CN106252491A - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN106252491A
CN106252491A CN201610696438.7A CN201610696438A CN106252491A CN 106252491 A CN106252491 A CN 106252491A CN 201610696438 A CN201610696438 A CN 201610696438A CN 106252491 A CN106252491 A CN 106252491A
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CN
China
Prior art keywords
light
luminescence component
emitting device
emitting diode
backlight unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610696438.7A
Other languages
English (en)
Inventor
潘锡明
郑惟纲
黄知澍
李承鸿
叶时有
蒲计志
杨程光
汤士杰
洪祥富
王子翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW101125599A external-priority patent/TWI479695B/zh
Priority claimed from TW101131198A external-priority patent/TW201409775A/zh
Priority claimed from TW101131643A external-priority patent/TWI464908B/zh
Priority claimed from TW101132185A external-priority patent/TWI577919B/zh
Priority claimed from TW101132187A external-priority patent/TWI490432B/zh
Priority claimed from TW102116429A external-priority patent/TWI533468B/zh
Priority claimed from TW102116650A external-priority patent/TWI511279B/zh
Application filed by Epistar Corp filed Critical Epistar Corp
Publication of CN106252491A publication Critical patent/CN106252491A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
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    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
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    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
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Abstract

本发明公开了一种发光装置，包括：第一发光组件，包括具有第一表面与第一侧面的第一透明基板，以及设置于所述第一表面上的第一发光二极管芯片；第二发光组件，包括具有第二表面与第二侧面的第二透明基板，以及设置于所述第二表面上的第二发光二极管芯片；灯壳，具有几何中心轴，并包覆所述第一发光组件与所述第二发光组件；其中，所述第一侧面与所述第二侧面面向所述几何中心轴。本发明的发光装置将发光二极管芯片固设于透明基板上，以一定布置方式将多个发光组件至少部分集中或分散设置，以达成发光装置于不同应用时的光形需要，且可提高亮度与改善发光效果。

Description

发光装置
技术领域
本发明关于一种发光装置，尤其是指一种适应不同应用时的光形需要的发光装置。
背景技术
发光二极管(light emitting diode, LED)本身所发出来的光是偏向一种指向性的光源，并非如一般市场出售的灯泡为一种发散型的光源，因此在应用上会受到限制。举例说明，在一般室内外照明的灯具上的应用并无法达到所需要的光形。另外，现有技术中发光二极管发光装置仅可单面发光，因此具有较低的发光效率。
发明内容
本发明的目的在于提供一种适应不同应用时的光形需要的发光装置。
为了解决上述技术问题，本发明所采用的技术方案为：
一种发光装置，其包括：
第一发光组件，包括具有第一表面与第一侧面的第一透明基板，以及设置于所述第一表面上的第一发光二极管芯片；以及
第二发光组件，包括具有第二表面与第二侧面的第二透明基板，以及设置于所述第二表面上的第二发光二极管芯片；
灯壳，具有几何中心轴，并包覆所述第一发光组件与所述第二发光组件；
其中，所述第一侧面与所述第二侧面面向所述几何中心轴。
作为本发明的进一步改进，所述第一发光组件还包括覆盖所述第一发光二极管芯片的第一波长转换层，所述第二发光组件还包括覆盖所述第二发光二极管芯片的第二波长转换层。
作为本发明的进一步改进，所述第一侧面未被所述第一波长转换层覆盖，所述第二侧面未被所述第二波长转换层覆盖。
作为本发明的进一步改进，所述第一发光组件还包括设置于所述第一表面上的第三发光二极管芯片，所述第一波长转换层连续性地覆盖所述第一发光二极管芯片与所述第三发光二极管芯片。
作为本发明的进一步改进，所述第一波长转换层直接接触所述第一发光二极管芯片。
作为本发明的进一步改进，所述第一发光组件还包括一位于所述第一表面相对侧的第三表面，以及覆盖所述第一表面的第一波长转换层。
作为本发明的进一步改进，所述第一发光组件还包括覆盖所述第三表面的第二波长转换层，所述第二波长转换层与所述第一波长转换层所包含的荧光粉含量不同。
作为本发明的进一步改进，所述发光装置还包括第一连接电极设置于所述第一表面上，其中，所述第一波长转换层暴露至少部分所述第一连接电极。
作为本发明的进一步改进，所述发光装置还包括支架与所述第一连接电极连接。
作为本发明的进一步改进，所述支架可弯折，使所述第一发光组件与所述支架间有不等于180度的夹角。
本发明的发光装置将发光二极管芯片固设于透明基板上，以一定布置方式将多个发光组件至少部分集中或分散设置，以达成发光装置于不同应用时的光形需要，且可提高亮度与改善发光效果。
附图说明
图1A与图1B为本发明的一较佳实施例的发光组件的结构示意图。
图2A、图2B与图2C为本发明的一较佳实施例的不同形式的发光二极管芯片耦接于导线的示意图。
图3A与图3B为本发明的一较佳实施例的波长转换层的布置示意图。
图4A为本发明的另一较佳实施例的发光组件的剖面示意图。
图4B为本发明的另一较佳实施例的发光组件的剖面示意图。
图5为本发明的另一较佳实施例的发光组件的示意图。
图6A为本发明的一较佳实施例的承载座的示意图。
图6B为本发明的一较佳实施例的电路基板的示意图。
图6C为本发明的一较佳实施例的反射镜的示意图。
图6D为本发明的一较佳实施例的类金刚石碳膜的示意图。
图7A为本发明的一较佳实施例的发光装置的示意图。
图7B为本发明的另一较佳实施例的发光装置的示意图。
图8为本发明的另一较佳实施例的发光装置的外观示意图。
图9A、图9B与图9C为本发明的一较佳实施例的透明基板插接或黏接于承载座的示意图。
图10A与图10B为本发明的一较佳实施例的透明基板黏接于具支架的承载座的示意图。
图11为本发明的另一较佳实施例的发光装置的立体示意图。
图12为本发明的另一较佳实施例的发光装置的装置基座的立体示意图。
图13为本发明的另一较佳实施例的发光装置的立体示意图。
图14A、图14B、图14C与图14D为本发明的一较佳实施例以点对称或线对称排列透明基板于承载机构上的俯视示意图。
图15为本发明的另一较佳实施例的发光装置的示意图。
图16A与图16B为本发明的一较佳实施例灯壳的示意图。
图16C为本发明的一较佳实施例的广告牌式灯壳的俯视剖面示意图。
图16D、图16E、图16F与图16G为本发明的一较佳实施例的球泡灯式的实施示意图。
图17为本发明的另一较佳实施例的灯条的示意图。
图18为本发明的另一较佳实施例的发光装置的立体示意图。
图19为本发明的另一较佳实施例的发光装置的示意图。
具体实施方式
请参考图1A与图1B，图1A与图1B为本发明的一较佳实施例的发光组件或发光板的结构示意。如图1A与图1B所示，发光组件1包括：一透明基板2；一承载面210；一第一主表面21A；一第二主表面21B以及至少一多方向出光发光二极管芯片3。其中，透明基板2本身为平板薄片状并具有两个主要面体，其中任一主要面体为承载面210，具有发光功能的发光二极管芯片3设置于所述承载面210上，且发光二极管芯片3未被透明基板2遮蔽的一发光面34，与未设置发光二极管芯片3的至少部分承载面210共同形成可发光的第一主表面21A。透明基板2未设有发光二极管芯片3的另一主要面体则为第二主表面21B。也可于基板两个面均布置发光二极管芯片3，其中两个面上的发光二极管芯片3可对应交错排列，使各面上的发光二极管芯片3发光时，光线可顺利穿透透明基板2并从另一面出光，而不被另一面上的发光二极管芯片遮蔽，增加单位面积的发光强度。透明基板2的材质可为氧化铝(Al2O3)、含有氧化铝的蓝宝石、碳化硅(SiC)、玻璃、塑料或是橡胶，其中，本发明较佳实施例是采用蓝宝石基板，因为蓝宝石基板的材料大体上为单晶结构，不但具有较好的透光率，且散热能力佳，可延长发光组件1的寿命；但使用传统蓝宝石基板于本发明中有易碎裂的问题，所以本发明经实验验证，本发明的透明基板2较佳选用厚度大于或等于200微米(um)的蓝宝石基板，以达成较佳的可靠度，并有较佳的承载以及透光功能。同时为有效达成发光组件1双向或全方向等多方向出光的目的，本发明的发光二极管芯片3较佳可选用出光角度大于180度者。这样，当本发明在使用时，设置于透明基板2的上的发光二极管芯片3除发光面34可发出往远离基板方向离开的光线外，发光二极管芯片3也可发出至少部分进入透明基板2的光线，而进入透明基板2的光线除从透明基板2上对应第一主表面21A的第二主表面21B出光外，也可从透明基板2的未设置发光二极管芯片3的部分承载面210与其他表面出光，使发光组件1可以达成双面出光或全方向出光等多方向出光效果。在本发明中，第一主表面21A或第二主表面21B的面积为发光二极管芯片3的发光面34的总和面积的五倍以上，所述设计兼顾到发光效率以及散热等条件而为较佳的配置比例。
另外，本发明的另一较佳实施例是发光组件1的第一主表面21A与第二主表面21B所发出光线的色温差异等于或小于1500K，使发光组件1有更全面一致的发光效果。而在透明基板2的透光特性上，当发光二极管芯片3发出光线的波长范围大于或等于420纳米，和/或当所述光线的波长范围小于或等于470纳米时，在上述透明基板2厚度条件下，透明基板2的光穿透率大于或等于70%。
本发明并不以上述实施例为限。下文将依序介绍本发明的其它较佳实施例，且为了便于比较各实施例的相异处并简化说明，在下文的各实施例中使用相同的符号标注等同的组件，且主要针对各实施例的相异处进行说明，而不再对重复部分进行赘述。
请参考图2A、图2B与图2C，本发明为了获得供电以进行发光，发光二极管芯片3本身包括一第一电极31A与一第二电极31B，所述第一电极31A与第二电极31B则分别与位于透明基板2上的一第一连接导线23A以及一第二连接导线23B电性连接。其中，图2A、图2B与图2C分别揭示了不同形式的发光二极管芯片3以及与导线的耦接方式。图2A为横式发光二极管芯片，其中发光二极管芯片3形成于透明基板2的承载面210上，第一电极31A与第二电极31B以打线方式分别电性耦接于第一连接导线23A与第二连接导线23B；图2B为覆晶式发光二极管芯片，发光二极管芯片3为倒置并通过第一电极31A与第二电极31B与透明基板2耦接，其中第一电极31A与第二电极31B分别以焊接或黏接方式电性耦接于第一连接导线23A与第二连接导线23B；图2C则是于发光二极管芯片3的两端设置第一电极31A与第二电极31B，并将发光二极管芯片3以直立设置的方式使第一电极31A与第二电极31B分别与第一连接导线23A以及第二连接导线23B相连接。
请参考图3A与图3B，本发明的发光组件1还包括一波长转换层4，其设置于第一主表面21A或/与第二主表面21B上，或是直接设置于发光二极管芯片3上，且其可直接接触于发光二极管芯片3，或是与发光二极管芯片3相邻一段距离而不直接接触。波长转换层4含有至少一种荧光粉，如石榴石系、硫酸盐系或硅酸盐系等无机或有机材质的荧光粉，以接收至少部分发光二极管芯片3所发出光线并转换为另一种波长范围的光。例如，当发光二极管芯片3发出蓝光，波长转换层4转换部分蓝光为黄光，而使发光组件1在蓝光与黄光混合下最后发出白光。另外由于第一主表面21A光源主要是发光二极管芯片3的发光面直接出光，而第二主表面21B光源则是发光二极管芯片3的光线穿透透明基板2发出的光，发光组件1的两个表面的光线强度不同，所以本发明的另一较佳实施例为发光组件1于第一主表面21A与第二主表面21B上的波长转换层4的荧光粉含量相应配置，其中第一主表面21A对第二主表面21B上的荧光粉（或发光二极管芯片上的荧光粉对第二主表面21B上的荧光粉）含量比例范围较佳的可从1比0.5至1比3，使发光组件1的光线强度或光形可以符合应用需求，以及使发光组件1的第一主表面21A与第二主表面21B所发出光线的色温差异等于或小于1500K，提升发光组件1的波长转换效率与发光效果。
