KR102188447B1 - 도전성 접착제 조성물 및 그것을 사용한 전자 소자 - Google Patents
도전성 접착제 조성물 및 그것을 사용한 전자 소자 Download PDFInfo
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- KR102188447B1 KR102188447B1 KR1020157010695A KR20157010695A KR102188447B1 KR 102188447 B1 KR102188447 B1 KR 102188447B1 KR 1020157010695 A KR1020157010695 A KR 1020157010695A KR 20157010695 A KR20157010695 A KR 20157010695A KR 102188447 B1 KR102188447 B1 KR 102188447B1
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- South Korea
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- weight
- conductive adhesive
- powder
- adhesive composition
- resin
- Prior art date
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- -1 or WO 3 Inorganic materials 0.000 claims description 10
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- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 3
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- 239000004332 silver Substances 0.000 abstract description 31
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
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- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
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- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 2
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- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 2
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
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- 239000011572 manganese Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
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- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
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- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
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- 229930185605 Bisphenol Natural products 0.000 description 1
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- 239000004952 Polyamide Substances 0.000 description 1
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- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
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- 229910052799 carbon Inorganic materials 0.000 description 1
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- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
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- 125000005265 dialkylamine group Chemical group 0.000 description 1
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- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- 230000001590 oxidative effect Effects 0.000 description 1
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
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- 239000004848 polyfunctional curative Substances 0.000 description 1
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-280701 | 2012-12-25 | ||
| JP2012280701 | 2012-12-25 | ||
| PCT/JP2013/081340 WO2014103569A1 (ja) | 2012-12-25 | 2013-11-21 | 導電性接着剤組成物及びそれを用いた電子素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150100621A KR20150100621A (ko) | 2015-09-02 |
| KR102188447B1 true KR102188447B1 (ko) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020157010695A KR102188447B1 (ko) | 2012-12-25 | 2013-11-21 | 도전성 접착제 조성물 및 그것을 사용한 전자 소자 |
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| Country | Link |
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| JP (1) | JP6156393B2 (ja) |
| KR (1) | KR102188447B1 (ja) |
| CN (1) | CN104822789B (ja) |
| TW (1) | TWI599636B (ja) |
| WO (1) | WO2014103569A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6151742B2 (ja) * | 2015-06-09 | 2017-06-21 | タツタ電線株式会社 | 導電性ペースト |
