CN109516453B - 石墨烯结构体的形成方法和形成装置 - Google Patents

石墨烯结构体的形成方法和形成装置

Info

Publication number
CN109516453B
CN109516453B CN201811099667.6A CN201811099667A CN109516453B CN 109516453 B CN109516453 B CN 109516453B CN 201811099667 A CN201811099667 A CN 201811099667A CN 109516453 B CN109516453 B CN 109516453B
Authority
CN
China
Prior art keywords
gas
substrate
processed
microwave
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811099667.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN109516453A (zh
Inventor
井福亮太
松本贵士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN109516453A publication Critical patent/CN109516453A/zh
Application granted granted Critical
Publication of CN109516453B publication Critical patent/CN109516453B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/881Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
    • H10D62/882Graphene
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/15Nano-sized carbon materials
    • C01B32/182Graphene
    • C01B32/184Preparation
    • C01B32/186Preparation by chemical vapour deposition [CVD]
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/15Nano-sized carbon materials
    • C01B32/18Nanoonions; Nanoscrolls; Nanohorns; Nanocones; Nanowalls
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/452Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45527Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
    • C23C16/45536Use of plasma, radiation or electromagnetic fields
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • H01J37/32211Means for coupling power to the plasma
    • H01J37/3222Antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • H01J37/32311Circuits specially adapted for controlling the microwave discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32715Workpiece holder
    • H01J37/32724Temperature
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2923Materials being conductive materials, e.g. metallic silicides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3238Materials thereof being insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3241Materials thereof being conductive materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3406Carbon, e.g. diamond-like carbon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3451Structure
    • H10P14/3452Microstructure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6328Deposition from the gas or vapour phase
    • H10P14/6334Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/6902Inorganic materials composed of carbon, e.g. alpha-C, diamond or hydrogen doped carbon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90Thermal treatments, e.g. annealing or sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332Coating
    • H01J2237/3321CVD [Chemical Vapor Deposition]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/842Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
    • Y10S977/844Growth by vaporization or dissociation of carbon source using a high-energy heat source, e.g. electric arc, laser, plasma, e-beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Electromagnetism (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Crystallography & Structural Chemistry (AREA)
CN201811099667.6A 2017-09-20 2018-09-20 石墨烯结构体的形成方法和形成装置 Active CN109516453B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-180049 2017-09-20
JP2017180049A JP6960813B2 (ja) 2017-09-20 2017-09-20 グラフェン構造体の形成方法および形成装置

Publications (2)

Publication Number Publication Date
CN109516453A CN109516453A (zh) 2019-03-26
CN109516453B true CN109516453B (zh) 2026-02-13

Family

ID=65719940

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811099667.6A Active CN109516453B (zh) 2017-09-20 2018-09-20 石墨烯结构体的形成方法和形成装置

Country Status (4)