请参考图4A。图4A为本发明的另一较佳实施例的发光组件1的剖面示意图。如图4A所示，本实施例的发光组件10包括一透明基板2与至少一多方向出光的发光二极管芯片14。透明基板2具有一承载面210与一第二主表面21B彼此相对设置。发光二极管芯片14设置于透明基板2的承载面210上，且发光二极管芯片14包括一第一电极16与一第二电极18，用以作外部电性连接。发光二极管芯片14未被透明基板2遮蔽的一发光面34，与未被发光二极管芯片14覆盖的部分承载面210共同形成一第一主表面21A。
发光二极管芯片14包括一基底141、一N型半导体层142、一主动层143与一P型半导体层144。在本实施例中，发光二极管芯片14的基底141可利用一芯片接合层28黏着于透明基板2上。在材料的选择上，芯片接合层28的折射率较佳可介于基底141的折射率与透明基板2的折射率之间，通过这种设置可增加出光量。另外，芯片接合层28可为一透明胶或其他适合的接合材料。第一电极16与第二电极18为相对芯片接合层28设置于发光二极管芯片14的另一面，并分别与P型半导体层144以及N型半导体层142电性连接（图未示第二电极18与N型半导体层142的连接关系）。第一电极16与第二电极18的上表面位于相同水平位置且可为金属电极，但不以此为限。另外，发光组件1还包括一第一连接导线20、一第二连接导线22以及一波长转换层4。第一连接导线20与第二连接导线22设置于透明基板2上，并可为例如金属连接导线或其他导电图案，但不以此为限。第一电极16与第二电极18分别与第一连接导线20与第二连接导线22电性连接，且连接方式可利用打线(wire bonding)或焊接方式，但不以此为限。波长转换层4设置于透明基板12上，并可包覆发光二极管芯片14。另外，波长转换层4还可进一步设置并覆盖透明基板2的第二主表面21B。
另外，为了增加光线从透明基板2离开的出光量并使出光的分布均匀，透明基板2的主要表面可选择性地分别具有一非平面结构12M。非平面结构12M可为各式凸出或凹陷的几何结构，例如金字塔、圆锥体、半球体或三角柱等，且非平面结构12M的排列可为规则性排列或随机性排列。另外，透明基板2的主要表面上也可选择性地设置有一类金刚石碳膜(diamond-like carbon, DLC) 25，用以增加导热及散热效果。
请参考图4B。图4B为本发明的另一较佳实施例的发光组件的剖面示意图。与图4A的实施例相较，在本实施例的发光组件1中，第一电极16与第二电极18与一第一芯片接合层28A设置于发光二极管芯片14的同一表面，并以覆晶方式(flip chip)分别与第一连接导线20与第二连接导线22电性连接。其中，第一连接导线20与第二连接导线22可分别延伸至第一电极16与第二电极18的下方，且第一电极16与第二电极18可利用一第二芯片接合层28B分别与第一连接导线20与第二连接导线22电性连接。第二芯片接合层28B可为导电凸块(conductive bump)例如金凸块(gold bump)或锡铅凸块(solder bump)、导电胶(conductive glue)例如银胶，或共晶层(eutectic layer)例如金锡(Au-Sn)合金共晶层或铟铋锡合金(In-Bi-Sn alloy)共晶层，但不以此为限。在使用第二芯片接合层28B的状况下，第一芯片接合层28A例如透明胶可省略，或是由波长转换层4加以取代。
请参考图5，图5为本发明的另一较佳实施例的发光组件的立体示意图。如图5所示，本发明的发光组件310包括透明基板2、至少一发光二极管芯片3、一第一连接电极311A、一第二连接电极311B与至少一波长转换层4。其中发光二极管芯片3设置于透明基板2的承载面210上，而形成发光的一第一主表面21A。在所述实施例中，发光二极管芯片3的一出光角度大于180度，且发光二极管芯片3所发出的至少部分光线可射入透明基板2，而射入光线至少部分可从对应第一主表面21A的一第二主表面21B出光，部分从透明基板2其他表面出光，进而达到多面或六面发光的发光效果。第一连接电极311A以及第二连接电极311B分别设置于透明基板2上两端或同侧（图未示），并分别为透明基板2上的一第一连接导线与一第二连接导线所延伸的组件对外电极，所以第一连接电极311A与第二连接电极311B分别与发光二极管芯片3电性连接。波长转换层4至少覆盖发光二极管芯片3并暴露至少部分第一连接电极311A与第二连接电极311B，其中波长转换层4至少部分吸收发光二极管芯片3和/或透明基板2所发出的光线，并转换成另一波长范围的光线，然后与未被吸收的光线混光，增加发光组件310的发光波长范围与发光效果。由于本实施例的发光组件310具有分别设置于透明基板2上相对两端的第一连接电极311A与第二连接电极311B，所以发光组件310可独自完成制作后再与适合的承载座进行结合，而不需使用传统发光二级管封装制程，因此可达到提升整体制造良率、简化结构以及增加所配合的承载座设计变化等效果。
请参考图6A，本发明的一实施例为使用前述发光组件的发光装置11，其中发光装置11还包括一承载座5，使发光组件的透明基板2可以立设于其上并耦接于所述承载座5，且透明基板2与承载座5之间具有一第一夹角θ1，所述第一夹角θ1角度可为固设或根据发光装置光形需要调动，其中较佳实施例的第一夹角θ1角度范围介于30度至150度之间。
请参考图6B，本发明的发光装置11的承载座5还包括一电路基板6与外部电源耦接，并电性耦接于透明基板2上的第一连接导线以及第二连接导线（图未示），而与发光二极管芯片3电性连接，使外部电源通过电路基板供应发光二极管芯片3发光所需电源。若无设置所述电路基板6，发光二极管芯片3也可直接通过第一连接导线以及第二连接导线（图未示）电性连接于承载座5，使外部电源可经由承载座5对所述发光二极管芯片3供电。
请参考图6C，本发明的发光装置11还包括一反射镜或滤波器8设置于第二主表面21B上或承载面上210，所述反射镜或滤波器8可反射所述发光二极管芯片3所发出至少部分光线，并使部分射入所述透明基板2的光线改由所述第一主表面21A射出。所述反射镜8包括至少一金属层或一布拉格反射镜(Bragg reflector)，但不以此为限。其中，布拉格反射镜可由多层具有不同折射率的介电薄膜所堆栈而构成，或是由多层具有不同折射率的介电薄膜与多层金属氧化物所堆栈而构成。
请参考图6D，本发明的发光装置11的透明基板2还包括一类金刚石碳膜(diamond-like carbon, DLC) 9，其中所述类金刚石碳膜9设置于透明基板2的承载面210和/或第二主表面21B上，以增加导热及散热效果。
请参考图7A。图7A为本发明的一较佳实施例的发光装置示意图。如图7A所示，本实施例的发光装置10包括一发光组件与一承载座26，其中所述发光组件包括一透明基板2与至少一发光二极管芯片14，且发光组件嵌入所述承载座26内，并通过连接导线20、22分别与所述承载座的电极30、32电性连接，使一电源可通过所述电极30、32提供驱动电压V+, V-以驱动所述发光二极管芯片14发出光线L。发光二极管芯片14包括一第一电极16与一第二电极18，并利用打线方式(wire bonding)与第一连接导线20与第二连接导线22电性连接，但不以此为限。另外发光二极管芯片14所发出光线L的出光角大于180度或具有多个发光面，使得所述发光组件的出光方向包括从第一主表面21A及第二主表面21B出光，且部分光线也可由发光二极管芯片14和/或透明基板2的四个侧壁所射出，使发光组件具有六面发光或全方向等多方向出光特性。
发光组件还包括一波长转换层4设置于发光二极管芯片14、第一主表面21A或第二主表面21B上。其中波长转换层4可转换至少部分发光二极管芯片14所发出的光线为另一波长范围的光，使发光组件发出特定光色或波长范围较大的光线，例如发光二极管芯片14产生的部分蓝光在照射到波长转换层4后可转换成为黄光，而发光组件即可发出由蓝光与黄光混合成的白光。另外，透明基板2可以非平行方式和/或平行方式直接或间接固设于承载座26上。例如，透明基板2的侧壁以垂直方式固设于承载座26上，或将基板2平放于承载座26上，但不以此为限。由于透明基板2选择具有良好的热传导特性的材料，发光二极管芯片14所产生的热能可快速通过透明基板12传递至承载座26以进行散热，所以本发明的发光装置可使用高功率的发光二极管芯片，但较佳实施例的发光装置是在同样功率条件下，改用多个较小功率的发光二极管芯片设置于基板12上，以充分利用基板12的热传导特性，如本实施例的发光二极管芯片的功率可小于或等于例如0.2瓦特，但不以此为限。
请参考图7B。图7B为本发明的另一较佳实施例的发光装置的外观示意图。与图7A相较，发光装置10’包括若干个发光二极管芯片14，且至少部分发光二极管芯片14以串联方式彼此电性连接。其中，各发光二极管芯片14分别包括一第一电极16与一第二电极18，串联头端的一个发光二极管芯片14的第一电极16与第一连接导线20电性连接，而尾端的另一个发光二极管芯片14的第二电极18与第二连接导线22电性连接，但不以此为限，发光二极管芯片14也可利用并联或串并联方式电性连接。本实施例的发光二极管芯片14可以选自发出同一色光的发光二极管芯片，例如蓝光发光二极管芯片，或根据应用需求使用组合不同色光的发光二极管芯片。在这种状况下搭配波长转换层4的做法更可增加发光装置10’发出各种光色的弹性。
请参考图8。图8为本发明的另一较佳实施例的发光装置的外观示意图。与图7相较，本实施例的发光装置50还包括一支架51，用以连接发光组件与承载座26，其中发光组件的透明基板2通过一组件接合层52固设于支架51的一侧，而支架51的另一侧可嵌设于承载座26上。另外支架51为可弹性调整角度，使发光组件与承载座26的夹角介于30度至150度之间。支架51的材质可包括选自铝金属、复合式金属材料、铜导线、电线、陶瓷基板或印刷电路板之任一。
