KR102129533B1 - 발광소자, 발광장치 및 장치 베이스 - Google Patents

발광소자, 발광장치 및 장치 베이스 Download PDF

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KR102129533B1
KR102129533B1 KR1020130061001A KR20130061001A KR102129533B1 KR 102129533 B1 KR102129533 B1 KR 102129533B1 KR 1020130061001 A KR1020130061001 A KR 1020130061001A KR 20130061001 A KR20130061001 A KR 20130061001A KR 102129533 B1 KR102129533 B1 KR 102129533B1
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South Korea
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light emitting
light
emitting diode
delete delete
diode chip
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KR1020130061001A
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Korean (ko)
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KR20130133695A (ko
Inventor
스이-밍 판
웨이-강 쳉
치-슈 후앙
첸-홍 리
시-위 예
치-치 푸
쳉-광 양
시-치에 탕
시앙-푸 홍
쯔-시앙 왕
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에피스타 코포레이션
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Priority claimed from TW101125599A external-priority patent/TWI479695B/zh
Priority claimed from TW101131198A external-priority patent/TW201409775A/zh
Priority claimed from TW101131643A external-priority patent/TWI464908B/zh
Priority claimed from TW101132185A external-priority patent/TWI577919B/zh
Priority claimed from TW101132187A external-priority patent/TWI490432B/zh
Priority claimed from TW102116429A external-priority patent/TWI533468B/zh
Priority claimed from TW102116650A external-priority patent/TWI511279B/zh
Application filed by 에피스타 코포레이션 filed Critical 에피스타 코포레이션
Publication of KR20130133695A publication Critical patent/KR20130133695A/ko
Publication of KR102129533B1 publication Critical patent/KR102129533B1/ko
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    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
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    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
KR1020130061001A 2012-05-29 2013-05-29 발광소자, 발광장치 및 장치 베이스 Expired - Fee Related KR102129533B1 (ko)

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TW101119098 2012-05-29
TW101119098 2012-05-29
TW101121921 2012-06-19
TW101121921 2012-06-19
TW101125599A TWI479695B (zh) 2012-07-16 2012-07-16 A light emitting diode chip and a light emitting element
TW101125599 2012-07-16
TW101131198 2012-08-28
TW101131198A TW201409775A (zh) 2012-08-28 2012-08-28 具有發光二極體的發光裝置
TW101131643A TWI464908B (zh) 2012-08-30 2012-08-30 Light emitting device
TW101131643 2012-08-30
TW101132187 2012-09-04
TW101132187A TWI490432B (zh) 2012-09-04 2012-09-04 Light emitting device
TW101132185A TWI577919B (zh) 2012-09-04 2012-09-04 Light emitting device
TW101132185 2012-09-04
TW102116429A TWI533468B (zh) 2012-05-29 2013-05-08 發光元件及其發光裝置
TW102116429 2013-05-08
TW102116650A TWI511279B (zh) 2012-06-19 2013-05-10 用於形成多方向出光之發光二極體晶片的藍寶石基板