Country Link
US (1) US11091836B2 (https=)
JP (1) JP6960813B2 (https=)
KR (1) KR102209666B1 (https=)
CN (1) CN109516453B (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5851804B2 (ja) * 2011-11-09 2016-02-03 東京エレクトロン株式会社 前処理方法、グラフェンの形成方法及びグラフェン製造装置
JP6960813B2 (ja) 2017-09-20 2021-11-05 東京エレクトロン株式会社 グラフェン構造体の形成方法および形成装置
KR102592698B1 (ko) * 2017-11-29 2023-10-24 삼성전자주식회사 나노결정질 그래핀 및 나노결정질 그래핀의 형성방법
US11289331B2 (en) * 2018-09-27 2022-03-29 Applied Materials, Inc. Methods for graphene formation using microwave surface-wave plasma on dielectric materials
KR20200128975A (ko) * 2019-05-07 2020-11-17 삼성전자주식회사 그래핀의 형성방법
US20230033329A1 (en) 2019-12-11 2023-02-02 Jozef Stefan Institute Method and apparatus for deposition of carbon nanostructures
JP7422540B2 (ja) * 2019-12-26 2024-01-26 東京エレクトロン株式会社 成膜方法および成膜装置
KR102887170B1 (ko) * 2020-03-04 2025-11-14 삼성전자주식회사 그래핀의 형성방법 및 그래핀 제조 장치
CN111517313B (zh) * 2020-05-16 2021-08-10 西安工业大学 一种高连续性均匀规律孔隙结构三维石墨烯的制备方法
JP7561530B2 (ja) 2020-06-25 2024-10-04 東京エレクトロン株式会社 成膜方法及び成膜装置
JP2022079159A (ja) 2020-11-16 2022-05-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2022114773A (ja) * 2021-01-27 2022-08-08 東京エレクトロン株式会社 成膜方法および成膜装置
CN116670325A (zh) * 2021-01-27 2023-08-29 国立研究开发法人产业技术综合研究所 微波等离子处理装置
JP2022120690A (ja) 2021-02-05 2022-08-18 東京エレクトロン株式会社 基板処理方法および基板処理装置
KR102320909B1 (ko) 2021-05-07 2021-11-02 한밭대학교 산학협력단 탄소 나노월 및 이의 제조방법, 이를 포함하는 리튬 이차전지용 음극
JP2022183969A (ja) 2021-05-31 2022-12-13 東京エレクトロン株式会社 成膜方法および成膜装置
US20220403509A1 (en) 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method
US12571092B2 (en) 2021-07-15 2026-03-10 Applied Materials, Inc. Integrated methods for graphene formation
JP7682054B2 (ja) * 2021-08-17 2025-05-23 東京エレクトロン株式会社 プラズマ処理装置
JP7623086B2 (ja) * 2021-09-13 2025-01-28 東京エレクトロン株式会社 プラズマ源及びプラズマ処理装置
JP7692775B2 (ja) 2021-09-16 2025-06-16 東京エレクトロン株式会社 基板処理方法、基板処理装置および半導体構造
KR102928751B1 (ko) 2021-09-29 2026-02-23 도쿄엘렉트론가부시키가이샤 성막 방법 및 성막 장치
JP2024540405A (ja) * 2021-11-04 2024-10-31 ユニヴェルシテ・ピカルディ・ジュール・ヴェルヌ 対象となる基板上にグラフェン又は酸化グラフェンを直接堆積させる方法
JP2023119615A (ja) 2022-02-17 2023-08-29 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2024004544A (ja) 2022-06-29 2024-01-17 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2024073129A (ja) 2022-11-17 2024-05-29 東京エレクトロン株式会社 成膜方法およびプラズマ処理装置

