JP2003324114A - Sealing compound filling method and sealing compound filling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To adaptively fill a sealing compound with a proper amount corresponding to variations even if the variations occur in a gap between an electronic part and a substrate, thereby avoiding the problem of a defective external appearance and the problem of a malfunction. <P>SOLUTION: A sealing compound filling device 20 comprises a measuring means 21 for measuring the surface height H<SB>1</SB>of an electronic part 26 and the surface height H<SB>2</SB>of a substrate 28 in a state that an electrode 27 of the electronic part 26 is connected to an electrode 29 of the substrate 28, and a control means 22 for controlling the amount of a sealing compound 2 to be filled in a gap Gap between the electronic part 26 and the substrate 28 based on the measured value. Since H<SB>1</SB>varies corresponding to the Gap, when the Gap is larger than a proper gap, the filling amount of the sealing compound 32 is controlled toward an increase, while, when the Gap is smaller than the proper gap, the filling amount of the sealing compound 32 is controlled toward a decrease, thereby filling the sealing compound 32 with the proper amount corresponding to variations of the Gap. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealant filling method and a sealant filling device. More specifically, the present invention relates to a sealant filling method and a sealant filling device that fill a sealant such as a resin between a substrate-mounted component and a substrate by a capillary flow to seal the component.

[0002]

2. Description of the Related Art "Flip chip mounting" is one of the high-density mounting techniques for electronic components. FIG. 5A is a structural diagram of flip-chip mounting. The illustrated one is an electrode pad 2 formed on one surface of an electronic component 1 such as a semiconductor bare chip.
After electrically connecting the bumps 5 and the electrode pads 4 of the substrate 3 with the bumps 5, a seal having electrical insulation and environment resistance is provided around the electronic component 1 and in the gap between the electronic component 1 and the substrate 3. It is assembled by filling the stopper 6.

The sealant 6 is discharged from the nozzle 7 near the side surface of the electronic component 1 with a predetermined pressure. Discharged sealant 6
Covers the side surface of the electronic component 1 and the surface of the substrate 3, and a part thereof enters into the gap between the electronic component 1 and the substrate 3 by the capillary phenomenon (A Capillary Phenomenon). Therefore, as shown in FIG. 1A, the side surface of the electronic component 1, the lower surface of the electronic component 1 (the surface on which the electrode pad 2 is formed), the upper surface of the substrate 3 (the surface on which the electrode pad 4 is formed) and the bump 5 are sealed. Is
Since the same performance (electrical insulation and environmental resistance) as that of the package can be obtained, it is possible to realize high-density mounting without using the package.

Generally, the mounting of the electronic component 1 on the substrate 3 is performed by a so-called "mounting machine". At the time of mounting, a gap between the electronic component 1 and the substrate 3, more specifically,
There may be variations in the gap D between the lower surface of the electronic component 1 (the surface on which the electrode pad 2 is formed) and the upper surface of the substrate 3 (the surface on which the electrode pad 4 is formed).

FIG. 5B shows an example of an excessively large gap (hereinafter referred to as “excessive gap”) D _max , and FIG. 5C shows an example of an excessively small gap (hereinafter referred to as “small gap”) D _min . Where D _max
>D> D _min . In these figures, the proper gap D
Consider a case where the same amount of the sealant 6 as in the above case is filled.

In the case of the excessive gap D _max , the side surface of the electronic component 1 cannot be sufficiently covered because the sealant 6 is insufficient, and in some cases, the electrode pad 2 and the substrate 3 of the electronic component 1 are not covered. A part of the electrode pad 4 or the bump 5 may be exposed. In particular, this exposure has a disadvantage that it impairs electrical insulation and environmental resistance and causes malfunction of the electronic circuit. On the other hand, in the case of the minute gap D _min, the amount of the sealing agent 6 becomes excessive and, for example, the upper surface of the electronic component 1 may be covered, resulting in a disadvantage that the appearance is deteriorated. Therefore, in terms of appearance and operational stability, the discharge amount (filling amount) of the sealant 6 must be properly controlled.

