JP2014017340A - Liquid material discharge device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid material discharge device and method by which it is possible to control a discharge amount according to actual gap dimensions around a chip component.SOLUTION: A liquid material discharge device photographs a substrate 11 from above by an upper camera 587; acquires, by image processing, information on actual dimensions of gaps 120 (gaps 120 around a chip component 100) between side faces of the chip component 100 and inner side faces of a cavity 111; and stores discharge amount control information corresponding to the acquired dimension information in a storage unit 13. With a needle 503 being moved to above the gaps 120, a discharge control unit 17 controls pressure inside a liquid storing unit 501 according to the stored discharge amount control information, so as to perform discharge and injection of resin.

Description

  The present invention relates to a liquid material discharge apparatus and method for discharging a liquid material containing a viscous fluid such as an adhesive onto an object.

  As a method of mounting a chip component on a substrate, flip chip mounting is known in which bumps (projection electrodes) for connection are provided on the surface of the chip component, and the chip component is mounted with the surface facing the substrate. In flip chip mounting, after mounting, an underfill (sealing material) is generally poured between the substrate and the chip component in order to protect the connection between the electrode and the bump on the substrate. For the injection of a liquid material such as underfill, a liquid material discharge device (for example, see Patent Document 1 below) capable of highly accurate discharge amount control can be used.

JP 2011-147838 A

  FIG. 10A is a cross-sectional view of a state in which the chip component 100 is flip-chip mounted in the cavity 111 of the substrate 11. FIG. 10B is a plan view when there is no displacement in the same state. FIG. 10C is a plan view in the case where there is a displacement in the same state. The substrate 11 is a cavity substrate and has a cavity 111 for mounting the chip component 100. In the case of a large number of cavities, a large number of cavities 111 are provided. In the mounted state, a plurality of bumps 101 (solder or the like) provided on the surface of the chip component 100 and an electrode (not shown) on the bottom surface of the cavity 111 are electrically connected. The liquid material is injected from a gap 120 between the side surface of the chip component 100 and the inner surface of the cavity 111 (gap 120 around the chip component 100), and between the surface of the chip component 100 and the bottom surface of the cavity 111 (bump 101). Around).

  The dimensions L1 to L4 of the gap 120 (in the case of no positional deviation shown in FIG. 10B) are, for example, about 200 μm at present, and are expected to be further shortened in the future. Here, even when the gap 120 is mounted with a size of 200 μm, an error of about ± 50 μm may occur when including a positional shift at the time of mounting or a positional shift of the electrode. That is, in the mounting state before the liquid material injection, the actual dimensions L1 'to L4' of the gap 120 (when there is a positional deviation shown in FIG. 10C) have a width of 150 to 250 μm. Since this gap size error greatly affects the required amount of liquid material to be applied, the liquid material is quantitatively discharged based on the assumed gap size (gap size without misalignment) without considering the actual gap size. However, there is a problem that the amount of liquid material to be injected becomes excessive or insufficient.

  The present invention has been made in view of such a situation, and an object of the present invention is to provide a liquid material ejection apparatus and method capable of controlling the ejection amount in accordance with the actual gap size around a chip component.

  One embodiment of the present invention is a liquid material discharge device. This liquid material ejection device is a liquid material ejection device that injects a liquid material from a gap around a chip component mounted on a substrate, and includes means for obtaining actual dimension information of the gap, and the dimension information includes Accordingly, the discharge amount of the liquid material is controlled.

  You may provide the table which memorize | stored the actual dimension information of the said gap, and the discharge amount control information according to it.

  A camera that images the chip part from above may be provided, and actual dimension information of the gap may be acquired from an image captured by the camera.

  A cavity may be formed in the substrate, the chip component may be mounted in the cavity, and the gap may be a gap between a side surface of the chip component and an inner surface of the cavity.

  The actual dimension information of the gap may be acquired for each of the plurality of side surfaces of the chip component.

  The chip component may be mounted face-down on a substrate so that the bump of the chip component and the electrode of the substrate are connected to each other, and a liquid material may be poured around the bump.

