KR102071721B1 - 위상 시프트 마스크 블랭크 및 그 제조 방법, 및 위상 시프트 마스크 - Google Patents
위상 시프트 마스크 블랭크 및 그 제조 방법, 및 위상 시프트 마스크 Download PDFInfo
- Publication number
- KR102071721B1 KR102071721B1 KR1020127029347A KR20127029347A KR102071721B1 KR 102071721 B1 KR102071721 B1 KR 102071721B1 KR 1020127029347 A KR1020127029347 A KR 1020127029347A KR 20127029347 A KR20127029347 A KR 20127029347A KR 102071721 B1 KR102071721 B1 KR 102071721B1
- Authority
- KR
- South Korea
- Prior art keywords
- phase shift
- shift mask
- film
- transition metal
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/755—Nanosheet or quantum barrier/well, i.e. layer structure having one dimension or thickness of 100 nm or less
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010090435 | 2010-04-09 | ||
| JPJP-P-2010-090435 | 2010-04-09 | ||
| PCT/JP2011/002090 WO2011125337A1 (ja) | 2010-04-09 | 2011-04-08 | 位相シフトマスクブランク及びその製造方法、並びに位相シフトマスク |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187010644A Division KR102008857B1 (ko) | 2010-04-09 | 2011-04-08 | 위상 시프트 마스크 블랭크 및 그 제조 방법, 및 위상 시프트 마스크 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130103314A KR20130103314A (ko) | 2013-09-23 |
| KR102071721B1 true KR102071721B1 (ko) | 2020-01-30 |
Family
ID=44762306
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127029347A Active KR102071721B1 (ko) | 2010-04-09 | 2011-04-08 | 위상 시프트 마스크 블랭크 및 그 제조 방법, 및 위상 시프트 마스크 |
| KR1020187010644A Active KR102008857B1 (ko) | 2010-04-09 | 2011-04-08 | 위상 시프트 마스크 블랭크 및 그 제조 방법, 및 위상 시프트 마스크 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187010644A Active KR102008857B1 (ko) | 2010-04-09 | 2011-04-08 | 위상 시프트 마스크 블랭크 및 그 제조 방법, 및 위상 시프트 마스크 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8999609B2 (https=) |
| JP (2) | JP5313401B2 (https=) |
| KR (2) | KR102071721B1 (https=) |
| CN (2) | CN105739233B (https=) |
| TW (2) | TWI588593B (https=) |
| WO (1) | WO2011125337A1 (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2317511B1 (de) * | 2009-11-03 | 2012-03-07 | Bayer MaterialScience AG | Photopolymerformulierungen mit einstellbarem mechanischem Modul Guv |
| KR101300791B1 (ko) * | 2011-12-15 | 2013-08-29 | 한국생산기술연구원 | 전자빔 조사를 이용한 몰리브덴 박막의 전도도 향상 방법 |
| JP5286455B1 (ja) * | 2012-03-23 | 2013-09-11 | Hoya株式会社 | マスクブランク、転写用マスクおよびこれらの製造方法 |
| WO2014073389A1 (ja) | 2012-11-08 | 2014-05-15 | Hoya株式会社 | マスクブランクの製造方法および転写用マスクの製造方法 |
| KR102166222B1 (ko) * | 2013-01-15 | 2020-10-15 | 호야 가부시키가이샤 | 마스크 블랭크, 위상 시프트 마스크 및 이들의 제조 방법 |
| JP6324756B2 (ja) * | 2013-03-19 | 2018-05-16 | Hoya株式会社 | 位相シフトマスクブランク及びその製造方法、位相シフトマスクの製造方法、並びに表示装置の製造方法 |
| JP5630592B1 (ja) * | 2013-06-17 | 2014-11-26 | 大日本印刷株式会社 | フォトマスクの製造方法 |
| JP6364813B2 (ja) * | 2014-02-27 | 2018-08-01 | 大日本印刷株式会社 | フォトマスクの製造方法 |
| TW201537281A (zh) * | 2014-03-18 | 2015-10-01 | Hoya Corp | 光罩基底、相偏移光罩及半導體裝置之製造方法 |
| KR102069960B1 (ko) | 2015-03-27 | 2020-01-23 | 호야 가부시키가이샤 | 마스크 블랭크, 위상 시프트 마스크 및 위상 시프트 마스크의 제조 방법, 및 반도체 장치의 제조 방법 |