| JP2017069027A (ja) * | 2015-09-30 | 2017-04-06 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品及び積層セラミックコンデンサ |
| JP2017111978A (ja) * | 2015-12-16 | 2017-06-22 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
| JP2017203109A (ja) * | 2016-05-11 | 2017-11-16 | パナソニックＩｐマネジメント株式会社 | 導電性粒子を含む樹脂組成物およびその樹脂組成物を含む電子装置 |
| US10658121B2 (en) * | 2017-10-18 | 2020-05-19 | Kemet Electronics Corporation | Process for forming a solid electrolytic capacitor |
| WO2019159566A1 (ja) * | 2018-02-14 | 2019-08-22 | 株式会社スリーボンド | 導電性接着剤およびその硬化物 |
| JP7281179B2 (ja) * | 2019-05-30 | 2023-05-25 | 化研テック株式会社 | 導電性接着剤及び導電性接着剤の使用方法 |
| US20220396094A1 (en) * | 2019-11-27 | 2022-12-15 | The Yokohama Rubber Co., Ltd. | Pneumatic tire |
| JP2020077645A (ja) * | 2020-01-29 | 2020-05-21 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
| CN115136265A (zh) * | 2020-02-20 | 2022-09-30 | 松下知识产权经营株式会社 | 电解电容器用导电性糊剂及电解电容器 |
| KR102583626B1 (ko) * | 2021-02-05 | 2023-10-04 | 주식회사 엘지화학 | 조성물 |
| US20230215630A1 (en) * | 2021-12-31 | 2023-07-06 | Samsung Electro-Mechanics Co., Ltd. | Multlayer electronic component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005041213A1 (ja) * | 2003-10-27 | 2005-05-06 | Toyo Boseki Kabushiki Kaisha | 導電性ペースト |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02147618A (ja) * | 1988-11-29 | 1990-06-06 | Nitto Denko Corp | エポキシ樹脂組成物及びそれを用いた接着方法 |
| JPH03188180A (ja) * | 1989-12-18 | 1991-08-16 | Hitachi Chem Co Ltd | 導電性フイルム状接着剤，接着法，半導体装置および半導体装置の製造法 |
| JPH04147618A (ja) * | 1990-10-11 | 1992-05-21 | Canon Inc | オーミック電極形成方法 |
| JPH0885187A (ja) * | 1994-09-20 | 1996-04-02 | Nippon Paint Co Ltd | ラミネート金属板及びその製造方法 |
| JPH0992029A (ja) | 1995-09-28 | 1997-04-04 | Matsushita Electric Ind Co Ltd | 導電性ペースト |
| JPH10251606A (ja) * | 1997-03-10 | 1998-09-22 | Asahi Chem Ind Co Ltd | 導電性接着剤 |
| JP3526183B2 (ja) | 1997-09-18 | 2004-05-10 | 住友ベークライト株式会社 | 導電性樹脂ペースト及びこれを用いて製造された半導体装置 |
| JP3484957B2 (ja) | 1997-11-10 | 2004-01-06 | 住友金属鉱山株式会社 | 導電性接着剤 |
| JP3520798B2 (ja) | 1998-03-19 | 2004-04-19 | 東レ株式会社 | プラズマディスプレイ用導電ペ―ストならびにプラズマディスプレイおよびその基板 |
| JP4467120B2 (ja) | 2000-01-13 | 2010-05-26 | 住友金属鉱山株式会社 | 導電性樹脂組成物 |
| JP3975728B2 (ja) | 2001-11-19 | 2007-09-12 | 住友金属鉱山株式会社 | 導電性接着剤及びそれを用いた半導体等の回路基板 |
| JP4363873B2 (ja) * | 2003-03-25 | 2009-11-11 | ソニーケミカル＆インフォメーションデバイス株式会社 | 電気装置の製造方法 |
| CN101210162B (zh) * | 2006-12-28 | 2011-11-30 | 西安西电变压器有限责任公司 | 一种半导体胶及其制备方法 |
| JP2009269976A (ja) | 2008-05-02 | 2009-11-19 | Taiyo Ink Mfg Ltd | 導電性樹脂組成物 |
| JP5558118B2 (ja) * | 2009-07-01 | 2014-07-23 | 旭化成イーマテリアルズ株式会社 | マイクロカプセル型エポキシ樹脂用硬化剤、及びそれを含むマスターバッチ型エポキシ樹脂用硬化剤組成物 |
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2013
- 2013-11-21 WO PCT/JP2013/081340 patent/WO2014103569A1/ja active Application Filing
- 2013-11-21 JP JP2014554244A patent/JP6156393B2/ja not_active Expired - Fee Related
- 2013-11-21 KR KR1020157010695A patent/KR102188447B1/ko active IP Right Grant
- 2013-11-21 CN CN201380062821.1A patent/CN104822789B/zh not_active Expired - Fee Related
- 2013-12-19 TW TW102147082A patent/TWI599636B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005041213A1 (ja) * | 2003-10-27 | 2005-05-06 | Toyo Boseki Kabushiki Kaisha | 導電性ペースト |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI599636B (zh) | 2017-09-21 |
| CN104822789A (zh) | 2015-08-05 |
| CN104822789B (zh) | 2016-09-28 |
| KR20150100621A (ko) | 2015-09-02 |
| JP6156393B2 (ja) | 2017-07-05 |
| JPWO2014103569A1 (ja) | 2017-01-12 |
| WO2014103569A1 (ja) | 2014-07-03 |
| TW201430099A (zh) | 2014-08-01 |
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