JP3501441B2 - Method and apparatus for manufacturing electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a TAB (Tape Autom).
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component and a manufacturing apparatus thereof that are assembled into a package of ated bonding (hereinafter abbreviated as TAB) system.

[0002]

2. Description of the Related Art In recent years, as a package using the TAB method, a tape carrier package in which an electronic element such as a semiconductor chip is bonded to a tape carrier and resin-sealed, a plastic package in which the tape carrier is further connected to a lead frame, and a tape are used.・ There is a ball grid array. In particular, in a field where a multi-pin package is required such as a semiconductor device for a liquid crystal driver, it is common to mount a semiconductor chip on a tape carrier package.

A conventional TAB type electronic component and its manufacturing method will be described below.

FIG. 6 is a sectional view showing the structure of this TAB type electronic component. In FIG. 6, 1 is a tape carrier,
The device hole 5 is opened, and the metal lead 3 is attached and formed on the insulating tape 2. The portion where the metal lead 3 projects into the device hole 5 is the inner lead 4. A semiconductor chip 6 has bumps 7 formed on its surface. The tip of the inner lead 4 is connected to the semiconductor chip 6 via the bump 7. A sealing resin 8a covers at least a part of the surface of the semiconductor chip 6, the inner leads 4, the bumps 7, and the insulating tape 2.
The sealing resin 8a is intended to protect the surface of the semiconductor chip 6 and the joint between the inner lead 4 and the bump 7, and to integrally fix the tape carrier 1 and the semiconductor chip 6 together.

Next, FIG. 7 is a schematic view of a sealing device for manufacturing a semiconductor chip by sealing a semiconductor chip in such a TAB type package. In FIG. 7, 9 is a sealing resin application part of the sealing device. Here, the syringe 11 is filled with the liquid resin 8b, and the syringe 11 is filled with the dispenser 12.
By applying air pressure to the liquid resin 8b, the liquid resin 8b is dropped from the needle 10 attached to the tip of the syringe 11 to the tape carrier portion to which the semiconductor chip 6 is attached. At this time, while drawing the needle 10 at a predetermined speed at a predetermined position from above the semiconductor chip 6, the inner lead 4, and a part of the insulating tape 2 shown in FIG. Apply. Then, the liquid sealing resin 8b while being conveyed through the curing furnace 17.
By drying and curing, the sealing resin 8a shown in FIG. 6 is formed.

In the process of manufacturing an electronic component using such a sealing device as shown in FIG. 7, the film thickness of the sealing resin 8a may change. The cause of the variation in the discharge amount of the liquid resin 8b that varies the film thickness is as follows. That is, (1) the viscosity of the liquid resin 8b changes with respect to the ambient temperature, but the higher the temperature, the lower the viscosity.
Under the same air pressure of 2, the discharge amount increases. On the contrary, when the temperature becomes low, the discharge amount decreases.

(2) When the solvent contained in the liquid resin 8b volatilizes with time and decreases, the viscosity decreases and the discharge amount decreases under the same air pressure of the dispenser 12.

(3) Since the liquid resin 8b is deposited on the inner wall of the needle 10 with time and the inner diameter becomes narrow, the discharge amount is reduced under the same air pressure of the dispenser 12.

In response to such a change in film thickness, usually, some of the TAB type electronic parts after curing are taken out, the film thickness is measured by a contact type or non-contact type length measuring device, and the measured value is used as a basis. The discharge amount of the liquid resin is adjusted by the air pressure of the dispenser 12 to maintain the liquid resin at a predetermined value. However, in this method, (1) it is necessary to wait for the liquid resin 8b to be applied to the tape carrier 1 and then to pass through the curing furnace 17 in order to take out the electronic component for measuring the film thickness of the sealing resin 8a. (2) If the air pressure of the first dispenser 12 is improper and the film thickness does not fall within the predetermined range when starting the production, at least up to the syringe 11 and the outlet of the curing furnace 17. In between, there will be electronic components with the liquid resin 8b applied with an inappropriate film thickness, and there is a problem that a large number of electronic components will be out of specification.

