JPH04223390A - Thick film circuit forming device - Google Patents

Abstract

PURPOSE:To enable a thick film circuit forming device where an electronic circuit is formed through drawing to accurately form a fine circuit pattern always by a method wherein a problem that a distance between a drawing head and the surface of a drawing object can not be kept constant when a thick film circuit or the like has been already formed on a board is solved, and the measurement error of a measuring sensor is corrected by a control. CONSTITUTION:A nozzle 1 which discharges a thick film paste 3 onto a board 2, a board level measuring sensor 4 which measures the distance between the nozzle 1 and the board 2, a head 5 which controls the nozzle 1 in height, and a control 7 which corrects the head 5 in quantity of drive are provided.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for forming thick film circuits constituting electronic circuits and the like.

0002

2. Description of the Related Art A thick film circuit forming apparatus using a conventional drawing method will be described with reference to FIG. In the figure, 1 is a nozzle that discharges a thick film paste 3 onto a substrate 2. A substrate height measuring sensor 4 measures the height above the substrate 2 on the drawing trajectory before drawing. Reference numeral 5 denotes a head unit that controls the height of the nozzle 1. The head unit 5 controls the height of the nozzle 1 while driving the head unit 5 to maintain the distance between the nozzle 1 and the substrate 2 based on the value measured by the substrate height measurement sensor 4. moves on the substrate 2 while discharging the thick film paste 3 to draw. As described above, conventional thick film circuits are generally formed by repeating a paste drawing process, a drying process, and a combustion process several times, and then going through a component mounting process and the like.

0003

However, in the above-mentioned conventional apparatus, since a semiconductor laser beam employing a triangulation method is used for the substrate height measurement sensor 4 shown in FIG. As shown in FIG. 8, the semiconductor laser beam 7 may penetrate or sink into the object 6 to be measured, such as a thick film circuit, and it will deviate from the original reflected optical path 8 (dotted chain line shown in FIG. 8). (hereinafter also referred to as a thick film circuit) 6, the material, surface roughness, color, etc. may lead to erroneous measurements, making it impossible to make accurate measurements and making it impossible to maintain a constant distance between the substrate 2 and the nozzle 1. was.

[0004] The present invention solves the above problems,
Even if the substrate height measurement sensor malfunctions, the value is corrected and the distance between the substrate and nozzle is maintained constant, resulting in small variations in the line width and thickness of the drawn thick film paste and high precision. It is an object of the present invention to provide a thick film circuit forming apparatus that can form fine circuit patterns and significantly improve the quality of electronic circuits.

[0005]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a nozzle for discharging a thick film paste onto a substrate, and a substrate height that measures the height of the nozzle from the substrate prior to the nozzle. The nozzle height measurement sensor includes a head section that controls the height of the nozzle based on the sensor value, and a control section that corrects the drive amount of the head section.

[0006]

[Operation] Therefore, according to the structure of the present invention, even if the substrate height measurement sensor malfunctions, its value is corrected, and the distance between the substrate and the nozzle is maintained at a constant value, so that thick film paste The variation in line width and film thickness is small,
It becomes possible to form fine circuit patterns with high precision, and the quality of electronic circuits can be significantly improved.

[0007]

[Example] An example of the present invention will be described below with reference to FIGS. 1 to 6.
Also, the same parts as those in FIGS. 7 and 8 are given the same reference numerals, detailed explanations are omitted, and differences will be explained.

(Embodiment 1) FIG. 1 shows the configuration of a thick film circuit forming apparatus using a drawing method in a first embodiment of the present invention. This is a control unit that can The nozzle 1 moves up and down 12 by the same amount as the increase/decrease in the measured value of the substrate height measurement sensor 4.
It is driven to maintain the distance between the nozzle 1 and the substrate 2. At this time, when measuring a substance made of a material different from that of the substrate 2, such as a thick film circuit 6 that has already been formed by drawing, the control unit 7 corrects the drive amount of the nozzle 1 through the head unit 5, so that the amount of drive of the nozzle 1 is corrected as shown in the figure. While maintaining the value X, the nozzle 1 can discharge the thick film paste 3 from the tip of the nozzle 1 using pressure, for example, and draw it on the substrate 2 or the thick film circuit 6.

The control unit 7 has a function of correcting the amount of malfunction of the substrate height measurement sensor 4, and uses the amount of received light obtained simultaneously with the measurement value of the substrate height measurement sensor 4 as a control method. The amount of light received is determined by materials with different materials, surface roughness, etc., such as the already drawn thick film circuit 6, so by inputting the data of the amount of light received from the object 6 into the control section in advance, It becomes possible to measure the measurement object 6. Further, the amount of measurement error due to the difference between the object to be measured 6 and the substrate 2 is measured in advance for each object to be measured 6, and inputted as data to the control section 7. Then, the material and surface roughness of the object to be measured 6 are determined from the amount of light received, the amount of error due to the object to be measured 6 is read out from the input data, and the amount of drive of the head unit 5 is corrected as the correction amount. As shown, the distance X between the substrate 2 or the thick film circuit 6 and the nozzle 1 is maintained at a constant value.

As the substrate height measuring sensor 4, a distance measuring device using a laser beam (for example, Hikari Micro manufactured by Anritsu Corporation (product number M532A, measurable range: ±800 [μm])) is used. As the thick film paste 3, various thick film pastes such as conductors or resistors can be used (for conductors, for example, Ag/Pd paste, #613 manufactured by DuPont Co., Ltd.
4). As the substrate 2, a ceramic substrate, a glass epoxy substrate, or the like is used.