(First Prior Art) Japanese Patent Laid-Open No. 7-24989
No. 7 discloses that when an IC chip is mounted on a heat dissipation pad on a substrate, the heights of the bottom surface of the IC chip and the leads of the IC chip with respect to the mounting surface of the substrate are measured by a displacement sensor, An electronic component mounting device that controls the amount of a heat dissipation agent (for efficiently releasing heat generated in the IC chip to the heat dissipation pad: for example, thermal grease) applied to the heat dissipation pad according to the height difference. Is described.

FIG. 6 is a conceptual diagram of the first prior art.
The mounting head 10 is movable in the XY axis directions (horizontal direction), and the suction nozzle 11 attached to the mounting head 10
Can suck and hold the IC chip 12 by the negative pressure at the tip of the nozzle, and can move in the Z-axis direction (vertical direction). The displacement sensor 13 such as a laser displacement meter is used for the suction nozzle 1
1 is the height of the bottom surface of the IC chip 12 (Ha) and the height of the leads 14 of the IC chip 12 (Hb).
To measure.

Here, Ha and Hb are predetermined reference heights Hr.
Is a relative height from Hr, and Hr is a mounting table (not shown) (which shares the same spatial coordinates as the above XY axis and Z axis).
This is the surface height of the substrate 15 placed on. An electrode pad 16 for connecting the lead 14 and a heat dissipation pad 1 for mounting the bottom surface of the IC chip 12 on the substrate 15
7 are formed. A heat dissipation agent 18, the amount of which is controlled based on the above measured values (Ha, Hb), is applied on the heat dissipation pad 17 by the application unit 19, and then the mounting head 10 is moved to place the IC chip 12 on the substrate. Surface mount to 15.

(Second Prior Art) Japanese Patent Laid-Open No. 3-52295
In the publication, the shape of the grease (corresponding to the heat dissipation agent 18 of the first conventional technology) dropped on the cooling element (corresponding to the heat dissipation pad 17 of the first conventional technology) is photographed and the shape is also taken. The "grease application amount detection device" is described in which the height of grease is measured and the application amount of grease is checked from the photographed information and the measured value.

(Third Prior Art) Japanese Patent Laid-Open No. 11-4765
No. 7, gazette divides the application amount of the sealant to be applied per electronic component into the number of times of application corresponding to the viscosity of the sealant and the size of the electronic component, and determines the application amount. There is described "a sealant supply control method and a sealant applying device" in which the amount is alternately increased and decreased as the number of applications increases, and is assigned at each application.

[0012]

However, these prior arts have the following disadvantages, and the above-mentioned FIG.
There is a problem that it cannot be applied to the surface mount component shown in (a).

(Problem of First Prior Art) In this technique, the height (Ha) of the bottom surface of the IC chip 12 and the height (Hb) of the leads 14 of the IC chip 12 are measured by the displacement sensor 13. Since the IC chip 12 is “held at the tip” of the suction nozzle 11 at the time of the measurement, in short, the measured values (Ha, Hb) are “before mounting” on the substrate 15.
The IC chip 12 is obtained as a measurement target.

Therefore, the state of the surface mount component shown in FIG. 5A, that is, between the electrode pad 2 formed on one surface of the electronic component 1 and the electrode pad 4 of the substrate 3 is electrically provided by the bump 5. Since the one surface (the surface on which the electrode pad 2 is formed) of the electronic component 1 is not exposed in the state after being connected to, the height of the bottom surface of the electronic component 1 is measured in the first conventional technique. Therefore, no information for determining the filling amount of the sealant 6 can be obtained.

(Problem of Second Prior Art) In this technique, the shape of the grease dropped on the cooling element is photographed and the height of the grease in the shape is measured.
Since these photographing and measurement are performed after "dripping" the grease, for convenience sake, "dripping" is replaced with "filling" and "grease" is replaced with "sealing agent". Assuming application to the surface mount component shown in FIG. 5A, “imaging the shape of the sealant 6 filled between the electronic component 1 and the substrate 3” and “sealant in that shape” The height of 6 must be measured ", and the sealant 6 must be filled before photographing, and at least the filling amount cannot be properly controlled. In addition, it is not clear which point the height of the sealant 6 should be.
In the first place, since the sealant 6 that has entered the gap D between the electronic component 1 and the substrate 3 cannot be visually observed, it is impossible to measure the height let alone the image.

