KR102209666B1 - 그래핀 구조체의 형성 방법 및 형성 장치 - Google Patents

그래핀 구조체의 형성 방법 및 형성 장치 Download PDF

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KR102209666B1
KR102209666B1 KR1020180108838A KR20180108838A KR102209666B1 KR 102209666 B1 KR102209666 B1 KR 102209666B1 KR 1020180108838 A KR1020180108838 A KR 1020180108838A KR 20180108838 A KR20180108838 A KR 20180108838A KR 102209666 B1 KR102209666 B1 KR 102209666B1
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microwave
gas
graphene structure
processing container
substrate
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KR20190033010A (ko
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료타 이후쿠
다카시 마츠모토
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도쿄엘렉트론가부시키가이샤
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
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KR1020180108838A 2017-09-20 2018-09-12 그래핀 구조체의 형성 방법 및 형성 장치 Active KR102209666B1 (ko)

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JPJP-P-2017-180049 2017-09-20
JP2017180049A JP6960813B2 (ja) 2017-09-20 2017-09-20 グラフェン構造体の形成方法および形成装置

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KR102209666B1 true KR102209666B1 (ko) 2021-01-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102320909B1 (ko) 2021-05-07 2021-11-02 한밭대학교 산학협력단 탄소 나노월 및 이의 제조방법, 이를 포함하는 리튬 이차전지용 음극
KR20230039536A (ko) * 2021-09-13 2023-03-21 도쿄엘렉트론가부시키가이샤 플라스마원 및 플라스마 처리 장치

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* Cited by examiner, † Cited by third party
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JP5851804B2 (ja) * 2011-11-09 2016-02-03 東京エレクトロン株式会社 前処理方法、グラフェンの形成方法及びグラフェン製造装置
JP6960813B2 (ja) 2017-09-20 2021-11-05 東京エレクトロン株式会社 グラフェン構造体の形成方法および形成装置
KR102592698B1 (ko) * 2017-11-29 2023-10-24 삼성전자주식회사 나노결정질 그래핀 및 나노결정질 그래핀의 형성방법
US11289331B2 (en) * 2018-09-27 2022-03-29 Applied Materials, Inc. Methods for graphene formation using microwave surface-wave plasma on dielectric materials
KR20200128975A (ko) * 2019-05-07 2020-11-17 삼성전자주식회사 그래핀의 형성방법
US20230033329A1 (en) 2019-12-11 2023-02-02 Jozef Stefan Institute Method and apparatus for deposition of carbon nanostructures
JP7422540B2 (ja) * 2019-12-26 2024-01-26 東京エレクトロン株式会社 成膜方法および成膜装置
KR102887170B1 (ko) * 2020-03-04 2025-11-14 삼성전자주식회사 그래핀의 형성방법 및 그래핀 제조 장치
CN111517313B (zh) * 2020-05-16 2021-08-10 西安工业大学 一种高连续性均匀规律孔隙结构三维石墨烯的制备方法
JP7561530B2 (ja) 2020-06-25 2024-10-04 東京エレクトロン株式会社 成膜方法及び成膜装置
JP2022079159A (ja) 2020-11-16 2022-05-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2022114773A (ja) * 2021-01-27 2022-08-08 東京エレクトロン株式会社 成膜方法および成膜装置
CN116670325A (zh) * 2021-01-27 2023-08-29 国立研究开发法人产业技术综合研究所 微波等离子处理装置
JP2022120690A (ja) 2021-02-05 2022-08-18 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2022183969A (ja) 2021-05-31 2022-12-13 東京エレクトロン株式会社 成膜方法および成膜装置
US20220403509A1 (en) 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method
US12571092B2 (en) 2021-07-15 2026-03-10 Applied Materials, Inc. Integrated methods for graphene formation
JP7682054B2 (ja) * 2021-08-17 2025-05-23 東京エレクトロン株式会社 プラズマ処理装置
JP7692775B2 (ja) 2021-09-16 2025-06-16 東京エレクトロン株式会社 基板処理方法、基板処理装置および半導体構造
KR102928751B1 (ko) 2021-09-29 2026-02-23 도쿄엘렉트론가부시키가이샤 성막 방법 및 성막 장치
JP2024540405A (ja) * 2021-11-04 2024-10-31 ユニヴェルシテ・ピカルディ・ジュール・ヴェルヌ 対象となる基板上にグラフェン又は酸化グラフェンを直接堆積させる方法
JP2023119615A (ja) 2022-02-17 2023-08-29 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2024004544A (ja) 2022-06-29 2024-01-17 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2024073129A (ja) 2022-11-17 2024-05-29 東京エレクトロン株式会社 成膜方法およびプラズマ処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097113A (ja) * 2004-11-26 2005-04-14 Mineo Hiramatsu カーボンナノウォールの製造方法と製造装置
JP2013100205A (ja) * 2011-11-09 2013-05-23 Tokyo Electron Ltd 前処理方法、グラフェンの形成方法及びグラフェン製造装置

