DE69224503D1 - Photoempfindliche Polyimidvorläufer-Zubereitung - Google Patents
Photoempfindliche Polyimidvorläufer-ZubereitungInfo
- Publication number
- DE69224503D1 DE69224503D1 DE69224503T DE69224503T DE69224503D1 DE 69224503 D1 DE69224503 D1 DE 69224503D1 DE 69224503 T DE69224503 T DE 69224503T DE 69224503 T DE69224503 T DE 69224503T DE 69224503 D1 DE69224503 D1 DE 69224503D1
- Authority
- DE
- Germany
- Prior art keywords
- polyimide precursor
- photosensitive polyimide
- precursor preparation
- preparation
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/107—Polyamide or polyurethane
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78294391A | 1991-10-25 | 1991-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69224503D1 true DE69224503D1 (de) | 1998-04-02 |
Family
ID=25127671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69224503T Expired - Lifetime DE69224503D1 (de) | 1991-10-25 | 1992-10-14 | Photoempfindliche Polyimidvorläufer-Zubereitung |
Country Status (4)
Country | Link |
---|---|
US (2) | US6013414A (de) |
EP (1) | EP0538716B1 (de) |
JP (1) | JP2814442B2 (de) |
DE (1) | DE69224503D1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6071667A (en) * | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
JP5216179B2 (ja) * | 2000-09-12 | 2013-06-19 | 株式会社ピーアイ技術研究所 | ネガ型感光性ポリイミド組成物及びそれを用いた画像の形成方法 |
TWI265377B (en) * | 2005-12-19 | 2006-11-01 | Ind Tech Res Inst | Negative photoresist composition |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952822B2 (ja) * | 1978-04-14 | 1984-12-21 | 東レ株式会社 | 耐熱性感光材料 |
JPS57168942A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Photosensitive polymer composition |
JPS59160139A (ja) * | 1983-03-04 | 1984-09-10 | Hitachi Ltd | 感光性重合体組成物 |
JPS59212833A (ja) * | 1983-05-17 | 1984-12-01 | Mitsubishi Electric Corp | 感光性耐熱材料 |
JPS6042425A (ja) * | 1983-08-17 | 1985-03-06 | Toray Ind Inc | 化学線感応性重合体組成物 |
JPS61151238A (ja) * | 1984-12-25 | 1986-07-09 | Mitsubishi Gas Chem Co Inc | 感光性ポリイミド前駆体及びその製造方法 |
CN1004490B (zh) * | 1985-04-27 | 1989-06-14 | 旭化成工业株式会社 | 可固化组合物 |
US4741988A (en) * | 1985-05-08 | 1988-05-03 | U.S. Philips Corp. | Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell |
JPH0766188B2 (ja) * | 1985-11-29 | 1995-07-19 | 旭化成工業株式会社 | 感光性組成物 |
DE3786628T2 (de) * | 1986-09-04 | 1994-03-24 | Kanegafuchi Chemical Ind | Hoch molekulare, amphiphile, photoempfindliche Photopolymere und Herstellungsverfahren. |
US4837299A (en) * | 1986-12-31 | 1989-06-06 | General Electric Company | Process for making polyimides |
JPS6462355A (en) * | 1987-09-02 | 1989-03-08 | Nippon Steel Chemical Co | Heat-resistant photosensitive material having low thermal expansion coefficient |
US4803147A (en) * | 1987-11-24 | 1989-02-07 | Hoechst Celanese Corporation | Photosensitive polyimide polymer compositions |
US5399460A (en) * | 1991-12-04 | 1995-03-21 | E. I. Du Pont De Nemours And Company | Negative photoresists containing aminoacrylate salts |
-
1992
- 1992-09-22 JP JP4252547A patent/JP2814442B2/ja not_active Expired - Lifetime
- 1992-10-14 DE DE69224503T patent/DE69224503D1/de not_active Expired - Lifetime
- 1992-10-14 EP EP92117496A patent/EP0538716B1/de not_active Expired - Lifetime
-
1994
- 1994-12-16 US US08/357,789 patent/US6013414A/en not_active Expired - Fee Related
-
1995
- 1995-05-16 US US08/441,965 patent/US6010832A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6013414A (en) | 2000-01-11 |
JP2814442B2 (ja) | 1998-10-22 |
US6010832A (en) | 2000-01-04 |
JPH0643640A (ja) | 1994-02-18 |
EP0538716B1 (de) | 1998-02-25 |
EP0538716A1 (de) | 1993-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |