KR102010643B1 - Resin molding apparatus, method for manufacturing resin-molded component and method for manufacturing products - Google Patents

Abstract

An object of this invention is to provide the resin molding apparatus of the fluid resin which can reduce the nonuniformity of the resin thickness of a molded article. In order to achieve the above object, the resin molding apparatus of the present invention measures the volume of the flowable resin applied to the discharging mechanism 520 for discharging the flowable resin for molding the resin into the coating area of the coating object 11 and the coating area. And a compression molding mechanism 530 for compression molding by using the volume measuring mechanism and the application object to which the fluid resin is applied.

Description

RESIN MOLDING APPARATUS, METHOD FOR MANUFACTURING RESIN-MOLDED COMPONENT AND METHOD FOR MANUFACTURING PRODUCTS}

The present invention relates to a resin molding apparatus, a method for producing a resin molded article, and a method for producing a product.

This application claims the priority based on Japanese Patent Application No. 2016-126068 for which it applied on June 24, 2016, and all the content disclosed in the specification and drawing of this application is integrated in this application.

Electronic components such as ICs and semiconductor electronic components are often molded and used as resin-sealed resin-sealed electronic components (resin molded articles).

In order to reduce the nonuniformity of the thickness of resin for resin sealing, for example, patent document 1 describes performing weight measurement of the liquid resin (flowable resin) discharged on a workpiece | work.

Japanese Patent Laid-Open No. 2003-165133

However, it is difficult to measure the amount of fluid resin with high precision by weight measurement. For example, electronic scales are often used for weighing, but electronic scales are susceptible to the use environment. For example, in the case of measuring the liquid resin widely discharged to a large discharge object with an electronic scale, the measured value is unstable, and high precision measurement is difficult. For this reason, there exists a possibility that the resin thickness of a resin molded article may become uniform.

Therefore, an object of this invention is to provide the resin molding apparatus of the fluid resin, the manufacturing method of a resin molded article, and the manufacturing method of a product which can reduce the nonuniformity of the resin thickness of a resin molded article.

In order to achieve the above object, the resin molding apparatus of the present invention includes a discharge mechanism for discharging the flowable resin for resin molding to the application region of the coating object; A volume measuring mechanism for measuring a volume of the flowable resin discharged to the application region; And a compression molding mechanism for compression molding using the application object to which the fluid resin is applied.

The manufacturing method of the resin molded article of this invention is a discharge process which discharges the fluid resin for resin molding in the application | coating area | region of an application | coating object; A volume measurement step of measuring a volume of the flowable resin discharged to the application region; And a compression molding step of compression molding using the application object to which the fluid resin is applied.

The manufacturing method of the product of this invention is characterized by manufacturing a product using the resin molded article manufactured by the manufacturing method of the resin molded article of the said invention.

According to this invention, the nonuniformity of the resin thickness of a resin molded article can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS It is a side view which shows typically an example of a discharge mechanism in the resin molding apparatus of this invention.
It is a side view which shows typically an example of a displacement meter (part of a volume measuring mechanism) in the resin molding apparatus of this invention.
It is a side view which shows typically an example of a camera (part of a volume measuring mechanism) in the resin molding apparatus of this invention.
It is a side view which shows typically an example of the compression molding mechanism in the resin molding apparatus of this invention.
It is a top view which shows typically an example of the resin molding apparatus of this invention.
It is a top view which shows typically another example of the resin molding apparatus of this invention.
It is a top view which shows typically an example of a fluid resin discharge pattern in the discharge process of the manufacturing method of the resin molded article of this invention.
8 is a plan view schematically showing another example of the flowable resin discharge pattern in the discharge step.
9 is a plan view schematically showing still another example of the flowable resin discharge pattern in the discharge step.
10 is a plan view schematically showing still another example of the flowable resin discharge pattern in the discharge step.
11 is a plan view schematically showing still another example of the flowable resin discharge pattern in the discharge step.
12 is a plan view schematically showing still another example of the flowable resin discharge pattern in the discharge step.
It is a top view which shows typically another example of the fluid resin discharge pattern in a discharge process.
14 is a plan view schematically showing another example of the flowable resin discharge pattern in the discharge step.
15 is a plan view schematically showing another example of the flowable resin discharge pattern in the discharge step.
16 is a plan view schematically showing still another example of the flowable resin discharge pattern in the discharge step.
17 is a plan view schematically showing another example of the flowable resin discharge pattern in the discharge step.
18 is a plan view schematically showing another example of the flowable resin discharge pattern in the discharge step.
19 is a perspective view schematically showing an example of volume measurement of a flowable resin using a displacement meter (part of the volume measurement mechanism) according to the present invention.
20 is a functional block diagram of an essential part of the calculation of the discharge volume of the flowable resin of FIG. 19 or 36.
It is a side view which shows typically an example at the time of moving a release film (application object) in a resin expansion process.
It is a side view which shows typically an example at the time of injecting gas into fluid resin in a resin expansion process.
It is a top view which shows typically an example of the expansion pattern at the time of injecting gas into fluid resin in a resin expansion process, and expanding a fluid resin.
It is a top view which shows typically another example of the expansion pattern at the time of injecting gas into fluid resin in a resin expansion process, and expanding a fluid resin.
It is a top view which shows typically another example of the expansion pattern at the time of injecting gas into fluid resin in a resin expansion process, and expanding a fluid resin.
It is a top view which shows typically an example of the process at the time of expanding a flowable resin by injecting gas into a flowable resin in a resin expansion process.
FIG. 27 is a plan view schematically showing another one step in the same resin expanding step as FIG. 26.
It is a top view which shows another one process typically in the same resin enlargement process as FIG.
It is a top view which shows another one process typically in the same resin enlargement process as FIG.
It is sectional drawing which shows typically an example of a compression molding process in the manufacturing method of the resin molded article of this invention.
FIG. 31 is a cross-sectional view schematically showing another one step in the same compression molding step as FIG. 30.
32 is a cross-sectional view schematically showing still another one step in the same compression molding step as in FIG. 30.
33 is a cross-sectional view schematically showing still another one step in the same compression molding step as in FIG. 30.
34 is a plan view schematically showing an example of volume measurement of a flowable resin using a displacement meter and a camera (part of the volume measuring instrument) according to the present invention.
35 is a functional block diagram of an essential part of the calculation of the discharge volume of the flowable resin of FIG.
36 is a plan view schematically showing another example of volume measurement of the flowable resin using a displacement meter (part of the volume measuring instrument) according to the present invention.

Next, the present invention will be described in more detail by way of example. However, this invention is not limited by the following description.

In the present invention, the "flowable resin" is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resins and molten resins. In addition, in this invention, a "liquid phase" means having fluidity at normal temperature (room temperature) and having fluidity of the grade which flows by exerting a force, and high or low fluidity, ie, the grade of a viscosity regardless. That is, in this invention, "liquid resin" means resin which has fluidity at normal temperature (room temperature), and has fluidity of the grade which flows by acting a force. In addition, in this invention, "molten resin" means resin which became the state which has a liquid state or fluidity | liquidity by melting, for example. Although the form of the said molten resin is not specifically limited, For example, it is a form which can be supplied to the cavity, a pot, etc. of a shaping | molding mold.

In the present invention, "compression molding" refers to molding by supplying a resin to the cavity of the molding mold and applying a force to the resin in the cavity while the molding mold is fastened.

In the present invention, "application" includes at least discharging the fluid resin. In the present invention, "coating" may further include spreading the discharged flowable resin.

The resin molding apparatus of this invention calculates the volume of the said fluid resin from the measurement result of the dimension measuring mechanism and the said dimension measuring mechanism which the said volume measuring mechanism measures the dimension of the said fluid resin discharged to the said application area | region, for example. It may include an operation unit. In addition, one or more dimensional measuring mechanisms may be used, and only one type may be used and a plurality of types may be used.

In the resin molding apparatus of the present invention, for example, the dimensional measuring mechanism is a dimensional measuring mechanism for measuring thickness, and the calculation unit measures the length of the flowable resin discharged to the coating area and the fluidity measured by the dimensional measuring device. Based on the thickness of the resin, the volume of the flowable resin can be calculated.

The resin molding apparatus of the present invention further includes a camera in which the dimensional measuring mechanism is a dimensional measuring mechanism for measuring thickness, and the volume measuring mechanism picks up an image of the fluid resin discharged to the coating area, and the computing unit is configured to perform the camera. The volume of the said flowable resin can be calculated based on the area of the said flowable resin based on the imaging data by and the thickness of the said flowable resin measured by the said dimension measuring mechanism.

In the resin molding apparatus of the present invention, for example, the dimension measuring mechanism is a dimension measuring mechanism for three-dimensional data measurement, and the calculation unit is based on the three-dimensional data of the fluid resin obtained by the measurement of the dimension measuring mechanism. The volume of the flowable resin can be calculated.

In the resin molding apparatus of the present invention, for example, the dimensional measuring mechanism may be a displacement meter.

In the resin molding apparatus of the present invention, for example, the displacement meter may be a displacement gauge for thickness measurement.

In the resin molding apparatus of the present invention, the displacement meter may be, for example, a non-contact displacement meter. In addition, the displacement meter may be, for example, at least one of an electromagnetic displacement meter, an ultrasonic displacement meter, a capacitive displacement meter, and an overcurrent displacement meter. The electromagnetic displacement meter may be, for example, an optical displacement meter, and may be, for example, a laser displacement meter.

The resin molding apparatus of the present invention further includes a storage unit that stores data, for example, and the storage unit can store at least one of a measurement result by the dimensional measurement mechanism and a calculation result by the calculation unit.

The resin molding apparatus of the present invention may further include, for example, a moving mechanism in which the discharge mechanism moves the discharge position of the fluid resin with respect to the application object. The moving mechanism may be, for example, an application object moving mechanism for moving the application object to move the discharge position of the fluid resin relative to the application object. The application object moving mechanism can move the application object in a substantially horizontal direction, for example.

The resin molding apparatus of the present invention may further include, for example, a resin enlargement mechanism for spreading the fluid resin discharged in the application region. The resin enlarging mechanism can, for example, apply a force to the fluid resin discharged by the discharge mechanism to spread the fluid resin.

The resin molding apparatus of this invention can further contain the conveyance mechanism which conveys the said application object to the said compression molding mechanism, for example.

The resin molding apparatus of the present invention may further include a cutting mechanism for cutting the release film, for example, wherein the application object is a release film. In addition, the discharge mechanism may discharge the fluid resin on the release film cut by the cutting mechanism.

In the resin molding apparatus of the present invention, for example, the discharge mechanism and the compression molding mechanism may be different modules, and may be detachable from each other.

In the resin molding apparatus of the present invention, for example, the compression molding mechanism is plural, the plurality of compression molding mechanisms are different modules, and the discharge mechanism and the plurality of compression molding mechanisms are different modules. And at least one of the plurality of compression molding instruments may be detachable from one another relative to at least one of the other instruments.

The resin molding apparatus of the present invention may include, for example, a volume measuring mechanism control mechanism for controlling the measurement of the volume by the volume measuring mechanism of the discharged flowable resin by a computer program.

The resin molding apparatus of this invention may contain the movement mechanism control mechanism which controls the movement of the said movement mechanism with a computer program, for example.

In the resin molding apparatus of the present invention, for example, the resin expanding mechanism continuously spreads the fluid resin toward the periphery of the coating region from a dropping position with respect to at least a part of the fluid resin discharged by the discharge mechanism. can do.

In the resin molding apparatus of this invention, the said resin expansion mechanism can rotate the said application object, for example, can apply the centrifugal force to the said fluid resin, and can make the said fluid resin spread.

The resin molding apparatus of the present invention may further include, for example, a resin expanding mechanism control mechanism that controls the operation of the resin expanding mechanism by a computer program.

In the resin molding apparatus of the present invention, for example, the resin expansion mechanism may inject a gas to the fluid resin to force the fluid resin with the gas to spread the fluid resin. In addition, the shape of the gas injection port in the resin enlargement mechanism may be, for example, a shape or a slit shape in which the short diameter and the long diameter are substantially the same.

In the resin molding apparatus of this invention, the said resin expansion mechanism can inject the gas heated as the said gas, for example.

The resin molding apparatus of this invention may contain the gas injection control mechanism which controls the injection of the said gas by a computer program, for example.

The resin molding apparatus of the present invention may further include, for example, a resin heating mechanism for heating the fluid resin discharged to the coating region.

The resin molding apparatus of the present invention may further include, for example, a fluid resin measuring mechanism for measuring the fluid resin.

The resin molding apparatus of the present invention may include, for example, a sensor that detects the fluid resin on the application region in order to control the resin enlargement mechanism.

The resin molding apparatus of the present invention may further include a film holder for fixing the release film, for example.

The resin molding apparatus of the present invention includes, for example, the resin expanding mechanism, the compression molding mechanism is plural, and the plurality of compression molding mechanisms are arranged in different modules, respectively, and the discharge mechanism and the resin At least one of the enlargement mechanisms is arranged as a different module than the compression molding mechanism, and at least one of the modules may be detachable from each other with respect to the at least one other module.

In the resin molding apparatus of the present invention, for example, at least one of the discharge mechanism, the resin expanding mechanism, and the compression molding mechanism is disposed in a different module with respect to at least one other, and at least one of the modules is at least one other. It may be detachable from each other for the module of.

The resin molding apparatus of the present invention further includes, for example, a moving mechanism for moving the discharge position of the fluid resin with respect to the coating object, wherein at least one of the moving mechanism, the discharge mechanism, and the compression molding mechanism, It may be divided into other modules for at least one other, and at least one of the modules may be detachable from each other with respect to the other at least one of the modules. The moving mechanism may be, for example, an application object moving mechanism for moving the application object to move the discharge position of the fluid resin relative to the application object, as described above. In this case, the resin molding apparatus of the present invention may further include the resin expanding mechanism, and the resin expanding mechanism may be divided into different modules with respect to at least one other mechanism, and may be detachable from each other.

The resin molding apparatus of the present invention includes, for example, a moving mechanism control mechanism that controls the movement of the moving mechanism by a computer program, and includes the moving mechanism control mechanism, the moving mechanism, the discharge mechanism, and the compression molding mechanism. At least one of the modules may be divided into other modules for at least one other, and at least one of the modules may be detachable from each other with respect to the at least one other module. In this case, the resin molding apparatus of the present invention may further include the resin expanding mechanism, and the resin expanding mechanism may be divided into different modules with respect to at least one other mechanism, and may be detachable from each other.

In the resin molding apparatus of the present invention, for example, the resin expanding mechanism injects a gas to the fluid resin, exerts a force on the fluid resin by the gas to spread the fluid resin, A gas injection control mechanism for controlling the injection by a computer program, wherein at least one of the gas injection control mechanism, the discharge mechanism, the resin enlargement mechanism, and the compression molding mechanism is divided into other modules for at least one other; At least one of the modules may be detachable from each other with respect to at least one of the other modules.

The resin molding apparatus of the present invention includes, for example, a resin heating mechanism for heating the flowable resin discharged to the application region, wherein at least one of the resin heating mechanism, the discharge mechanism, and the compression molding mechanism is different from each other. For one, it may be divided into other modules, and at least one of the modules may be detachable from each other with respect to at least one of the other modules. In this case, the resin molding apparatus of the present invention may further include the resin expanding mechanism, and the resin expanding mechanism may be divided into different modules with respect to at least one other mechanism, and may be detachable from each other.

The resin molding apparatus of the present invention includes, for example, a flowable resin metering mechanism for measuring the flowable resin, wherein at least one of the flowable resin metering mechanism, the discharge mechanism, and the compression molding mechanism is different from at least one other. Divided into modules, at least one of the modules may be detachable from each other with respect to at least one of the other modules. In this case, the resin molding apparatus of the present invention may further include the resin expanding mechanism, and the resin expanding mechanism is divided into different modules with respect to at least one other mechanism, and may be detachable from each other.

The resin molding apparatus of this invention further contains the conveyance mechanism which conveys the said application target object to the said compression molding mechanism, for example, At least one of the said conveyance mechanism, the said discharge mechanism, and the said compression molding mechanism is in another at least one. And divided into different modules, and at least one of the modules may be detachable from each other with respect to the other at least one module. In this case, the resin molding apparatus of the present invention may further include the resin expanding mechanism, and the resin expanding mechanism may be divided into different modules with respect to at least one other mechanism, and may be detachable from each other.

The resin molding apparatus of this invention is a release film, for example, and further contains the cutting mechanism which cut | disconnects the release film, At least one of the said cutting mechanism, the said discharge mechanism, and the said compression molding mechanism differs, for example. For at least one, it may be divided into other modules, and at least one of the modules may be detachable from each other with respect to at least one of the other modules. In this case, the resin molding apparatus of the present invention may further include the resin expanding mechanism, and the resin expanding mechanism may be divided into different modules with respect to at least one other mechanism, and may be detachable from each other.

The manufacturing method of the resin molded article of this invention calculates the volume of the said flowable resin from the dimension measurement process of measuring the dimension of the said flowable resin discharged to the said application | coating area, and the measurement result of the said dimension, for example. It may include a calculation process.

The manufacturing method of the resin molded article of this invention can measure the dimension of the said fluid resin by a displacement meter, for example in the said dimension measurement process.

The manufacturing method of the resin molded article of this invention can measure the thickness of the said fluid resin discharged at least in the said dimension measurement process, for example.

In the manufacturing method of the resin molded article of this invention, the volume of the said flowable resin can be computed based on the thickness and area of the said flowable resin discharged in the said volume measurement process, for example.

The method for producing a resin molded article of the present invention measures, for example, three-dimensional data of the flowable resin discharged in the dimensional measurement step, and based on the three-dimensional data of the flowable resin discharged in the volume measurement step. To calculate the volume of the flowable resin.

The method for producing a resin molded article of the present invention further includes a storage step of storing data, for example, and in the storage step, at least one of a measurement result of the dimension and a calculation result of the volume of the flowable resin can be stored. have.

The method for producing a resin molded article of the present invention may further include, for example, a discharging step in which the discharging step moves the discharging position of the fluid resin relative to the coating object.

The manufacturing method of the resin molded article of this invention can further include the resin expansion process which spreads the said fluid resin discharged by the said discharge mechanism, for example. In the resin expansion step, for example, a force can be applied to the flowable resin to spread it.

The manufacturing method of the resin molded article of this invention can further include the conveyance process which conveys the said application object to the place which performs the said compression molding process, for example.

The manufacturing method of the resin molded article of this invention is the release film shape cut | disconnected by the said cutting process in the said discharge process, for example, the said application | coating object is a release film, and includes the cutting process which cut | disconnects the release film. The said flowable resin can be discharged to.

The manufacturing method of the resin molded article of this invention can move the discharge position of the said fluid resin relative to the said application | coating object, for example in the said discharge process. In this case, for example, the application object can be moved, and the discharge position of the fluid resin can be moved relative to the application object.

The manufacturing method of the resin molded article of this invention can control the measurement of the volume of the said flowable resin discharged by a computer program in the said volumetric measurement process, for example.

The manufacturing method of the resin molded article of this invention can control expansion of the said resin by a computer program in the said resin enlargement process, for example.

In the method for producing a resin molded article of the present invention, for example, in the resin enlargement step, the portion of the flowable resin may be continuously spread from the drop position of the flowable resin toward the periphery of the coating region. Magnification can be performed.

In the method for producing a resin molded article of the present invention, the flowable resin can be spread by, for example, rotating the application object in the resin expanding step to exert a centrifugal force on the flowable resin.

In the method for producing a resin molded article of the present invention, for example, in the resin expansion step, a gas may be injected into the flowable resin to force the flowable resin to spread the flowable resin by the gas. For example, heated gas may be injected as the gas. For example, the injection of the gas can be controlled by a computer program. For example, in the said resin enlargement process, it can control so that the distance of the injection hole of the said gas and the surface of the said fluid resin may become constant. In addition, although the said gas is not specifically limited, For example, air is preferable from a viewpoint of cost, convenience, etc.

In the method for producing a resin molded article of the present invention and the resin molding apparatus of the present invention, for example, the application area may be approximately circular, and may be approximately rectangular or approximately square.

In the method for producing a resin molded article of the present invention, for example, in the resin enlargement step, the fluid resin is continuously directed from the drop position toward the periphery of the coating region with respect to at least a part of the fluid resin discharged in the discharge step. Can spread.

The manufacturing method of the resin molded article of this invention can discharge the said fluid resin, respectively, in the center part and the periphery part in the said application | coating area | region in the said discharge process, for example.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the discharging position of the fluid resin is in a direction substantially coincident with the outer circumferential direction of the coating area while dropping the fluid resin on the coating area. By moving, the said fluid resin can be discharged.

The manufacturing method of the resin molded article of this invention can discharge the said fluid resin, for example, moving the discharge position of the said fluid resin in a spiral form at the said discharge process.

In the manufacturing method of the resin molded article of this invention, the said discharge process WHEREIN: The discharge of the said fluid resin is divided into several virtual area | regions on the said application | coating area | region, and is performed in each virtual area | region, The said virtual area | region is the said application | coating area | region Is an area surrounded by an outer periphery, a center, and a radius of the discharge area, wherein the discharge of the flowable resin in the virtual area causes the discharge position of the flowable resin toward the periphery of the application area or in the periphery of the application area in the virtual area. This can be done while meandering toward the center.

In the manufacturing method of the resin molded article of this invention, for example, in the said discharge process, it moves toward the peripheral part from the center part of the said coating area, moving the discharge position of the said fluid resin to the direction substantially coinciding with the outer peripheral direction of the said coating area. Or move from the periphery of the application area toward the center.

In the manufacturing method of the resin molded article of this invention, for example, in the said discharge process, the moving speed of the discharge position of the said fluid resin can be kept substantially constant.

In the method for producing a resin molded article of the present invention, for example, in the discharging step, the moving angular velocity of the discharging position of the flowable resin can be slower from the center of the coating region toward the periphery.

The manufacturing method of the resin molded article of this invention can control movement of the discharge position of the said fluid resin by a computer program, for example in the said discharge process.

The manufacturing method of the resin molded article of this invention can move the discharge position of the said fluid resin relatively with respect to the said application object in the said discharge process, for example. For example, by moving the application object, the discharge position of the fluid resin can be moved relative to the application object. For example, the application object can be moved in a substantially horizontal direction. Further, for example, the movement of the discharge position of the fluid resin can be controlled by a computer program.

The manufacturing method of the resin molded article of this invention may further include the resin heating process of heating the said fluid resin discharged to the said application | coating area, for example. The said resin heating process can be performed by spraying the said heated gas, for example.

The manufacturing method of the resin molded article of this invention may include the resin metering process which measures the said fluid resin, for example.

In the manufacturing method of the resin molded article of this invention, the said coating object may be a release film, for example. Moreover, the said discharge process can be performed in the state which fixed the said release film on the film holder, for example.

The manufacturing method of the resin molded article of this invention can mount a frame on the said application object, and can discharge the said resin as the said application | coating area | region inside the said frame.

In the manufacturing method of the resin molded article of this invention, the shape of the said fluid resin may be liquid or paste form, for example. In addition, for example, the flowable resin may be a liquid resin having fluidity at room temperature.

