MY158931A - Silver Powder and Process for Manufacturing Same - Google Patents

Silver Powder and Process for Manufacturing Same

Info

Publication number
MY158931A
MY158931A MYPI2013701717A MYPI2013701717A MY158931A MY 158931 A MY158931 A MY 158931A MY PI2013701717 A MYPI2013701717 A MY PI2013701717A MY PI2013701717 A MYPI2013701717 A MY PI2013701717A MY 158931 A MY158931 A MY 158931A
Authority
MY
Malaysia
Prior art keywords
silver powder
powder
manufacturing same
time
flakes
Prior art date
Application number
MYPI2013701717A
Other languages
English (en)
Inventor
Tsuyoshi Kawashima
Mika Okada
Eiji Ishida
Tomomichi Nihei
Toshiaki Terao
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of MY158931A publication Critical patent/MY158931A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/24—Features related to electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
MYPI2013701717A 2011-06-08 2012-06-08 Silver Powder and Process for Manufacturing Same MY158931A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011128015 2011-06-08

Publications (1)

Publication Number Publication Date
MY158931A true MY158931A (en) 2016-11-30

Family

ID=47296181

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701717A MY158931A (en) 2011-06-08 2012-06-08 Silver Powder and Process for Manufacturing Same

Country Status (6)

Country Link
JP (1) JP5288063B2 (zh)
KR (1) KR101885391B1 (zh)
CN (1) CN103079728B (zh)
MY (1) MY158931A (zh)
TW (1) TWI574761B (zh)
WO (1) WO2012169628A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5500237B1 (ja) * 2012-12-05 2014-05-21 住友金属鉱山株式会社 銀粉
JP5505535B1 (ja) * 2012-12-07 2014-05-28 住友金属鉱山株式会社 銀粉
JP6115405B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
JP6115406B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
JP6404554B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀粉の製造方法
JP6404553B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀溶液の管理方法および銀粉の製造方法
JP6206248B2 (ja) * 2014-02-26 2017-10-04 住友金属鉱山株式会社 導電性ペーストに含まれる導電性粉末の粗大粒子の評価方法
JP6252275B2 (ja) * 2014-03-20 2017-12-27 住友金属鉱山株式会社 銀粉及びその製造方法
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP6835595B2 (ja) * 2015-01-30 2021-02-24 住友電気工業株式会社 金属粉末、インク及び金属粉末の製造方法
JP6727922B2 (ja) * 2016-05-20 2020-07-22 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法、ならびに導電性ペースト
CN112430443B (zh) * 2019-08-26 2022-12-23 京瓷株式会社 导热性粘合用片、导热性粘合用片制造方法和半导体装置
KR20220038387A (ko) * 2019-08-26 2022-03-28 교세라 가부시키가이샤 은 입자의 제조 방법, 열경화성 수지 조성물, 반도체 장치 및 전기·전자부품
TW202146114A (zh) * 2020-04-14 2021-12-16 日商昭榮化學工業股份有限公司 無機微粉末的製造方法
CN113192690B (zh) * 2021-04-07 2023-05-09 湖南中伟新银材料科技有限公司 一种uv固化导电银浆的制备方法
CN113192689B (zh) * 2021-04-07 2023-05-09 湖南中伟新银材料科技有限公司 一种银粉分散体的制备方法和应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09256008A (ja) * 1996-03-15 1997-09-30 Noritake Co Ltd 単分散性銀−パラジウム複合粉末の製造方法及びその粉末
JP3751154B2 (ja) 1998-10-22 2006-03-01 同和鉱業株式会社 銀粉の製造方法
JP2004043892A (ja) * 2002-07-11 2004-02-12 Sumitomo Electric Ind Ltd 貴金属微粒子とその製造方法
JP3991218B2 (ja) 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
JP4248002B2 (ja) * 2007-03-22 2009-04-02 古河電気工業株式会社 微粒子分散液、及び微粒子分散液の製造方法
US8337726B2 (en) * 2006-07-28 2012-12-25 Furukawa Electric Co., Ltd. Fine particle dispersion and method for producing fine particle dispersion
EP2030706B1 (fr) * 2007-08-31 2010-11-10 Metalor Technologies International S.A. Procédé de préparation de nanoparticules d'argent
JP2010236007A (ja) * 2009-03-31 2010-10-21 Mitsubishi Materials Corp 球状銀粒子及び該銀粒子の製造方法並びに製造装置
JP5568255B2 (ja) * 2009-06-17 2014-08-06 住友金属鉱山株式会社 銀粉及びその製造方法
CN101599310A (zh) * 2009-07-02 2009-12-09 张祥成 亲水性纳米微米级微相半分离导电Ag/AgCl参比电极浆料及其制备方法
JP5297344B2 (ja) * 2009-11-04 2013-09-25 京都エレックス株式会社 加熱硬化型導電性ペースト組成物

Also Published As

Publication number Publication date
WO2012169628A1 (ja) 2012-12-13
TW201311377A (zh) 2013-03-16
JPWO2012169628A1 (ja) 2015-02-23
TWI574761B (zh) 2017-03-21
CN103079728A (zh) 2013-05-01
KR20140030091A (ko) 2014-03-11
CN103079728B (zh) 2015-06-24
KR101885391B1 (ko) 2018-08-03
JP5288063B2 (ja) 2013-09-11

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