KR101885391B1 - 은분 및 그 제조 방법 - Google Patents

은분 및 그 제조 방법 Download PDF

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Publication number
KR101885391B1
KR101885391B1 KR1020137005224A KR20137005224A KR101885391B1 KR 101885391 B1 KR101885391 B1 KR 101885391B1 KR 1020137005224 A KR1020137005224 A KR 1020137005224A KR 20137005224 A KR20137005224 A KR 20137005224A KR 101885391 B1 KR101885391 B1 KR 101885391B1
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KR
South Korea
Prior art keywords
silver
paste
kneading
silver powder
particles
Prior art date
Application number
KR1020137005224A
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English (en)
Korean (ko)
Other versions
KR20140030091A (ko
Inventor
츠요시 가와시마
미카 오카다
에이지 이시다
도모미치 니헤이
도시아키 테라오
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20140030091A publication Critical patent/KR20140030091A/ko
Application granted granted Critical
Publication of KR101885391B1 publication Critical patent/KR101885391B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/24—Features related to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020137005224A 2011-06-08 2012-06-08 은분 및 그 제조 방법 KR101885391B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011128015 2011-06-08
JPJP-P-2011-128015 2011-06-08
PCT/JP2012/064832 WO2012169628A1 (ja) 2011-06-08 2012-06-08 銀粉及びその製造方法

Publications (2)

Publication Number Publication Date
KR20140030091A KR20140030091A (ko) 2014-03-11
KR101885391B1 true KR101885391B1 (ko) 2018-08-03

Family

ID=47296181

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137005224A KR101885391B1 (ko) 2011-06-08 2012-06-08 은분 및 그 제조 방법

Country Status (6)

Country Link
JP (1) JP5288063B2 (zh)
KR (1) KR101885391B1 (zh)
CN (1) CN103079728B (zh)
MY (1) MY158931A (zh)
TW (1) TWI574761B (zh)
WO (1) WO2012169628A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5500237B1 (ja) * 2012-12-05 2014-05-21 住友金属鉱山株式会社 銀粉
JP5505535B1 (ja) * 2012-12-07 2014-05-28 住友金属鉱山株式会社 銀粉
JP6115405B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
JP6115406B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
JP6404554B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀粉の製造方法
JP6404553B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀溶液の管理方法および銀粉の製造方法
JP6206248B2 (ja) * 2014-02-26 2017-10-04 住友金属鉱山株式会社 導電性ペーストに含まれる導電性粉末の粗大粒子の評価方法
JP6252275B2 (ja) * 2014-03-20 2017-12-27 住友金属鉱山株式会社 銀粉及びその製造方法
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
WO2016121749A1 (ja) * 2015-01-30 2016-08-04 住友電気工業株式会社 金属粉末、インク、焼結体及びプリント配線板用基材並びに金属粉末の製造方法
JP6727922B2 (ja) * 2016-05-20 2020-07-22 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法、ならびに導電性ペースト
EP4023721A4 (en) * 2019-08-26 2023-08-30 Kyocera Corporation SILVER PARTICLE PRODUCTION METHOD, THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC PART
CN112430443B (zh) * 2019-08-26 2022-12-23 京瓷株式会社 导热性粘合用片、导热性粘合用片制造方法和半导体装置
KR20230008044A (ko) * 2020-04-14 2023-01-13 소에이 가가쿠 고교 가부시키가이샤 무기 미분말 제조방법
CN113192689B (zh) * 2021-04-07 2023-05-09 湖南中伟新银材料科技有限公司 一种银粉分散体的制备方法和应用
CN113192690B (zh) * 2021-04-07 2023-05-09 湖南中伟新银材料科技有限公司 一种uv固化导电银浆的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010236007A (ja) * 2009-03-31 2010-10-21 Mitsubishi Materials Corp 球状銀粒子及び該銀粒子の製造方法並びに製造装置
JP2011001581A (ja) * 2009-06-17 2011-01-06 Sumitomo Metal Mining Co Ltd 銀粉及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09256008A (ja) * 1996-03-15 1997-09-30 Noritake Co Ltd 単分散性銀−パラジウム複合粉末の製造方法及びその粉末
JP3751154B2 (ja) 1998-10-22 2006-03-01 同和鉱業株式会社 銀粉の製造方法
JP2004043892A (ja) * 2002-07-11 2004-02-12 Sumitomo Electric Ind Ltd 貴金属微粒子とその製造方法
JP3991218B2 (ja) 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
KR101375488B1 (ko) * 2006-07-28 2014-03-18 후루카와 덴키 고교 가부시키가이샤 미립자 분산액, 및 미립자 분산액의 제조방법
JP4248002B2 (ja) * 2007-03-22 2009-04-02 古河電気工業株式会社 微粒子分散液、及び微粒子分散液の製造方法
ATE487554T1 (de) * 2007-08-31 2010-11-15 Metalor Technologies Int Verfahren zur herstellung von silbernanoteilchen
CN101599310A (zh) * 2009-07-02 2009-12-09 张祥成 亲水性纳米微米级微相半分离导电Ag/AgCl参比电极浆料及其制备方法
JP5297344B2 (ja) * 2009-11-04 2013-09-25 京都エレックス株式会社 加熱硬化型導電性ペースト組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010236007A (ja) * 2009-03-31 2010-10-21 Mitsubishi Materials Corp 球状銀粒子及び該銀粒子の製造方法並びに製造装置
JP2011001581A (ja) * 2009-06-17 2011-01-06 Sumitomo Metal Mining Co Ltd 銀粉及びその製造方法

Also Published As

Publication number Publication date
TWI574761B (zh) 2017-03-21
JPWO2012169628A1 (ja) 2015-02-23
JP5288063B2 (ja) 2013-09-11
CN103079728B (zh) 2015-06-24
MY158931A (en) 2016-11-30
CN103079728A (zh) 2013-05-01
TW201311377A (zh) 2013-03-16
WO2012169628A1 (ja) 2012-12-13
KR20140030091A (ko) 2014-03-11

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