The manufacturing method of the resin molded article of this invention carries out the said discharge process and the said compression molding process in another place, for example, and conveys the said object to be conveyed to the place which performs the said compression molding process before the said compression molding process. It may further comprise a process. In addition, the said conveyance process can be performed, for example, expanding the said fluid resin, ie, simultaneously with the said resin expansion process, and can be performed in the state in which the said fluid resin is expanded, ie, after the said resin expansion process.

The manufacturing method of the 1st electronic component of this invention is a manufacturing method of the resin molded article which the said resin molded article is an electronic component, resin sealing a chip by compression molding in the said compression molding process, and manufactures the said electronic component.

The manufacturing method of the 2nd electronic component of this invention is an intermediate product manufacturing process which manufactures the said electronic component as an intermediate product by the manufacturing method of the said 1st electronic component of this invention, and the other electron which is a finished product from the said intermediate product. It is a manufacturing method of the electronic component which is the said completed product including the final product manufacturing process which manufactures a component. On the other hand, the manufacturing method of the 2nd electronic component of this invention is the said electron which is an intermediate | middle product manufactured by the manufacturing method (1 embodiment of the manufacturing method of the resin molded article of the present invention) of the said 1st electronic component of this invention. It is a method of manufacturing another product (another electronic component which is a finished product) using a component (resin molded article). Therefore, it can be said that the manufacturing method of the 2nd electronic component of this invention is one Embodiment of the manufacturing method of the said product of this invention.

The manufacturing method of the 2nd electronic component of this invention is an intermediate product manufacturing process which manufactures the said electronic component as an intermediate product by the manufacturing method of the said 1st electronic component of this invention as mentioned above, and the said intermediate product It is a manufacturing method of the electronic component which is the said final product characterized by including the final product manufacturing process which manufactures the other electronic component which is a finished product from. In the manufacturing method of the 2nd electronic component of this invention, the said intermediate product contains the sealing resin which sealed the said chip | tip, the said application | coating object, and the said chip | tip, for example, The said chip | tip and the said sealing in the said finished goods manufacturing process The application object can be removed from the resin. Further, for example, in the finished product manufacturing process, after removing the coating object from the chip and the sealing resin, a wiring member may be connected to the chip.

On the other hand, generally, an "electronic component" refers to the case before the resin sealing and the state which carried out the resin sealing of the chip, but in the present invention, unless specifically referred to as "electronic component", unless otherwise specified, The chip refers to an electronic component (electronic component as a finished product) in which resin is sealed. In the present invention, the term "chip" refers to a chip in a state in which at least a portion is not resin-sealed, and at least one of a chip before resin-sealing, a chip in which a portion is resin-sealed, and a plurality of chips is not exposed in the resin. It also includes chips. Specific examples of the "chip" in the present invention include chips such as ICs, semiconductor chips, and power control semiconductor elements. In this invention, the chip | tip of the state which at least one part is not resin-sealed and is exposed is called "chip" for convenience in order to distinguish it from the electronic component after resin sealing. However, the "chip" in the present invention is not particularly limited as long as at least a portion of the chip is in an exposed state without resin sealing, and may not be chip-shaped.

EMBODIMENT OF THE INVENTION Hereinafter, the specific Example of this invention is described based on drawing. For convenience of explanation, each drawing is schematically shown by omission and exaggeration as appropriate.

<Example 1>

In the present Example, the resin molding apparatus of this invention, the manufacturing method of a resin molded article, and the example of the manufacturing method of a product are demonstrated.

[One. Resin Molding Apparatus]

First, the resin molding apparatus of this invention is demonstrated, for example.

(1) discharge mechanism

In the side view of FIG. 1, an example of a discharge mechanism is typically shown in the resin molding apparatus of this invention. As shown, this discharge mechanism has a table (fixing table) 12 and a dispenser 13. The release film 11 is mounted and fixed to the upper surface of the table (fixing stand) 12. The release film 11 may be a resin film, for example. The release film 11 corresponds to the "application object" which apply | coats the fluid resin for resin sealing to the application | coating area | region of the upper surface. The release film 11 prevents adhesion of the cured resin (sealing resin) to which the fluid resin hardened | cured after a resin sealing molding to a shaping | molding mold, and makes it easy to take out a resin molded article. The table 12 may be movable or rotatable in, for example, two axes of XY (approximately horizontal direction), and includes at least one component in three axes of XYZ (ie, horizontal and vertical directions). In any direction). The release film 11 is sucked by the suction surface (not shown) by the suction mechanism (not shown, for example, a decompression pump etc.) from the suction hole (not shown) of the upper surface of the table 12, for example, to adsorb | suck to the upper surface of the table 12, Can be fixed The dispenser 13 is a mechanism which discharges fluid resin on the release film 11, and corresponds to a "discharge mechanism." The dispenser 13 is equipped with a nozzle 14, and fluid resin can be discharged onto the release film 11 from the tip outlet of the nozzle 14. The dispenser 13 is movable in the biaxial direction (approximately horizontal direction) of X-Y together with the nozzle 14, and thereby it is possible to move the discharge position of fluid resin. In addition or alternatively, the discharge position of the fluid resin can be moved by moving the table 12 in the biaxial direction (approximately horizontal direction) of X-Y. In addition, the discharge mechanism of FIG. 1 may further have a resin enlargement mechanism for spreading the flowable resin discharged on the release film 11. The resin expanding mechanism can be spread by applying a force to the fluid resin, for example. The resin expanding mechanism may be a mechanism for applying a force to the flowable resin by expanding the table 12 together with the film 11 (object to be coated), as described later, and injecting gas into the flowable resin. Thus, the gas may be a mechanism for spreading the flowable resin by applying a force to the flowable resin. On the other hand, when the table 12 is moved to apply a force to the flowable resin to spread the flowable resin, the table 12 functions as part of the resin expanding mechanism.

(2) volumetric instruments

In the side view of FIG. 2, an example of a volume measuring mechanism is typically shown in the resin molding apparatus of this invention. This volume measuring mechanism has a laser displacement meter 15, a calculation unit and a storage unit (not shown) shown in FIG. FIG. 2 shows a state in which the laser displacement meter 15 is disposed above the table 12 and the film 11 instead of the dispenser 13 and the nozzle 14 of FIG. 1. The laser displacement meter 15 can measure the thickness of the fluid resin (not shown) discharged on the film 11 at least by the dispenser 13 and the nozzle 14, as mentioned later, for example. The calculation unit may calculate the volume of the flowable resin using the measurement result of the laser displacement meter 15. The storage unit may store at least one of the measurement result by the laser displacement meter 15 and the calculation result by the calculation unit. In addition, the laser displacement meter 15 may be, for example, a laser displacement meter capable of measuring three-dimensional data of the flowable resin as in Example 3 described later. On the other hand, at least part of the calculation unit and at least part of the storage unit may be embedded in the laser displacement meter 15.

In addition, this volume measuring mechanism may further have a camera 16, as shown in the side view of FIG. FIG. 3 shows a state in which the camera 16 is disposed above the table 12 and the film 11 instead of the laser displacement meter 15 in FIG. 2. The camera 16 can image an image (planar shape) of the fluid resin (not shown) discharged on the film 11, for example, as mentioned later. And based on the image imaged by the camera 16, the calculating part can calculate the area of the said flowable resin discharged. The volume of the flowable resin can be calculated from the area of the flowable resin and the thickness of the flowable resin measured by the laser displacement meter 15. On the other hand, a part of the calculator may be built in the camera 16 to calculate the area of the flowable resin, and another part of the calculator may be built in the laser displacement meter 15 to calculate the volume of the flowable resin.

(3) compression molding apparatus

An example of the compression molding mechanism in the resin molding apparatus of this invention is shown typically in sectional drawing of FIG. As shown, this compression molding mechanism has a molding mold 531 and a mold clamping mechanism 115. The molding mold 531 is composed of an upper mold 101 and a lower mold 102. The upper mold 101 has an upper end fixed to the fixed platen 111 and is suspended from the lower surface of the fixed platen 111. The lower die 102 is mounted on the movable platen 112. The movable platen 112 can be elevated in the vertical direction as will be described later.

The lower mold | type 102 has the lower mold | type base member 103, the lower mold | type cavity side member 104, the elastic member 105, and the lower mold | type cavity bottom member 106 as shown. The lower mold base member 103 is mounted on the upper surface of the movable platen 112. The lower mold cavity bottom member 106 is mounted on an upper surface of the lower mold base member 103 and constitutes a bottom surface of the lower mold cavity 532. The lower mold cavity side member 104 is a frame-shaped member disposed to surround the lower mold cavity bottom member 106, and is mounted on the upper surface of the lower mold base member 103 via the elastic member 105 to lower the lower mold cavity 532. ) To configure the side. The lower mold | type 102 is comprised by the lower mold | type cavity bottom member 106 and the lower mold | type cavity side member 104, and the lower mold | type cavity 532 is comprised. In addition, the lower mold 102 is provided with a heating mechanism (not shown) for heating the lower mold 102, for example. By heating the lower die 102 with the heating mechanism, for example, the resin in the lower die cavity 532 is heated and cured.

The mold clamping mechanism is a mechanism for fastening and opening the molding mold and, as shown in the drawing, has a driving source 116 and a transmission member 117 for transmitting the driving force of the driving source 116. And the lower surface (lower end) of the movable platen 112 is connected to the drive source 116 via the transmission member 117. In addition, the driving source 116 is installed on the base 113. By driving the movable platen 112 up and down by the drive source 116, the lower die 102 provided thereon can be driven up and down. That is, the mold clamping mechanism 115 can fasten a molding mold by driving the movable part platen 112 upwards, and can open a molding mold by driving the movable platen 112 downward. Although the drive source 116 is not specifically limited, For example, electric motors, such as a servo motor, can be used. Although the transmission member 117 is not specifically limited, For example, it can comprise using a ball screw. Further, for example, the mold clamping mechanism 115 may be configured by using a hydraulic cylinder as the drive source 116 and a rod as the transfer member 117. Moreover, the mold clamping mechanism 115 can also be comprised using a toggle link mechanism.

In addition, tie bars (pillar-shaped members) 114 are disposed at four corners of the base 113, the movable platen 112, and the fixed platen 111 as supporting members, respectively. Specifically, the upper ends of the four tie bars 114 are fixed to four corners of the fixing platen 111, and the lower ends are fixed to four corners of the base 113. Four supporting edges of the movable platen 112 are perforated to penetrate the support members 114, respectively. The movable platen 112 can move up and down along the tie bar 114. In addition, instead of the tie bar (column member), the tie bar (support member) 114 can use wall-shaped members, such as a hold frame (trademark), for example. The wall-shaped member can be provided between, for example, surfaces where the movable platen 112 and the fixed platen 111 face each other.

In addition, although the structure which raises and lowers the lower mold | type cavity bottom member 106 using the mold clamping mechanism 115 is shown in FIG. 4, this invention is not limited to this. For example, in addition to the mold clamping mechanism 115, another drive mechanism for elevating the lower mold cavity bottom member 106 can be provided. In this configuration, the elastic member 105 may not be used.