A technique capable of improving the above-mentioned problems is disclosed in Japanese Patent Application Laid-Open No. 6-314714. That is, a non-contact type length measuring instrument is installed in front of the entrance of the curing furnace,
This is a method in which after the liquid resin is applied, the tape carrier is measured before entering the tape carrier into the curing furnace, and the temperature of the curing furnace is adjusted based on the measurement result. In this method, since the film thickness of the liquid resin is measured for each application against the change in the film thickness due to the change in the discharge amount of the liquid resin over time, many defective products are manufactured after the application of the liquid resin. There is an advantage that the variation of the coating film thickness can be known in advance, and the discharge amount of the liquid resin can be immediately adjusted. However, the invention disclosed in the above publication is aimed at controlling the curing temperature corresponding to the measured film thickness of the liquid resin and completely curing the entire resin even when the film thickness varies. Yes,
It is not intended to control the sealing resin film thickness of the finally completed electronic component package to have a constant value.

[0011]

The sealing device in the invention described in the above-mentioned document has one liquid resin coating device and one film thickness sensor installed, but is actually used in the mass production stage. As shown in FIG. 7, the device is a plurality of coating devices (needle 10, syringe 11, dispenser 12) for increasing the productivity of TAB electronic components.
Are arranged side by side in the transport direction of the tape carrier so that a plurality of liquid resins 8b can be applied onto the tape carrier 1 at a time. In the case of having a plurality of such coating devices, according to the method of the above-mentioned prior art,
Install the same number of length measuring instruments as the coating device to measure the film thickness,
If it is dedicated to the film thickness measurement of the liquid resin applied from the coating device corresponding to each length measuring device, it is possible to distinguish which coating device has applied the film thickness. However, in such a method, it is necessary not only to secure a space for installing a film thickness measuring device, but also to provide multiple control systems for feeding back the film thickness measurement result to the application of the liquid resin. The rise is inevitable. Further, when the type of the semiconductor chip changes and the pitch of the semiconductor chip on the tape carrier changes, there is a drawback that the work such as adjusting the installation position of the film thickness measuring device according to the pitch becomes complicated.

On the other hand, when one film thickness measuring device is installed, the above problem disappears, but since the film thickness of the liquid resin applied by a plurality of coating devices is measured by one measuring device, It cannot be discriminated by which coating device the coating thickness was applied, and therefore feedback cannot be made to the film thickness adjustment.

In any case, the conventional resin encapsulation process or the resin encapsulation device has problems in distinguishing the applied liquid resin and controlling the film thickness. The present invention solves the above-mentioned conventional problems, and in manufacturing a TAB type electronic component, even if the film thickness of the liquid resin applied by a plurality of coating devices is measured using a pair of length measuring devices, A method capable of accurately feedback controlling the film thickness of a resin to a specific coating device, and efficiently manufacturing an electronic component sealed with a resin having a stable film thickness with little variation in time, and a low cost device therefor The purpose is to provide.

[0014]

SUMMARY OF THE INVENTION In order to solve the above problems and to achieve the object, the present invention provides a method of manufacturing an electronic component in which a plurality of liquid resin coating devices are used to form a semiconductor chip on a tape carrier surface. After the liquid resin is simultaneously applied to a plurality of regions containing the resin, before the introduction into the curing furnace, a pair of the measuring device provided in front of the entrance of the curing furnace is used to remove the length measuring device and the liquid resin. The step of measuring the distance and calculating the film thickness of the liquid resin from the measured distance, the step of outputting a signal after the measurement by the length measuring device is completed, and if the calculated film thickness is not the predetermined film thickness, At the same time as the signal output,
Alternatively, after a certain period of time after the signal is output, the step of controlling the corresponding coating device including the step of controlling the corresponding coating device is performed, and the liquid resin coated passes through the length measuring device. It has a step of repeating each time.

Further, the manufacturing apparatus of the present invention includes a plurality of liquid resin coating devices capable of simultaneously coating liquid resin onto a plurality of regions including semiconductor chips on a tape carrier,
A pair of length measuring instruments installed in front of the curing furnace to measure the distance to the liquid resin, a counter that generates a signal each time the measurement by the length measuring instrument is completed, and a film thickness calculated from the measurement distance. And a control device for controlling the corresponding coating device so that the coating film is coated to have a predetermined film thickness when the film thickness is not the predetermined film thickness.