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6863942B2 (en) 1998-06-19 2005-03-08 The Research Foundation Of State University Of New York Free-standing and aligned carbon nanotubes and synthesis thereof
US6649431B2 (en) 2001-02-27 2003-11-18 Ut. Battelle, Llc Carbon tips with expanded bases grown with simultaneous application of carbon source and etchant gases
EP1804274A3 (en) 2001-03-28 2007-07-18 Tadahiro Ohmi Plasma processing apparatus
US7666381B2 (en) 2003-06-10 2010-02-23 Plasmet Corporation Continuous production of carbon nanomaterials using a high temperature inductively coupled plasma
WO2005021430A1 (ja) 2003-08-27 2005-03-10 Nu Eco Engineering Co., Ltd. カーボンナノウォールの製造方法、カーボンナノウォールおよび製造装置
CN100492600C (zh) 2003-11-05 2009-05-27 大见忠弘 等离子体处理装置
JP4324078B2 (ja) 2003-12-18 2009-09-02 キヤノン株式会社 炭素を含むファイバー、炭素を含むファイバーを用いた基板、電子放出素子、該電子放出素子を用いた電子源、該電子源を用いた表示パネル、及び、該表示パネルを用いた情報表示再生装置、並びに、それらの製造方法
JP5068458B2 (ja) * 2006-01-18 2012-11-07 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
US7276796B1 (en) 2006-03-15 2007-10-02 International Business Machines Corporation Formation of oxidation-resistant seed layer for interconnect applications
JP2008239357A (ja) * 2007-03-25 2008-10-09 Univ Nagoya カーボンナノウォールの製造方法
US8919428B2 (en) 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US20090273106A1 (en) 2008-05-02 2009-11-05 Yuan Ze University Porous Carbon Membranes and Their Forming Method
JP5222040B2 (ja) 2008-06-25 2013-06-26 東京エレクトロン株式会社 マイクロ波プラズマ処理装置
CN102265400A (zh) 2008-10-23 2011-11-30 桑迪士克3D有限责任公司 展示减少的分层的基于碳的存储器元件和形成其的方法
US8277872B1 (en) 2008-11-12 2012-10-02 Stc.Unm Methods of making multi-scale carbon structures
WO2011016616A2 (ko) 2009-08-03 2011-02-10 인제대학교 산학협력단 신규한 구조의 탄소계 나노복합체 및 이의 제조방법
US10167572B2 (en) 2009-08-07 2019-01-01 Guardian Glass, LLC Large area deposition of graphene via hetero-epitaxial growth, and products including the same
US8323521B2 (en) * 2009-08-12 2012-12-04 Tokyo Electron Limited Plasma generation controlled by gravity-induced gas-diffusion separation (GIGDS) techniques
JP2011068513A (ja) 2009-09-25 2011-04-07 Tokyo Electron Ltd カーボンナノチューブ膜の成膜方法
JP5439120B2 (ja) 2009-11-02 2014-03-12 株式会社東芝 半導体装置およびその製造方法
US20110136346A1 (en) 2009-12-04 2011-06-09 Axcelis Technologies, Inc. Substantially Non-Oxidizing Plasma Treatment Devices and Processes
US20110195207A1 (en) 2010-02-08 2011-08-11 Sungkyunkwan University Foundation For Corporate Collaboration Graphene roll-to-roll coating apparatus and graphene roll-to-roll coating method using the same
KR101129930B1 (ko) * 2010-03-09 2012-03-27 주식회사 하이닉스반도체 반도체 소자 및 그의 형성 방법
JP5692794B2 (ja) * 2010-03-17 2015-04-01 独立行政法人産業技術総合研究所 透明導電性炭素膜の製造方法
JP2011201735A (ja) 2010-03-26 2011-10-13 Fujitsu Ltd グラフェン膜の製造方法及び半導体装置の製造方法
JP5660804B2 (ja) 2010-04-30 2015-01-28 東京エレクトロン株式会社 カーボンナノチューブの形成方法及びカーボンナノチューブ成膜装置
KR20120012271A (ko) * 2010-07-30 2012-02-09 성균관대학교산학협력단 그래핀의 제조 방법, 그래핀 시트 및 이를 이용한 소자
JP2012089334A (ja) * 2010-10-19 2012-05-10 Tokyo Electron Ltd マイクロ波プラズマ源およびプラズマ処理装置
JP5775705B2 (ja) 2011-02-25 2015-09-09 東京エレクトロン株式会社 カーボンナノチューブの形成方法及び前処理方法
JP5893865B2 (ja) * 2011-03-31 2016-03-23 東京エレクトロン株式会社 プラズマ処理装置およびマイクロ波導入装置
