KR101823718B1 - 기판 반전 장치, 기판 반전 방법 및 박리 시스템 - Google Patents

기판 반전 장치, 기판 반전 방법 및 박리 시스템 Download PDF

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KR101823718B1
KR101823718B1 KR1020137017300A KR20137017300A KR101823718B1 KR 101823718 B1 KR101823718 B1 KR 101823718B1 KR 1020137017300 A KR1020137017300 A KR 1020137017300A KR 20137017300 A KR20137017300 A KR 20137017300A KR 101823718 B1 KR101823718 B1 KR 101823718B1
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substrate
holding portion
wafer
processed
cleaning
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Korean (ko)
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KR20140021990A (ko
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야스하루 이와시타
오사무 히라카와
마사루 혼다
아키라 후쿠토미
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1137—Using air blast directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
    • Y10T156/1939—Air blasting delaminating means]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020137017300A 2011-01-19 2012-01-12 기판 반전 장치, 기판 반전 방법 및 박리 시스템 Active KR101823718B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011009309A JP5323867B2 (ja) 2011-01-19 2011-01-19 基板反転装置、基板反転方法、剥離システム、プログラム及びコンピュータ記憶媒体
JPJP-P-2011-009309 2011-01-19
PCT/JP2012/050465 WO2012098986A1 (ja) 2011-01-19 2012-01-12 基板反転装置、基板反転方法及び剥離システム

Publications (2)

Publication Number Publication Date
KR20140021990A KR20140021990A (ko) 2014-02-21
KR101823718B1 true KR101823718B1 (ko) 2018-01-30

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KR1020137017300A Active KR101823718B1 (ko) 2011-01-19 2012-01-12 기판 반전 장치, 기판 반전 방법 및 박리 시스템

Country Status (5)

Country Link
US (1) US8997822B2 (https=)
JP (1) JP5323867B2 (https=)
KR (1) KR101823718B1 (https=)
TW (1) TWI529778B (https=)
WO (1) WO2012098986A1 (https=)

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EP2950328A4 (en) * 2012-11-30 2017-01-25 Nikon Corporation Suction apparatus, carry-in method, conveyance system, light exposure device, and device production method
JP6188123B2 (ja) 2012-12-28 2017-08-30 芝浦メカトロニクス株式会社 貼合装置および貼合処理方法
JP6093328B2 (ja) * 2013-06-13 2017-03-08 東京エレクトロン株式会社 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体
KR102075994B1 (ko) * 2014-03-25 2020-02-12 삼성전자주식회사 기판 분리 장치 및 기판 분리 시스템
JP6283573B2 (ja) * 2014-06-03 2018-02-21 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
US9991150B2 (en) 2014-12-12 2018-06-05 Micro Materials Inc. Procedure of processing a workpiece and an apparatus designed for the procedure
CN104485294A (zh) 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 一种晶圆临时键合及分离方法
CN104979262B (zh) * 2015-05-14 2020-09-22 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
CN106710442B (zh) * 2015-10-21 2021-01-22 京东方科技集团股份有限公司 背光源分离设备
JP6596342B2 (ja) * 2016-01-25 2019-10-23 東京エレクトロン株式会社 紫外線処理装置、接合システム、紫外線処理方法、プログラム及びコンピュータ記憶媒体
TWI701708B (zh) * 2016-02-24 2020-08-11 德商蘇士微科技印刷術股份有限公司 半導體接合設備及相關技術
KR102198676B1 (ko) * 2016-04-26 2021-01-05 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 성막 장치
CN107665848B (zh) * 2016-07-29 2020-08-25 上海微电子装备（集团）股份有限公司 一种解键合调平装置及解键合方法
JP6853646B2 (ja) * 2016-10-04 2021-03-31 株式会社ディスコ ロボットハンド及び搬送ロボット
WO2018171909A1 (en) * 2017-03-21 2018-09-27 Applied Materials, Inc. Apparatus and method for holding a substrate, apparatus and method for loading a substrate into a vacuum processing module, and system for vacuum processing of a substrate
US11120985B2 (en) * 2017-11-22 2021-09-14 Tokyo Electron Limited Substrate transfer device, substrate processing system, substrate processing method and computer-readable recording medium
US10170443B1 (en) * 2017-11-28 2019-01-01 International Business Machines Corporation Debonding chips from wafer
KR102505213B1 (ko) * 2017-12-08 2023-03-03 삼성전자주식회사 분리용 전자 장치 및 이의 공정 방법
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner
KR102712687B1 (ko) * 2019-01-28 2024-10-04 삼성디스플레이 주식회사 기판 반전 장치
JP7522572B2 (ja) * 2020-03-26 2024-07-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板反転方法
JP6836003B1 (ja) * 2020-08-27 2021-02-24 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
CN115706035B (zh) * 2021-08-12 2026-01-23 北京北方华创微电子装备有限公司 半导体清洗设备及其晶圆翻转装置
CN114300409B (zh) * 2021-12-31 2025-05-16 绍兴同芯成集成电路有限公司 一种超薄晶圆置入凹槽型载盘的方法
CN117645162B (zh) * 2024-01-29 2024-04-12 山东澳兴绝缘材料有限公司 一种钢板料片分离装置

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JP2002208625A (ja) 2001-01-10 2002-07-26 Matsushita Electric Ind Co Ltd 半導体ウェハの薄化処理方法
JP2002270661A (ja) 2001-03-07 2002-09-20 Hitachi Electronics Eng Co Ltd 基板重ね合わせ装置
JP2003019687A (ja) 2001-07-03 2003-01-21 Aitec:Kk ロボットハンドの駆動装置
JP2005085882A (ja) 2003-09-05 2005-03-31 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2005116678A (ja) * 2003-10-06 2005-04-28 Nitto Denko Corp 半導体ウエハの剥離方法およびこれを用いた剥離装置
WO2007099976A1 (ja) * 2006-02-22 2007-09-07 Ebara Corporation 基板処理装置、基板搬送装置、基板把持装置、および薬液処理装置

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Publication number Publication date
US8997822B2 (en) 2015-04-07
US20130292062A1 (en) 2013-11-07
TWI529778B (zh) 2016-04-11
TW201246271A (en) 2012-11-16
JP5323867B2 (ja) 2013-10-23
KR20140021990A (ko) 2014-02-21
WO2012098986A1 (ja) 2012-07-26
JP2012151312A (ja) 2012-08-09

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