  A liquid storage unit, a discharge unit that discharges a liquid material present in the liquid storage unit, and a discharge control unit, wherein the discharge control unit is configured to discharge the liquid according to actual dimensional information of the gap. You may control at least any one of the value of the pressure added to the inside of a liquid storage part, the addition time of the said pressure, and the frequency | count of discharge for every predetermined time.

  Another aspect of the present invention is a liquid material discharge method. In this liquid material ejection method, the actual dimension information of the gap around the chip component mounted on the substrate is acquired, the ejection amount of the liquid material is controlled according to the dimension information, and the liquid material is injected from the gap .

  It should be noted that any combination of the above-described constituent elements, or a conversion of the expression of the present invention between systems or the like is also effective as an aspect of the present invention.

  According to the present invention, it is possible to control the discharge amount according to the actual gap size around the chip component.

The principal part side sectional view of the liquid material discharge device concerning an embodiment of the invention. The flowchart which shows the preparation procedure of a discharge pressure correction table. The flowchart which shows the preparation procedure of a vacuum pressure correction table. The flowchart which shows an example of the automatic driving | operation operation | movement after preparation of a correction table. The arrangement explanatory view of the small camera 585 provided one to one needle 503. The top view of the liquid material discharge apparatus which concerns on embodiment of this invention. The front view of the liquid material discharge apparatus. The right view of the same liquid material discharge apparatus. Explanatory drawing of piping in the dispenser unit 5 of the same liquid material discharge apparatus. (A) is a cross-sectional view of a state in which the chip component 100 is flip-chip mounted in the cavity 111 of the substrate 11, (B) is a plan view when there is no displacement in the same state, and (C) is a displacement in the same state. FIG. The flowchart which shows an example of the operation | movement which applies using the preparation procedure of a shot frequency correction table, and a shot frequency correction table.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, process, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

  First, the overall configuration of the present apparatus will be described with reference to FIGS. 6 to 9, and then the main part will be described in detail with reference to FIGS.

  FIG. 6 is a plan view of the liquid material ejection device according to the embodiment of the present invention. FIG. 7 is a front view of the liquid material discharge device. FIG. 8 is a right side view of the liquid material discharge device. FIG. 9 is an explanatory diagram of piping in the dispenser unit 5 of the liquid material discharge device. This liquid material discharge device includes a base 1, a mounting table 2, an XYZ table 3, a dispenser unit 5, an optical sensor 7, an optical sensor drive system 8, a transport unit 9, and a main control unit 12. Prepare. Note that two directions orthogonal to each other in the horizontal plane are defined as an X direction and a Y direction, and a vertical direction is defined as a Z direction.

  The mounting table 2 is fixed to the upper surface of the base 1, the XYZ table 3 is fixed to the mounting table 2, and the dispenser unit 5 is supported by the XYZ table 3 so as to be movable in each direction of XYZ. The optical sensor driving system 8 is fixed to the upper surface of the base 1, and the optical sensor 7 for detecting the liquid level is supported by the optical sensor driving system 8 so as to be movable in the Z direction. The transport unit 9 is fixed to the upper surface of the base 1, and the substrate 11 as an application target is transported in the X direction by the transport unit 9. As shown in FIG. 10A, the chip component 100 is face-down mounted in the cavity 111 of the substrate 11 so that the bumps 101 of the chip component 100 and the electrodes (not shown) of the substrate 11 are connected to each other. The material discharge device pours a liquid material between the surface of the chip component 100 and the bottom surface of the cavity 111 (around the bump 101). The main control unit 12 is inside the base 1 (housing) and controls the operation of the entire apparatus, and includes a storage unit 13, a calculation unit 15, and a discharge control unit 17.

  The XYZ table 3 includes a base plate 301, an X-axis slide guide 303, an X-axis slider 305, a Y-axis support frame 311, a Y-axis slide guide 313, a Y-axis slider 315, a Z-axis support frame 321, A Z-axis slide guide 323 and a Z-axis slider 325 are provided.