(4) Structure of whole resin molding apparatus

Next, an example of the structure of the resin molding apparatus of this invention is typically shown in the top view of FIG. The resin molding apparatus of FIG. 5 is an apparatus for manufacturing an electronic component (resin molded article). As shown in the drawing, the apparatus includes a release film cutting module (release film cutting mechanism) 510, a discharge mechanism (application module) 520, a compression molding mechanism (compression molding module) 530, and a transfer mechanism (transfer module). 540 and the control unit 550 are arranged side by side in the above order from the right side of the drawing. Each module is divided separately, but can be attached to and detached from adjacent modules. The coating module 520 includes a discharge mechanism for discharging the flowable resin for resin molding to the coating area on the release film (coated object), as will be described later. In addition, the coating module 520 includes a discharge mechanism (discharge module) for discharging the fluid resin and a resin enlargement mechanism (resin expansion module) for expanding the fluid resin, as described later. In addition, the apparatus of FIG. 5 further includes a volume measuring mechanism for measuring the volume of the flowable resin discharged. As described later, the volume measuring mechanism further includes a laser displacement meter (not shown), an arithmetic unit included in the control unit 550, and a storage unit (not shown). The said calculating part calculates the volume of the discharged fluid resin based on the measurement data of the laser displacement meter 15, for example. In addition, when using the camera 16, the area of the fluid resin discharged by image-processing the imaging data of the camera 16 like Example 2 mentioned later can be computed, for example. The storage unit stores, for example, data relating to a measurement result of the laser displacement meter. Specifically, for example, as will be described later, the measurement data of the measurement result of the laser displacement meter can be stored, and the data calculated based on the measurement result of the laser displacement meter in the calculation unit can also be stored. Moreover, in the structure provided with the camera 16, the said storage part can memorize the imaging data of the camera 16, for example, and can also memorize the area computed by the said calculation part based on the imaging data. On the other hand, as described above, at least a part of each of the calculation unit and the storage unit may be incorporated in the laser displacement meter 15. In addition, as described above, a part of the calculator may be embedded in the camera 16 and another part of the calculator may be embedded in the laser displacement meter 15.

On the other hand, the laser displacement meter 15 and the camera 16 may be provided in plural to reduce the measurement time, respectively.

The release film cutting module (release film cutting mechanism) 510 can cut | disconnect a circular release film from a long release film, and can separate. As shown, the release film cutting module 510 includes a film holder mounting mechanism 511, a roll-shaped release film 512, and a film gripper 513. The table 12 (not shown in FIG. 5) of FIG. 1 is mounted on the upper surface of the film holder mounting mechanism 511. As described above, the table 12 may be referred to as a "film holder" as a holder for fixing the film 11. As shown, the tip of the release film is taken out from the roll-shaped release film 512 to cover the upper surface of the table 12 mounted on the film holder mounting mechanism 511, and the release film is fixed on the table 12. can do. The film gripper 513 fixes the distal end of the release film taken out from the roll release film 512 on the side opposite to the roll release film 512 when viewed from the film holder mounting mechanism 511. The film can be taken out from the roll-shaped release film 512. On the film holder mounting mechanism 511, the said release film can be cut | disconnected by a cutter (not shown), and can be made into the circular release film 11. FIG. In addition, the release film cutting module 510 includes a waste material processing mechanism (not shown) which processes the remaining release film (waste material) by cutting and separating the circular release film 11.

The application module 520 includes a discharge mechanism, a resin loader (resin transfer mechanism) 521, and a post-processing mechanism 522. As described in FIG. 1, the discharge mechanism includes a release film 11, a table (fixing table) 12, and a dispenser 13 (eject mechanism) on which the nozzle 14 is mounted. On the other hand, since FIG. 5 is a top view (drawing seen from above), since the table 12 is not hidden by the release film 11, it is not shown in figure. In addition, since the nozzle 14 is not shown by the dispenser 13 in FIG. 5, it is not shown in figure. In addition, in FIG. 5, the discharge mechanism further includes a film holder moving mechanism 523. On the film holder movement mechanism 523, the table 12 and the release film 11 are mounted. By moving or rotating the film holder moving mechanism 523 in the horizontal direction, the table 12 mounted thereon can be moved or rotated for each release film 11. In FIG. 5, the film holder moving mechanism 523 is the same as the film holder mounting mechanism 511 described above, and may move between the release film cutting module 510 and the application module 520. In addition, the film fixing table moving mechanism 523 can expand and apply a force to fluid resin by moving or rotating the table 12 for every release film 11. Therefore, the film fixing stand moving mechanism 523 corresponds to the "resin enlargement mechanism" in the resin molding apparatus of FIG. In addition, as a resin expanding mechanism which expands by applying a force to fluid resin, it may contain the gas blow nozzle (not shown in FIG. 5) etc. as mentioned later. In addition, the coating module 520 may include a camera (sensor), a heater, and the like, as described below. In addition, the resin loader 521 and the post-processing mechanism 522 are formed integrally. In a state in which the flowable resin 21 (not shown in FIG. 5) is supplied onto the release film 11 (resin receiving portion), which is adsorbed and fixed to the lower end surface of the frame member (circular frame) by using the resin loader 521. The frame member (circular frame) and the release film 11 can be combined. And the release film 11 can be supplied and set in the state which apply | coated fluid resin in the lower mold | type cavity for compression molding mentioned later in the compression molding module 530 in the state.

The compression molding module 530 includes a molding mold 531 as shown. The molding mold 531 is not particularly limited, but may be, for example, a mold. The molding mold 531 has an upper mold and a lower mold (not shown) as main components, and the lower mold cavity 532 is circular as shown. The molding mold 531 is further provided with an upper substrate setting part (not shown) and a lower mold cavity bottom member (not shown) for resin pressurization. In the compression molding module 530, a chip (e.g., a semiconductor chip) mounted on a resin pre-sealing substrate (pre-molding substrate), which will be described later, is resin-sealed in a sealing resin (resin package) in a lower mold cavity, thereby completing a resin-sealed substrate. (Molding completed substrate) can be formed. The compression molding module 530 may include, for example, the compression molding mechanism shown in FIG. 4, and the molding mold 531 may be, for example, the molding mold 531 shown in FIG. 4.

The conveyance mechanism (conveying module) 540 can convey the said chip (resin sealing object) before resin sealing for every board | substrate, and can convey the electronic component (resin molded article) after resin sealing. As shown, the conveyance mechanism (conveying module) 540 includes a substrate loader 541, a rail 542, and a robot arm 543. The rail 542 protrudes from the conveyance mechanism (conveying module) 540 and reaches the regions of the compression molding module 530 and the application module 520. The substrate loader 541 may mount the substrate 544 thereon. The substrate 544 may be a resin pre-sealing substrate (pre-molding substrate) 544a, and may be a resin sealing completion substrate (molding completed substrate) 544b. The substrate loader 541 and the resin loader 521 (post-processing mechanism 522) can move between the application module 520, the compression molding module 530, and the transfer module 540 on the rail 542. . In addition, as shown in the drawing, the transfer module 540 includes a substrate accommodating portion, and can accommodate the pre-sealing substrate (pre-molding substrate) 544a and the resin-sealing completed substrate (molding completed substrate) 544b, respectively. . A chip (not shown, for example, a semiconductor chip) is mounted on the substrate 544a before molding. In the molded substrate 544b, the chip is sealed with a resin (sealing resin) in which a fluid resin is solidified, and an electronic component (resin molded article) is formed. The robot arm 543 can be used as follows, for example. That is, first, by inverting the front and back of the pre-molded substrate 544a taken out from the receiving portion of the pre-molded substrate 544a, it can be mounted on the substrate loader 541 with the chip mounting surface facing downward. Second, by taking the molded substrate 544b out of the substrate loader 541 and inverting the front and back, the molded resin substrate 544b can be accommodated in the housing portion of the molded substrate with the sealing resin facing upward.

The control unit 550 cuts the release film, discharges the flowable resin, expands the flowable resin, conveys the pre-sealing substrate and the sealed substrate, conveys the resin material, conveys the release film, heats the molding mold, fastens the molding mold, and Control the opening and the like. In other words, the control unit 550 controls the respective operations in the release film cutting module 510, the application module 520, the molding module 530, and the transfer module 540. Thus, the resin molding apparatus of this invention can control each said component by a control part, and can function as a fully automatic apparatus. Alternatively, the resin molding apparatus of the present invention can function as a manual apparatus without using the control unit, but it is efficient to control each of the above components by the control unit. In addition, the controller 550 includes a calculator and a memory (not shown). The apparatus of FIG. 5 includes a laser displacement meter (not shown), and a volume measuring mechanism for measuring the volume of the flowable resin discharged by the laser displacement meter, the calculation unit and the storage unit is configured. In addition, the volume measuring mechanism may further include a camera, for example, as described later. In addition, the laser displacement meter is not limited thereto, and may be, for example, the other displacement meter described above.

The position where the control unit 550 is disposed is not limited to the position shown in FIG. 5, and may be arbitrary. For example, the control unit 550 may be disposed in at least one of the respective modules 510, 520, 530, and 540, You can also place it. In addition, the control part 550 can also be comprised as a some control part which isolate | separated at least one part according to the operation used as a control object.

In addition, another example of the structure of the resin molding apparatus of this invention is typically shown in the top view of FIG. The resin molding apparatus of FIG. 6 has two compression molding modules 530, and the resin of FIG. 3 except that the two compression molding modules 530 are adjacent to be parallel to each other between the application module 520 and the conveyance module 540. Same as the molding apparatus. In addition, in the resin molding apparatus of FIG. 6, the transport module 540 and the molding module 530 adjacent thereto are detachable, or the application module 520 and the molding module 530 adjacent thereto are detachable, or Both are removable. In addition, the two molding modules 530 are detachable from each other.

In the resin molding apparatus of FIG. 5 and FIG. 6, as mentioned above, the conveyance module 540 which supplies a board | substrate, and the application | coating module 520 which discharges fluid resin on a release film are interposed between the compression molding module 530. They are arranged opposite each other. Moreover, the release film cutting module 510 which forms the circular release film is arrange | positioned at the outer side of the application | coating module 520. This resin molding apparatus is a separate resin molding apparatus in which the above modules are divided and arranged. In addition, the arrangement | positioning of each module of the resin molding apparatus of this invention is not specifically limited, It may be other than the arrangement of FIG. 5 and FIG. For example, a configuration in which the compression molding module is detachably arranged by the required number can be adopted. Moreover, a release film cutting module (circular release film forming module), an application module, and a conveyance module (substrate module) can be arrange | positioned near one side of a compression molding module. In this case, the release film cutting module, the application module, and the substrate module become the master module, and the compression molding module becomes the slave module (master-slave type). In this case, the required number of compression molding modules can be arranged in sequence. Moreover, a release film cutting module, an application | coating module, and a conveyance module (substrate module) can be integrated. In addition, the release film cutting module, the application module, and the conveyance module (substrate module) can be integrated into one molding module, and the whole of such components is integrated alone as a resin molding device (for example, a compression molding device). Function.

In addition, when arranging a some compression shaping | molding module between a conveyance module (substrate module) and an application | coating module, and when arranging several compression shaping | molding modules with respect to a master module sequentially, it is preferable to arrange | position as follows. That is, each said molding module is arrange | positioned side by side along the direction which the rail used when the component containing a board | substrate loader, a resin loader, and a post-processing mechanism moves is extended. In addition, each module of the resin molding apparatus of this invention can be mutually detachable using a coupling mechanism, such as a bolt and a nut, or a positioning mechanism suitably. Moreover, with respect to the compression molding module, another compression molding module can be detachably configured. Thereby, the compression molding module can be post-increased or decreased.

[2. Manufacturing method of resin molded article and manufacturing method of product]

Next, the example of the manufacturing method of the resin molded article of this invention, and the manufacturing method of a product are demonstrated. More specifically, the example of the manufacturing method of the resin molded article using the resin molding apparatus demonstrated in FIGS. 1-6 is demonstrated, and the example of the manufacturing method of the product using the same is demonstrated.

(1) Process of apply | coating fluid resin

First, the example of the process of apply | coating the fluid resin for resin molding on the application | coating area | region of an application target object is demonstrated using FIGS. As described below, in the present embodiment, the step of applying the flowable resin includes a discharge step of discharging the flowable resin for molding a resin in the coating area of the coating object, and a volume of the flowable resin discharged in the coating area. And a resin enlarging step of spreading the flowable resin discharged in the application region. However, in this invention, the process of apply | coating fluid resin is not limited to this.

