KR102214856B1 - 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치 - Google Patents

폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치 Download PDF

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KR102214856B1
KR102214856B1 KR1020157008796A KR20157008796A KR102214856B1 KR 102214856 B1 KR102214856 B1 KR 102214856B1 KR 1020157008796 A KR1020157008796 A KR 1020157008796A KR 20157008796 A KR20157008796 A KR 20157008796A KR 102214856 B1 KR102214856 B1 KR 102214856B1
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general formula
group
resin composition
photosensitive resin
polyimide precursor
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KR20150097459A (ko
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테츠야 에노모토
케이시 오노
마사유키 오에
케이코 스즈키
카즈야 소에지마
에츠하루 스즈키
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에이치디 마이크로시스템즈 가부시키가이샤
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
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    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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KR1020157008796A 2012-12-21 2013-12-19 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치 Active KR102214856B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-279343 2012-12-21
JP2012279343 2012-12-21
PCT/JP2013/007467 WO2014097633A1 (ja) 2012-12-21 2013-12-19 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置

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KR20150097459A KR20150097459A (ko) 2015-08-26
KR102214856B1 true KR102214856B1 (ko) 2021-02-09

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US (1) US9751984B2 (https=)
JP (2) JP6600943B2 (https=)
KR (1) KR102214856B1 (https=)
CN (1) CN104870523B (https=)
TW (2) TWI670297B (https=)
WO (1) WO2014097633A1 (https=)

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JP6164070B2 (ja) * 2013-12-04 2017-07-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
CN107615166B (zh) 2015-08-21 2020-12-25 旭化成株式会社 感光性树脂组合物、聚酰亚胺的制造方法及半导体装置
FR3041357B1 (fr) * 2015-09-17 2017-09-01 Rhodia Operations Solvants de decapage des resines photosensibles
CN105182703B (zh) * 2015-09-25 2019-06-25 江阴润玛电子材料股份有限公司 一种新型有机负胶显影液及其制备方法
CN113820920B (zh) 2016-03-31 2023-07-04 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法和半导体装置
WO2018021262A1 (ja) * 2016-07-27 2018-02-01 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、その硬化物、層間絶縁膜、表面保護膜及び電子部品
US11163234B2 (en) * 2016-08-22 2021-11-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition and method for producing cured relief pattern
TWI899456B (zh) * 2016-09-26 2025-10-01 日商力森諾科股份有限公司 樹脂組成物、半導體用配線層積層體及半導體裝置
TWI707889B (zh) * 2017-08-01 2020-10-21 日商旭化成股份有限公司 半導體裝置及其製造方法
JP6848916B2 (ja) * 2018-03-29 2021-03-24 信越化学工業株式会社 シリコーン変性ポリイミド樹脂組成物
TWI889648B (zh) * 2018-04-06 2025-07-11 美商杜邦電子股份有限公司 供使用於電子裝置之聚合物
JP7091881B2 (ja) * 2018-06-29 2022-06-28 Ｈｄマイクロシステムズ株式会社 樹脂組成物、硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
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