KR101954455B1 - 인 함유 페놀 수지와 그 제조 방법, 그 수지 조성물, 경화물 - Google Patents

인 함유 페놀 수지와 그 제조 방법, 그 수지 조성물, 경화물 Download PDF

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Publication number
KR101954455B1
KR101954455B1 KR1020120125234A KR20120125234A KR101954455B1 KR 101954455 B1 KR101954455 B1 KR 101954455B1 KR 1020120125234 A KR1020120125234 A KR 1020120125234A KR 20120125234 A KR20120125234 A KR 20120125234A KR 101954455 B1 KR101954455 B1 KR 101954455B1
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KR
South Korea
Prior art keywords
phosphorus
containing phenol
resin
reaction
epoxy resin
Prior art date
Application number
KR1020120125234A
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English (en)
Korean (ko)
Other versions
KR20130052518A (ko
Inventor
요코 모리타
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20130052518A publication Critical patent/KR20130052518A/ko
Application granted granted Critical
Publication of KR101954455B1 publication Critical patent/KR101954455B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
KR1020120125234A 2011-11-11 2012-11-07 인 함유 페놀 수지와 그 제조 방법, 그 수지 조성물, 경화물 KR101954455B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011247988A JP5917098B2 (ja) 2011-11-11 2011-11-11 リン含有フェノール樹脂の製造方法
JPJP-P-2011-247988 2011-11-11

Publications (2)

Publication Number Publication Date
KR20130052518A KR20130052518A (ko) 2013-05-22
KR101954455B1 true KR101954455B1 (ko) 2019-03-05

Family

ID=48310694

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120125234A KR101954455B1 (ko) 2011-11-11 2012-11-07 인 함유 페놀 수지와 그 제조 방법, 그 수지 조성물, 경화물

Country Status (4)

Country Link
JP (1) JP5917098B2 (zh)
KR (1) KR101954455B1 (zh)
CN (1) CN103102471B (zh)
TW (1) TWI543997B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6228799B2 (ja) * 2013-09-30 2017-11-08 新日鉄住金化学株式会社 エポキシ樹脂組成物及びその硬化物
JP7211749B2 (ja) * 2018-09-27 2023-01-24 日鉄ケミカル＆マテリアル株式会社 リン含有硬化剤、該リン含有硬化剤とエポキシ樹脂を含有するエポキシ樹脂組成物、およびその硬化物
CN111806001A (zh) * 2020-07-08 2020-10-23 山东金宝电子股份有限公司 一种耐浸焊高柔韧cem-1覆铜板的制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001348420A (ja) 2000-06-06 2001-12-18 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ、多層プリント配線板
JP2002206019A (ja) 2000-09-12 2002-07-26 Mitsui Chemicals Inc リン含有エポキシ樹脂、該樹脂を用いた難燃性高耐熱エポキシ樹脂組成物及び積層板
JP2003040969A (ja) 2001-07-26 2003-02-13 Toto Kasei Co Ltd 含燐フェノール樹脂及び該フェノール樹脂を用いたエポキシ樹脂組成物
JP2003277487A (ja) 2002-03-26 2003-10-02 Matsushita Electric Works Ltd プリント配線板用リン変性エポキシ樹脂組成物及びその製造方法
WO2006059363A1 (ja) 2004-11-30 2006-06-08 Matsushita Electric Works, Ltd. プリプレグ用エポキシ樹脂組成物およびプリプレグ、多層プリント配線板
JP2010275414A (ja) 2009-05-28 2010-12-09 Nippon Steel Chem Co Ltd リン含有フェノール樹脂、該樹脂の製造方法、該樹脂を用いたリン含有エポキシ樹脂組成物および該組成物の硬化物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547386B2 (ja) * 2008-09-25 2014-07-09 パナソニック株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、および多層プリント配線板
JP5544184B2 (ja) * 2010-02-08 2014-07-09 新日鉄住金化学株式会社 リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001348420A (ja) 2000-06-06 2001-12-18 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ、多層プリント配線板
JP2002206019A (ja) 2000-09-12 2002-07-26 Mitsui Chemicals Inc リン含有エポキシ樹脂、該樹脂を用いた難燃性高耐熱エポキシ樹脂組成物及び積層板
JP2003040969A (ja) 2001-07-26 2003-02-13 Toto Kasei Co Ltd 含燐フェノール樹脂及び該フェノール樹脂を用いたエポキシ樹脂組成物
JP2003277487A (ja) 2002-03-26 2003-10-02 Matsushita Electric Works Ltd プリント配線板用リン変性エポキシ樹脂組成物及びその製造方法
WO2006059363A1 (ja) 2004-11-30 2006-06-08 Matsushita Electric Works, Ltd. プリプレグ用エポキシ樹脂組成物およびプリプレグ、多層プリント配線板
JP2010275414A (ja) 2009-05-28 2010-12-09 Nippon Steel Chem Co Ltd リン含有フェノール樹脂、該樹脂の製造方法、該樹脂を用いたリン含有エポキシ樹脂組成物および該組成物の硬化物

Also Published As

Publication number Publication date
CN103102471A (zh) 2013-05-15
JP2013103975A (ja) 2013-05-30
JP5917098B2 (ja) 2016-05-11
KR20130052518A (ko) 2013-05-22
TW201323468A (zh) 2013-06-16
CN103102471B (zh) 2018-01-09
TWI543997B (zh) 2016-08-01

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