DE69331471T2 - Photoempfindliche Polyimidvorlaüferzusammensetzung - Google Patents

Photoempfindliche Polyimidvorlaüferzusammensetzung

Info

Publication number
DE69331471T2
DE69331471T2 DE69331471T DE69331471T DE69331471T2 DE 69331471 T2 DE69331471 T2 DE 69331471T2 DE 69331471 T DE69331471 T DE 69331471T DE 69331471 T DE69331471 T DE 69331471T DE 69331471 T2 DE69331471 T2 DE 69331471T2
Authority
DE
Germany
Prior art keywords
polyimide precursor
precursor composition
photosensitive polyimide
photosensitive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69331471T
Other languages
English (en)
Other versions
DE69331471D1 (de
Inventor
Yoshio Matsuoka
Kanichi Yokota
Yasuhiro Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16677279&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69331471(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Asahi Kasei Corp, Asahi Chemical Industry Co Ltd filed Critical Asahi Kasei Corp
Publication of DE69331471D1 publication Critical patent/DE69331471D1/de
Application granted granted Critical
Publication of DE69331471T2 publication Critical patent/DE69331471T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
DE69331471T 1992-07-22 1993-07-19 Photoempfindliche Polyimidvorlaüferzusammensetzung Revoked DE69331471T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21573292 1992-07-22

Publications (2)

Publication Number Publication Date
DE69331471D1 DE69331471D1 (de) 2002-02-21
DE69331471T2 true DE69331471T2 (de) 2002-06-20

Family

ID=16677279

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69331471T Revoked DE69331471T2 (de) 1992-07-22 1993-07-19 Photoempfindliche Polyimidvorlaüferzusammensetzung
DE69308671T Expired - Fee Related DE69308671T2 (de) 1992-07-22 1993-07-19 Photoempfindliche Polyimid-Zusammensetzung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69308671T Expired - Fee Related DE69308671T2 (de) 1992-07-22 1993-07-19 Photoempfindliche Polyimid-Zusammensetzung

Country Status (4)

Country Link
US (2) US6162580A (de)
EP (2) EP0718696B1 (de)
KR (1) KR0127278B1 (de)
DE (2) DE69331471T2 (de)

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EP0624826B1 (de) * 1993-05-14 1997-07-16 OCG Microelectronic Materials Inc. Verfahren zur Herstellung von Reliefstrukturen durch i-Linien-Bestrahlung
JP3687988B2 (ja) 1993-09-03 2005-08-24 日立化成工業株式会社 ｉ線ステッパ用感光性樹脂組成物
US5807498A (en) * 1996-03-29 1998-09-15 Alliant Techsystems Inc. Process and materials for aligning liquid crystals and liquid crystal optical elements
US5958292A (en) * 1998-05-18 1999-09-28 Elsicon Inc. Materials for inducing alignment of liquid crystals and liquid crystal optical elements
US6991834B1 (en) * 1998-12-23 2006-01-31 Elsicon, Inc. Materials for inducing alignment of liquid crystals and liquid crystal optical elements
US7005165B2 (en) * 1998-12-23 2006-02-28 Elsicon, Inc. Photosensitive polyimides for optical alignment of liquid crystals
EP1219662B1 (de) * 1999-01-21 2004-08-04 Asahi Kasei Kabushiki Kaisha Polyamidsäureester
JP3949849B2 (ja) * 1999-07-19 2007-07-25 日東電工株式会社 チップサイズパッケージ用インターポーザーの製造方法およびチップサイズパッケージ用インターポーザー
DE19955969A1 (de) * 1999-11-19 2001-05-31 Inst Mikrotechnik Mainz Gmbh Verwendung von Polyimid für Haftschichten und lithographisches Verfahren zur Herstellung von Mikrobauteilen
US7261997B2 (en) * 2002-01-17 2007-08-28 Brewer Science Inc. Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
US20050255410A1 (en) 2004-04-29 2005-11-17 Guerrero Douglas J Anti-reflective coatings using vinyl ether crosslinkers
CN1980984B (zh) * 2004-07-16 2010-06-09 旭化成电子材料株式会社 聚酰胺
US7524617B2 (en) * 2004-11-23 2009-04-28 E.I. Du Pont De Nemours And Company Low-temperature curable photosensitive compositions
US7914974B2 (en) 2006-08-18 2011-03-29 Brewer Science Inc. Anti-reflective imaging layer for multiple patterning process
US20100009290A1 (en) * 2006-12-03 2010-01-14 Central Glass Co., Ltd. Photosensitive Polybenzoxazines and Methods of Making the Same
WO2008069813A1 (en) * 2006-12-04 2008-06-12 Central Glass Co., Ltd. Photosensitive polyimides and methods of making the same
KR101647158B1 (ko) * 2008-01-29 2016-08-09 브레우어 사이언스 인코포레이션 다중 다크 필드 노출에 의한, 하드마스크 패턴화를 위한 온-트랙 공정
US9640396B2 (en) 2009-01-07 2017-05-02 Brewer Science Inc. Spin-on spacer materials for double- and triple-patterning lithography
KR102174075B1 (ko) 2012-12-21 2020-11-04 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체 수지 조성물
KR102214856B1 (ko) 2012-12-21 2021-02-09 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치
JP6244871B2 (ja) * 2013-12-13 2017-12-13 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体樹脂組成物
KR20180055875A (ko) 2016-08-22 2018-05-25 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법
TWI658066B (zh) * 2017-02-03 2019-05-01 台虹科技股份有限公司 聚醯亞胺聚合物以及聚醯亞胺膜
CN107011925B (zh) * 2017-05-23 2020-12-29 成都海亿科技有限公司 液晶垂直取向膜用材料及由其制备的液晶盒和制备方法
TWI658067B (zh) * 2017-11-24 2019-05-01 台虹科技股份有限公司 聚醯亞胺前驅物及其所製得之微影圖案
TW202336531A (zh) * 2021-11-17 2023-09-16 德商馬克專利公司 藉濕式化學蝕刻以改善金屬結構製造的組合物和方法

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US4548891A (en) * 1983-02-11 1985-10-22 Ciba Geigy Corporation Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators
DE3411714A1 (de) * 1984-03-29 1985-10-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyimidazol- und polyimidazopyrrolon-reliefstrukturen
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US5037720A (en) * 1987-07-21 1991-08-06 Hoechst Celanese Corporation Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use
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DE3724368A1 (de) * 1987-07-23 1989-02-02 Basf Ag Verfahren zur herstellung oligomerer oder polymerer strahlungsreaktiver vorstufen fuer loesungsmittelstrukturierte schichten
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JP2626696B2 (ja) * 1988-04-11 1997-07-02 チッソ株式会社 感光性重合体
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DE68919453T2 (de) * 1988-08-24 1995-03-30 Asahi Chemical Ind Vorläufer für ein Polymid mit geringer thermischer Spannung und einen Polymidvorläufer enthaltende photopolymensierbare Zusammensetzung.
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Also Published As

Publication number Publication date
EP0718696A2 (de) 1996-06-26
KR940005998A (ko) 1994-03-22
US6482569B1 (en) 2002-11-19
EP0580108A3 (en) 1994-08-24
DE69331471D1 (de) 2002-02-21
EP0580108B1 (de) 1997-03-12
KR0127278B1 (ko) 1997-12-26
EP0580108A2 (de) 1994-01-26
DE69308671T2 (de) 1997-10-16
US6162580A (en) 2000-12-19
EP0718696B1 (de) 2002-01-16
DE69308671D1 (de) 1997-04-17
EP0718696A3 (de) 1998-03-25

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation