KR 102228487B1
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KR
South Korea
Prior art keywords
cutting
dressing
cutting blade
workpiece
chuck table
Prior art date
Application number
KR1020170030446A
Other languages
English (en)
Korean (ko)
Other versions
KR20170107383A (ko
Inventor
다이고 노리즈미
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20170107383A publication Critical patent/KR20170107383A/ko
Application granted granted Critical
Publication of KR102228487B1 publication Critical patent/KR102228487B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020170030446A 2016-03-15 2017-03-10 피가공물의 절삭 방법 KR102228487B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016051222A JP6600267B2 (ja) 2016-03-15 2016-03-15 被加工物の切削方法
JPJP-P-2016-051222 2016-03-15

Publications (2)

Publication Number Publication Date
KR20170107383A KR20170107383A (ko) 2017-09-25
KR102228487B1 true KR102228487B1 (ko) 2021-03-15

Family

ID=59870842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170030446A KR102228487B1 (ko) 2016-03-15 2017-03-10 피가공물의 절삭 방법

Country Status (4)

Country Link
JP (1) JP6600267B2 (zh)
KR (1) KR102228487B1 (zh)
CN (1) CN107186891B (zh)
TW (1) TWI703025B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102446906B1 (ko) 2022-04-01 2022-09-27 안주형 그루브를 형성하는 절삭 어셈블리 및 이를 포함하는 절삭 장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6964945B2 (ja) * 2018-01-05 2021-11-10 株式会社ディスコ 加工方法
JP6998232B2 (ja) * 2018-02-20 2022-01-18 株式会社ディスコ 加工装置
JP7013276B2 (ja) * 2018-02-23 2022-01-31 株式会社ディスコ 加工装置
CN108247361A (zh) * 2018-03-22 2018-07-06 中山市溢丰达机械设备有限公司 型材口部形状测数加工设备
JP7416581B2 (ja) * 2019-08-20 2024-01-17 株式会社ディスコ 切削方法及び切削装置
CN111941673B (zh) * 2020-08-06 2022-02-25 苏州世沃电子科技有限公司 一种带有修边卸料功能的石墨烯板剪切设备及使用方法
JP7121846B1 (ja) 2021-10-12 2022-08-18 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法
KR102412353B1 (ko) * 2022-02-21 2022-06-23 (주)네온테크 비젼을 사용한 절입량 보정용 다이싱 장치 및 비전을 활용한 절입량의 보정 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049120A (ja) * 1998-07-27 2000-02-18 Disco Abrasive Syst Ltd 切削装置
JP3280736B2 (ja) 1993-03-04 2002-05-13 株式会社東京精密 ダイシング溝の位置測定方法
JP2002237472A (ja) * 2001-02-07 2002-08-23 Disco Abrasive Syst Ltd 被加工物の切削方法
JP2005197492A (ja) 2004-01-08 2005-07-21 Disco Abrasive Syst Ltd 切削溝の計測方法
JP2011011302A (ja) 2009-07-03 2011-01-20 Disco Abrasive Syst Ltd 切削ブレードのドレッシング方法
JP2013110321A (ja) 2011-11-22 2013-06-06 Disco Abrasive Syst Ltd 切削装置
JP2015164228A (ja) * 2012-04-24 2015-09-10 株式会社東京精密 ダイシングブレード

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2955937B2 (ja) * 1998-03-16 1999-10-04 株式会社東京精密 ダイシングマシンの溝切制御方法及び装置
JP4559094B2 (ja) 2004-02-16 2010-10-06 株式会社ディスコ 切削ブレード装着装置，切削装置
JP2007203429A (ja) * 2006-02-03 2007-08-16 Disco Abrasive Syst Ltd ドレッシング・ツルーイングボード，及びドレッシング・ツルーイング方法
JP2007331059A (ja) * 2006-06-15 2007-12-27 Canon Inc ダイヤモンドブレードのドレッシング方法
JP5134216B2 (ja) * 2006-06-23 2013-01-30 株式会社ディスコ ウエーハの加工結果管理方法
JP5096052B2 (ja) 2007-06-22 2012-12-12 株式会社ディスコ 切削装置
JP5128897B2 (ja) * 2007-10-23 2013-01-23 株式会社ディスコ ウエーハの分割方法
KR101567908B1 (ko) * 2009-04-24 2015-11-10 가부시키가이샤 토쿄 세이미쯔 다이싱 장치, 다이싱 장치 유닛 및 다이싱 방법
JP2011009652A (ja) * 2009-06-29 2011-01-13 Disco Abrasive Syst Ltd 切削装置における切削ブレードの位置検出方法
JP5571331B2 (ja) * 2009-07-07 2014-08-13 株式会社ディスコ 切削装置
JP5537891B2 (ja) * 2009-10-09 2014-07-02 株式会社東京精密 切断ブレードのドレッシング方法
JP5410917B2 (ja) * 2009-10-13 2014-02-05 株式会社ディスコ 積層ドレッシングボード並びにこれを使用したドレッシング方法及び切削方法
JP5764031B2 (ja) * 2011-10-06 2015-08-12 株式会社ディスコ 切削装置
KR20150004931A (ko) * 2012-06-15 2015-01-13 가부시키가이샤 토쿄 세이미쯔 다이싱 장치 및 다이싱 방법
JP6170769B2 (ja) * 2013-07-11 2017-07-26 株式会社ディスコ ウェーハの加工方法
JP6251574B2 (ja) * 2014-01-14 2017-12-20 株式会社ディスコ 切削方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3280736B2 (ja) 1993-03-04 2002-05-13 株式会社東京精密 ダイシング溝の位置測定方法
JP2000049120A (ja) * 1998-07-27 2000-02-18 Disco Abrasive Syst Ltd 切削装置
JP2002237472A (ja) * 2001-02-07 2002-08-23 Disco Abrasive Syst Ltd 被加工物の切削方法
JP2005197492A (ja) 2004-01-08 2005-07-21 Disco Abrasive Syst Ltd 切削溝の計測方法
JP2011011302A (ja) 2009-07-03 2011-01-20 Disco Abrasive Syst Ltd 切削ブレードのドレッシング方法
JP2013110321A (ja) 2011-11-22 2013-06-06 Disco Abrasive Syst Ltd 切削装置
JP2015164228A (ja) * 2012-04-24 2015-09-10 株式会社東京精密 ダイシングブレード

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102446906B1 (ko) 2022-04-01 2022-09-27 안주형 그루브를 형성하는 절삭 어셈블리 및 이를 포함하는 절삭 장치
KR20220136302A (ko) 2022-04-01 2022-10-07 안주형 피절삭물의 비가공부분과의 간섭 없이 그루브를 형성하는 절삭 가공 장치
KR20220136303A (ko) 2022-04-01 2022-10-07 안주형 그루브를 형성하는 절삭 어셈블리 및 이를 포함하는 절삭 장치
KR20220136301A (ko) 2022-04-01 2022-10-07 안주형 곡면 홈 절삭 가공 장치

Also Published As

Publication number Publication date
TWI703025B (zh) 2020-09-01
CN107186891A (zh) 2017-09-22
JP2017168575A (ja) 2017-09-21
CN107186891B (zh) 2021-04-23
JP6600267B2 (ja) 2019-10-30
KR20170107383A (ko) 2017-09-25
TW201736070A (zh) 2017-10-16

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