(Problem of Third Prior Art) This technique is
The amount of the sealant applied is appropriately controlled. The control mode is divided into the number of times of application corresponding to the viscosity of the sealant and the size of the electronic component, and the amount of application is determined by the number of times of application. The increase and decrease are set so that the increase and decrease are alternately repeated, which is an inconvenience of the surface mount component shown in FIG. 5A, that is, "the lower surface of the electronic component 1 (the electrode pad 2
May occur in the gap D between the upper surface of the substrate 3 and the upper surface of the substrate 3 (the surface on which the electrode pad 4 is formed), and the variation may cause an excess or deficiency in the filling amount of the sealant 6. ” I haven't.

From the above point of view, the object of the present invention is to adaptively fill an appropriate amount of the sealing agent according to the variation, even if the gap between the electronic component and the substrate varies. And a sealing agent filling method and a sealing agent filling device capable of avoiding the problem of poor appearance (when the filling amount is too large) and the problem of defective operation (when the filling amount is too small).

[0018]

A method of filling a sealant according to the present invention seals a gap between the electronic component and the substrate in a state where an electrode on the electronic component side and an electrode on the substrate side are connected. In a sealant filling method of filling a stopper and sealing the component, the surface height of the electronic component in the state and the surface height of the substrate are measured, and the sealant is based on the measured value. It is characterized by controlling the filling amount of.

In the present invention, the filling amount of the sealant is controlled based on the surface height of the electronic component and the surface height of the substrate in the mounted state. Here, since the surface height of the electronic component changes corresponding to the gap between the electronic component and the substrate, if the gap becomes larger than the proper gap, the filling amount of the sealant increases. On the other hand, if the gap is smaller than the proper gap, the filling amount of the sealant is controlled in a decreasing direction so that even if there is variation in the gap, the variation can be adjusted according to the variation. Further, it is possible to adaptively fill a proper amount of the sealant, and it is possible to avoid the above-mentioned inconvenience, that is, the problem of poor appearance and the problem of malfunction.

In a preferred embodiment, the filling amount of the sealant is controlled based on a value obtained by subtracting the height of the electronic component from the difference between the surface height of the electronic component and the surface height of the substrate. It is characterized by that.

In this aspect, the filling amount of the sealant is controlled based on the value obtained by subtracting the height of the electronic component from the difference between the surface height of the electronic component in the mounted state and the surface height of the substrate. here,
The gap between the electronic component in the mounted state and the substrate is the height of the electronic component due to the difference between the surface height of the electronic component and the surface height of the substrate (a value unique to the electronic component and known before mounting). Is given). Therefore, the gap can be accurately measured, the degree of variation from the proper gap can be accurately grasped, and the filling amount of the sealant can be appropriately controlled.

Alternatively, the sealing agent filling method according to the present invention is
In a sealant filling method of filling a sealant in a recess formed in a substrate to seal the recess, the depth of the recess is measured, and the filling amount of the sealant is determined based on the measured value. It is characterized by controlling.

In the present invention, the depth of the recess formed in the substrate is measured, and the filling amount of the sealant for sealing the recess is controlled based on the measured value. Here, when variations occur in the depth of the recess due to manufacturing errors or the like, the amount of the sealant may be excessive or insufficient, but since the filling amount of the sealant is controlled based on the actual depth of the recess, Inconvenience can be avoided.

In a preferred embodiment of the invention, the filling amount of the sealant is controlled based on the measured value and the volume of the recessed portion calculated from the opening size of the recessed portion. is there.

In this aspect, based on the actual depth of the recess and the volume of the recess calculated from the opening size of the recess,
The filling amount of the sealant is controlled. Here, the volume of the recess is
Since the amount corresponds to the actual filling amount of the sealant, the recesses can be filled with the sealant in proper proportion.