  The base plate 301 is fixed to the upper surface of the mounting table 2, the X-axis slide guide 303 is fixed to the upper surface of the base plate 301, and the X slider 305 is driven by a ball screw driving mechanism and can move along the X-axis slide guide 303. is there. The ball screw drive mechanism is configured to move a ball screw nut screwed to the ball screw shaft in the axial direction of the ball screw shaft by rotationally driving the ball screw shaft with a motor.

  The Y-axis support frame 311 is fixed to the X-axis slider 305, the Y-axis slide guide 313 is fixed to the Y-axis support frame 311, and the Y-axis slider 315 is driven by a ball screw drive mechanism and moves along the Y-axis slide guide 313. Is possible. The Z-axis support frame 321 is fixed to the Y-axis slider 315, the Z-axis slide guide 323 is fixed to the Z-axis support frame 321, and the Z-axis slider 325 is driven by a ball screw drive mechanism and moves along the Z-axis slide guide 323. Is possible. Therefore, the Z-axis slider 325 can move in each direction of XYZ, and the dispenser unit 5 attached to the Z-axis slider 325 can also move in each direction of XYZ.

  The dispenser unit 5 has a liquid storage part 501, a needle 503 as a discharge part, and a pipe for these in the illustrated example. As shown in FIG. 9, the liquid storage unit 501 of each system is connected to a pressure air source 591 and a vacuum source 592 via a switching valve 551. Pressure control valves 596 and 597 are provided between the switching valve 551 and the pressure air source 591 and the vacuum source 592, respectively, and the pressure in the liquid storage unit 501 can be adjusted. The negative pressure can be shielded by the shielding valve 561. Moreover, the internal pressure of the liquid storage unit 501 can be made equal to the atmospheric pressure by opening the release valve 562. Each valve is controlled by the discharge controller 17.

  An upper camera 587 (having a vertical viewing axis) capable of imaging the lower side (that is, the substrate 11 from above) on the Z-axis support frame 321 as a frame that can move in a horizontal or biaxial direction (that is, XY direction). Are fixed, and the cavity 111 of the substrate 11 and the chip component 100 in the cavity 111 can be imaged. In order to image the needle 503 from the side, a horizontal camera 580 is attached to the base 1, and the liquid handle held at the lower end of the needle 503 can be imaged. Further, the lower camera 581 (having a vertical viewing axis) is fixed to the base 1 and can image the needle 503 from below.

  The overall operation of this device will be outlined. First, the substrate 11 as an application target is supplied to the carry-in unit 91 of the transport unit 9 in FIG. The substrate 11 is conveyed from the carry-in unit 91 to the coating unit 95 and positioned at a predetermined position. The dispenser unit 5 moves onto the application unit 95 (on the substrate 11) with the support of the XYZ table 3 and applies the liquid material to the substrate 11. When the coating operation is completed, the substrate 11 is transported to the carry-out unit 97 and discharged. If necessary, a preheating unit is provided in front of the coating unit 95 and the temperature of the substrate 11 is increased by preheating means such as a heater, and a cooling unit is provided in the subsequent stage of the coating unit 95 to lower the temperature of the substrate 11 and coating. The formed liquid may be solidified and stabilized. After performing the coating operation on the predetermined number of substrates 11, the dispenser unit 5 moves backward in the Y direction, and the remaining liquid amount (liquid level) of the dispenser unit 5 is detected by the optical sensor 7 here. Details of the detection method will be described later. If necessary, the discharge pressure of the liquid material is corrected according to the amount of remaining liquid (head differential correction). Data necessary for correction is stored in the storage unit 13 in the main control unit 12. Details of the data acquisition method will be described later. Thus, an appropriate discharge pressure corresponding to the amount of the liquid material is maintained.

  FIG. 1 is a side sectional view of an essential part of a liquid material discharge apparatus according to an embodiment of the present invention.

  The liquid storage unit 501 and the needle 503 are detachably attached to each other (a male screw at the lower end of the liquid storage unit 501 and a female screw at the upper end of the needle 503 are screwed together). The needle 503 is held by the needle holder 533, and the liquid storage unit 501 is held by the case 511. The needle holder 533 is fixed to the case 511, and only the liquid storage unit 501 can be removed from the case 511 when replacing the liquid storage unit.