请参考图9A、图9B与图9C，当本发明中的透明基板2设置于承载座5上时，较佳实施例为可通过插接或是黏接的方式来达成两者的接合。
如图9A所示，透明基板2为布置于承载座5上，并插接于承载座5的单孔式插槽61，使发光组件通过连接导线与所述插槽61电性耦接。此时透明基板2上的发光二极管芯片(图未示)与承载座5的电源供应相耦接，且透明基板2上的导电图案或连接导线延伸至透明基板2边缘并整合为具有若干个导电触片的金手指结构或如连接电极311A和311B，也就是电性端口。插槽61可让透明基板2插入，使发光二极管芯片(图未示)在获得承载座5供电的同时，透明基板2也被固设于承载座5的插槽61。
请参考图9B，其为通过插接透明基板2于承载座5上多孔式插槽的结构示意图。在此实施例中，此时透明基板2具有至少一双插脚结构，其中一个插脚可为电性正极，另一个则可为电性负极，两处都为具有导电触片作为端口。而对应地，在承载座5则具有至少两个与插脚插入面尺寸相符的插槽61，使透明基板2可与承载座5顺利接合，并让发光二极管芯片获得供电。
请参考图9C，为通过组件接合层以黏接的方式将透明基板2与承载座5接合。在黏接的过程中，可以通过金、锡、铟、铋、银等金属做焊接辅助而接合，或是使用具导电性的硅胶或是环氧树脂辅助固设透明基板2，并可使发光组件的导电图案或连接导线借助所述组件接合层与承载座上的电极电性连接。
请参考图10A与图10B，本实施例的发光装置11主要组成同上述实施例所述，其中承载座5可为一金属基板如可弯折的铝质金属、复合式含铝材料、铜导线或电线构成，也可为陶瓷基板或印刷电路板。承载座5的表面或是侧边具有至少一支架62，所述支架62为与承载座5分离或一体化的机构件。发光组件可通过黏接或焊接的方式与支架62相耦接，也就是借助组件接合层63将透明基板2固设于承载座5，并与承载座5无支架的部分的表面维持具有第一夹角θ1，且承载座5无支架的部分的表面也可设置发光二极管芯片以提升发光装置11的发光效果；另外，发光组件也可通过插接（图未示）的方式与支架62相连接，也就是借助连接器结合发光组件与支架和/或支架与承载座而将透明基板2固设于承载座5。由于承载座5与支架62可弯折，因此增加了发光装置11在应用时的灵活性，同时可使用若干个不同发光波长的发光组件组合出不同光色，使发光装置11具有色彩变化性以满足不同需求。
请参考图11。如图11所示，本实施例的发光装置包括至少一发光组件1及一承载座5，其中所述承载座5包括至少一支架62以及至少一电路图案P。发光组件1的主要组成可如上述实施例所述，并以透明基板的一端与支架62相耦接，以避免或减少支架62对发光组件1出光的遮蔽效果。承载座5可为铝质金属基板、复合式铝质金属基板、铜导线或电线构成，也可为陶瓷基板或印刷电路板，支架62可自承载座5的一部分加以切割并弯折一角度(如上述图10A与图10B的第一夹角θ1)而成。电路图案P设置于承载座5上，并具有至少1组电性端点与一电源电性连接，且有一部分延伸至支架62与发光组件1电性连接，使所述发光组件1可通过承载座5的电路图案P与电源电性连接。另外，承载座5还包括至少一孔洞H或至少一缺口G，使固设件如螺丝、钉子或插销等等可通过所述孔洞H或缺口G将承载座5与其他组件依发光装置应用情形作进一步构装或安装，同时孔洞H或缺口G也增加承载座5的散热面积，提升发光装置的散热效果。
请参考图12。图12为本发明的另一较佳实施例的发光装置的装置基座的立体示意图。如图12所示，本实施例的装置基座322包括一承载座5以及至少一支架62，与图11的实施例相较，本实施例的支架62还包括至少一条状部342与一缺口330，，其中电极30、32分别设置于缺口330的两侧或同侧（图未示），条状部342至少构成所述缺口330的一边墙。一发光组件对应所述缺口330与所述支架62耦接，且所述发光组件的连接导线与电极30、32电性连接，使所述发光组件可通过支架62及承载座上的电路图案与一电源电性耦接而被驱动。其中缺口330尺寸需不小于发光组件的一主要出光面，使发光组件面对支架62方向的出光不被支架62遮蔽。支架62与承载座5之间的连接处可为一可活动设计，以使支架62与承载座5之间夹角可视需要进行调整。
请参考图12与图13。图13为本发明的另一较佳实施例的发光装置的立体示意图。与图12的实施例相较，图13所示的发光装置302还包括至少一有若干个缺口330的支架62，其中所述若干个缺口330分别设置于支架62的两边，使条状部342至少同时构成所述若干个缺口330的一边墙。若干个发光组件310与所述若干个缺口330对应设置，且各发光组件310的导电图案或连接电极(图未示)分别与电极30以及电极32对应设置并电性连结。本实施例的发光装置302还进一步可包括若干个支架62，各设置有发光组件310的支架62与承载座5之间夹角可视需要各自进行调整，换句话说，至少部分支架62与承载座5之间的夹角可彼此相异以达到所需的发光效果，但并不以此为限。另外也可在相同支架或不同支架设置不同发光波长范围的发光组件组合，使发光装置的色彩效果更丰富。