(1-1) discharge process

First, a discharging step of discharging the flowable resin for resin molding is performed to the coating area of the coating object. That is, fluid resin is discharged to at least one part in the application | coating area | region on the release film 11 from the exit of the front end of the nozzle 14 of FIG. In addition, the application | coating area | region on the release film 11 is mentioned later. In this discharging step, for example, the discharging position of the fluid resin can be moved by moving the dispenser 13 together with the nozzle 14 in the X-Y biaxial direction (approximately horizontal direction). In addition, or in place of this, the discharge position of the fluid resin can be moved by moving the table 12 in the biaxial direction (approximately horizontal direction) of X-Y. Also, for example, the release film 11 (object to be coated) may be vibrated with the table 12 while discharging the flowable resin from the nozzle 14, and in addition or in lieu thereof, the nozzle 14 may be vibrated. You can.

On the other hand, the flowable resin is not particularly limited, may be a liquid resin and may be a molten resin. The definitions of "liquid resin" and "melt resin" are as described above. The fluid resin is preferably a liquid resin from the viewpoint of ease of handling and the like. If the liquid resin has fluidity at room temperature (room temperature) as defined above, the viscosity is not limited. For example, the liquid resin may be a liquid or may be a paste. In addition, the flowable resin may be, for example, a thermoplastic resin and may be a thermosetting resin. A thermosetting resin is liquid resin at normal temperature, for example, a viscosity falls when it heats, and when it heats further, it polymerizes and hardens | cures and becomes cured resin. In the present invention, the flowable resin is, for example, preferably a relatively high viscosity thermosetting resin that does not flow quickly at room temperature after discharge, and is preferably flowed by exerting a force.

For example, the flowable resin metering step of measuring the flowable resin using the flowable resin metering mechanism can be performed before the discharge step. Thereby, the flowable resin of predetermined amount which is not too many and not too small can be discharged on the release film 11. FIG. Although the fluid resin metering mechanism is not specifically limited, For example, the metering mechanism (for example, a load cell for metering) etc. which are used for granular resin as described in patent document 1 can be used. The metering mechanism can be provided adjacent to the side of the dispenser 13, for example.

7-13, the example of the resin discharge pattern in the said discharge process is shown typically. 7-13 is a figure which shows the state which discharged the fluid resin 21 on the release film 11 which is a coating object in all. 7-13 is the example in which the release film 11 which is a coating object is circular in all, and the application | coating area | region 11a is circular. 7 to 13, the inside of the region indicated by the dotted line (concentric circles slightly smaller than the circle of the outer frame of the release film 11) is the application region 11a. The fluid resin 21 is not applied to the periphery of the release film 11 (outside of the application region 11a), and is used for supporting the release film in the compression molding step described later.

In FIG. 7, the release film 11 and the application | coating area | region 11a are circular, and the example which discharges the fluid resin 21 only in the center part of the application | coating area | region 11a is shown. FIG. 7A is a plan view, and FIG. 7B is a sectional view taken along the line I-I 'direction of FIG. 7A.

8, the release film 11 and the application | coating area | region 11a are circular, and the example which discharged the fluid resin 21 in the spiral form is shown. FIG. 8A is a plan view, and FIG. 8B is a sectional view taken along the line II-II ′ in FIG. 8A. In the discharging step of discharging the fluid resin 21 in a spiral manner, for example, the fluid resin 21 can be discharged from the center of the coating area 11a toward the periphery, and on the contrary, can be discharged from the periphery of the coating area 11a toward the center. have.

In the top view of FIG. 9, the release film 11 and the application | coating area | region 11a are circular, and while discharging | flowing the fluid resin 21 to the center part of the application | coating area | region 11a, it is circular (ring shape) so that the circumference | surroundings may be surrounded. The example discharged as follows is shown. In FIG. 9, although the ring of the fluid resin 21 is one, it is not limited to this, It can discharge in multiple concentric circles. An example is shown in the top view of FIG. FIG. 10 is the same as FIG. 9 except having two rings of the fluid resin 21 so as to surround the fluid resin 21 at the center, and discharging them in concentric circles. In addition, although there are two rings of the flowable resin 21 in FIG. 10, the present invention is not limited thereto, and three or more rings may be provided.

11 is an example in which the release film 11 and the application region 11a have a circular shape, and the fluid resin 21 is discharged in a point shape so as to be scattered almost on the application region 11a.

12 is an example in which the release film 11 and the application region 11a have a circular shape, and the fluid resin 21 is discharged radially around the center of the application region 11a. In the discharging step of radially discharging the fluid resin 21, for example, the fluid resin 21 can be discharged from the center of the coating region 11a toward the periphery and, on the contrary, can be discharged from the periphery toward the center.

13 is an example in which the release film 11 and the application | coating area | region 11a are circular, and the fluid resin 21 was discharged in planar shape to the center part of the application | coating area | region 11a. FIG. 13 is the same as FIG. 7 in that the fluid resin 21 is discharged to the center part of the application | coating area | region 11a. However, while FIG. 7 discharges the fluid resin 21 in the narrow range of the center part of the application | coating area | region 11a, FIG. 13 shows that the discharge range of the fluid resin 21 is wide, and the fluid resin 21 is planar. different.

7 to 13 show an example in which the release film 11 and the application region 11a are circular, while in FIG. 14 to 18, an example in which the release film 11 and the application region 11a is square. 14 to 18, the application region 11a is the inside of the region indicated by the dotted line (a concentric square slightly smaller than the square of the outer circumference of the release film 11). The fluid resin 21 is not applied to the periphery of the release film 11 (outside of the application region 11a), and is used for supporting the release film in the compression molding step described later. On the other hand, the shape of the coating area in the present invention is not limited thereto, and may be any shape such as, for example, approximately circular, approximately rectangular, approximately square, approximately elliptical, approximately triangular, approximately hexagonal, and other arbitrary polygons. In addition, the shape of the object to be coated in the present invention is also not particularly limited, and may be any shape such as, for example, approximately circular, approximately rectangular, approximately square, approximately elliptical, approximately triangular, approximately hexagonal, and other arbitrary polygons. Round, approximately rectangular or approximately square are preferred in view of ease of handling and the like. In addition, in the present invention, the shape of the coating object and the shape of the coating area may be the same as or different from those of FIGS. 7 to 13.

14, the release film 11 and the application | coating area | region 11a are square, and the example which discharges the fluid resin 21 only in the center part of the application | coating area | region 11a is shown. FIG. 14A is a plan view, and FIG. 14B is a sectional view taken along the direction of line III-III 'of FIG. 14A.

15, the release film 11 and the application | coating area | region 11a are square, and the example which discharged the fluid resin 21 in the spiral form is shown. FIG. 15A is a plan view, and FIG. 15B is a sectional view taken along the direction of the line IV-IV 'of FIG. 15A. Although the spiral shape of the flowable resin 21 was substantially circular in FIG. 8, as shown in FIG. 15, it is a substantially square spiral substantially along the outer periphery shape of the release film 11. As shown in FIG. In FIG. 15, in the ejection step of discharging the fluid resin 21 in a spiral manner, as in FIG. 8, for example, the fluid resin 21 can be ejected from the center of the application region 11a toward the periphery and, on the contrary, is ejected from the peripheral part toward the center. can do.

16 is an example in which the release film 11 and the application region 11a are square, and the fluid resin 21 is discharged in a dot shape so as to be dotted over almost the entire application region 11a.

17 is an example in which the release film 11 and the application | coating area | region 11a are square, and the fluid resin 21 was discharged radially centering on the center part of the application | coating area | region 11a. In the discharging step of discharging the fluid resin 21 radially, for example, the fluid can be discharged from the center of the release film 11 toward the periphery, and on the contrary, the fluid can be discharged from the periphery toward the center.

18 is an example where the release film 11 and the application | coating area | region 11a are square, and the fluid resin 21 was discharged in planar shape to the center part of the application | coating area | region 11a. FIG. 18 is the same as FIG. 14 in that the fluid resin 21 was discharged to the center part of the application | coating area | region 11a. However, while FIG. 14 discharges the fluid resin 21 to the narrow range of the center part of the application | coating area | region 11a, FIG. 18 has a large discharge range of the fluid resin 21, and the fluid resin 21 is planar. The point is different.

(1-2) Volumetric process

Next, a volume measuring step of measuring the volume of the discharged flowable resin is performed. First, as shown in FIG. 2, the laser displacement meter 15 is arrange | positioned above the table 12 and the film 11, and the thickness of the fluid resin (not shown) discharged on the film 11 is measured. Specifically, for example, as shown in FIG. 19, the discharged flowable resin 21 is irradiated with the laser light L1 from the laser displacement meter 15. Then, the laser beam L2 reflected by the fluid resin 21 is detected by the laser displacement meter 15. Thereby, the thickness of the part to which the laser beam L1 was irradiated from the fluid resin 21 is measured. In addition, as shown by arrow M1 of the figure, the thickness of each part of the fluid resin 21 is measured similarly, moving the laser displacement meter 15 from inside to outside along the spiral of the fluid resin 21. At this time, the length of the flowable resin 21 can be measured at the same time, but may not be measured. For the measurement of the length of the fluid resin 21, for example, the movement distance at the time of detecting the fluid resin 21 of the laser displacement meter 15 can be used. The width of the fluid resin 21 is substantially constant by the shape of the discharge port of the nozzle 14 at the time of fluid resin discharge, and the length of the fluid resin 21 is substantially, for example, by a predetermined discharge program. Is determined. Therefore, by measuring only the thickness of the flowable resin 21, the volume of the flowable resin 21 can be calculated almost accurately. However, this is an example, and the present invention is not limited thereto. For example, as described above, the length can be measured simultaneously with the width of the fluid resin 21. For example, in addition to the thickness of the flowable resin 21, one or both of the width and length of the flowable resin 21 may be further measured, as shown in FIG. 34 or 36 (Example 2 or 3) described later. Can be. In addition, if the volume of the flowable resin 21 can be calculated almost accurately, the thickness of the flowable resin 21 may not necessarily be measured.

19 shows an example in which the discharged flowable resin 21 has a spiral shape, the shape of the flowable resin 21 is not limited thereto and may be any shape. The same applies to FIGS. 34 and 36 described later. In addition, in FIG. 19, illustration of the release film 11 and the application | coating area | region 11a was abbreviate | omitted for the sake of simplicity of illustration. The same applies to FIGS. 34 and 36 described later.

In addition, after measuring the thickness of the flowable resin 21, as shown in the functional block diagram of FIG. 20, the flowable resin 21 is calculated by the calculation unit 551 and the storage unit 552 included in the control unit 550. Calculate and remember the volume of. That is, first, the thickness data (measurement result) of the fluid resin 21 measured by the laser displacement meter 15 is transmitted to the calculating part 551 (step S1). And the volume of the fluid resin 21 is computed by the calculating part 551 using the thickness data of the said fluid resin 21 (calculation process). Then, the calculated volume of the flowable resin 21 is transmitted to the storage unit 552 (step S2), and stored by the storage unit 552 (memory step). Alternatively, the measurement result of the laser displacement meter 15 may be directly transmitted to the storage unit 552 (step S1A) and stored in the storage unit 552 (storage step). And the measurement result of the laser displacement meter 15 memorize | stored by the memory | storage part 552 is transmitted to the calculation part 551 (step S3), and the volume of the fluid resin 21 is calculated by the calculation part 551 using the measurement result. Can be calculated (calculation process). In addition, the volume of the fluid resin 21 by the calculation can be transmitted to the storage unit 552 (step S2), and stored in the storage unit 552 (memory step). As described above, a volume measurement step of measuring the volume of the discharged flowable resin 21 can be performed. Meanwhile, at least a part of the calculator 551 or at least a part of the memory 552 may be built in the laser displacement meter 15.

On the other hand, in the storage unit 552, data relating to the volume of the flowable resin 21 can be stored as traceable traceability related data in association with a resin molded article or a product using the same, and the discharge of the flowable resin 21 It may be used to control the amount, or may be used to set manufacturing conditions. The same applies to the second and third embodiments described later.

Further, for example, in order to shorten the measurement time, by using a plurality of laser displacement meters (sensors) 15 simultaneously, a portion of the flowable resin 21 is measured by the plurality of laser displacement meters, respectively. The whole can be measured. The same applies to the second and third embodiments described later.

For example, measurement precision can be improved by performing volume measurement of the fluid resin 21 in multiple times, and calculating an average etc. The same applies to the second and third embodiments described later.

(1-3) Resin Expansion Step

Next, examples of the resin expanding step are shown in Figs. 21 and 22, respectively. In addition, although the case where a resin enlargement process is performed is demonstrated here, since the resin enlargement process is arbitrary in this invention, when it is not needed, it is a process which can be omitted.

In addition, according to the examples of FIGS. 21 and 22, for example, the flowable resin can be continuously spread from the drop position of the flowable resin (not shown) toward the periphery of the coating area, but the method of spreading the flowable resin is It is not limited. In addition, the specific example of the resin discharge pattern is the same as that of FIGS. 7-18 mentioned above, for example, and the specific example of the expansion pattern of fluid resin is the same as FIG. 23-29 mentioned later, for example.

Here, continuously spreading the flowable resin from the dropping position of the flowable resin toward the periphery of the coating area, for example, when the dropping position of the flowable resin is near one end side of the coating area, This includes spreading toward the periphery. Therefore, this case also includes a case where the fluid resin is continuously spread from the vicinity of one end side of the application region toward the center portion, and subsequently spreads continuously from the center of the application region toward the peripheral portion of the other end side. It also includes the case.

First, an example of a resin enlargement process is shown in FIG. In this step, a force is applied to the fluid resin (not shown) discharged on the upper surface of the resin film 11 to enlarge it. For example, the release film 11 is moved for every table 12 by moving the table 12 in the biaxial direction (approximately horizontal direction) of X-Y by a drive mechanism (not shown). Accordingly, a force is applied to the discharged flowable resin to enlarge it. That is, the said drive mechanism of the table 12 corresponds to the "coating object operation mechanism" which moves and expands the film 11 (coating object) by applying a force to the said fluid resin. The movement of the table 12 may be, for example, a movement in the horizontal direction and may be a rotation. For example, the table 12 can be rotated by the drive mechanism, and the centrifugal force exerts a force on the flowable resin to enlarge it. Although it does not specifically limit as a drive mechanism for rotating the table 12, For example, a spin coater etc. can be used. At this time, the heater (resin heating mechanism) 17 can perform a resin heating step of heating the fluid resin discharged to the release film 11. Thereby, the viscosity of fluid resin can be reduced and spreading (expansion) of fluid resin can be promoted. In addition, a resin heating process can be performed simultaneously with a resin enlargement process, for example, and can also be performed before a resin enlargement process. Although the heater 17 is not specifically limited, For example, an infrared lamp (for example, a far infrared lamp), a halogen lamp (halogen heater), a warm air (heating gas) blowing mechanism, a table built-in electric heater, etc. can be used. At this time, for example, the camera (sensor) 18 detects the enlarged state of the fluid resin, and moves the table 12 (for example, rotational speed, etc.) and the air blowing amount of the gas based on the detection result. Etc. can be controlled. Thereby, for example, when a fluid resin spreads excessively and exceeds from an application | coating area | region, it can be prevented. The movement of the table 12 can be controlled by a computer program, for example. On the other hand, the control by the camera (sensor) 18 can be performed in advance in the condition setting step, and it can be made to perform the discharge process which discharges a fluid resin based on the conditions at the time of actual resin shaping | molding.

22 shows another example of the resin enlargement step. In FIG. 22, instead of moving the table 12, a gas is injected into the flowable resin (not shown) discharged to the upper surface of the resin film 11 by a gas blow nozzle (gas injection mechanism) 19, and the gas is applied to the gas. By applying a force to the flowable resin thereby to expand. In the gas blow nozzle 19, the shape of the gas injection port is not particularly limited, but for example, the short diameter and the long diameter may be approximately the same hole shape, or may be an elongated slit shape. The gas injected by the gas blow nozzle 19 is not particularly limited, but may be, for example, a high pressure gas such as compressed air (compressed air) or compressed nitrogen gas. At this time, when the heated gas is sprayed, the viscosity of the liquid resin can be lowered to facilitate the expansion. At this time, similarly to the method of FIG. 21, the expanded state of the fluid resin is detected by the camera (sensor) 18, and the injection of the gas by the gas blow nozzle 19 can be controlled based on the detection result. Injection of the gas by the gas blow nozzle 19 can be controlled by a computer program, for example. Further, for example, in the resin enlargement step, the gas blow nozzle 19 can be controlled so that the distance between the gas injection port and the surface of the flowable resin becomes constant. As a result, for example, the gas pressure applied to the surface of the flowable resin becomes constant, and the uneven expansion of the flowable resin can be reduced. In addition, in the resin enlargement process, the said flowable resin can be enlarged by spraying gas to the flowable resin, moving one or both of the gas blow nozzle 19 and the fixed base 12 in the X-Y direction.

For example, in the resin enlargement process, the method of moving the release film (application object) 11 as shown in FIG. 21, and the method of spraying gas to fluid resin as shown in FIG. 22 can be used together. As a result, the flowable resin is more likely to flow and spread easily.

As mentioned above, the fluid resin for resin molding can be apply | coated to the application | coating area | region on the release film (application object) 11.

Next, FIGS. 23-29 show the example of the expansion pattern of the fluid resin which used the resin expansion process by gas injection. FIG. 23 shows an example in which the release film 11 and the coating region 11a are circular, and the fluid resin 21 is discharged only to the center portion of the coating region 11a in the same manner as in FIG. 7. FIG. 23A is a longitudinal sectional view of the air blow nozzle 19 (gas blow nozzle), FIG. 23B is a cross sectional view of the air blow nozzle 19, and FIG. 23C is a resin enlargement step. It is a top view which shows the appearance of a. As shown, in this example, the shape of the gas injection port of the air blow nozzle 19 is substantially circular hole shape. In this example, the gas is injected into the flowable resin while one or both of the air blow nozzle 19 and the fixed table 12 are moved in the XY direction, so that the flowable resin 21 is centered in the coating region 11a as shown. To the periphery.

24 shows an example in which the release film 11 and the application region 11a are square, and the fluid resin 21 is discharged only to one end (near one side of the square) of the application region 11a. FIG. 24A is a longitudinal sectional view of the air blow nozzle 19, FIG. 24B is a cross sectional view of the air blow nozzle 19, and FIG. 24C is a schematic view of the resin expanding process. It is a top view shown by. As shown, in this example, the shape of the gas injection port of the air blow nozzle 19 is an elongate slit shape. In this example, as shown in FIG. 24 (c), by injecting gas into the fluid resin while moving one or both of the air blow nozzle 19 and the fixed table 12 (not shown) in the XY direction, the fluid resin (21) is extended toward the other end from the one end of the application | coating area | region 11a.

25 shows an example in which the release film 11 and the application region 11a are square, and the fluid resin 21 is discharged to the center and four corners of the application region 11a. FIG. 25A is a longitudinal sectional view of the air blow nozzle 19, FIG. 25B is a cross sectional view of the air blow nozzle 19, and FIG. 25C is a schematic view of the resin expanding process. It is a top view shown by. As shown, in this example, the shape of the gas injection port of the air blow nozzle 19 is a substantially circular hole shape. In addition, in this example, the air blow nozzle 19 is provided in each position corresponding to the resin discharge point of the center part and four corners of the application | coating area | region 11a. In FIG. 25, the amount of the flowable resin discharged to the center portion is larger than the four corners, and correspondingly, the gas injection port of the air blow nozzle 19 is also larger than the four corners. As shown in FIG. 24C, the fluid resin 21 is enlarged by injecting gas into the fluid resin 21 from each air blow nozzle 19.

26 to 29 are process plan views showing an example in which the release film 11 and the application region 11a are square, and the fluid resin 21 is discharged only at the center portion of the application region 11a. In this example, the shape of the gas injection port of the air blow nozzle 19 is an elongate slit shape. First, as shown in FIG. 26, the fluid resin 21 is discharged only to the center part of the application | coating area | region 11a. And as shown in FIG. 26, one or both of the air blow nozzle 19 and the fixing stand 12 (not shown) are moved along the height direction of the square of the application area | region 11a (up and down direction of drawing). Thereby, as shown in FIG. 27, the fluid resin 21 is expanded along the height direction of the square of the application | coating area | region 11a. Next, the release film 11 is rotated 90 degrees together with the fixing table 12 (not shown), and the height direction and width direction of the square of the application area | region 11a are changed. And as shown in FIG. 28, one or both of the air blow nozzle 19 and the fixing stand 12 (not shown) are moved along the height direction of the square of the application | coating area | region 11a (up and down direction of drawing) again. Thereby, as shown in FIG. 29, the fluid resin 21 will be in the state extended to the whole application | coating area | region 11a on the release film 11. As shown in FIG.

As described above, the gas is injected into the flowable resin 21 by using FIGS. 23 to 29 to apply the force to the flowable resin 21 by the gas to continuously spread the flowable resin 21. An example of a branch is shown. However, in the present invention, the resin expanding step is not limited thereto, and any modification may be made.

In addition, in this invention, an application object is not limited to a release film. For example, it is possible to discharge and expand the flowable resin thereon as a plate-like member (heat-dissipating heat sink, electromagnetic shielding barrier metal, etc.) as a coating object. For example, a plate-shaped member can be mounted on a release film, and fluid resin can be discharged or expanded on this plate-shaped member. And the conveyance process which conveys the said plate-shaped member to the place which performs the said resin sealing process for every mold release film can also be performed, and the said compression molding process can also be performed. Moreover, the said discharge process, the said resin expansion process, the said conveyance process, and the said compression molding process using the said plate-shaped member can be performed without using a release film.

As described above, the object to be coated in the present invention is not particularly limited, but may be, for example, a substrate (work) on which a chip is mounted. However, it is more preferable that it is not a board | substrate (work) especially when spreading the discharged fluid resin. For example, as mentioned above, by apply | coating a release film, a plate-shaped member, etc. which are not a member of the board | substrate (work) side in a resin molded article with fluid resin, even if a force is applied to the said fluid resin in the said resin expansion process, Unnecessary force is not applied to the workpiece). Thereby, for example, damage to the member (for example, a chip, a wire, etc.) arrange | positioned on a board | substrate (work) can be prevented. On the other hand, when making an application | coating object into the board | substrate (work) in which the chip was mounted, the data of a chip is input by the scan of the laser displacement meter 15, the imaging of the camera 16, etc., for example, and the volume of a fluid resin Can be used to compute.

Moreover, the magnitude | size of an application object (release film etc.) is not specifically limited, either. However, since this invention can reduce the nonuniformity of the thickness of fluid resin, it is especially suitable for a large application object. For example, the long diameter of an application | coating area | region may be 300 mm or more in the said application object (release film etc.).

(2) compression molding process

Next, the example of the compression molding process in the manufacturing method of the resin molded article of this invention is demonstrated using FIGS. 30-33. In the compression molding process shown in FIGS. 30-33, the compression molding mechanism shown in FIG. 4 is used. However, in FIGS. 30-33, parts other than the shaping | molding mold 531 are abbreviate | omitted for the sake of simplicity.