  As shown in FIG. 1, the optical sensor drive system 8 fixed to the upper surface of the base 1 is configured such that the optical sensor 7 is moved by the ball screw drive mechanism in the Z direction (the height direction of the liquid storage unit 501) on the side of the liquid storage unit 501. ) Is supported movably.

  The storage unit 13 illustrated in FIG. 8 stores a plurality of liquid amounts and discharge pressures and suction pressures corresponding to the respective liquid amounts for one liquid material as a correction table in association with each other. The discharge control unit 17 refers to the correction table in the storage unit 13 and controls the pressure inside the liquid storage unit 501. The correction table is divided into a discharge pressure correction table and a vacuum pressure correction table. The procedure for creating each table will be described below.

  FIG. 2 is a flowchart showing a procedure for creating a discharge pressure correction table. First, two liquid storage portions 501 having a filling rate of resin as a liquid material of 100% and 20%, respectively, are set in the liquid material discharge device (S11). The operator presses the detection button (S12). The optical sensor 7 detects the amount of resin in the liquid storage unit 501 (S13). This is to know the exact filling rate. Next, one-shot discharge is performed from the needle 503 of the liquid storage unit 501 at a predetermined discharge pressure, and the weight is measured, for example, with a precision balance (S14). The weights of the one-shot discharge when the filling rate is 100% and 20% are compared (S15), and if they are different, the discharge pressure of the liquid storage portion 501 on the side of the filling rate of 20% is changed in the case of FIG. S16) The one-shot discharge, weight measurement, and comparison are repeated until both are the same. And the discharge pressure value when both become the same is memorize | stored (S17). The computing unit 15 interpolates (for example, linear interpolation) the discharge pressure value between 100% and 20% filling rate with a predetermined function, and creates a discharge pressure correction table (S18). The function used for interpolation can be determined experimentally.

  FIG. 3 is a flowchart showing a procedure for creating a vacuum pressure correction table. First, two liquid storage portions 501 having a filling rate of resin as a liquid material of 100% and 20%, respectively, are set in the liquid material discharge device (S31). The operator presses the detection button (S32). The optical sensor 7 detects the amount of resin in the liquid storage unit 501 (S33). After discharging a predetermined amount of liquid knob at the tip (lower end) of the needle 503, vacuum calibration is performed by image processing while imaging the liquid knob with the horizontal camera 580 (S34). In the vacuum calibration, the suction pressure (vacuum value) is determined so that the spherical liquid extract at the lower end of the needle 503 is drawn in the same manner at a filling rate of 100% and 20% (S35), and the determined vacuum value is stored (S36). . For vacuum calibration, for example, the technique disclosed in Japanese Patent Application Laid-Open No. 2007-29912 proposed by the present applicant can be used. Briefly, the horizontal camera 580 captures an image with a droplet held at the lower end of the needle 503, and the distance between the lower end of the droplet and the reference position (lower end) of the needle 503 from the captured droplet shape. Is calculated by the calculation unit 15. The discharge controller 17 adjusts the vacuum value so that the calculated distance remains within the range set for a certain period of time. The calculation unit 15 interpolates (for example, linear interpolation) a vacuum value between 100% and 20% of the filling rate with a predetermined function, and creates a vacuum value correction table (S37). The function used for interpolation can be determined experimentally.

  In any of the preparation procedures of the discharge pressure correction table and the vacuum pressure correction table, for example, the filling rate is 40% and 60% instead of or in addition to the resin filling rate 100% and 20% of the liquid storage unit 501. You may determine a discharge pressure value and a vacuum value about a thing.