TW102116650 2013-05-10

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KR1020130061002A Ceased KR20130133696A (ko) 2012-05-29 2013-05-29 다 방향으로 발광하는 발광다이오드 칩 형성용 사파이어 기판, 발광다이오드 칩 및 발광장치

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Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9269870B2 (en) 2011-03-17 2016-02-23 Epistar Corporation Light-emitting device with intermediate layer
CN106252491A (zh) * 2012-05-29 2016-12-21 晶元光电股份有限公司 发光装置
US9166116B2 (en) 2012-05-29 2015-10-20 Formosa Epitaxy Incorporation Light emitting device
CN105074941B (zh) 2012-12-06 2019-10-08 首尔伟傲世有限公司 发光二极管、照明模块、照明设备和背光单元
US9536924B2 (en) 2012-12-06 2017-01-03 Seoul Viosys Co., Ltd. Light-emitting diode and application therefor
TWI540768B (zh) * 2012-12-21 2016-07-01 鴻海精密工業股份有限公司 發光晶片組合及其製造方法
KR20140096722A (ko) * 2013-01-29 2014-08-06 엘지이노텍 주식회사 램프 유닛
TWI626395B (zh) * 2013-06-11 2018-06-11 晶元光電股份有限公司 發光裝置
US20150003058A1 (en) * 2013-07-01 2015-01-01 Biao Zhang Led light bulb
TWI642874B (zh) 2013-09-11 2018-12-01 晶元光電股份有限公司 發光二極體組件以及相關之照明裝置
CN103545458B (zh) * 2013-10-18 2019-06-11 京东方科技集团股份有限公司 照明装置及其制作方法
TWM473612U (zh) * 2013-10-25 2014-03-01 Unity Opto Technology Co Ltd 發光二極體支架及其泡燈
CN104654067A (zh) * 2013-11-25 2015-05-27 璨圆光电股份有限公司 发光装置
JP2015135918A (ja) * 2014-01-17 2015-07-27 豊田合成株式会社 発光装置およびその製造方法
TWM507584U (zh) * 2014-03-18 2015-08-21 璨圓光電股份有限公司 半導體發光元件及其發光裝置
CN103912808B (zh) * 2014-03-19 2016-09-28 江苏日月照明电器有限公司 一种led发光组件及其灯具
CN103953896A (zh) * 2014-04-23 2014-07-30 广东聚科照明股份有限公司 一种360°全周光灯丝装置
CN103953863A (zh) * 2014-04-23 2014-07-30 广东聚科照明股份有限公司 一种360°全周光灯条
WO2015170814A1 (en) * 2014-05-09 2015-11-12 Lg Electronics Inc. Apparatus of light source for display and apparatus of display using the same
TW201545378A (zh) * 2014-05-19 2015-12-01 邱羅利士公司 封裝結構及其製法
KR102199991B1 (ko) * 2014-05-28 2021-01-11 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
US10739882B2 (en) 2014-08-06 2020-08-11 Apple Inc. Electronic device display with array of discrete light-emitting diodes
US10854800B2 (en) * 2014-08-07 2020-12-01 Epistar Corporation Light emitting device, light emitting module, and illuminating apparatus
CN105509001A (zh) * 2014-09-26 2016-04-20 罗建华 一种led灯板
KR20170069240A (ko) * 2014-10-01 2017-06-20 코닌클리케 필립스 엔.브이. 조절가능한 방출 스펙트럼을 갖는 광원
CN104359027A (zh) * 2014-11-03 2015-02-18 黎昌兴 发光体装置于透射导热基本的led光源
TW201617548A (zh) * 2014-11-06 2016-05-16 艾笛森光電股份有限公司 Led燈蕊結構
CN105737103B (zh) * 2014-12-10 2018-07-20 深圳市光峰光电技术有限公司 波长转换装置及相关荧光色轮和投影装置
US9958115B2 (en) * 2015-07-22 2018-05-01 Qin Kong LED tube grow light
US10209427B2 (en) * 2015-10-30 2019-02-19 Alson Technology Limited Electronic device
KR102435458B1 (ko) * 2015-12-04 2022-08-30 엘지디스플레이 주식회사 백라이트 유닛용 광원 패키지 및 그를 포함하는 광원 장치
DE102016105211A1 (de) 2016-03-21 2017-09-21 Osram Opto Semiconductors Gmbh Filament und dessen Herstellung sowie Leuchtmittel mit Filamenten