First, as shown in FIG. 30, the board | substrate (pre-molding board | substrate) 544a is supplied and fixed to the lower surface of the upper mold 101. As shown in FIG. The substrate 544a can be fixed to the lower surface of the upper die 101 by, for example, a clamp (not shown). On the other hand, the chip 1 is fixed to the lower surface of the board | substrate 544a (as opposed to the fixing surface with respect to the upper mold | type 101) as shown.

Next, as shown in FIG. 30, the release film 11 to which the fluid resin 21 was apply | coated is conveyed to the shaping | molding mold 544a by the resin loader (resin conveyance mechanism) 521 (transfer process). At this time, for example, as shown in the drawing, the frame member 701 is mounted on the release film 11, and the flowable resin 21 is mounted on the release film 11 in the opening of the frame member 701. It may be in one state.

And as shown in FIG. 31, the resin loader 521 mounts the release film 11 which mounted the fluid resin 21 in the cavity 532 of the lower mold | type 102. As shown in FIG. At this time, the release film 11 can be adsorb | sucked to the cavity 532 by the suction mechanism (not shown). Thus, the fluid resin 21 is supplied to the cavity 532 of the lower mold 102 together with the release film 11.

Next, as shown in FIG. 32 and FIG. 33, one surface of the substrate 544a is resin-sealed by the sealing resin 21b in the lower mold 102 of the molding mold 531. Specifically, for example, as shown in FIG. 32, the lower mold | type 102 is raised to the arrow Y1 direction by the mold clamping mechanism 115 (not shown in FIG. 32) of FIG. The chip 1 mounted on the lower surface of the substrate 544a is immersed in the flowable resin filled in 532. Thereafter, the fluid resin 21 is heated and cured to form a sealing resin. At this time, the fluid resin 21 can be heated by the lower mold | die 102 heated up previously by the heating mechanism (not shown). Thereby, as shown in FIG. 33, the resin-sealed completed board | substrate (molding completed board | substrate, electronic component) 544b by which the chip | tip 2 fixed to the board | substrate 544a was sealed by the sealing resin 21b can be manufactured. have. Then, as shown in FIG. 33, the lower mold | die 102 is lowered in the direction of the arrow Y2 by the mold clamping mechanism 115 (not shown in FIG. 33), and mold opening is performed.

As mentioned above, although the example of the compression molding process and the conveyance process was shown, the said compression molding process and the said conveyance process are not specifically limited, For example, it can carry out according to the general resin sealing method.

(3) Manufacturing method of resin molded article

Next, an example of the whole process of the manufacturing method of the resin molded article using the compression molding apparatus of FIG. 5 or FIG. 6 is demonstrated.

First, in the release film cutting module (release film cutting mechanism) 510, as described above, the tip of the release film is taken out of the roll-shaped release film 512 by the film gripper 513 to release the film holder mounting mechanism 511. The upper surface of the table 12 mounted on the ()) is covered, and the release film is fixed on the table 12. In this state, as described above, the release film is cut by a cutter (not shown) to form a circular release film 11. The remaining release film (waste material) which cut and separated the circular release film 11 is processed by the waste material processing mechanism (not shown).

Next, the nozzle 14 in the application module 520 together with the table 12 (not shown) and the release film 11 mounted thereon with the film holder mounting mechanism 511 (film holder moving mechanism 523) mounted thereon. To the bottom of the resin supply port. In this state, the fluid resin 21 is discharged (discharge step) and enlarged (resin expansion step), for example, in the application area on the release film 11. The discharge step and the resin enlargement step can be performed, for example, as described above. In this case, the movement of the resin discharging position is performed by moving (or rotating) the film holder moving mechanism 523 together with the table 12 (not shown) and the release film 11 mounted thereon, for example. I can do it. On the other hand, as described above, the resin enlargement step can be omitted in the present invention.

Next, the flowable resin apply | coated to the release film 11 and the application | coating area | region on it is moved from the film fixing stand moving mechanism 523, and is supported by the resin loader (resin conveyance mechanism) 521. Next, as shown in FIG. Movement of the release film 11 from the film fixing stand moving mechanism 523 to the resin loader 521 can be performed by supporting the release film 11 with the support mechanism (not shown) which the resin loader 521 has.

Next, the robot arm 543 inverts the front and back of the pre-molded substrate 544a taken out from the receiving portion of the pre-molded substrate 544a as described above. Thereby, the board | substrate 544a is mounted in the board | substrate loader 541 so that a chip mounting surface may face downward, and it conveys in the compression molding module 530. FIG. At this time, the substrate 544a before molding is supplied to the mold surface of the upper mold (molding mold 531). Next, as demonstrated in FIG. 30, the rail 542 is moved with the post-processing mechanism 522 which integrated the release film 11 and the resin loader 521 which supported the fluid resin with the resin loader 521. Next, as shown in FIG. It conveys into the compression shaping module 530 (conveying mechanism). At this time, as demonstrated in FIG. 31, the release film 11 and the fluid resin can be supplied in the lower mold | type cavity 532 which has a circular opening part by mounting the mold release film 11 to the lower mold surface.

Next, as described with reference to FIG. 32, in the compression molding module 530, the molding mold 531 (upper mold and lower mold) is fastened. Accordingly, the chip mounted on the pre-molding substrate 544a set in the upper mold is immersed in the flowable resin in the lower mold cavity 532, and the fluid resin in the lower mold cavity 532 can be pressurized by the cavity bottom member. have. As described with reference to FIG. 33, in the molding mold 531 (lower mold cavity 532), the flowable resin is solidified (for example, cured by heating), and the resin (solidified resin) 21b after solidification is obtained. ) To seal the electronic component. As a result, a resin-sealed substrate 544b (molded substrate and electronic component) is formed. Next, as described with reference to FIG. 33, the molding mold 531 (upper mold and lower mold) is opened. And the resin-sealed board | substrate 544b is taken out from the board | substrate loader 541, it is conveyed and accommodated to the conveyance module 540 side. In addition, after taking out the resin sealing completed board | substrate (molding completed board | substrate, electronic component) 544b from the shaping | molding mold 531 in the board | substrate loader 541, using the upper surface cleaner (not shown) of the post-processing mechanism 522. Clean the upper substrate setting. In parallel with this, or slowing down the timing, the release film which became unnecessary using the release film removal mechanism (not shown) of a post-processing mechanism can be taken out from a lower mold surface.

Or the board | substrate loader 541 which mounted the resin sealing completed board | substrate 544b (electronic component) can be moved from the compression molding module 530 to the conveyance module 540. In this case, the robot arm 543 removes the resin-sealed substrate (molded substrate, electronic component) 544b from the substrate loader 541 and reverses the front and back as described above. Thereby, the resin-sealed board | substrate (molding board | substrate, electronic component) 544b is accommodated in the accommodating part of a resin-sealing board | substrate (molding board | substrate, electronic component) so that sealing resin side may face upward. In this way, an electronic component (resin molded article) can be manufactured.

In FIG. 5 and FIG. 6, the manufacturing apparatus of the electronic component and the manufacturing method of the electronic component using the same have been described. However, the present invention is not limited to electronic components, and can be applied to the production of any other resin molded article. For example, when manufacturing optical components, such as a lens, an optical module, a light guide plate, or other resin products by compression molding, this invention is applicable.

(4) manufacturing method of the product

The present invention can be applied to, for example, WLP (Wafer_Level_Package). The WLP to which the present invention is applied may be, for example, a FO-WLP (Fan-Out Wafer Level Package). When using this invention for WLP, it does not specifically limit except the said discharge process and the said compression molding process, It can carry out according to general WLP. Specifically, for example, as described above, first, the electronic component is manufactured as an intermediate product by the manufacturing method of the first electronic component of the present invention (intermediate product manufacturing step). And the other electronic component which is a finished product is manufactured from the said intermediate product (finished product manufacturing process, the manufacturing method of the 2nd electronic component of this invention). In the manufacturing method of the 2nd electronic component of this invention, as above-mentioned, you may remove an application | coating object from the chip | tip and sealing resin of an intermediate product, for example in a finished product manufacturing process. In the case where the method for manufacturing the second electronic component of the present invention is applied to the WLP, for example, in the electronic component as a finished product, the chip is simply attached to the substrate (carrier) to be sealed, and electrical connection (wire bonding and flipping) is performed. Chip bonding, etc.) may not be performed. For example, as mentioned above, after removing an application | coating object from the chip | tip of an intermediate product and sealing resin, a wiring member can be connected to a chip | tip. Although it does not specifically limit as a wiring member, For example, a wire, a ball (bump), a flip chip, etc. are mentioned.

The manufacturing process at the time of applying the manufacturing method of the 2nd electronic component of this invention to WLP can be performed more specifically, for example as follows. That is, an intermediate product is manufactured by first sealing a chip bonded to a carrier such as a semiconductor substrate such as a silicon wafer, a glass substrate, a metal substrate, or the like by applying the manufacturing method of the resin molded article of the above-described embodiment ( Intermediate manufacturing process). About this intermediate product, a carrier can be removed, wiring to a chip (rewiring process), and it can separate as individual electronic components by a cutting process, and can manufacture a finished product (finished product manufacturing process). In addition, the following examples are also possible. That is, using a wiring layer formed on a semiconductor substrate such as a silicon wafer as a carrier, the chip is bonded to the wiring layer of the semiconductor substrate so as to be electrically connected, and an intermediate product is produced by applying the manufacturing method of the resin molded article of the embodiment to the chip. (Intermediate product manufacturing process). With respect to this intermediate product, the finished product can be produced by separating the carrier as a separate electronic component by leaving the carrier layer in the state where the wiring layer is connected to the chip, and carrying out a cutting step (finished product manufacturing step).

Although it does not specifically limit as a manufacturing process at the time of applying the manufacturing method of the 2nd electronic component of this invention other than WLP, For example, it can do as follows. That is, first, the resin is sealed by applying the manufacturing method of the resin molded article of the above-described embodiment to a chip electrically connected to a semiconductor substrate such as a silicon wafer such as a silicon wafer or a printed substrate to which the chip is electrically connected. Manufacture the product (intermediate manufacturing process). By performing a cutting process with respect to this intermediate product, it can isolate | separate as individual electronic components and can manufacture a finished product (finished product manufacturing process).

In addition, as mentioned above, the manufacturing method of the 2nd electronic component of this invention is one Embodiment of the manufacturing method of the said product of this invention. In addition, the manufacturing method of the said product of this invention is not limited only to the manufacturing method of the 2nd electronic component of this invention, For example, it can be used also for manufacture of products other than an electronic component.

<Example 2>

Next, another Example of this invention is described. This Example is the same as Example 1 except the said volumetric measurement process.

The volume measuring process of this Example is demonstrated using FIG. 2, FIG. 3, FIG. 19, FIG. 34, and FIG. In this embodiment, the camera 16 is further used in addition to the laser displacement meter 15. That is, first, as in Example 1, the thickness of the fluid resin 21 is measured as shown in FIGS. 2 and 19. Next, the fluid resin 21 is imaged directly from the camera 16 shown in FIG. Fig. 34 schematically shows an image captured in this manner. As shown in the figure, an image (planar shape) of the fluid resin 21 appears inside the image P. FIG.