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6863942B2 (en) 1998-06-19 2005-03-08 The Research Foundation Of State University Of New York Free-standing and aligned carbon nanotubes and synthesis thereof
US6649431B2 (en) 2001-02-27 2003-11-18 Ut. Battelle, Llc Carbon tips with expanded bases grown with simultaneous application of carbon source and etchant gases
EP1804274A3 (en) 2001-03-28 2007-07-18 Tadahiro Ohmi Plasma processing apparatus
US7666381B2 (en) 2003-06-10 2010-02-23 Plasmet Corporation Continuous production of carbon nanomaterials using a high temperature inductively coupled plasma
WO2005021430A1 (ja) 2003-08-27 2005-03-10 Nu Eco Engineering Co., Ltd. カーボンナノウォールの製造方法、カーボンナノウォールおよび製造装置
CN100492600C (zh) 2003-11-05 2009-05-27 大见忠弘 等离子体处理装置
JP4324078B2 (ja) 2003-12-18 2009-09-02 キヤノン株式会社 炭素を含むファイバー、炭素を含むファイバーを用いた基板、電子放出素子、該電子放出素子を用いた電子源、該電子源を用いた表示パネル、及び、該表示パネルを用いた情報表示再生装置、並びに、それらの製造方法
JP2005097113A (ja) 2004-11-26 2005-04-14 Mineo Hiramatsu カーボンナノウォールの製造方法と製造装置
JP5068458B2 (ja) * 2006-01-18 2012-11-07 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
US7276796B1 (en) 2006-03-15 2007-10-02 International Business Machines Corporation Formation of oxidation-resistant seed layer for interconnect applications
JP2008239357A (ja) * 2007-03-25 2008-10-09 Univ Nagoya カーボンナノウォールの製造方法
US8919428B2 (en) 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US20090273106A1 (en) 2008-05-02 2009-11-05 Yuan Ze University Porous Carbon Membranes and Their Forming Method
JP5222040B2 (ja) 2008-06-25 2013-06-26 東京エレクトロン株式会社 マイクロ波プラズマ処理装置
CN102265400A (zh) 2008-10-23 2011-11-30 桑迪士克3D有限责任公司 展示减少的分层的基于碳的存储器元件和形成其的方法
US8277872B1 (en) 2008-11-12 2012-10-02 Stc.Unm Methods of making multi-scale carbon structures
WO2011016616A2 (ko) 2009-08-03 2011-02-10 인제대학교 산학협력단 신규한 구조의 탄소계 나노복합체 및 이의 제조방법
US10167572B2 (en) 2009-08-07 2019-01-01 Guardian Glass, LLC Large area deposition of graphene via hetero-epitaxial growth, and products including the same
US8323521B2 (en) * 2009-08-12 2012-12-04 Tokyo Electron Limited Plasma generation controlled by gravity-induced gas-diffusion separation (GIGDS) techniques
JP2011068513A (ja) 2009-09-25 2011-04-07 Tokyo Electron Ltd カーボンナノチューブ膜の成膜方法
JP5439120B2 (ja) 2009-11-02 2014-03-12 株式会社東芝 半導体装置およびその製造方法
US20110136346A1 (en) 2009-12-04 2011-06-09 Axcelis Technologies, Inc. Substantially Non-Oxidizing Plasma Treatment Devices and Processes
US20110195207A1 (en) 2010-02-08 2011-08-11 Sungkyunkwan University Foundation For Corporate Collaboration Graphene roll-to-roll coating apparatus and graphene roll-to-roll coating method using the same
KR101129930B1 (ko) * 2010-03-09 2012-03-27 주식회사 하이닉스반도체 반도체 소자 및 그의 형성 방법
JP5692794B2 (ja) * 2010-03-17 2015-04-01 独立行政法人産業技術総合研究所 透明導電性炭素膜の製造方法
JP2011201735A (ja) 2010-03-26 2011-10-13 Fujitsu Ltd グラフェン膜の製造方法及び半導体装置の製造方法
JP5660804B2 (ja) 2010-04-30 2015-01-28 東京エレクトロン株式会社 カーボンナノチューブの形成方法及びカーボンナノチューブ成膜装置
KR20120012271A (ko) * 2010-07-30 2012-02-09 성균관대학교산학협력단 그래핀의 제조 방법, 그래핀 시트 및 이를 이용한 소자
JP2012089334A (ja) * 2010-10-19 2012-05-10 Tokyo Electron Ltd マイクロ波プラズマ源およびプラズマ処理装置
JP5775705B2 (ja) 2011-02-25 2015-09-09 東京エレクトロン株式会社 カーボンナノチューブの形成方法及び前処理方法
JP5893865B2 (ja) * 2011-03-31 2016-03-23 東京エレクトロン株式会社 プラズマ処理装置およびマイクロ波導入装置
WO2012153674A1 (ja) * 2011-05-06 2012-11-15 独立行政法人産業技術総合研究所 透明導電膜積層体の製造方法および透明導電膜積層体
KR101872949B1 (ko) 2011-05-17 2018-07-02 삼성전자주식회사 상변화 메모리 장치 및 이의 제조 방법
JP5414756B2 (ja) 2011-09-09 2014-02-12 株式会社東芝 半導体装置とその製造方法
JP5414760B2 (ja) 2011-09-27 2014-02-12 株式会社東芝 半導体装置およびその製造方法
EP2763936A4 (en) 2011-10-07 2015-07-15 Purdue Research Foundation FAST SYNTHESIS OF GRAPHS AND FORMATION OF GRAPHIC STRUCTURES
JP5851804B2 (ja) * 2011-11-09 2016-02-03 東京エレクトロン株式会社 前処理方法、グラフェンの形成方法及びグラフェン製造装置
JP5801221B2 (ja) 2012-02-22 2015-10-28 株式会社東芝 半導体装置の製造方法および半導体装置
EP2825508A4 (en) 2012-03-15 2015-10-21 Massachusetts Inst Technology FILTER BASED ON GRAPHENE
TWI526559B (zh) 2012-04-06 2016-03-21 中央研究院 藉由物理氣相沉積法在基板上成長碳薄膜或無機材料薄膜的方法
JP6037688B2 (ja) * 2012-07-09 2016-12-07 東京エレクトロン株式会社 マイクロ波導入モジュールにおける異常検知方法
JP2014026773A (ja) * 2012-07-25 2014-02-06 Tokyo Electron Ltd プラズマ処理装置
JP2014049667A (ja) * 2012-09-03 2014-03-17 Tokyo Electron Ltd プラズマ処理装置及びこれを備えた基板処理装置
JP5624600B2 (ja) 2012-12-27 2014-11-12 株式会社東芝 配線及び半導体装置の製造方法
KR20200003258A (ko) 2013-01-14 2020-01-08 캘리포니아 인스티튜트 오브 테크놀로지 그라펜을 형성시키는 방법 및 시스템
JP6074270B2 (ja) * 2013-01-15 2017-02-01 東京エレクトロン株式会社 グラフェンのパターニング方法、及びパターンニング用部材
JP2014167142A (ja) * 2013-02-28 2014-09-11 Tokyo Electron Ltd カーボン膜形成方法及びカーボン膜
JP6002087B2 (ja) 2013-05-29 2016-10-05 東京エレクトロン株式会社 グラフェンの生成方法
JP6338462B2 (ja) * 2013-09-11 2018-06-06 東京エレクトロン株式会社 プラズマ処理装置
JP6356415B2 (ja) * 2013-12-16 2018-07-11 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
US9911544B1 (en) * 2014-06-10 2018-03-06 The United States Of America As Represented By The Administrator Of Nasa Metal oxide vertical graphene hybrid supercapacitors
US9857328B2 (en) 2014-12-18 2018-01-02 Agilome, Inc. Chemically-sensitive field effect transistors, systems and methods for manufacturing and using the same
JP6478748B2 (ja) * 2015-03-24 2019-03-06 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
JP6624833B2 (ja) * 2015-07-31 2019-12-25 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
JP6590716B2 (ja) * 2016-02-02 2019-10-16 東京エレクトロン株式会社 トランジスタの閾値制御方法および半導体装置の製造方法
KR20160059466A (ko) * 2016-03-09 2016-05-26 이윤택 무촉매 저온 기판 성장 그래핀의 제조방법 및 무촉매 저온 기판 성장 그래핀 및 제조 장치
JP6697292B2 (ja) * 2016-03-14 2020-05-20 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP6671230B2 (ja) * 2016-04-26 2020-03-25 東京エレクトロン株式会社 プラズマ処理装置およびガス導入機構
US10269706B2 (en) 2016-07-26 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
JP6793503B2 (ja) 2016-09-01 2020-12-02 東京エレクトロン株式会社 グラフェンの生成方法
JP6796450B2 (ja) * 2016-10-25 2020-12-09 東京エレクトロン株式会社 プラズマ処理装置
JP6960813B2 (ja) 2017-09-20 2021-11-05 東京エレクトロン株式会社 グラフェン構造体の形成方法および形成装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Alexander Malesevic et al.Synthesis of few-layer graphene via microwave plasma-enhanced chemical vapour deposition.《Nanotechnology》.2008,第1-6页. *
Synthesis of few-layer graphene via microwave plasma-enhanced chemical vapour deposition;Alexander Malesevic et al;《Nanotechnology》;20081231;第1-6页 *
使用等离子体 CVD 方法形成碳纳米壁;平松美根男 等;《表面科学》;20101231;第31卷(第3期);第144-149页 *