  The flow of the automatic operation operation including the discharge pressure correction and the vacuum pressure correction will be described. FIG. 4 is a flowchart showing an example of the automatic driving operation after the correction table is created. In the example of this figure, whenever application | coating is complete | finished about one board | substrate (S51), the resin amount detection by the optical sensor 7 is implemented (S52). If the amount of resin is sufficient, it is determined whether or not the discharge pressure needs to be corrected (S53), and if necessary, the discharge pressure is corrected (S54). If the remaining amount of the resin is not enough, the liquid storage unit is replaced (S55), and the liquid storage unit initial (operation for recognizing that the liquid storage unit having a filling rate of 100% is attached) is performed (S56), After the amount detection (S57), it is determined whether or not the vacuum pressure correction is necessary (S58). If necessary, the vacuum pressure is corrected (S59), and the next substrate is applied. The correction of the vacuum pressure may be performed together with the correction of the discharge pressure in step S54.

  In the present embodiment, in addition to the above discharge control according to the liquid amount (filling rate of resin), the discharge amount of the resin (underfill) as the liquid material is set according to the size of the gap 120 around the chip component 100. Control. As described above with reference to FIGS. 10B and 10C, when the dimensions L1 to L4 of the gap 120 (in an ideal state) when it is assumed that there is no displacement of the chip component 100 are, for example, 200 μm, the gap 120 The actual dimensions L1 ′ to L4 ′ are as wide as 150 to 250 μm. For this reason, in the quantitative discharge corresponding to the case where the gap 120 has a size of 200 μm, there is a problem that the resin is excessive and overflows from the cavity 111, or conversely, the resin is insufficient and does not sufficiently spread around the bump 101. Will occur.

  Therefore, in the present embodiment, the actual dimension information of the gap 120 is acquired prior to the ejection, and the resin ejection amount is controlled in accordance with the dimension information. The storage unit 13 illustrated in FIG. 8 stores, as a correction table, a plurality of actual dimension information of the chip component 100 and discharge amount control information corresponding to the actual dimension information for one liquid material. The dimension information may be the dimension itself, or may be an error or a ratio with a true value (gap dimension when it is assumed that there is no displacement). The discharge amount control information may be the discharge amount itself. For example, the pressure value that the discharge control unit 17 applies to the inside of the liquid storage unit 501, the pressure addition time, the number of discharges per predetermined time ( Or the number of shots). The relationship between the dimension information and the discharge amount control information can be obtained in advance by experiments or simulations (calculations).

  The flow of the discharge amount control is as follows. In the present embodiment, the substrate 11 is imaged from above by the upper camera 587, and the actual dimension of the gap 120 (gap 120 around the chip component 100) between the side surface of the chip component 100 and the inner surface of the cavity 111 is processed by image processing. Information is acquired for each side surface (that is, information on the dimensions L1 ′ to L4 ′ in FIG. 10C is derived), and discharge amount control information corresponding to the acquired dimension information is read into the storage unit 13. Then, the needle 503 is moved above the gap 120, and the discharge control unit 17 controls the pressure inside the liquid storage unit 501 in accordance with the read discharge amount control information to discharge and inject the resin. Resin is discharged and injected sequentially for each side of the gap 120. The injection amount from the side where the size of the gap 120 is large is increased, and the injection amount from the small side is decreased. In addition, after obtaining the dimension information for each side of the gap 120, the resin injection may be sequentially performed for each side, or after obtaining the dimension information and the resin injection for a certain side, A flow of acquiring dimensional information and injecting resin for the side may be used.

  FIG. 11 is a flowchart showing an example of a procedure for creating a shot number correction table and an operation for applying using the shot number correction table. First, the liquid storage part 501 (syringe) filled with resin is mounted on the liquid material discharge device (S71), and the optical sensor 7 detects the amount of resin in the liquid storage part 501 (S72). Next, a reference gap size, a reference discharge volume, and a reference shot number are set for each side (S73). After the setting, the operator switches to the automatic operation screen (S74) and turns on the automatic operation (S75). After starting the automatic operation, the upper camera 587 measures the gap dimension of each side (S76). If the measured gap dimension is the same as the registered gap dimension (reference gap dimension) (Yes in S77), the shot count value is stored together with the gap dimension (S79). If the values are different (No in S77), a value (shot number value after correction) is calculated by multiplying the reference shot number by the correction coefficient (S78), and the corrected shot number value is stored together with the gap size (S79). ). The correction coefficient is calculated by the reference gap size, the reference discharge volume, the reference shot number, and FlowRate (weight per shot) calculated by resin weight measurement. The shot number value between (reference gap−50 μm) and (reference gap + 50 μm) is interpolated with a predetermined function (for example, linear interpolation) to create a shot number correction table (S80). Thereafter, correction is performed using the correction value in the shot number correction table (S81), and application (discharge) is performed (S82).