为了提高亮度与改善发光效果，本发明的另一实施例的发光装置将若干个透明基板所形成的发光组件同时布置于上述实施例的承载座或其他承载机构上，此时可采用对称或非对称排列的形式做布置，较佳的对称布置方式也就是将多个透明基板所形成的发光组件以点对称或线对称的形式设置于承载机构上。请参考图14A、图14B、图14C与图14D，各实施例的发光装置在各种不同形状的承载机构60上设置若干个发光组件，并且以点对称或线对称的形式让整体发光装置11的出光能够均匀(发光二极管芯片省略示意)，所述发光装置11的出光效果还可通过改变上述的第一夹角的大小而再做进一步的调整与改善。如图14A所示，发光组件之间以点对称方式夹90度角，此时从发光装置四面的任一面往发光装置看均正对至少两个发光组件；图14B所示的发光装置的发光组件之间夹角小于90度；图14D所示的发光装置的发光组件之间夹角大于90度。另一实施例则以非对称布置方式将多个发光组件至少部分集中或分散设置，以达成发光装置于不同应用时的光形需要（图未示）。
请参考图15。图15为本发明的另一较佳实施例的发光装置的剖面示意图。如图15所示，发光装置301包括发光组件310以及一支架321。支架321包括一缺口330，且发光组件310与缺口330对应设置。其中，本实施例的支架321的延伸部可当作插脚或弯折成表面焊接所需接垫，用以固设或/及电性连结于其他所需的组件例如承载座。由于发光组件310的一出光面设置于缺口330内，所以不论支架321是否为透光材料，发光装置301皆可保有六面发光的多方向发光效果。
请参考图16A，为本发明具体实施例的发光装置，所述发光装置包括一长管形的灯壳7、至少一发光组件1以及一承载机构60，其中发光组件1设置于承载机构60上并至少一部分位于长管形的灯壳7所形成的空间内。又请参考图16B，此实施例包括两个以上发光组件1设置于灯壳7内，这些发光组件1的第一主表面21A之间是以不互相平行的方式做排列。另外，发光组件1至少部分置于灯壳7所形成空间内，且不紧贴灯壳7的内壁，较佳的实施例为发光组件1与灯壳7之间有一大于或等于500微米(μm)的距离D；但也可设计以灌胶方式形成灯壳7，并使所述灯壳7至少部分包覆并直接接触于所述发光组件1。
请参考图16C，本发明的另一具体实施例的发光装置，其中所述发光装置的灯壳7具有至少一个罩面71，所述罩面71可为印刷有广告的版面或其他需要背光源的显示设备，且本发明的发光组件1的第一主表面21A和第二主表面21B所提供的光照形成罩面71的背光，其中，发光组件1与罩面71之间形成的第二夹角的角度范围介于0度~45度(第二夹角于图中为0度，故未示)。为了确保透明基板以及多方向出光的发光二极管芯片所组合成的发光组件或发光板/发光片所产生的光能均匀的穿透灯壳7，发光组件1至少部分置于灯壳7所形成之空间内，且基本上不紧贴灯壳7的内壁，较佳的实施例为发光组件1与灯壳7之间有一大于或等于500微米的距离D；但另也可设计以灌胶方式形成灯壳7，并使灯壳7至少部分包覆并直接接触于透明基板2。
请参考图16D、图16E、图16F与图16G，为本发明的另一系列具体实施例，发光装置进一步包括一球形的灯壳7以及底座64。在图16D中，与上述实施例相较，本实施例的发光装置还包括一球形的灯壳7一承载座5进一步设置于一底座64上，其中所述底座64可为传统灯泡底座，所述灯壳7可与底座64耦接并包覆发光组件与承载座5，或灯壳7可直接与承载座5耦接而包覆发光组件。底座64的形式可为平台或是另有承载突部，如图16E所示。在16F图中，灯壳7内侧涂布有波长转换层4，可让发光二极管芯片3所产生的光线至少有部分在离开灯壳7之前可被转换成另一波长范围的光。而在16G图中，则揭示了使用双层的灯壳7与灯壳7’的设计，灯壳7与灯壳7’之间具有一空间S，利用灯壳7、灯壳7’以及两者之间的空间S可使发光装置在花纹和色彩等发光效果上做进一步变化。