According to the present invention, in particular, a signal is output every time the measurement by the length measuring device is completed, and the corresponding coating device is controlled at the same time as this signal output or after a certain time after the signal output. By doing so, it is possible to distinguish which coating device the measured liquid resin has been coated on, and thereby the coating device to be accurately controlled is automatically selected. Which coating device the liquid resin passing through the position where the length measuring device is installed for distance measurement is specified once at the beginning of the process, and once set, the coating device is installed after that, Since the liquid resins corresponding to the respective coating devices pass in the arranged order, the control device can recognize the coating devices corresponding to all the passing liquid resins. Since the output signal after measuring the distance to each liquid resin is an output signal unique to the liquid resin, the application device to be controlled is recognized in synchronization with the signal.

Even when the film thickness of the liquid resin applied by the plurality of coating devices is measured by using a pair of length measuring devices, the coating device corresponding to the measured liquid resin is controlled without error, and the liquid resin is discharged. Since the amount can be adjusted, it is not necessary to adjust the installation position of the length-measuring device even when the pitches of the semiconductor chips on the tape carrier are different, and it is possible to realize a low-cost sealing device with a small space for installing the length-measuring device. .

By the way, in the manufacturing method of the present invention, the film thickness is measured immediately after the liquid resin is applied to the tape carrier and before the hardening by the length measuring device installed in front of the hardening furnace. This makes it possible to immediately feed back the film thickness data to the determination of the amount of the liquid resin, without having to wait for the film thickness measurement until the film is cured and comes out from the curing furnace as in the conventional case. Therefore, it is possible to prevent the production of a large number of electronic components applied with an abnormal film thickness deviating from the predetermined film thickness. The more the length measuring device is installed adjacent to the syringe, the greater the effect.

Further, as is apparent from the above-mentioned constitution of the present invention, the conventional method measures the resin film thickness in a state almost at the completion stage after the liquid resin is applied and cured through the curing furnace. On the other hand, in the present invention, the film thickness of the liquid resin immediately after coating is measured. This is based on the finding that the film thickness after curing can be controlled and controlled even if the film thickness of the liquid resin immediately after coating is measured.

The liquid resin used for the TAB semiconductor component is
There are types that include volatile solvents and types that do not include solvents. When a liquid resin containing a volatile solvent is used, the film thickness before drying and curing and the film thickness after curing are reduced by the amount corresponding to the volume in which the solvent is volatilized. This rate of decrease is constant,
There is a linear correlation between the film thickness measurement value of the liquid sealing resin and the film thickness of the sealing resin after curing.

FIG. 8 shows the thickness of the liquid resin before curing (horizontal axis).
And a correlation graph in which an example of the film thickness (vertical axis) of the sealing resin after curing is plotted. By measuring the film thickness of the liquid sealing resin from this correlation graph, the film thickness of the cured sealing resin can be predicted. On the other hand, in the case of a sealing resin containing no solvent, since there is no volume change rate before and after curing, the film thickness of the liquid sealing resin and the film thickness of the sealing resin after curing are almost equal. From the above, it is possible to control the film thickness of the cured sealing resin by measuring the film thickness immediately after the liquid resin is applied to the TAB semiconductor component.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS.

FIG. 1 is a diagram for explaining a method of manufacturing an electronic component and a manufacturing apparatus therefor according to an embodiment of the present invention.
This is a block diagram of a sealing device for a TAB electronic component.
In the following description, the same components as those in FIGS. 6 and 7 showing the conventional technique are denoted by the same reference numerals, and the description of the overlapping matters will be omitted.

In the TAB type electronic component sealing device, a plurality of coating devices A and B are installed in the coating portion 9 of the liquid resin 8b. As an example, FIG. 1 shows two coating devices of the tape carrier 1. The figure shows a case where they are installed side by side in the transport direction. The coating device is a syringe 11A filled with liquid resin 8b and having needles 10A and 10B attached to the tips thereof.
And 11B, and a syringe 1 for discharging the liquid resin 8b.
Dispenser 12A that applies air pressure to 1A and 11B
And 12B are installed. This air pressure determines the amount of liquid resin discharged from the tips of the needles 10A and 10B. These two coating devices are called coating device A and coating device B, respectively.