As shown in the functional block diagram of FIG. 35, the volume of the fluid resin 21 is calculated and stored by the calculation unit 551 and the storage unit 552 included in the control unit 550. That is, first, the thickness data (measurement result) of the fluid resin 21 measured by the laser displacement meter 15 is transmitted to the calculating part 551 similarly to FIG. 20 (step S1). Moreover, the image of the fluid resin 21 shown in the image P of FIG. 34 is transmitted to the calculating part 551 (process S1B). Then, the phase of the fluid resin 21 is binarized by the calculation unit 551 to calculate the area of the fluid resin 21, and using the data of the area and thickness of the fluid resin 21, the calculation unit 551. ), The volume of the fluid resin 21 is calculated (calculation step). On the other hand, at this time, the calculation part 551 can be made to image-process etc. of the fluid resin 21. Then, the calculated volume of the flowable resin 21 is transmitted to the storage unit 552 (step S2), and stored in the storage unit 552 (memory step). Alternatively, the measurement result of the laser displacement meter 15 is directly transmitted to the storage unit 552 (step S1A), and the image of the fluid resin 21 shown in the image P of FIG. 34 is directly stored in the storage unit 552. Can be sent (step S1C), and stored in the storage unit 552 (memory step). And the measurement result of the laser displacement meter 15 memorize | stored by the memory | storage part 552, and the image of the fluid resin 21 shown in the image P of FIG. 34 are transmitted to the calculating part 551 (step S3), and they are used. The volume of the fluid resin 21 can be computed by the calculating part 551 (calculation process). In this manner, the volume measuring step can be performed. In addition, as above-mentioned, processes other than this can be performed similarly to Example 1. On the other hand, the calculation unit may not be independent of the laser displacement meter 15 and the camera 16. For example, at least a part of the calculator may be embedded in the camera 16 to calculate the area of the fluid resin, and at least a part of the calculator may be embedded in the laser displacement meter 15 to calculate the volume of the fluid resin. . In addition, at least a part of the storage unit may be built in the laser displacement meter 15 and the camera 16.

According to this embodiment, since the area is measured in addition to the thickness of the flowable resin 21, the volume of the flowable resin 21 can be calculated with higher accuracy than in the first embodiment.

On the other hand, only one laser displacement meter (sensor) 15 and one camera (sensor) 16 may be used, for example, but a plurality of laser displacement meters (sensors) 15 and cameras (sensors) 16 may be used simultaneously to shorten the measurement time. Specifically, the whole of the flowable resin 21 can be measured by measuring a part of the flowable resin 21 with each of the plurality of sensors.

<Example 3>

Next, another embodiment of the present invention will be described. This Example is the same as Example 1 and Example 2 except the said volumetric measurement process.

The volume measuring process of a present Example is demonstrated using FIG. 2, FIG. 20, and FIG. In the present embodiment, the camera 16 is not used, but the laser displacement meter 15 is used to measure the area in addition to the thickness of the flowable resin 21 as shown in FIGS. 2 and 36. 36 is a figure which shows the top view of the fluid resin 21, and the trace | route of the movement of the laser displacement meter 15. FIG. That is, as shown by arrow M1 of FIG. 36, the laser displacement meter 15 scans the whole surface of the fluid resin 21, moving zigzag. Then, as shown in regions R1, R2, and R3 in the figure, the scanned regions are divided, and three-dimensional data (thickness, width, and length) of the fluid resin 21 is obtained for each. In addition, although the shape of the divided area | region is a strip | belt shape in FIG. 36, it is not limited to this, Any shape may be sufficient.

In addition, after acquiring three-dimensional data of each divided region, as shown in the functional block diagram of FIG. 20, the arithmetic unit 551 and the storage unit 552 included in the control unit 550 allow the fluid resin 21 to be used. Calculate and remember the volume That is, first, the three-dimensional data (measurement result) of each divided area is collectively sent to the calculating part 551 (step S1). And the volume of the whole fluid resin 21 is computed by the calculating part 551 using such data (calculation process). Then, the calculated volume of the flowable resin 21 is transmitted to the storage unit 552 (step S2) and stored in the storage unit 552 (memory step). Alternatively, the measurement result of the laser displacement meter 15 may be directly transmitted to the storage unit 552 (step S1A), and stored in the storage unit 552 (memory step). And the measurement result of the laser displacement meter 15 memorize | stored by the memory | storage part 552 is transmitted to the calculating part 551 (step S3), and the volume of the fluid resin 21 is calculated by the calculating part 551 using the measurement result. Can be calculated (calculation process). Moreover, the volume of the fluid resin 21 by the calculation can also be sent to the memory | storage part 552 (step S2), and can be stored in the memory | storage part 552 (memory process). As described above, a volume measurement step of measuring the volume of the discharged flowable resin 21 can be performed. In addition, as above-mentioned, processes other than this can be performed similarly to Example 1 or Example 2. Meanwhile, at least a part of the calculator or at least a part of the memory may be embedded in the laser displacement meter 15.

According to this embodiment, since the area is measured in addition to the thickness of the flowable resin 21, the volume of the flowable resin 21 can be calculated with higher accuracy than in the first embodiment. In addition, by dividing the measurement area to acquire and calculate data, it is possible to calculate the volume of the flowable resin 21 with higher precision than in Example 2, which measures the thickness and area of the flowable resin 21 as in the present embodiment. have.

[Effects of the Present Invention]

According to the present invention, for example, in the volume measuring mechanism, by using a non-contact displacement meter, the amount of resin (volume) of the discharged flowable resin can be grasped with non-contact and high accuracy. The non-contact displacement meter is not particularly limited, but may be, for example, at least one of the above-described electromagnetic displacement meter, ultrasonic displacement meter, capacitive displacement meter, and overcurrent displacement meter. The electromagnetic displacement meter may be, for example, an optical displacement meter, and may be, for example, a laser displacement meter described in each of the above embodiments.

According to the present invention, since the resin amount of the flowable resin can be managed by volume, the relationship between the resin amount and the resin thickness of the resin molded article can be grasped with high accuracy, and the resin thickness of the resin molded article can be managed more accurately. . For this reason, according to this invention, the nonuniformity of the resin thickness of a resin molded article can be reduced as mentioned above. On the other hand, in the technical field to which the present invention belongs, conventionally, there is no idea that the resin amount of the flowable resin is managed by volume. For example, as in Patent Document 1, the resin amount of the flowable resin is measured by weight measurement. Managed. However, even when trying to calculate the volume from the weight measurement value and density (specific gravity) of the flowable resin using the same weight measurement as in Patent Literature 1, there is a nonuniformity in the density (specific gravity) of the flowable resin, so that the accurate volume calculation It is difficult. For this reason, as mentioned above, there exists a possibility that the resin thickness of a resin molded article may become nonuniform. On the other hand, according to this invention, since the volume of fluid resin can be measured correctly, the gap of the resin thickness of a resin molded article can be reduced.

According to this invention, since the nonuniform expansion of a fluid resin can be reduced, the following problems (i) to (e) in a resin molded article can be suppressed or prevented, for example. However, such an effect is an illustration and does not limit this invention.

(A) flow mark

(B) Segregation of filler (filler) in resin

(C) voids (bubbles) in the resin

(D) Thickness unevenness of package (resin molded product)

(E) Incline of package (resin molded product)

This invention is not limited to the above-mentioned embodiment, It can employ | adopt arbitrarily suitably combining, changing, or selecting as needed within the range which does not deviate from the meaning of this invention.

1: chip 11: release film (applicable object)
11a: coating area 12: table (fixing table)
13: dispenser (dispensing mechanism) 14: nozzle
15: displacement meter (dimension measuring instrument) 16: camera
17: Heater 18: Camera (Sensor)
19: gas blow nozzle (gas injection mechanism)
21: fluid resin 21b: sealing resin
101: upper mold 102: lower mold
103: lower mold base member 104: lower mold cavity side member
105: elastic member 106: lower mold cavity bottom member
111: fixed platen 112: movable platen
113: Base 114: Tie bar (support member)
115: mold fastening mechanism 116: drive source
117: transmission member
510: release film cutting module (release film cutting mechanism)
511: film holder mounting mechanism 512: roll-shaped release film
513: film gripper
520: application module (discharge mechanism and resin expansion mechanism)
521: resin loader 522: post-processing mechanism
523: film holder moving mechanism 530: compression molding mechanism (compression molding module)
531: molding mold 532: lower mold cavity
540: conveying mechanism (conveying module) 541: substrate loader
542: rail 543: robot arm
544a: Pre-sealing substrate (pre-molding substrate)
544b: Resin-sealed substrate (molded substrate)
550: control unit 701: frame member
L1, L2: laser light M1: direction of movement of the laser displacement meter

Claims (19)

A discharge mechanism for discharging the flowable resin for molding the resin into the coating area of the coating object;
A volume measuring mechanism for measuring a volume of the flowable resin discharged to the application region; And
And a compression molding mechanism for compression molding using the application object to which the fluid resin is applied. The method of claim 1,
And a volume measuring mechanism for measuring the volume of the flowable resin discharged to the coating area, and a calculating part for calculating the volume of the flowable resin from the measurement result of the size measuring mechanism. The method of claim 2,
The dimension measuring mechanism is a dimension measuring mechanism for thickness measurement,
And the calculation unit calculates the volume of the flowable resin based on the length of the flowable resin discharged to the coating region and the thickness of the flowable resin measured by the dimension measuring mechanism. The method of claim 2,
The dimension measuring mechanism is a dimension measuring mechanism for thickness measurement,
The volume measuring mechanism further comprises a camera for imaging an image of the flowable resin discharged to the application region,
And the calculation unit calculates the volume of the flowable resin based on the area of the flowable resin based on the imaging data by the camera and the thickness of the flowable resin measured by the dimension measuring mechanism. The method of claim 2,
The dimension measuring mechanism is a dimension measuring mechanism for measuring three-dimensional data,
And the calculation unit calculates a volume of the flowable resin based on three-dimensional data of the flowable resin obtained by the measurement of the dimension measuring mechanism. The method of claim 2,
Further comprising a storage unit for storing data,
And said data is at least one of a measurement result by said dimension measuring mechanism and a calculation result by said calculating unit. The method of claim 1,
And a moving mechanism, wherein the discharge mechanism moves the discharge position of the fluid resin with respect to the application object. The method of claim 1,
And a resin enlargement mechanism for spreading the flowable resin discharged in the application region. The method of claim 1,
The resin molding apparatus further includes the conveyance mechanism which conveys the said application object to the said compression molding mechanism. The method of claim 1,
The application object is a release film,
A resin molding apparatus further comprising a cutting mechanism for cutting the release film. The method according to any one of claims 1 to 10,
The ejection mechanism and the compression molding mechanism are different modules, and the resin molding apparatus is detachable from each other. The method according to any one of claims 1 to 10,
The compression molding mechanism is plural,
Each of the plurality of compression molding mechanisms is a different module,
The discharge mechanism and the plurality of compression molding mechanisms are different modules,
At least one of the discharge mechanism and the plurality of compression molding mechanisms is detachable from each other with respect to at least one of the other mechanisms. A discharging step of discharging the flowable resin for molding the resin into the coating region of the coating object;
A volume measurement step of measuring a volume of the flowable resin discharged to the application region; And
And a compression molding step of compression molding using the application object to which the flowable resin is applied. The method of claim 13,
And a volume measuring step of measuring the size of the flowable resin discharged to the coating region, and a calculating step of calculating the volume of the flowable resin from the measurement result of the size. The method of claim 14,
The manufacturing method of the resin molded article which measures the thickness of the discharged said flowable resin at least in the said dimension measuring process. The method of claim 15,
In the volume measuring step, the volume of the flowable resin is calculated on the basis of the thickness and area of the discharged flowable resin. The method of claim 14,
In the dimension measuring step, three-dimensional data of the discharged flowable resin is measured,
In the volume measuring step, the volume of the flowable resin is calculated on the basis of the three-dimensional data of the flowable resin discharged. The method of claim 14,
Further comprising a storage step of storing data,
The said manufacturing process WHEREIN: The manufacturing method of the resin molded article which stores at least one of the measurement result of the said dimension, and the calculation result of the volume of the said fluid resin. A product is manufactured using the resin molded article manufactured by the manufacturing method in any one of Claims 13-18.

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