KR102010643B1 - 수지 성형 장치, 수지 성형품의 제조 방법 및 제품의 제조 방법 - Google Patents

수지 성형 장치, 수지 성형품의 제조 방법 및 제품의 제조 방법 Download PDF

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Publication number
KR102010643B1
KR102010643B1 KR1020170037684A KR20170037684A KR102010643B1 KR 102010643 B1 KR102010643 B1 KR 102010643B1 KR 1020170037684 A KR1020170037684 A KR 1020170037684A KR 20170037684 A KR20170037684 A KR 20170037684A KR 102010643 B1 KR102010643 B1 KR 102010643B1
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KR
South Korea
Prior art keywords
resin
flowable
volume
flowable resin
fluid
Prior art date
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KR1020170037684A
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English (en)
Korean (ko)
Other versions
KR20180001434A (ko
Inventor
케이타 미즈마
료타 오카모토
Original Assignee
토와 가부시기가이샤
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Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20180001434A publication Critical patent/KR20180001434A/ko
Application granted granted Critical
Publication of KR102010643B1 publication Critical patent/KR102010643B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020170037684A 2016-06-24 2017-03-24 수지 성형 장치, 수지 성형품의 제조 방법 및 제품의 제조 방법 KR102010643B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016126068A JP6218891B1 (ja) 2016-06-24 2016-06-24 樹脂成形装置、樹脂成形品の製造方法及び製品の製造方法
JPJP-P-2016-126068 2016-06-24

Publications (2)

Publication Number Publication Date
KR20180001434A KR20180001434A (ko) 2018-01-04
KR102010643B1 true KR102010643B1 (ko) 2019-10-21

Family

ID=60156868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170037684A KR102010643B1 (ko) 2016-06-24 2017-03-24 수지 성형 장치, 수지 성형품의 제조 방법 및 제품의 제조 방법

Country Status (4)

Country Link
JP (1) JP6218891B1 (zh)
KR (1) KR102010643B1 (zh)
CN (1) CN107538667B (zh)
TW (1) TWI640413B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6923503B2 (ja) * 2018-11-27 2021-08-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7312452B2 (ja) * 2020-01-24 2023-07-21 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7291660B2 (ja) * 2020-04-17 2023-06-15 Ｔｏｗａ株式会社 樹脂成形品の製造方法、樹脂成形装置
JP7003184B2 (ja) * 2020-06-22 2022-01-20 Ｔｏｗａ株式会社 樹脂成形装置、及び、樹脂成形品の製造方法
WO2022254656A1 (ja) * 2021-06-03 2022-12-08 アピックヤマダ株式会社 圧縮成形装置
JP2023046946A (ja) * 2021-09-24 2023-04-05 Ｔｏｗａ株式会社 樹脂成形品の製造方法、フィルム固定部材、液状樹脂拡大機構、及び樹脂成形装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017340A (ja) * 2012-07-07 2014-01-30 Tdk Corp 液体材料吐出装置及び方法
JP2015122446A (ja) 2013-12-24 2015-07-02 Ｔｏｗａ株式会社 樹脂撒布方法、被樹脂封止部品の樹脂封止方法、樹脂撒布装置、被樹脂封止部品の樹脂封止装置、および樹脂封止成形品製造装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3501441B2 (ja) * 1998-05-12 2004-03-02 松下電器産業株式会社 電子部品の製造方法及び製造装置
JP3984824B2 (ja) * 2001-11-30 2007-10-03 アピックヤマダ株式会社 液材吐出装置及び樹脂封止装置
JP3986052B2 (ja) * 2001-12-04 2007-10-03 住友重機械工業株式会社 樹脂封止装置及びその方法
JP2006134917A (ja) * 2004-11-02 2006-05-25 Apic Yamada Corp 樹脂封止方法
JP4210678B2 (ja) * 2005-09-21 2009-01-21 アピックヤマダ株式会社 ディスペンサおよび樹脂モールド装置
JP5155720B2 (ja) * 2008-04-09 2013-03-06 住友重機械工業株式会社 樹脂量決定装置、および、当該樹脂量決定装置を備えた樹脂封止装置
JP5143618B2 (ja) * 2008-04-21 2013-02-13 住友重機械工業株式会社 樹脂量決定装置、および、当該樹脂量決定装置を備えた樹脂封止装置
JP5261261B2 (ja) * 2009-03-31 2013-08-14 Ｔｏｗａ株式会社 圧縮樹脂封止成形に用いられる液状樹脂材料供給方法及び装置
JP5520612B2 (ja) * 2010-01-04 2014-06-11 東芝機械株式会社 ディスペンサを備えた転写装置、ディスペンサの吐出量検出方法、及びディスペンサの吐出量制御方法
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置
JP6169516B2 (ja) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017340A (ja) * 2012-07-07 2014-01-30 Tdk Corp 液体材料吐出装置及び方法
JP2015122446A (ja) 2013-12-24 2015-07-02 Ｔｏｗａ株式会社 樹脂撒布方法、被樹脂封止部品の樹脂封止方法、樹脂撒布装置、被樹脂封止部品の樹脂封止装置、および樹脂封止成形品製造装置

Also Published As

Publication number Publication date
KR20180001434A (ko) 2018-01-04
CN107538667A (zh) 2018-01-05
JP2017226202A (ja) 2017-12-28
TWI640413B (zh) 2018-11-11
CN107538667B (zh) 2019-12-06
JP6218891B1 (ja) 2017-10-25
TW201800206A (zh) 2018-01-01

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