Also Published As

Publication number Publication date
KR102209666B1 (ko) 2021-01-28
JP2019055887A (ja) 2019-04-11
CN109516453A (zh) 2019-03-26
US20190085457A1 (en) 2019-03-21
US11091836B2 (en) 2021-08-17
JP6960813B2 (ja) 2021-11-05
KR20190033010A (ko) 2019-03-28

Similar Documents

Publication Publication Date Title
CN109516453B (zh) 石墨烯结构体的形成方法和形成装置
KR102455326B1 (ko) 그래핀 구조체를 형성하는 방법 및 장치
KR102751036B1 (ko) 성막 방법 및 성막 장치
US12018375B2 (en) Flim forming method of carbon-containing film by microwave plasma
US20190237326A1 (en) Selective film forming method and film forming apparatus
KR102650973B1 (ko) 그래핀 구조체를 형성하는 방법 및 장치
JP2011199003A (ja) シリコン酸化膜の形成方法、及びプラズマ処理装置
KR20220113782A (ko) 성막 방법 및 성막 시스템
US20250191907A1 (en) Film forming method and film forming apparatus
KR102781994B1 (ko) 기판 처리 방법 및 기판 처리 장치
US20250149329A1 (en) Subtrate processing method and substrate processing apparatus
US20260047360A1 (en) Substrate processing method, method for manufacturing semiconductor device, and microwave plasma apparatus
US20250329515A1 (en) Film forming method and plasma processing apparatus
US20240254626A1 (en) Film forming method and film forming apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant