KR101952823B1 - 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법 - Google Patents

필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법 Download PDF

Info

Publication number
KR101952823B1
KR101952823B1 KR1020187009234A KR20187009234A KR101952823B1 KR 101952823 B1 KR101952823 B1 KR 101952823B1 KR 1020187009234 A KR1020187009234 A KR 1020187009234A KR 20187009234 A KR20187009234 A KR 20187009234A KR 101952823 B1 KR101952823 B1 KR 101952823B1
Authority
KR
South Korea
Prior art keywords
film
resin
formula
polyamide
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020187009234A
Other languages
English (en)
Korean (ko)
Other versions
KR20180094840A (ko
Inventor
고지 미야모토
노조미 마스이
쇼 가네사카
준이치 이케우치
Original Assignee
스미또모 가가꾸 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=62909127&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101952823(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 스미또모 가가꾸 가부시키가이샤 filed Critical 스미또모 가가꾸 가부시키가이샤
Publication of KR20180094840A publication Critical patent/KR20180094840A/ko
Application granted granted Critical
Publication of KR101952823B1 publication Critical patent/KR101952823B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020187009234A 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법 Expired - Fee Related KR101952823B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017008828 2017-01-20
JPJP-P-2017-008828 2017-01-20
PCT/JP2018/000805 WO2018135432A1 (ja) 2017-01-20 2018-01-15 フィルム、樹脂組成物及びポリアミドイミド樹脂の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187035605A Division KR20180133564A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

Publications (2)

Publication Number Publication Date
KR20180094840A KR20180094840A (ko) 2018-08-24
KR101952823B1 true KR101952823B1 (ko) 2019-02-27

Family

ID=62909127

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020187009234A Expired - Fee Related KR101952823B1 (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
KR1020187035605A Ceased KR20180133564A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
KR1020207009594A Ceased KR20200038329A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020187035605A Ceased KR20180133564A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
KR1020207009594A Ceased KR20200038329A (ko) 2017-01-20 2018-01-15 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법

Country Status (5)

Country Link
JP (2) JP7118651B2 (https=)
KR (3) KR101952823B1 (https=)
CN (1) CN110191909B (https=)
TW (1) TW201831565A (https=)
WO (1) WO2018135432A1 (https=)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7084710B2 (ja) * 2017-01-20 2022-06-15 住友化学株式会社 ポリアミドイミド樹脂および該ポリアミドイミド樹脂を含んでなる光学部材
JP6872023B2 (ja) * 2017-02-08 2021-05-19 エスケイシー・カンパニー・リミテッドSkc Co., Ltd. ポリアミドイミドフィルムの製造方法
JP7145703B2 (ja) * 2017-09-08 2022-10-03 三星電子株式会社 ポリ(アミド-イミド)コポリマー、ポリ(アミド-イミド)コポリマー製造用組成物、ポリ(アミド-イミド)コポリマーを含む成形品および表示装置
KR102430056B1 (ko) 2017-09-08 2022-08-05 삼성전자주식회사 폴리(아미드-이미드) 코폴리머, 폴리(아미드-이미드) 코폴리머 제조용 조성물, 폴리(아미드-이미드) 코폴리머를 포함하는 성형품 및 표시 장치
CA3108784A1 (en) * 2018-08-07 2020-04-02 Zymergen Inc. Optically transparent polyimides
JP2020037675A (ja) * 2018-08-29 2020-03-12 住友化学株式会社 光学フィルム
WO2020137870A1 (ja) * 2018-12-26 2020-07-02 住友化学株式会社 ポリイミド系樹脂の製造方法
JP2020105497A (ja) * 2018-12-26 2020-07-09 住友化学株式会社 ポリイミド系樹脂及びその製造方法
JP2020105496A (ja) * 2018-12-26 2020-07-09 住友化学株式会社 ポリイミド系樹脂の製造方法
TW202037642A (zh) * 2018-12-28 2020-10-16 日商住友化學股份有限公司 光學膜
JP7365211B2 (ja) * 2019-12-02 2023-10-19 住友化学株式会社 光学フィルム
KR20210110647A (ko) * 2018-12-28 2021-09-08 스미또모 가가꾸 가부시키가이샤 광학 필름, 플렉시블 표시 장치 및 폴리아미드이미드계 수지
CN113227211A (zh) * 2018-12-28 2021-08-06 住友化学株式会社 聚酰胺系树脂、光学膜及柔性显示装置
CN111381295A (zh) * 2018-12-28 2020-07-07 住友化学株式会社 光学膜
JP7382810B2 (ja) * 2018-12-28 2023-11-17 住友化学株式会社 光学フィルム
CN111378130A (zh) * 2018-12-28 2020-07-07 住友化学株式会社 光学膜
WO2020138045A1 (ja) * 2018-12-28 2020-07-02 住友化学株式会社 光学フィルム及びフレキシブル表示装置
WO2020138046A1 (ja) * 2018-12-28 2020-07-02 住友化学株式会社 光学フィルム
CN113227209A (zh) * 2018-12-28 2021-08-06 住友化学株式会社 聚酰胺酰亚胺系树脂、光学膜及柔性显示装置
WO2020138044A1 (ja) * 2018-12-28 2020-07-02 住友化学株式会社 ポリアミド系樹脂、光学フィルム及びフレキシブル表示装置
JP2020122122A (ja) * 2019-01-31 2020-08-13 住友化学株式会社 ポリイミド系樹脂粉体及びポリイミド系樹脂粉体の製造方法
TWI730820B (zh) * 2019-06-28 2021-06-11 南韓商Skc股份有限公司 聚合物薄膜
JP7512805B2 (ja) * 2019-10-02 2024-07-09 大日本印刷株式会社 ポリアミドイミド樹脂、ポリアミドイミドワニス、ポリアミドイミドフィルム、積層体、ディスプレイ用部材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
CN112646371A (zh) * 2019-10-11 2021-04-13 住友化学株式会社 光学膜及柔性显示装置
KR20220095209A (ko) * 2019-10-31 2022-07-06 스미또모 가가꾸 가부시키가이샤 광학 필름 및 플렉시블 표시 장치
CN112778522A (zh) * 2019-11-07 2021-05-11 住友化学株式会社 聚酰胺酰亚胺树脂、光学膜及柔性显示装置
KR20220145328A (ko) * 2020-03-05 2022-10-28 수미토모 케미칼 컴퍼니 리미티드 광학 적층체 및 표시 장치
KR102286207B1 (ko) * 2020-05-04 2021-08-06 에스케이이노베이션 주식회사 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널
WO2022071443A1 (ja) * 2020-09-30 2022-04-07 太陽ホールディングス株式会社 ポリアミドイミド共重合体およびこれを用いたフィルム
JP2022096909A (ja) * 2020-12-18 2022-06-30 住友化学株式会社 表示装置用前面板
TWI740758B (zh) * 2020-12-25 2021-09-21 律勝科技股份有限公司 聚醯胺醯亞胺共聚物及含其之薄膜
JP7831979B2 (ja) * 2021-11-16 2026-03-17 株式会社カネカ 樹脂組成物およびフィルム
KR102845592B1 (ko) * 2022-11-14 2025-08-13 에스케이마이크로웍스솔루션즈 주식회사 폴리아마이드-이미드계 필름, 이의 제조방법, 및 이를 포함하는 커버 윈도우 및 디스플레이 장치
CN121969673A (zh) * 2023-10-03 2026-05-01 株式会社钟化 聚酰胺酰亚胺、树脂组合物、成形体和薄膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265371A (ja) 2005-03-24 2006-10-05 Teijin Ltd ポリイミドフィルムの製造方法
KR101459178B1 (ko) 2011-09-30 2014-11-07 코오롱인더스트리 주식회사 공중합 폴리아마이드-이미드 필름 및 공중합 폴리아마이드-이미드의 제조방법
JP2016125063A (ja) 2015-01-02 2016-07-11 三星電子株式会社Samsung Electronics Co., Ltd. 表示装置用ウィンドウフィルムおよびこれを含む表示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4802934B2 (ja) * 2006-08-18 2011-10-26 新日本理化株式会社 脂環系ポリイミド共重合体及びその製造方法
JP5359029B2 (ja) * 2007-06-06 2013-12-04 Jnc株式会社 酸二無水物、液晶配向膜および液晶表示素子
WO2009063742A1 (ja) * 2007-11-12 2009-05-22 Toyo Boseki Kabushiki Kaisha 金属積層体
WO2009116500A1 (ja) * 2008-03-19 2009-09-24 Jsr株式会社 ポリイミド系材料、ポリイミドフィルム及びそれらの製造方法
KR20130071650A (ko) * 2011-12-21 2013-07-01 코오롱인더스트리 주식회사 투명 폴리아마이드―이미드 필름 및 그 제조방법
CN104204925A (zh) * 2012-03-30 2014-12-10 日产化学工业株式会社 聚酰亚胺类的液晶取向处理剂、液晶取向膜及液晶显示元件
EP2864400A4 (en) 2012-06-25 2016-02-24 Kolon Inc POLYAMIDE IMIDE COPOLYMER FILM AND PROCESS FOR PREPARING A POLYAMIDE IMIDE COPOLYMER
WO2015060363A1 (ja) * 2013-10-23 2015-04-30 日産化学工業株式会社 液晶配向剤、液晶配向膜、及び液晶配向素子
KR102268406B1 (ko) * 2014-02-21 2021-06-23 미쯔비시 케미컬 주식회사 폴리이미드 전구체 및/또는 폴리이미드를 포함하는 조성물, 및 폴리이미드 필름
JP6599620B2 (ja) * 2015-03-05 2019-10-30 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
CN105237767A (zh) * 2015-07-25 2016-01-13 常州大学 一种液晶聚酰胺酰亚胺及其制备方法
KR101984171B1 (ko) * 2016-06-01 2019-05-30 주식회사 엘지화학 고강도 투명 폴리아미드이미드 및 이의 제조방법
CN106117556B (zh) * 2016-07-12 2020-08-14 苏州优瑞德新材料有限公司 可溶性的聚酰胺酰亚胺树脂,以及从该树脂得到的柔性覆金属板和柔性印制电路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265371A (ja) 2005-03-24 2006-10-05 Teijin Ltd ポリイミドフィルムの製造方法
KR101459178B1 (ko) 2011-09-30 2014-11-07 코오롱인더스트리 주식회사 공중합 폴리아마이드-이미드 필름 및 공중합 폴리아마이드-이미드의 제조방법
JP2016125063A (ja) 2015-01-02 2016-07-11 三星電子株式会社Samsung Electronics Co., Ltd. 表示装置用ウィンドウフィルムおよびこれを含む表示装置