The sealant filling device according to the present invention comprises a measuring means for measuring the surface height of the electronic component and the surface height of the substrate in a state where the electrode on the electronic component side and the electrode on the substrate side are connected. A control means for controlling the filling amount of the sealant filled in the gap between the electronic component and the substrate based on the measured value is provided.

In the present invention, the filling amount of the encapsulant is controlled based on the surface height of the electronic component and the surface height of the substrate in the mounted state. Here, since the surface height of the electronic component changes corresponding to the gap between the electronic component and the substrate, if the gap becomes larger than the proper gap, the filling amount of the sealant increases. On the other hand, if the gap is smaller than the proper gap, the filling amount of the sealant is controlled in a decreasing direction so that even if there is variation in the gap, the variation can be adjusted according to the variation. Further, it is possible to adaptively fill a proper amount of the sealant, and it is possible to avoid the above-mentioned inconvenience, that is, the problem of poor appearance and the problem of malfunction.

[0028] In a preferred aspect thereof, the control means is based on a value obtained by subtracting the height of the electronic component from the difference between the surface height of the electronic component and the surface height of the substrate, and the filling amount of the sealant. It is characterized by controlling.

In this aspect, the filling amount of the sealant is controlled based on the value obtained by subtracting the height of the electronic component from the difference between the surface height of the electronic component in the mounted state and the surface height of the substrate. here,
The gap between the electronic component in the mounted state and the substrate is the height of the electronic component due to the difference between the surface height of the electronic component and the surface height of the substrate (a value unique to the electronic component and known before mounting). Is given). Therefore, the gap can be accurately measured, the degree of variation from the proper gap can be accurately grasped, and the filling amount of the sealant can be appropriately controlled.

Alternatively, the sealant filling device according to the present invention is
It is characterized by comprising a measuring means for measuring the depth of the recess formed in the substrate, and a control means for controlling the filling amount of the sealant to be filled in the recess based on the measured value. .

In the present invention, the depth of the recess formed in the substrate is measured, and the filling amount of the sealant for sealing the recess is controlled based on the measured value. Here, when variations occur in the depth of the recess due to manufacturing errors or the like, the amount of the sealant may be excessive or insufficient, but since the filling amount of the sealant is controlled based on the actual depth of the recess, Inconvenience can be avoided.

In a preferred aspect of the invention, the control means controls the filling amount of the sealant based on the measured value and the volume of the recess determined from the opening size of the recess. To do.

In this aspect, based on the actual depth of the recess and the volume of the recess determined from the opening size of the recess,
The filling amount of the sealant is controlled. Here, the volume of the recess is
Since the amount corresponds to the actual filling amount of the sealant, the recesses can be filled with the sealant in proper proportion.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a conceptual configuration diagram of a sealant filling device. The sealant filling device 20 may be an independent device, or may be a combined device with a mounting machine such as a rotary head type, an in-line type, or a batch type. Hereinafter, for convenience of description, the description will be given as an independent device.

The sealant filling device 20 comprises at least a measuring section (measuring means) 21, a control section (control means) 22 and a discharge section 23. The measuring unit 21 measures the surface height of the surface mounting board 25 placed on the table 24. Here, the surface mount substrate 25 includes an electrode pad (electrode) 27 formed on one surface of the electronic component 26 and an electrode pad (electrode) of the substrate 28.
It is electrically connected to 29 by a bump 30. The electronic component 26 is, for example, an active component such as a semiconductor bare chip or a transistor, a passive component such as a resistor, a capacitor, or a filter, or a mixed component thereof, that is, any electronic component required to realize a desired circuit function. It is one of the component parts.

The control unit 22 calculates the filling amount of the sealant 32 in the surface mounting board 25 based on the measurement value of the measuring unit 21, and the discharging unit 23 calculates the amount of the sealant corresponding to the calculated amount. Three
2 is discharged from the nozzle 31.

The sealant 32 has electrical insulation and environment resistance (for example, water resistance and some heat resistance), has viscosity (fluidity) at the time of ejection, and has elapsed time (or heating, etc.). (The physical conditions of the), it loses its viscosity and hardens (not necessarily means solidification; it does not have to flow)
It has a property. Examples of such materials include epoxy resin, acrylic resin, phenol resin,
Polyimide resin, thermosetting silicone resin, thermosetting P
PE resin, BCB resin and the like are known.