According to the embodiment described above, even if the substrate height measurement sensor 4 malfunctions, its value is corrected by the control section 7, so that the distance between the substrate 2 and the nozzle 1 is always maintained at a constant value. The line width and film thickness of the thick film paste 3 drawn are small in variation, and therefore it is possible to form fine circuit patterns with high precision, and the quality of electronic circuits can be greatly improved.

(Embodiment 2) FIG. 2 shows the configuration of a drawing apparatus in a second embodiment of the present invention. In the figure, the difference from the first embodiment is that the control data of the control section 7 , which is obtained from the CAD/CAM system 8, into which the drawing locus of the object to be measured 6 is input in advance. Therefore, this CAD/
Since the CAM system 8 can have data such as the drawing locus position or the type of object to be measured, the amount of measurement error between the object to be measured 6 and the substrate 2 can be calculated for each object, as in the first embodiment. By measuring the object 6 in advance and inputting it as data, the data on the current position of the nozzle 1 sent from the head section 5 side can be checked, and the head section 5 can be adjusted by the amount of correction commensurate with the position. By correcting and driving, the distance X between the substrate 2 and the nozzle 1 is maintained at a constant value, as shown in FIG.

Next, the CAD/
To explain the functions of the CAM system, for example, Figure 3
In the case of the drawing trajectory A→B→C→D (crossing over the already drawn thick film circuit 6) as shown in the figure, in the conventional NC program, the drawing start point (point A) and end point (point D) are Since the control is based on the coordinates of two points, it is not possible to change the drawing conditions (for example, the gap between the nozzle 1 and the substrate 2 or the thick film circuit 6) at points B and C in the middle.
In the AD/CAM system, it is possible to calculate points B and C and change the drawing conditions, and correction data can also be controlled as one of the drawing conditions, so the control method becomes very simple.

Furthermore, as shown in FIG. 4, in the case of the end of the thick film circuit 6, the material determination by the substrate height measurement sensor 4 is incomplete, the sensing is not stable, and the nozzle 1 However, in the CAD/CAM system of this embodiment, the diameter of the tip of the nozzle 1 can be input in advance, so the tip of the nozzle 1 and the thick film circuit 6 may overlap. In this case, as shown in the figure, the nozzle 1 can be controlled to escape upward by a certain amount by the thickness t of the thick film circuit 6 that has already been drawn.

Furthermore, as shown in FIG. 5, the data held by the CAD/CAM system regarding the thick film circuit 6 in this embodiment includes material type data corresponding to the drawing ranges A and B sent from the design data. However, as shown in FIG. 6, other data can be held by dividing the entire substrate 2 into small parts and having data on the type of material, etc. for each division unit.

As described above, according to the above embodiment, even if the substrate height measurement sensor 4 malfunctions, its value is corrected by the correction amount by the CAD/CAM system 8 connected to the control section 7. The distance between the nozzle 1 and the nozzle 1 is always maintained at a constant value, and the line width and film thickness of the drawn thick film paste 3 have small variations, making it possible to form fine circuit patterns with high precision and improving the quality of electronic circuits. can be significantly improved.

[0017]

Effects of the Invention As is clear from the above embodiments, the present invention provides a nozzle for discharging thick film paste onto a substrate, and a substrate height measurement method for measuring the height of the nozzle from the substrate prior to the nozzle. Since it is equipped with a sensor, a head section that controls the nozzle height based on the value of the sensor, and a control section that corrects the amount of drive of the head section, even if the substrate height measurement sensor malfunctions, the value will be corrected. is corrected, and the distance between the substrate and the nozzle is maintained at a constant value, and the variation in line width and film thickness of the drawn thick film paste is small, making it possible to form fine circuit patterns with high precision. This makes it possible to significantly improve the quality of electronic circuits.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional side view showing the configuration of a thick film circuit forming apparatus in a first embodiment of the present invention.

FIG. 2 is a partially sectional side view showing the configuration of a thick film circuit forming apparatus according to a second embodiment of the present invention.

FIG. 3 is a plan view showing the positional relationship between the drawing locus of the nozzle of the forming apparatus and the thick film circuit in the embodiment of the present invention.

FIG. 4 is a diagram for explaining the situation of nozzle movement in the embodiment of the present invention.

FIG. 5: CAD/C of a forming apparatus in an embodiment of the present invention
Conceptual diagram showing data such as drawing range held by the AM system

FIG. 6: CAD/CAM in the embodiment of the present invention
Conceptual diagram showing data such as drawing range held by the system

[
FIG. 7: Partial cross-sectional side view showing the configuration of a conventional thick film circuit forming apparatus

[Figure 8] A cross-sectional conceptual diagram of the main parts of a substrate and thick film circuit, showing the causes of measurement errors in conventional forming equipment.

[Explanation of symbols]

1 Nozzle 2　　　　Substrate 3 Thick film paste 4 Board height measurement sensor 5 Head part 7 Control section 8 CAD/CAM system

Claims (3)

[Claims] 1. A nozzle that discharges a thick film paste onto a substrate, a substrate height measurement sensor that measures the height of the nozzle from the substrate prior to the nozzle, and a height of the nozzle that is determined based on the value of the sensor. A thick film circuit forming apparatus includes a head section for controlling and a control section for correcting the amount of drive of the head section. 2. The control unit determines the object to be measured using changes in the amount of light received by the substrate height measurement sensor depending on the material of the object to be measured, and corrects the amount of drive of the head unit. The thick film circuit forming apparatus according to claim 1. 3. The control unit corrects the drive amount of the head unit by giving a correction value according to the object to be measured for each drawing point from a CAD/CAM system into which the drawing locus of the object to be measured is input in advance. 2. The thick film circuit forming apparatus according to claim 1.