KR20170131910A (ko) * 2016-05-23 2017-12-01 주식회사 루멘스 발광소자 및 이를 포함하는 발광벌브
DE102016113206A1 (de) * 2016-07-18 2018-01-18 Osram Opto Semiconductors Gmbh Strahlung emittierende Vorrichtung
DE102016117594A1 (de) * 2016-09-19 2018-03-22 Osram Opto Semiconductors Gmbh Licht emittierende Vorrichtung
CN107887369A (zh) * 2016-09-30 2018-04-06 王定锋 一种led双色灯条及制作方法
KR102430500B1 (ko) * 2017-05-30 2022-08-08 삼성전자주식회사 반도체 발광소자 및 이를 이용한 led 모듈
US20190139948A1 (en) * 2017-11-03 2019-05-09 Xiamen Eco Lighting Co. Ltd. Led lighting apparatus
KR102582424B1 (ko) * 2017-12-14 2023-09-25 삼성전자주식회사 발광소자 패키지 및 이를 이용한 디스플레이 장치
DE102017129975A1 (de) * 2017-12-14 2019-06-19 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauteils und Halbleiterbauteil
US10069047B1 (en) * 2018-01-16 2018-09-04 Leedarson Lighting Co. Ltd. LED device
CN108417691A (zh) * 2018-04-18 2018-08-17 东莞市恩瑞精密电子有限公司 线光源制作方法
CN110737085B (zh) * 2018-07-18 2021-11-30 深圳光峰科技股份有限公司 波长转换装置
CN108870104A (zh) * 2018-08-16 2018-11-23 四川蓝景光电技术有限责任公司 单点外漏型led灯
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
CN113841238A (zh) 2019-03-18 2021-12-24 英特曼帝克司公司 Led灯丝
US11342311B2 (en) * 2019-03-18 2022-05-24 Intematix Corporation LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material
JP7242894B2 (ja) 2019-03-18 2023-03-20 インテマティックス・コーポレーション 光ルミネセンス層状構造体を備えるパッケージ化された白色発光デバイス
CN112086413B (zh) * 2019-06-14 2024-04-23 Jmj韩国株式会社 半导体封装
US11171118B2 (en) 2019-07-03 2021-11-09 Micron Technology, Inc. Semiconductor assemblies including thermal circuits and methods of manufacturing the same
US11206749B2 (en) 2019-08-02 2021-12-21 Micron Technology, Inc. Tubular heat spreaders for memory modules and memory modules incorporating the same
KR20230004802A (ko) * 2020-04-30 2023-01-06 루미레즈 엘엘씨 광학 필터링 요소들이 통합된 컬러 led들
US12062737B2 (en) 2020-12-17 2024-08-13 Samsung Electronics Co., Ltd. LED chip and display apparatus including the same
TWI744194B (zh) * 2021-02-23 2021-10-21 晶呈科技股份有限公司 發光二極體封裝結構及其製作方法
US12428113B2 (en) * 2023-08-23 2025-09-30 Lumitec, Llc Marine navigation light with flexible circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347516A (ja) * 2004-06-03 2005-12-15 Jsr Corp 発光装置
JP2007165811A (ja) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718771Y2 (https=) * 1976-05-25 1982-04-20
US5168023A (en) * 1990-07-04 1992-12-01 Matsushita Electric Industrial Co., Ltd. Photosensitive element used in electrophotography
JPH10117018A (ja) * 1996-10-11 1998-05-06 Citizen Electron Co Ltd チップ型発光ダイオード
JP4061005B2 (ja) * 1999-03-31 2008-03-12 シャープ株式会社 発光ダイオードおよびその製造方法並びに発光ダイオードの電気配線基板への搭載方法
US6479046B2 (en) * 2000-08-17 2002-11-12 Joseph C. Dickens Attractants and repellants for colorado potato beetle
JP2002232020A (ja) * 2001-01-31 2002-08-16 Matsushita Electric Ind Co Ltd Ｌｅｄおよびこれを用いた表示装置、照明装置、液晶のバックライト装置並びに投影装置の光源装置