The tip of the nozzle 31 is directed toward the vicinity of the side surface of the electronic component 26, and if the amount of the sealant 32 discharged from the nozzle 31 is appropriate, it covers the side surface of the electronic component 26. At the same time, a curve is drawn so as to draw the skirt, and it is fixed on the substrate 28. In addition, the encapsulant 32 causes the lower surface of the electronic component 26 (the surface on which the electrode pad 27 is formed) and the upper surface of the substrate 28 (the electrode pad 29) due to the capillary phenomenon associated with its viscosity.
The gap Gap between the electrode pad 27 of the electronic component 26 and the electrode pad 2 of the substrate 28.
9 and the bumps 30 are all sealed with the sealant 32, and electrical insulation and environmental resistance can be secured.
The package can be eliminated.

Now, as explained at the beginning, the sealant 3
When the filling amount of 2 is constant, the filling amount becomes excessive or insufficient depending on the size of Gap. That is, in the worst case, an excessively small amount of filling causes the electrode pads 27, 29 or the bumps 30 to be exposed, which causes a malfunction, and an excessively large amount of filling causes a problem of poor appearance.

In the present embodiment, in order to avoid such an inconvenience, the measuring unit 21 uses the surface height of the surface mounting board 25, more specifically, the surface height (H ₁ ) of the electronic component 26 of the surface mounting board 25, The surface height (H ₂ ) of the substrate 28 of the surface-mounting substrate 25 is measured, and the control unit 22 uses the measured values (H ₁ , H ₂ ) and the known height (H ₃ ) of the electronic component 26. The actual Gap is obtained, and the amount of the sealant 32 suitable for the Gap is ejected from the nozzle 31 of the ejection unit 23.

Gap is given by the following equation (1). _{Gap = H 1 -H 2 -H 3} ···· (1) This equation is, in short, the difference between the surface height of the electronic component 26 (H ₁₎ and the surface height of the substrate _{28 (H 2) (H 1} - H ₂ ),
The known height (H ₃ ) of the electronic component 26 is subtracted from the difference, and the answer is Gap. For example, the surface height (H ₁ ) of the electronic component 26 is 1.0 mm, the surface height (H ₂ ) of the substrate 28 is 0.0 mm (that is, the reference height), and the known height (H ₃ ) of the electronic component 26 is 0. When it is set to 0.6 mm, Gap is 1.0 mm-0.0 m from the above formula (1).
m-0.6 mm = 0.4 mm. The ejection unit 23 ejects the sealant 32 in an amount suitable for this “Gap = 0.4 mm” from the nozzle 31.

[0042] Here, the measuring unit 21, as described earlier, it is to measure the surface height of the electronic component 26 (H ₁₎ and the surface height of the substrate 28 (H _2). As specific means thereof, for example, the height of the measured point is measured in a non-contact manner by using a laser beam, or the tip of the pin is pressed against the measured point to measure the expansion / contraction state of the pin. Although there are various types of devices that measure the height of the device, the optimum means may be adopted in consideration of measurement accuracy, responsiveness, device cost, and the like.

FIG. 2 is a diagram showing an operation flowchart of the sealant filling device 20. In this figure, the sealant filling device 20 first measures the surface height (H ₁ , H ₂ ) of the surface mount component 25 placed on the table 24 (step S).
11). H ₁ is the surface height of the electronic component 26 of the surface mount board 25, and H ₂ is the surface height of the board 28 of the surface mount board 25.

Next, the gap (Gap) between the lower surface of the electronic component 26 (the surface on which the electrode pad 27 is formed) and the upper surface of the substrate 28 (the surface on which the electrode pad 29 is formed) is calculated from the equation (1). (Step S12). Then, the filling amount corresponding to the Gap size is set (step S13), and then,
The sealant 32 is discharged from the nozzle 31 of the discharge unit 23 to the vicinity of the side surface of the electronic component 26 (step S14), and when the discharge amount reaches the set filling amount, the discharge operation is ended (step S15).