| US9897911B2 (en) * | 2015-08-31 | 2018-02-20 | Shin-Etsu Chemical Co., Ltd. | Halftone phase shift photomask blank, making method, and halftone phase shift photomask |
| JP6500791B2 (ja) * | 2016-01-22 | 2019-04-17 | 信越化学工業株式会社 | ハーフトーン位相シフト型フォトマスクブランク及びその製造方法 |
| KR101801101B1 (ko) * | 2016-03-16 | 2017-11-27 | 주식회사 에스앤에스텍 | 위상반전 블랭크 마스크 및 포토 마스크 |
| WO2018016262A1 (ja) | 2016-07-19 | 2018-01-25 | Hoya株式会社 | マスクブランク、位相シフトマスク、位相シフトマスクの製造方法及び半導体デバイスの製造方法 |
| JP6742184B2 (ja) * | 2016-07-26 | 2020-08-19 | アルバック成膜株式会社 | 位相シフタ膜の製造方法、位相シフトマスクブランクの製造方法、及び、位相シフトマスクの製造方法 |
| KR102254035B1 (ko) * | 2016-08-26 | 2021-05-20 | 호야 가부시키가이샤 | 마스크 블랭크, 전사용 마스크 및 반도체 디바이스의 제조 방법 |
| JP6677139B2 (ja) * | 2016-09-28 | 2020-04-08 | 信越化学工業株式会社 | ハーフトーン位相シフト型フォトマスクブランクの製造方法 |
| JP6733464B2 (ja) | 2016-09-28 | 2020-07-29 | 信越化学工業株式会社 | ハーフトーン位相シフトマスクブランク及びハーフトーン位相シフトマスク |
| JP6947207B2 (ja) * | 2016-09-28 | 2021-10-13 | 信越化学工業株式会社 | ハーフトーン位相シフト型フォトマスクブランク及びハーフトーン位相シフト型フォトマスク |
| JP6740107B2 (ja) * | 2016-11-30 | 2020-08-12 | Hoya株式会社 | マスクブランク、転写用マスク及び半導体デバイスの製造方法 |
| KR102688948B1 (ko) * | 2017-09-21 | 2024-07-29 | 호야 가부시키가이샤 | 마스크 블랭크, 전사용 마스크, 및 반도체 디바이스의 제조 방법 |
| US20200379338A1 (en) * | 2017-12-26 | 2020-12-03 | Hoya Corporation | Mask blank, phase shift mask, and method of manufacturing semiconductor device |
| JP7297692B2 (ja) * | 2019-02-28 | 2023-06-26 | Hoya株式会社 | フォトマスクブランク、フォトマスクの製造方法、および表示装置の製造方法 |
| JP2021170128A (ja) * | 2019-10-01 | 2021-10-28 | 信越化学工業株式会社 | ハーフトーン位相シフト型フォトマスクブランク及びハーフトーン位相シフト型フォトマスク |
| JP7280297B2 (ja) | 2021-02-03 | 2023-05-23 | アルバック成膜株式会社 | マスクブランクス及びフォトマスク |
| JP7280296B2 (ja) | 2021-02-03 | 2023-05-23 | アルバック成膜株式会社 | マスクブランクス及びフォトマスク |
| JP2022118976A (ja) | 2021-02-03 | 2022-08-16 | アルバック成膜株式会社 | マスクブランクス及びフォトマスク |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002162726A (ja) * | 2000-09-12 | 2002-06-07 | Hoya Corp | 位相シフトマスクブランクの製造方法、及び位相シフトマスクの製造方法 |
| US20020122991A1 (en) | 2000-12-26 | 2002-09-05 | Hoya Corporation | Halftone phase shift mask and mask blank |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5415953A (en) * | 1994-02-14 | 1995-05-16 | E. I. Du Pont De Nemours And Company | Photomask blanks comprising transmissive embedded phase shifter |
| JP2966369B2 (ja) | 1996-03-30 | 1999-10-25 | ホーヤ株式会社 | 位相シフトマスク、及び位相シフトマスクブランク |
| JPH1048808A (ja) * | 1996-05-30 | 1998-02-20 | Hoya Corp | フォトマスクの製造方法 |
| JP3913319B2 (ja) | 1997-07-07 | 2007-05-09 | Hoya株式会社 | ハーフトーン位相シフトマスクの製造方法 |
| JPH11184067A (ja) * | 1997-12-19 | 1999-07-09 | Hoya Corp | 位相シフトマスク及び位相シフトマスクブランク |
| JP2002156742A (ja) | 2000-11-20 | 2002-05-31 | Shin Etsu Chem Co Ltd | 位相シフトマスクブランク、位相シフトマスク及びこれらの製造方法 |
| JP4466805B2 (ja) | 2001-03-01 | 2010-05-26 | 信越化学工業株式会社 | 位相シフトマスクブランク及び位相シフトマスク |
| US20020182893A1 (en) * | 2001-06-05 | 2002-12-05 | International Business Machines Corporation | Oxidation of silicon nitride films in semiconductor devices |
| JP2003215778A (ja) | 2002-01-21 | 2003-07-30 | Shin Etsu Chem Co Ltd | スパッタターゲット、該スパッタターゲットを用いた位相シフトマスクブランク及び位相シフトマスクの製造方法 |
| US6875546B2 (en) | 2003-03-03 | 2005-04-05 | Freescale Semiconductor, Inc. | Method of patterning photoresist on a wafer using an attenuated phase shift mask |
| JP2005284216A (ja) * | 2004-03-31 | 2005-10-13 | Shin Etsu Chem Co Ltd | 成膜用ターゲット及び位相シフトマスクブランクの製造方法 |
| JP4535241B2 (ja) * | 2004-03-31 | 2010-09-01 | 凸版印刷株式会社 | ハーフトーン型位相シフトマスク用ブランク、ハーフトーン型位相シフトマスク及びパターン転写方法 |
| JP4407815B2 (ja) * | 2004-09-10 | 2010-02-03 | 信越化学工業株式会社 | フォトマスクブランク及びフォトマスク |
| JP2007271661A (ja) * | 2006-03-30 | 2007-10-18 | Hoya Corp | マスクブランク及びハーフトーン型位相シフトマスク |
| JP4958149B2 (ja) * | 2006-11-01 | 2012-06-20 | Hoya株式会社 | 位相シフトマスクブランクの製造方法及び位相シフトマスクの製造方法 |
| KR102198731B1 (ko) * | 2008-06-25 | 2021-01-05 | 호야 가부시키가이샤 | 위상 시프트 마스크 블랭크 및 위상 시프트 마스크 |
| JP5702920B2 (ja) * | 2008-06-25 | 2015-04-15 | Hoya株式会社 | 位相シフトマスクブランク、位相シフトマスクおよび位相シフトマスクブランクの製造方法 |
| JP5497288B2 (ja) * | 2008-12-29 | 2014-05-21 | Hoya株式会社 | フォトマスクブランクの製造方法及びフォトマスクの製造方法 |
| KR101153663B1 (ko) * | 2009-02-13 | 2012-07-20 | 호야 가부시키가이샤 | 포토마스크 블랭크 및 그 제조 방법과 포토마스크 및 그 제조 방법 |
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2011
- 2011-04-08 JP JP2012509319A patent/JP5313401B2/ja active Active
- 2011-04-08 WO PCT/JP2011/002090 patent/WO2011125337A1/ja not_active Ceased
- 2011-04-08 CN CN201610184327.8A patent/CN105739233B/zh active Active
- 2011-04-08 CN CN201180018078.0A patent/CN102834773B/zh active Active
- 2011-04-08 KR KR1020127029347A patent/KR102071721B1/ko active Active
- 2011-04-08 US US13/639,686 patent/US8999609B2/en active Active
- 2011-04-08 KR KR1020187010644A patent/KR102008857B1/ko active Active
- 2011-04-08 TW TW104141184A patent/TWI588593B/zh active
- 2011-04-08 TW TW100112282A patent/TWI519888B/zh active
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2013
- 2013-07-03 JP JP2013139879A patent/JP5758448B2/ja active Active
-
2015
- 2015-02-20 US US14/627,426 patent/US9436079B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002162726A (ja) * | 2000-09-12 | 2002-06-07 | Hoya Corp | 位相シフトマスクブランクの製造方法、及び位相シフトマスクの製造方法 |
| US20020122991A1 (en) | 2000-12-26 | 2002-09-05 | Hoya Corporation | Halftone phase shift mask and mask blank |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130103314A (ko) | 2013-09-23 |
| JP5313401B2 (ja) | 2013-10-09 |
| TWI519888B (zh) | 2016-02-01 |
| CN102834773B (zh) | 2016-04-06 |
| JP5758448B2 (ja) | 2015-08-05 |
| CN102834773A (zh) | 2012-12-19 |
| US9436079B2 (en) | 2016-09-06 |
| CN105739233A (zh) | 2016-07-06 |
| US8999609B2 (en) | 2015-04-07 |
| WO2011125337A1 (ja) | 2011-10-13 |
| CN105739233B (zh) | 2019-11-05 |
| TW201142486A (en) | 2011-12-01 |
| JPWO2011125337A1 (ja) | 2013-07-08 |
| US20130071777A1 (en) | 2013-03-21 |
| KR20180041266A (ko) | 2018-04-23 |
| TWI588593B (zh) | 2017-06-21 |
| KR102008857B1 (ko) | 2019-08-09 |
| TW201610559A (zh) | 2016-03-16 |
| US20150168823A1 (en) | 2015-06-18 |
| JP2013254206A (ja) | 2013-12-19 |
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