DE69224503D1 - Photoempfindliche Polyimidvorläufer-Zubereitung - Google Patents

Photoempfindliche Polyimidvorläufer-Zubereitung

Info

Publication number
DE69224503D1
DE69224503D1 DE69224503T DE69224503T DE69224503D1 DE 69224503 D1 DE69224503 D1 DE 69224503D1 DE 69224503 T DE69224503 T DE 69224503T DE 69224503 T DE69224503 T DE 69224503T DE 69224503 D1 DE69224503 D1 DE 69224503D1
Authority
DE
Germany
Prior art keywords
polyimide precursor
photosensitive polyimide
precursor preparation
preparation
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69224503T
Other languages
English (en)
Inventor
Jeffrey Donald Gelorme
Martin Joseph Goldberg
Nancy Carolyn Labianca
Jane Mar West Shaw
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69224503D1 publication Critical patent/DE69224503D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/107Polyamide or polyurethane

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE69224503T 1991-10-25 1992-10-14 Photoempfindliche Polyimidvorläufer-Zubereitung Expired - Lifetime DE69224503D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78294391A 1991-10-25 1991-10-25

Publications (1)

Publication Number Publication Date
DE69224503D1 true DE69224503D1 (de) 1998-04-02

Family

ID=25127671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69224503T Expired - Lifetime DE69224503D1 (de) 1991-10-25 1992-10-14 Photoempfindliche Polyimidvorläufer-Zubereitung

Country Status (4)

Country Link
US (2) US6013414A (de)
EP (1) EP0538716B1 (de)
JP (1) JP2814442B2 (de)
DE (1) DE69224503D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071667A (en) * 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
JP5216179B2 (ja) * 2000-09-12 2013-06-19 株式会社ピーアイ技術研究所 ネガ型感光性ポリイミド組成物及びそれを用いた画像の形成方法
TWI265377B (en) * 2005-12-19 2006-11-01 Ind Tech Res Inst Negative photoresist composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS57168942A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
JPS59160139A (ja) * 1983-03-04 1984-09-10 Hitachi Ltd 感光性重合体組成物
JPS59212833A (ja) * 1983-05-17 1984-12-01 Mitsubishi Electric Corp 感光性耐熱材料
JPS6042425A (ja) * 1983-08-17 1985-03-06 Toray Ind Inc 化学線感応性重合体組成物
JPS61151238A (ja) * 1984-12-25 1986-07-09 Mitsubishi Gas Chem Co Inc 感光性ポリイミド前駆体及びその製造方法
CN1004490B (zh) * 1985-04-27 1989-06-14 旭化成工业株式会社 可固化组合物
US4741988A (en) * 1985-05-08 1988-05-03 U.S. Philips Corp. Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell
JPH0766188B2 (ja) * 1985-11-29 1995-07-19 旭化成工業株式会社 感光性組成物
DE3786628T2 (de) * 1986-09-04 1994-03-24 Kanegafuchi Chemical Ind Hoch molekulare, amphiphile, photoempfindliche Photopolymere und Herstellungsverfahren.
US4837299A (en) * 1986-12-31 1989-06-06 General Electric Company Process for making polyimides
JPS6462355A (en) * 1987-09-02 1989-03-08 Nippon Steel Chemical Co Heat-resistant photosensitive material having low thermal expansion coefficient
US4803147A (en) * 1987-11-24 1989-02-07 Hoechst Celanese Corporation Photosensitive polyimide polymer compositions
US5399460A (en) * 1991-12-04 1995-03-21 E. I. Du Pont De Nemours And Company Negative photoresists containing aminoacrylate salts

Also Published As

Publication number Publication date
US6013414A (en) 2000-01-11
JP2814442B2 (ja) 1998-10-22
US6010832A (en) 2000-01-04
JPH0643640A (ja) 1994-02-18
EP0538716B1 (de) 1998-02-25
EP0538716A1 (de) 1993-04-28

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Legal Events

Date Code Title Description
8332 No legal effect for de