3A and 3B are characteristic diagrams of the control of the filling amount of the sealant, where FIG. 3A shows the discharge time as a variable element, and FIG. 3B shows the discharge pressure as a variable element. In (a), the vertical axis is the actual filling amount and the horizontal axis is the ejection time. The characteristic line 40 represents that the actual discharge amount increases or decreases according to the length of the discharge time under a constant discharge pressure. Further, in (b), the vertical axis is the actual filling amount and the horizontal axis is the discharge pressure. The characteristic line 41 represents that the actual ejection amount increases or decreases according to the magnitude of the ejection pressure during a constant ejection time.

When the characteristic line 40 is used, a filling amount 42 sufficient to fill Gap (obtained in step S13) is specified, and the ejection amount corresponding to the Gap is determined from the filling amount 42 and the characteristic line 40. You just have to find the time 43,
When using the characteristic line 41, Gap (step S13
It is sufficient to specify a filling amount 44 that is sufficient to fill (the value obtained in step 1) and obtain the ejection pressure 45 corresponding to the Gap from the filling amount 44 and the characteristic line 41.

As described above, in the present embodiment, the surface height (H ₁ ) of the electronic component 26 of the surface mount board 25 is set.
And the surface height (H ₂ ) of the substrate 28 of the surface-mounting substrate 25 are measured, and the actual Gap is calculated from the measured values (H ₁ , H ₂ ) and the known height (H ₃ ) of the electronic component 26. For that G
Since the amount of the sealant 32 suitable for the ap is discharged to the vicinity of the side surface of the electronic component 26 of the surface mounting substrate 25, even if the gap varies, the sealant 32 may have an excess or deficiency. Of the surface mount substrate 25 can be avoided, and the appearance defect due to overfilling can be avoided, and the problem of malfunction can be avoided by preventing the exposure of the electrodes and the like (electrode pads 27, 29 and bumps 30) due to insufficient filling. A beneficial effect that greatly contributes to quality improvement can be obtained.

In the above embodiment, the example in which the gap (Gap) between the electronic component and the substrate is filled with the sealant is shown, but the present invention is not limited to this mode. For example, it may be applied to an example in which the recess formed in the substrate is filled with the sealant.

FIG. 4 is a conceptual view of a main portion of another embodiment, which is a view of a portion replacing the surface mount board 25 in the above embodiment. In the figure, the substrate 50 has a recess 51 formed therein. The substrate 50 may itself be the final form of the electronic substrate,
Alternatively, it may be a partial substrate in which another substrate is laminated and fixed onto the substrate 50 to form a predetermined layer of the multilayer structure substrate.
When the substrate is a partial substrate, the opening of the recess 51 of the substrate 50 is closed by another substrate stacked thereon, and in this closed state, the inside of the recess 51 is a closed space (so-called cavity). Therefore, it is generally called a "cavity".

Now, the purpose of forming or using the concave portion 51 is various. It may be formed depending on the convenience of electronic components mounted on the substrate 50, or may be formed for the purpose of improving the electrical characteristics of the substrate 50. Alternatively, it may be formed for the purpose of embedding (embedding) the electronic component 53 inside the substrate 50. For any purpose, when it becomes necessary to fill and seal the concave portion 51 with the sealing agent 52, the filling amount of the sealing agent 52 must be an appropriate amount that does not cause excess or deficiency. This is because if the filling amount is small, the concave portion 51 cannot be completely sealed, and for example, when the electronic component 53 is embedded, a part of the electronic component 53 may be exposed. Alternatively, if the filling amount is too large, the encapsulant 52 bulges from the surface of the substrate 50, resulting in poor appearance, and inconvenience such as interlayer separation when producing a multilayer structure substrate.

Therefore, in this embodiment, the surface height (H ₁₁ ) of the substrate 50 and the bottom surface height (H ₁₂ ) of the recess 51 are measured, and these measured values (H ₁₁ , H ₁₂ ) are used to measure the recess 51. Obtain the depth (H ₁₂ −H ₁₁ ), and determine the depth and the opening size L of the recess 51.
The volume of the recess 51 is calculated from (known), and the amount of the sealant 52 corresponding to the volume is filled. When the electronic component 53 is embedded in the recess 51, a value obtained by subtracting the volume A of the electronic component 53 is defined as the volume.