A pair of non-contact type laser length measuring devices 13 are installed between the syringe 11A and the curing furnace 17 and above and below the tape carrier 1 to which the semiconductor chip 6 is connected.
The measurement principle of the non-contact type laser length measuring device 13 is to use a laser light source to mechanically move a lens through which reflected light of an object passes, and detect the amount of light that the focused laser light passes through a slit. Thus, the focus position is obtained. The pair of laser length measuring devices 13 is electrically connected to the control device 14, and the control device 14 calculates the film thickness of the liquid resin 8b from the measurement value of the laser length measuring device 13. A sprocket 16 is installed to convey the tape carrier 1, and a counter 15 and a controller 14 for measuring the number of revolutions of the sprocket 16 are installed.
And are electrically connected. Then, after simultaneously coating the two semiconductor chips 6 on the tape carrier 1 with each of the two coating devices A and B, the counter 15 measures the distance to the liquid resin 8b by the laser length measuring machine 13 as described later, and then conveys it. In order to distinguish the two semiconductor chips to be processed, a timing signal is output. Further, the control device 14 and the dispensers 12A and 12B are electrically connected, and the control device 14 forms a system for individually controlling the discharge amount of the liquid resin 8b in the two coating devices A and B. A curing furnace 17 for in-line curing the liquid resin 8b is installed adjacent to the application portion 9 of the liquid resin 8b.

Next, the manufacturing process of the tape carrier package 1 using this manufacturing apparatus will be described.

First, 2 on the tape carrier 1 shown in FIG.
The semiconductor chips 6 are needles 10A and 10B, respectively.
When it is conveyed below, the liquid resin 8b is simultaneously applied from the needles 10A and 10B to the two semiconductor chips 6, the corresponding inner leads 4 and a part of the insulating tape 2. After that, the tape carrier 1 is conveyed at a constant speed, and the distance between the liquid resin 8b surface of the electronic component and the rear surface of the semiconductor chip 6 of the electronic components, which are sequentially passed, is measured by a pair of non-contact type laser length measuring devices 13. The measured distance data is sent to the control device 14, where the film thickness of the liquid resin 8b is calculated. In this embodiment, the control device 14 also has a film thickness calculating function, but it is not always necessary to do so. A film thickness calculating means may be provided separately from the control device 14.

A method for calculating the film thickness of the liquid resin from the results of the measured values will be described with reference to FIG. The pair of laser length-measuring devices 13a and 13b are fixed to the equipment in consideration of the measurable distance range.
The distance between 3a and 13b is D, and the thickness of the semiconductor chip 6 is T
And The first laser length measuring device 13 on the upper surface of the liquid resin 8b
The distance measurement value from a to the liquid resin 8b is X, and the distance measurement value from the second laser length measuring device 13b on the lower surface of the semiconductor chip 6 to the semiconductor chip 6 is Y. The film thickness of the liquid resin 8b is calculated by calculating D- (T + X + Y) using these fixed numerical values and measured values. By measuring with this method, X + Y is constant even if the position of the TAB type electronic component moves up or down due to warping or bending of the insulating tape 2, rattling during transportation, etc. Therefore, the film thickness of the liquid resin 8b Can be measured accurately. Therefore, there is an advantage that the film thickness can be accurately measured without temporarily stopping and fixing the position of the insulating tape 2 so as not to change.

In this embodiment, the method of detecting the focal position of the laser beam is used as the principle of the non-contact type length measuring device, but a light source such as a light emitting diode may be used as the light source. is there. Further, a method of obtaining a distance from the phase difference of light, a method of measuring interference fringes of light, or the like can also be used. These methods and techniques are described, for example, in "Optical Measurement Handbook", Asakura Shoten, Toshiharu Tayuki et al., Pages 566-631.

Next, the steps after the measurement by the laser length measuring device 13 will be described with reference to the timing chart of FIG.

In the counter 15 shown in FIG. 1, each time the sprocket 16 completes the rotation for carrying the tape carrier 1 corresponding to one semiconductor chip 6, that is, the semiconductor chip 6 is located at the position of the laser length measuring device 13. Signals each time it completes the passage of. This corresponds to issuing a signal after the distance measurement is completed.

In the timing chart of FIG. 3, at time T1, two semiconductor chips 6 coated with the liquid resin 8b are applied.
Is a predetermined time before reaching the position of the laser length-measuring device 13, and times T3 and T4 are from the sprocket 16 when the rotation for carrying the tape carrier 1 corresponding to one semiconductor chip 6 is completed. Signal.