  As shown in FIG. 5, a small camera 585 (having a viewing axis in the tilt direction) as a tilt camera is attached to a Z-axis slider 325 together with a needle 503, and the small camera 585 can move with the needle 503 in each of XYZ directions. It is. Thereby, the lower end of the needle 503 can be always imaged from obliquely upward in the illustrated example by the small camera 585, which is convenient for an operator to monitor dirt on the lower end of the needle 503, for example.

  According to the present embodiment, since the discharge amount control according to the actual gap size around the chip component 100 is performed, it is possible to inject an appropriate amount of resin with less excess and deficiency than in the case of quantitative discharge, A highly reliable liquid material discharge device can be realized. In addition, since actual dimension information is acquired for each side of the gap 120 and different ejection amount control is performed for each side, various misalignments can be flexibly handled.

  The present invention has been described above by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope of the claims. By the way. Hereinafter, modifications will be described.

  The chip component 100 is not limited to be mounted in the cavity 111 of the substrate 11, and the gap 120 may be a gap between the chip component 100 and another component.

  The upper camera 587 may operate with the dispenser unit 5 also in the Z direction. Further, a plurality of dispenser units 5 may be provided. In this case, the same number of upper cameras 587 may be provided.

  In the embodiment, the example in which the resin amount is detected by the optical sensor 7 every time one substrate is applied has been described. However, the resin amount may be detected every time a plurality of substrates or lot units are applied.

  The dispenser unit 5 in the embodiment may be a non-contact coating method (jet dispenser, etc., Japanese Patent Application Laid-Open No. 2002-282740), and the effects of the present invention are realized in the same manner.

DESCRIPTION OF SYMBOLS 1 Base 2 Mounting base 3 XYZ table 5 Dispenser unit 7 Optical sensor 8 Optical sensor drive system 9 Conveyance unit 12 Main control part 13 Storage part 15 Calculation part 17 Discharge control part 501 Liquid storage part 503 Needle 511 Case 533 Needle holder 587 Top camera

Claims (8)

  A liquid material ejection device for injecting a liquid material from a gap around a chip component mounted on a substrate, the device comprising means for obtaining actual dimension information of the gap, and an ejection amount of the liquid material according to the dimension information Controlling the liquid material discharge device.   The liquid material ejection apparatus according to claim 1, further comprising a table storing actual dimension information of the gap and ejection amount control information corresponding to the dimension information.   The liquid material ejection apparatus according to claim 1, further comprising a camera that images the chip component from above, and that acquires actual dimension information of the gap from an image captured by the camera.   The cavity is formed in the substrate, the chip component is mounted in the cavity, and the gap is a gap between a side surface of the chip component and an inner side surface of the cavity. The liquid material discharge apparatus as described.   The liquid material ejection device according to any one of claims 1 to 4, wherein actual dimensional information of the gap is acquired for each of a plurality of side surfaces of the chip component.   The chip component is mounted face-down on a substrate, the bump of the chip component and the electrode of the substrate are connected to each other, and a liquid material is poured around the bump. The liquid material discharge apparatus as described.   A liquid storage unit, a discharge unit that discharges a liquid material present in the liquid storage unit, and a discharge control unit, wherein the discharge control unit is configured to discharge the liquid according to actual dimensional information of the gap. The liquid material discharge device according to any one of claims 1 to 6, wherein at least one of a value of pressure applied to the inside of the liquid storage unit, an addition time of the pressure, and a number of discharges per predetermined time is controlled.   A liquid material discharge method for acquiring actual dimension information of a gap around a chip component mounted on a substrate, controlling a discharge amount of the liquid material according to the dimension information, and injecting the liquid material from the gap.

Images