Also Published As

Publication number Publication date
WO2018135432A1 (ja) 2018-07-26
KR20180133564A (ko) 2018-12-14
CN110191909A (zh) 2019-08-30
KR20200038329A (ko) 2020-04-10
CN110191909B (zh) 2021-10-22
JP7118651B2 (ja) 2022-08-16
KR20180094840A (ko) 2018-08-24
JP2018119141A (ja) 2018-08-02
JP6675509B2 (ja) 2020-04-01
JP2019104939A (ja) 2019-06-27
TW201831565A (zh) 2018-09-01

Similar Documents

Publication Publication Date Title
KR101952823B1 (ko) 필름, 수지 조성물 및 폴리아미드이미드 수지의 제조 방법
JP7005680B2 (ja) ポリイミドフィルム
KR102475748B1 (ko) 폴리아미드이미드 수지 및 당해 폴리아미드이미드 수지를 포함하여 이루어지는 광학 부재
KR102461806B1 (ko) 광학 필름 및 광학 필름의 제조 방법
TWI758399B (zh) 光學膜及光學膜之製造方法
US11274206B2 (en) Polyamideimide resin and optical member including polyamideimide resin
JP2018119144A (ja) ポリイミド系フィルム及び積層体
JP6738946B1 (ja) 光学フィルム
JP7053904B2 (ja) 光学積層体及び表示装置
KR20190053112A (ko) 광학 필름
JP7257901B2 (ja) 光学フィルム
KR20190053105A (ko) 광학 필름
KR20200044751A (ko) 폴리아미드이미드 수지 및 광학 필름
JP2019085549A (ja) 光学フィルム
JP2023132813A (ja) ポリイミド系フィルムの製造方法
KR20200010083A (ko) 폴리아미드계 수지 분체의 제조 방법 및 폴리아미드계 수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

A302 Request for accelerated examination
PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E14-X000 Pre-grant third party observation filed

St.27 status event code: A-2-3-E10-E14-opp-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240222

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240222