In this way, the recess 51 formed in the substrate 50 can be sealed with an appropriate amount of the sealant 52, and the appearance can be improved and other disadvantages can be avoided.

[0053]

According to one aspect of the present invention, the filling amount of the sealant is controlled based on the surface height of the electronic component in the mounted state and the surface height of the substrate. The surface height of the electronic component and the surface height of the substrate are
Since the gap changes according to the gap between the electronic component and the substrate, if the gap becomes larger than the proper gap, the filling amount of the sealant is controlled to increase, while the gap becomes proper. If the gap is too small, the filling amount of the sealant is controlled in a decreasing direction so that even if there is variation in the gap, an appropriate amount of sealant can be applied according to the variation. Therefore, it is possible to avoid the above-mentioned inconvenience, that is, the problem of poor appearance and the problem of malfunction.

According to the second invention, the depth of the recess formed in the substrate is measured, and the filling amount of the sealant for sealing the recess is controlled based on the measured value. If the depth of the recess varies due to manufacturing error or the like, the amount of the sealant will be too large or too small.However, since the filling amount of the sealant is controlled based on the actual depth of the recess, this problem is avoided. it can.

[Brief description of drawings]

FIG. 1 is a conceptual configuration diagram of a sealant filling device 20.

FIG. 2 is a diagram showing an operation flowchart of the sealant filling device 20.

FIG. 3 is a characteristic diagram for controlling a filling amount of a sealant.

FIG. 4 is a conceptual diagram of a main part showing another embodiment.

FIG. 5 is a structural diagram of flip-chip mounting.

FIG. 6 is a conceptual diagram of a first conventional technique.

[Explanation of symbols]

Gap Gap H ₁ Surface height of electronic component H ₂ Surface height of substrate H ₃ Height of electronic component L Opening size 20 Sealant filling device 21 Measuring unit (measuring means) 22 Control unit (controlling means) 26 Electronic component 27 Electrode Pad (electrode) 28 Substrate 29 Electrode pad (electrode) 32 Sealant 50 Substrate 51 Recess

Claims (8)

[Claims] 1. A sealant for sealing a component by filling a gap between the electronic component and the substrate with a sealant in a state where an electrode on the electronic component side and an electrode on the substrate side are connected to each other. In the filling method, the surface height of the electronic component in the above state and the surface height of the substrate are measured, and the filling amount of the sealing agent is controlled based on the measured values. Method. 2. The filling amount of the sealant is controlled based on a value obtained by subtracting the height of the electronic component from the difference between the surface height of the electronic component and the surface height of the substrate. The sealing agent filling method according to claim 1. 3. A sealant filling method for filling a sealant in a recess formed in a substrate to seal the recess, wherein the depth of the recess is measured, and the sealing is performed based on the measured value. A method for filling a sealing agent, which comprises controlling the filling amount of the sealing agent. 4. The encapsulation according to claim 3, wherein the filling amount of the encapsulant is controlled based on the measured value and the volume of the recess determined from the opening size of the recess. Agent filling method. 5. A measuring means for measuring the surface height of the electronic component and the surface height of the substrate in a state where an electrode on the electronic component side and an electrode on the substrate side are connected, and the electronic means based on the measured value. A sealant filling device, comprising: a control unit that controls a filling amount of a sealant that fills a gap between a component and the substrate. 6. The control means controls the filling amount of the encapsulant based on a value obtained by subtracting the height of the electronic component from the difference between the surface height of the electronic component and the surface height of the substrate. The sealant filling device according to claim 5, which is characterized in that. 7. A measuring means for measuring the depth of a concave portion formed on a substrate, and a control means for controlling a filling amount of a sealant filling the concave portion based on the measured value. And a sealant filling device. 8. The control means controls the filling amount of the sealant based on the measured value and the volume of the recess determined from the opening size of the recess. Sealant filling device.