WO2012153674A1 (ja) * 2011-05-06 2012-11-15 独立行政法人産業技術総合研究所 透明導電膜積層体の製造方法および透明導電膜積層体
KR101872949B1 (ko) 2011-05-17 2018-07-02 삼성전자주식회사 상변화 메모리 장치 및 이의 제조 방법
JP5414756B2 (ja) 2011-09-09 2014-02-12 株式会社東芝 半導体装置とその製造方法
JP5414760B2 (ja) 2011-09-27 2014-02-12 株式会社東芝 半導体装置およびその製造方法
EP2763936A4 (en) 2011-10-07 2015-07-15 Purdue Research Foundation FAST SYNTHESIS OF GRAPHS AND FORMATION OF GRAPHIC STRUCTURES
JP5801221B2 (ja) 2012-02-22 2015-10-28 株式会社東芝 半導体装置の製造方法および半導体装置
EP2825508A4 (en) 2012-03-15 2015-10-21 Massachusetts Inst Technology FILTER BASED ON GRAPHENE
TWI526559B (zh) 2012-04-06 2016-03-21 中央研究院 藉由物理氣相沉積法在基板上成長碳薄膜或無機材料薄膜的方法
JP6037688B2 (ja) * 2012-07-09 2016-12-07 東京エレクトロン株式会社 マイクロ波導入モジュールにおける異常検知方法
JP2014026773A (ja) * 2012-07-25 2014-02-06 Tokyo Electron Ltd プラズマ処理装置
JP2014049667A (ja) * 2012-09-03 2014-03-17 Tokyo Electron Ltd プラズマ処理装置及びこれを備えた基板処理装置
JP5624600B2 (ja) 2012-12-27 2014-11-12 株式会社東芝 配線及び半導体装置の製造方法
KR20200003258A (ko) 2013-01-14 2020-01-08 캘리포니아 인스티튜트 오브 테크놀로지 그라펜을 형성시키는 방법 및 시스템
JP6074270B2 (ja) * 2013-01-15 2017-02-01 東京エレクトロン株式会社 グラフェンのパターニング方法、及びパターンニング用部材
JP2014167142A (ja) * 2013-02-28 2014-09-11 Tokyo Electron Ltd カーボン膜形成方法及びカーボン膜
JP6002087B2 (ja) 2013-05-29 2016-10-05 東京エレクトロン株式会社 グラフェンの生成方法
JP6338462B2 (ja) * 2013-09-11 2018-06-06 東京エレクトロン株式会社 プラズマ処理装置
JP6356415B2 (ja) * 2013-12-16 2018-07-11 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
US9911544B1 (en) * 2014-06-10 2018-03-06 The United States Of America As Represented By The Administrator Of Nasa Metal oxide vertical graphene hybrid supercapacitors
US9857328B2 (en) 2014-12-18 2018-01-02 Agilome, Inc. Chemically-sensitive field effect transistors, systems and methods for manufacturing and using the same
JP6478748B2 (ja) * 2015-03-24 2019-03-06 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
JP6624833B2 (ja) * 2015-07-31 2019-12-25 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
JP6590716B2 (ja) * 2016-02-02 2019-10-16 東京エレクトロン株式会社 トランジスタの閾値制御方法および半導体装置の製造方法
KR20160059466A (ko) * 2016-03-09 2016-05-26 이윤택 무촉매 저온 기판 성장 그래핀의 제조방법 및 무촉매 저온 기판 성장 그래핀 및 제조 장치
JP6697292B2 (ja) * 2016-03-14 2020-05-20 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP6671230B2 (ja) * 2016-04-26 2020-03-25 東京エレクトロン株式会社 プラズマ処理装置およびガス導入機構
US10269706B2 (en) 2016-07-26 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
JP6793503B2 (ja) 2016-09-01 2020-12-02 東京エレクトロン株式会社 グラフェンの生成方法
JP6796450B2 (ja) * 2016-10-25 2020-12-09 東京エレクトロン株式会社 プラズマ処理装置
JP6960813B2 (ja) 2017-09-20 2021-11-05 東京エレクトロン株式会社 グラフェン構造体の形成方法および形成装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097113A (ja) * 2004-11-26 2005-04-14 Mineo Hiramatsu カーボンナノウォールの製造方法と製造装置
JP2013100205A (ja) * 2011-11-09 2013-05-23 Tokyo Electron Ltd 前処理方法、グラフェンの形成方法及びグラフェン製造装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102320909B1 (ko) 2021-05-07 2021-11-02 한밭대학교 산학협력단 탄소 나노월 및 이의 제조방법, 이를 포함하는 리튬 이차전지용 음극
KR20230039536A (ko) * 2021-09-13 2023-03-21 도쿄엘렉트론가부시키가이샤 플라스마원 및 플라스마 처리 장치
KR102865626B1 (ko) 2021-09-13 2025-09-26 도쿄엘렉트론가부시키가이샤 플라스마원 및 플라스마 처리 장치

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