TW511299B (en) * 2001-03-14 2002-11-21 Kuo-Yen Lai Metal substrate with double LED for double side light emission
JP2004134249A (ja) * 2002-10-10 2004-04-30 Mitsubishi Electric Corp 照明装置
TW582122B (en) 2003-01-27 2004-04-01 Opto Tech Corp Light emitting diode package structure
US20050052885A1 (en) 2003-09-04 2005-03-10 Amazing International Enterprise Limited Structure of LED decoration lighting set
JP2005252222A (ja) 2004-02-03 2005-09-15 Matsushita Electric Ind Co Ltd 半導体発光装置、照明モジュール、照明装置、表示素子、および半導体発光装置の製造方法
EP1640756A1 (en) * 2004-09-27 2006-03-29 Barco N.V. Methods and systems for illuminating
TWI374553B (en) * 2004-12-22 2012-10-11 Panasonic Corp Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
CN1862879A (zh) 2005-01-26 2006-11-15 内部无线公司 低形天线
JP2006216765A (ja) * 2005-02-03 2006-08-17 Nippon Leiz Co Ltd 光源装置
CN1866552A (zh) * 2005-05-18 2006-11-22 光宝科技股份有限公司 光线行进方向改变单元及含有其的模块和发光二极管组件
US7569406B2 (en) 2006-01-09 2009-08-04 Cree, Inc. Method for coating semiconductor device using droplet deposition
US8441179B2 (en) * 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
KR100703217B1 (ko) 2006-02-22 2007-04-09 삼성전기주식회사 발광다이오드 패키지 제조방법
JP2007234975A (ja) * 2006-03-02 2007-09-13 Matsushita Electric Ind Co Ltd Ｌｅｄ光源モジュール、エッジ入力型バックライトおよび液晶表示装置
JP2007324578A (ja) * 2006-05-01 2007-12-13 Mitsubishi Chemicals Corp 集積型半導体発光装置およびその製造方法
WO2008060615A1 (en) * 2006-11-15 2008-05-22 The Regents Of The University Of California Transparent mirrorless light emitting diode
CN101192601B (zh) * 2006-11-30 2010-10-13 东芝照明技术株式会社 具有半导体发光元件的照明装置
TW200825529A (en) * 2006-12-06 2008-06-16 Chi Lin Technology Co Ltd Light mixer and backlight module having it
CN101578473B (zh) 2007-01-11 2013-04-10 松下电器产业株式会社 光源
US9159888B2 (en) * 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
JP5463447B2 (ja) * 2008-01-18 2014-04-09 三洋電機株式会社 発光装置及びそれを備えた灯具
JP5097057B2 (ja) * 2008-08-29 2012-12-12 株式会社沖データ 表示装置
US20100073944A1 (en) 2008-09-23 2010-03-25 Edison Opto Corporation Light emitting diode bulb
TW201015743A (en) * 2008-10-01 2010-04-16 Formosa Epitaxy Inc LED and manufacturing method thereof
AU2009322214A1 (en) 2008-12-04 2011-07-21 The Regents Of The University Of California Electron injection nanostructured semiconductor material anode electroluminescence method and device
KR20100076083A (ko) * 2008-12-17 2010-07-06 서울반도체 주식회사 복수개의 발광셀들을 갖는 발광 다이오드 및 그것을 제조하는 방법
JP5266075B2 (ja) * 2009-01-26 2013-08-21 パナソニック株式会社 電球形照明装置
US8382331B2 (en) * 2009-04-03 2013-02-26 Yung Pun Cheng LED lighting lamp
US8079735B1 (en) 2009-03-31 2011-12-20 Usman Vakil Light emitting diode illumination device
TWI495084B (zh) * 2009-07-07 2015-08-01 晶元光電股份有限公司 發光元件
US9029898B2 (en) * 2009-08-26 2015-05-12 Formosa Epitaxy Incorporation Light emitting diode and illumination device using same