Since the laser length measuring device 13 constantly measures the distance continuously, as the applied liquid resin 8b passes through the position of the laser length measuring device 13, the shape of the dome of the liquid resin 8b is changed. The calculated film thickness is calculated. Of these, the controller 14 of FIG. 1 records the maximum value of the measured values in a memory (not shown). The maximum value is recorded at the time T2 when the semiconductor chip 6 and the liquid resin 8b pass, and this maximum value means the film thickness of the liquid resin 8b. Of the two semiconductor chips, the controller 14 measures the time at which the chip coated with the liquid resin by the coating device A of FIG. 1 is completed, that is, after measuring the distance of the liquid resin 8b of the semiconductor chip 6, at T3 or After a certain time from T3, the dispenser 1 of FIG.
Send a control signal to 2A. At the same time, the memory for recording the maximum measured value from the laser length measuring device 13 is cleared to 0.

Here, the signals corresponding to the times T3 and T4 can be other than the method based on the rotation of the sprocket 16. For example, a signal can be output after counting the number of holes on the carrier provided for carrying the tape carrier 1 by the amount corresponding to one semiconductor chip 6. Further, it is possible to output a signal from the laser length-measuring device 13 at the time point when the laser length-measuring device 13 has finished measuring the maximum value or at a predetermined time after the end time point. Any other method is possible as long as the signal can be output after the time when the laser length measuring device 13 has finished measuring the maximum value.

Next, similarly, the maximum value of the film thickness of the liquid resin 8b measured when the chip coated with the liquid resin by the coating device B of FIG. When the rotation of transporting the tape carrier 1 corresponding to the number of tapes is completed, a signal is input from the counter 15 to the control device 14, and the control device 14 outputs the signal from the dispenser 1 after a time T4 or a certain time after that based on the signal.
A control signal is transmitted to 2B, and the memory for recording the maximum measurement value of the laser length measuring device 13 is cleared to 0.

By carrying out the above operation, the film thickness of each liquid resin 8b is sequentially measured while the two semiconductor chips are being conveyed, and the corresponding coating devices A and B applied with the respective liquid resins 8b. Therefore, the dispensers 12A and 12B are accurately distinguished and controlled. The control here is that the dispenser 12A or 12B receives the above-described control signal from the control device 14 and adjusts the discharge amount so that the liquid resin has a predetermined film thickness.

An explanation will be given with reference to the flowchart of FIG. 4 showing the operation flow of the manufacturing apparatus of the present invention from the measurement of the thickness of the liquid resin 8b to the control by the two coating apparatuses A and B. Here, as shown in FIG. 1, the case where the semiconductor chip 6 coated with the liquid resin 8b by the coating device A first passes through the laser length measuring device 13 will be described.

First, in step S1, air pressure is applied to the syringes 11A and 11B from the two dispensers 12A and 12B shown in FIG.
Liquid resin 8b from 0B is simultaneously applied onto the two semiconductor chips 6, the inner leads 4 and the insulating tape 2.

Next, in step S2, by rotating the sprocket 16 of FIG. 1, the tape carrier 1
To start transportation.

Next, in steps S3 to S5, the film thickness of the liquid resin 8b of the first semiconductor chip 6 coated by the coating device A is measured in step S3. The maximum value from the measured values of the laser length measuring device 13 which is continuously measured is recorded in the memory. In step S4, the recording of the maximum value is repeated until the conveyance of the tape carrier for one semiconductor chip 6 is completed. When the transportation of one semiconductor chip 6 is completed and a counter signal is transmitted, the process proceeds to step S5, and the controller 14 controls the liquid resin 8b of the liquid resin 8b based on the measurement value of the laser length measuring device 13 of FIG. Determine the film thickness. A predetermined value of the liquid resin film thickness after coating is inputted in advance to the control device 14,
When the measured and calculated thickness of the liquid resin 8b is thicker than the predetermined value, the air pressure of the dispenser 12A is lowered in step S6. On the other hand, if it is less than the predetermined value, the air pressure of the dispenser 12A is increased in step S7. If the film thickness is equal to the predetermined value or if the semiconductor chip 6 is cut off from the tape carrier 1 due to a defect or the like and does not exist, no signal is sent from the controller 14 to the dispenser 12A, and the process proceeds to step S8. However, immediately after the determination of the film thickness before that, the memory for recording the maximum measured value of the laser length measuring device 13 is cleared to 0.

