JPS6462355A - Heat-resistant photosensitive material having low thermal expansion coefficient - Google Patents

Heat-resistant photosensitive material having low thermal expansion coefficient

Info

Publication number
JPS6462355A
JPS6462355A JP21798387A JP21798387A JPS6462355A JP S6462355 A JPS6462355 A JP S6462355A JP 21798387 A JP21798387 A JP 21798387A JP 21798387 A JP21798387 A JP 21798387A JP S6462355 A JPS6462355 A JP S6462355A
Authority
JP
Japan
Prior art keywords
thermal expansion
expansion coefficient
photosensitive
low thermal
photosensitive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21798387A
Other languages
Japanese (ja)
Inventor
Keiichiro Wada
Nobuyuki Furukawa
Takashi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP21798387A priority Critical patent/JPS6462355A/en
Publication of JPS6462355A publication Critical patent/JPS6462355A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To obtain a heat-resistant photosensitive material having low thermal expansion coefficient, enabling direct microscopic processing with light and useful as a resist or lift-off material, etc., for the processing of printed circuit board, by using a photosensitive polyamide imide having low thermal expansion coefficient as a raw material. CONSTITUTION:The objective photosensitive material has a thermal expansion coefficient of <=2X10<-5>/ deg.C after cure and contains a polymer having a structural unit of formula [R1 and R2 are halogen or univalent organic group, at least one of which is methoxy group attached to ortho-position relative to amide bond; R3 is tetravalent organic group containing at least one aromatic ring; R is a photosensitive chemical species (preferably ammonium ion or pyridinium ion) or H provided that at least a part of R is former species; l and m are 0-4; n is positive integer] and produced e.g. by reacting a compound containing photosensitive group with a compound produced by the polycondensation of a tetracarboxylic acid dianhydride with a diamine containing amide bond in the molecule in an aprotic polar organic solvent.
JP21798387A 1987-09-02 1987-09-02 Heat-resistant photosensitive material having low thermal expansion coefficient Pending JPS6462355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21798387A JPS6462355A (en) 1987-09-02 1987-09-02 Heat-resistant photosensitive material having low thermal expansion coefficient

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21798387A JPS6462355A (en) 1987-09-02 1987-09-02 Heat-resistant photosensitive material having low thermal expansion coefficient

Publications (1)

Publication Number Publication Date
JPS6462355A true JPS6462355A (en) 1989-03-08

Family

ID=16712785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21798387A Pending JPS6462355A (en) 1987-09-02 1987-09-02 Heat-resistant photosensitive material having low thermal expansion coefficient

Country Status (1)

Country Link
JP (1) JPS6462355A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643640A (en) * 1991-10-25 1994-02-18 Internatl Business Mach Corp <Ibm> Photosensitive polyimide precursor composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643640A (en) * 1991-10-25 1994-02-18 Internatl Business Mach Corp <Ibm> Photosensitive polyimide precursor composition

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