WO2011033551A1 (ja) * 2009-09-15 2011-03-24 アリスト・エンジニアリング プライベート リミテッド 照明装置
US8025533B2 (en) * 2009-11-13 2011-09-27 Smk Corporation LED illumination apparatus
TWM383697U (en) 2009-12-30 2010-07-01 Sheng-Yi Zhuang LED lamp set and light-emitting bulb applying the lamp set
KR20110099513A (ko) * 2010-03-02 2011-09-08 삼성엘이디 주식회사 조명 장치
CN102194957A (zh) * 2010-03-19 2011-09-21 富士康(昆山)电脑接插件有限公司 发光二极管芯片承载座
CN102222749A (zh) * 2010-04-19 2011-10-19 展晶科技(深圳)有限公司 发光组件及其模块
CN101846256A (zh) * 2010-05-04 2010-09-29 蔡州 Led光源
TWM389204U (en) 2010-06-03 2010-09-21 Liquidleds Lighting Corp LED illumination lamp
CN102339927A (zh) * 2010-07-27 2012-02-01 展晶科技(深圳)有限公司 发光二极管
CN102374418B (zh) 2010-08-20 2014-08-20 光宝电子(广州)有限公司 发光二极管灯具
US8210716B2 (en) * 2010-08-27 2012-07-03 Quarkstar Llc Solid state bidirectional light sheet for general illumination
SG188483A1 (en) 2010-09-08 2013-04-30 Zhejiang Ledison Optoelectronics Co Ltd Led light bulb and led light-emitting strip being capable of emitting 4pi light
JP5545547B2 (ja) 2010-10-07 2014-07-09 東芝ライテック株式会社 光源体および照明器具
JP4778107B1 (ja) * 2010-10-19 2011-09-21 有限会社ナプラ 発光デバイス、及び、その製造方法
EP2631958A1 (en) * 2010-10-22 2013-08-28 Panasonic Corporation Mounting board, light emitting device and lamp
CN201866576U (zh) 2010-10-28 2011-06-15 王元成 一种led灯泡
KR101726807B1 (ko) * 2010-11-01 2017-04-14 삼성전자주식회사 반도체 발광소자
JP2012099726A (ja) 2010-11-04 2012-05-24 Stanley Electric Co Ltd Ｌｅｄモジュール及びｌｅｄランプ
US20120118222A1 (en) * 2010-11-15 2012-05-17 Sumitomo Electric Industries, Ltd. METHOD OF MANUFACTURING GaN-BASED FILM
TW201233940A (en) 2010-11-30 2012-08-16 Wintek Corp Light source for crystal lamp
CN202839730U (zh) 2010-12-28 2013-03-27 松下电器产业株式会社 发光装置、发光模块及灯
CN102130239B (zh) * 2011-01-31 2012-11-07 郑榕彬 全方位采光的led封装方法及led封装件
US8314566B2 (en) * 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
DE102011017195A1 (de) * 2011-04-15 2012-10-18 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung
US8723665B2 (en) * 2011-07-26 2014-05-13 Tyco Safety Products Canada Ltd. Audio buffering in two-way voice alarm systems
TWI464868B (zh) 2011-09-14 2014-12-11 隆達電子股份有限公司 固態光源模組及固態光源陣列
JP6101629B2 (ja) * 2011-10-31 2017-03-22 シャープ株式会社 発光装置、照明装置、及び、発光装置の製造方法
US8591072B2 (en) * 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
US9395051B2 (en) 2012-04-13 2016-07-19 Cree, Inc. Gas cooled LED lamp
US9010964B2 (en) * 2012-04-26 2015-04-21 Epistar Corporation LED light bulb with interior facing LEDs
CN106252491A (zh) * 2012-05-29 2016-12-21 晶元光电股份有限公司 发光装置
CN202733581U (zh) * 2012-08-27 2013-02-13 程敬鹏 一种全角度发光的led灯泡
TWM453804U (zh) 2013-01-25 2013-05-21 Bo-Cheng Lin 具多方向照明之ｌｅｄ燈泡

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347516A (ja) * 2004-06-03 2005-12-15 Jsr Corp 発光装置
JP2007165811A (ja) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置

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