Next, in steps S8 to S12, the film thickness of the liquid resin 8b of the second semiconductor chip 6 coated by the coating device B in step S8 is measured in the same manner as above,
The film thickness is determined and the dispenser 12B is controlled. A control signal is transmitted to the dispenser 12B according to the film thickness measured in steps S11 and S12. 2 as above
The film thickness of the liquid resin of the two semiconductor chips 6 individually applied by the one coating device A and B is measured by a pair of laser length measuring devices 13, and the air pressure of each dispenser 12A and 12B is controlled, By adjusting the discharge amount of the liquid resin 8b, the film thickness of the applied resin can be corrected to a predetermined film thickness.

By using this embodiment described above, it is clear whether the measured film thickness of the liquid resin is applied by the coating device A or B while the sealing device is continuously moving. The film thickness can be controlled while distinguishing. That is,
Even when the film thickness measuring device (length measuring device) is installed only in one place and two liquid resins are simultaneously applied, it is possible to select the applying device to be accurately controlled and control them. As a result, a mass-production type sealing device having a plurality of coating devices can be provided at low cost without adding a film thickness measuring system and a control system.

In the above description, the liquid resin that first passed through the laser length measuring device 13 was applied by the coating device A. However, the liquid resin applied by the coating device B is first applied to the laser length measuring device 13. Even in the case of passing through the vehicle, it can be dealt with by incorporating it in the program of the control device 14 in FIG. In this case, when the liquid resin applied by the B coating device is used to start the sealing device, the laser length measuring device 13
If the first value is passed as the initial value, the remaining values are passed in the order of A, B, A, B, ... And further,
If you set the device so that when the sealing device is stopped, a set of applied resin A and B will stop after passing through the length measuring device, it will be reset when the operation is restarted. Even without it, the control of the coating device can be performed correctly.

An example of the measurement result of the resin film thickness after curing when the present invention is carried out by using an actual product will be described with reference to the graph of FIG. FIG. 5A shows a case where the discharge pressure of the liquid resin 8b is not adjusted at all during production by the conventional manufacturing method, and the number of continuously produced TAB type semiconductor components and the encapsulating resin after curing thereof are shown. It is the graph which plotted the film thickness measured value of 8a. The film thickness (vertical axis) is about 120μ at the start of production
Although the film thickness was set to m, the film thickness tended to decrease after a slight increase, and in the production of 4000 pieces (horizontal axis), the film thickness difference was about 60 μm. For this reason, conventionally, the operator measures the film thickness of the cured sealing resin 8a at intervals of 2000 to 3000 pieces, and
It was necessary to adjust the air pressure of the dispensers 12A and 12B.

FIG. 5 (b) is a graph plotting the number of continuously produced TAB type semiconductor parts and the film thickness measurement value of the cured sealing resin 8a when the manufacturing method according to the present invention is carried out. is there. The air pressure of the dispensers 12A and 12B is controlled with respect to the change in the discharge amount of the liquid resin 8b due to various causes, so that the film thickness fluctuation range of the cured sealing resin 8a is about 30 μm or less. It became possible to obtain.

In the embodiment described above, the liquid resin 8
The discharge amount b was controlled by setting the air pressures of the dispensers 12A and 12B to appropriate values. The discharge amount control with this air pressure can be most easily executed, but the syringe 11A and 11B can be further controlled by changing the viscosity of the liquid resin 8b by applying the air pressure or heating or cooling the syringe 11A and 11B. It can be controlled by adding and adjusting a solvent to the internal shape resin, or by combining these methods.

In the above embodiment, the case where the liquid resin is simultaneously applied by the two coating devices A and B has been described.
Even if two or more coating devices are installed and coated simultaneously, the discharge amount of each coating device using a pair of length-measuring devices is controlled from the above-described technical concept, as shown in FIG. It is obvious that a control system similar to the above can be constructed. Even in this case, the order of the liquid resins passing through the laser length measuring machine 13 is the same as the order in which the coating devices are arranged,
When the production is suspended, if all the coating devices are set to stop the sealing device after the coating from one set is completed, the laser length measuring device 13 will be passed first even if it is restarted. The coating device to which the liquid resin is applied is the same as the coating device to which the resin passed first when starting last time is used, and the order is not changed, and the control device accurately distinguishes the coating device.