请参考图17与图18，图17为本发明的另一较佳实施例的灯条的示意图，图18为本发明的另一较佳实施例的发光装置的立体示意图。如图17所示，本实施例的灯条323包括若干个缺口330。灯条323具有一延伸方向X，且缺口330沿延伸方向X排列设置。若干个多方向出光的发光组件对应灯条323的缺口330设置而形成一发光灯条，但并不以此为限。另外，灯条323还包括若干个不同电性的电极30和32、一第一连外电极350A以及一第二连外电极350B。电极30和32分别设置于各缺口330的两侧或同侧（图未示）。第一连外电极350A以及第二连外电极350B分别与各电极30和32电性连接并设置于灯条323的两侧。如图18所示，发光装置303包括上述实施例的灯条323以及一装置框架360。其中，设置有发光组件310的灯条323可视需要以垂直、水平或斜放的方式设置于装置框架360上，灯条323可借助位于两侧的第一连外电极350A以及第二连外电极350B通过装置框架360与一电源电性连结，但并不以此为限。此外，发光装置303也可视需要搭配适合的光学膜（例如扩散膜）以调整装置框架360中发光组件310所形成的发光效果。
请参考图19，图19为本发明的另一较佳实施例的发光装置的示意图。如图19所示，发光装置304包括若干个发光组件310以及一承载座324。承载座324包括若干个缺口330，缺口330以一数组方式排列设置，且各发光组件310与缺口330对应设置。本实施例的各发光组件310于缺口330的连接方式与上述实施例相似，所以不再赘述。在本实施例中，承载座324还包括第一连外电极350A以及第二连外电极350B，用以与其他外部组件电性连接。另外，本实施例的发光装置304可用于广告牌或直下式背光模块，且承载座324较佳实施方式为具有透光性质，但并不以此为限。
综上所述，本发明的发光组件使用透明基板以及出光角大于180度的发光二极管芯片，因此具有六面发光或全方向发光等的多方向发光效果，且可提升发光效率并改善现有技术中发光二极管的发光组件光型不佳的问题。另外，透明基板包括选择自具有良好的热传导特性的材料，使发光二极管芯片所产生的热能可快速通过透明基板进行散热。
本发明所揭示的发光组件或发光板/发光片，为将发光二极管芯片设置于透明基板上而形成的，所以本发明的发光组件可被有效且充分的灵活运用；并且发光组件的两个主要面都可出光，因此能在最少的供电下获得最大的出光效率，并有均匀的出光效果，而无论是应用于灯泡、灯管、广告牌等领域，都可展现其发光效果佳、低耗电量以及出光均匀等优点，实为一具经济和实用价值的发光组件。

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1.一种发光装置，其特征在于，包括：
第一发光组件，包括具有第一表面与第一侧面的第一透明基板，以及设置于所述第一表面上的第一发光二极管芯片；以及
第二发光组件，包括具有第二表面与第二侧面的第二透明基板，以及设置于所述第二表面上的第二发光二极管芯片；
灯壳，具有几何中心轴，并包覆所述第一发光组件与所述第二发光组件；
其中，所述第一侧面与所述第二侧面面向所述几何中心轴。
2.根据权利要求1所述的发光装置，其特征在于，所述第一发光组件还包括覆盖所述第一发光二极管芯片的第一波长转换层，所述第二发光组件还包括覆盖所述第二发光二极管芯片的第二波长转换层。
3.根据权利要求2所述的发光装置，其特征在于，所述第一侧面未被所述第一波长转换层覆盖，所述第二侧面未被所述第二波长转换层覆盖。
4.根据权利要求2所述的发光装置，其特征在于，所述第一发光组件还包括设置于所述第一表面上的第三发光二极管芯片，所述第一波长转换层连续性地覆盖所述第一发光二极管芯片与所述第三发光二极管芯片。
5.根据权利要求2所述的发光装置，其特征在于，所述第一波长转换层直接接触所述第一发光二极管芯片。
6.根据权利要求1所述的发光装置，其特征在于，所述第一发光组件还包括一位于所述第一表面相对侧的第三表面，以及覆盖所述第一表面的第一波长转换层。
7.根据权利要求6所述的发光装置，其特征在于，所述第一发光组件还包括覆盖所述第三表面的第二波长转换层，所述第二波长转换层与所述第一波长转换层所包含的荧光粉含量不同。
8.根据权利要求1所述的发光装置，其特征在于，所述发光装置还包括第一连接电极设置于所述第一表面上，其中，所述第一波长转换层暴露至少部分所述第一连接电极。
9.根据权利要求8所述的发光装置，其特征在于，所述发光装置还包括支架与所述第一连接电极连接。
10.根据权利要求9所述的发光装置，其特征在于，所述支架可弯折，使所述第一发光组件与所述支架间有不等于180度的夹角。
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CN203277380U (zh) 2013-11-06
US9368483B2 (en) 2016-06-14
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US10030857B2 (en) 2018-07-24
CN103456728A (zh) 2013-12-18

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