Further, in the present invention, the coating device A can also be constructed by incorporating a means for sounding an alarm when the measured value of the film thickness of the liquid resin 8b shows an abnormal value into the control device 14.
When a sudden trouble of (1) and (B) occurs, defects can be minimized.

[0049]

As described above, according to the present invention, the film thickness of a plurality of liquid resins simultaneously applied by a plurality of coating devices can be accurately measured by a pair of length measuring devices, and When the film thickness deviates from the predetermined value based on the measurement result, the corresponding coating device can be designated and the discharge amount of the liquid resin can be automatically controlled and adjusted. Therefore,
Unlike the prior art, it is not necessary to install the same number of length measuring devices as the coating device, so there is no increase in equipment cost, and no position adjustment of the length measuring devices is required. Further, it is possible to obtain a stable film thickness with little variation in the applied resin film, and it is not necessary to produce a large number of defective film thickness products as in the conventional case. As a result, a sealing resin having high adhesion strength and excellent mountability can be formed.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a TAB type electronic component sealing device according to an embodiment of the present invention.

FIG. 2 is a diagram showing a film thickness measuring method according to an embodiment of the present invention.

FIG. 3 is a diagram showing a timing chart of the film thickness measurement of the liquid resin according to the embodiment of the present invention, and a positional relationship between the length measuring device and the liquid resin.

FIG. 4 is a flowchart showing a procedure for forming a sealing resin and controlling the film thickness thereof according to the embodiment of the present invention.

FIG. 5 is a graph showing changes in resin film thickness after curing.

FIG. 6 is a cross-sectional view showing the configuration of a conventional TAB electronic component.

FIG. 7 is a conventional TAB type electronic component sealing device.

FIG. 8 is a correlation graph between the liquid resin film thickness before curing and the resin film thickness after curing.

[Explanation of symbols]

1 tape carrier 2 insulating tape 3 metal leads 4 inner lead 5 device holes 6 semiconductor chips 7 bumps 8a Sealing resin (after curing) 8b Liquid resin (before curing) 9 Sealing device coating section 10,10A, 10B needle 11, 11A, 11B syringe 12,12A, 12B dispenser 13 Laser length measuring device 14 Control device 15 counter 16 sprockets 17 Curing furnace

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryuji Yamamoto 1-1 Sachimachi, Takatsuki-shi, Osaka, Matsushita Electronics Industrial Co., Ltd. (56) References JP-A-1-100928 (JP, A) JP-A 5-6913 (JP, A) JP-A-6-204270 (JP, A) JP-A-6-314714 (JP, A) JP-A-9-129660 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/56 G01B 11/06

Claims (2)

(57) [Claims] 1. A first step of simultaneously applying liquid resin to a plurality of electronic elements on an insulating tape having a plurality of electronic elements mounted thereon and a peripheral portion thereof by a plurality of applying means, and the liquid resin. Second, a distance between the liquid resin surface and the length measuring device is measured using a pair of length measuring devices before curing.
Step, a third step of calculating the film thickness of the liquid resin from the measured distance, a fourth step of outputting a signal each time the measurement of the distance is completed, and the calculated film thickness is predetermined. Fifth step of controlling the coating means that has coated the liquid resin having a predetermined film thickness so that the liquid resin having a predetermined film thickness is coated simultaneously with or after the signal output when the film thickness is not A method of manufacturing an electronic component, comprising: 2. A means for transporting an insulating tape having a plurality of electronic elements mounted thereon, and a plurality of liquids capable of simultaneously applying a liquid resin to each of the plurality of electronic elements on the insulating tape and its peripheral portion. A resin applying means, a means for curing the applied liquid resin, and a surface of the liquid resin which is installed between the plurality of liquid resin applying means and the inlet of the hardening means and facing the surface of the insulating tape. A pair of length measuring means for measuring the distance from the liquid crystal, a means for outputting a signal each time the measurement of the distance is completed, a means for calculating the film thickness of each of the liquid resins from the measured distance, and the calculation And a means for controlling the applying means for applying the liquid resin having a non-predetermined film thickness so that the film is applied to a predetermined film thickness at the same time as or after the output of the signal when the film thickness is not the predetermined film thickness. Prepared An electronic component manufacturing apparatus characterized by the above.