KR101705978B1 - 수지 성형 장치 및 수지 성형 방법 - Google Patents

수지 성형 장치 및 수지 성형 방법 Download PDF

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Publication number
KR101705978B1
KR101705978B1 KR1020150070904A KR20150070904A KR101705978B1 KR 101705978 B1 KR101705978 B1 KR 101705978B1 KR 1020150070904 A KR1020150070904 A KR 1020150070904A KR 20150070904 A KR20150070904 A KR 20150070904A KR 101705978 B1 KR101705978 B1 KR 101705978B1
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KR
South Korea
Prior art keywords
resin material
resin
release film
elevating member
molding
Prior art date
Application number
KR1020150070904A
Other languages
English (en)
Korean (ko)
Other versions
KR20150135129A (ko
Inventor
게이타 미즈마
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20150135129A publication Critical patent/KR20150135129A/ko
Application granted granted Critical
Publication of KR101705978B1 publication Critical patent/KR101705978B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
    • B29C39/18—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020150070904A 2014-05-22 2015-05-21 수지 성형 장치 및 수지 성형 방법 KR101705978B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-106176 2014-05-22
JP2014106176A JP6310773B2 (ja) 2014-05-22 2014-05-22 樹脂成形装置及び樹脂成形方法

Publications (2)

Publication Number Publication Date
KR20150135129A KR20150135129A (ko) 2015-12-02
KR101705978B1 true KR101705978B1 (ko) 2017-02-10

Family

ID=54564189

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150070904A KR101705978B1 (ko) 2014-05-22 2015-05-21 수지 성형 장치 및 수지 성형 방법

Country Status (4)

Country Link
JP (1) JP6310773B2 (zh)
KR (1) KR101705978B1 (zh)
CN (1) CN105082432B (zh)
TW (1) TWI575616B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6612172B2 (ja) * 2016-04-25 2019-11-27 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法
JP6672103B2 (ja) * 2016-08-01 2020-03-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
WO2018080906A1 (en) * 2016-10-24 2018-05-03 Dow Global Technologies Llc Forming and cutting tool for composite material
JP6774865B2 (ja) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
JP6989409B2 (ja) * 2018-02-16 2022-01-05 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7417429B2 (ja) * 2020-01-17 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形品の製造方法
CN111446352B (zh) * 2020-03-23 2022-03-18 东莞市中麒光电技术有限公司 Led显示屏模组的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120880A (ja) 2004-10-22 2006-05-11 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2013039693A (ja) 2011-08-12 2013-02-28 Apic Yamada Corp 樹脂供給装置、樹脂モールド装置および樹脂供給方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2508897B2 (ja) * 1990-07-13 1996-06-19 住友化学工業株式会社 積層成形体およびその製造方法
JP3214788B2 (ja) * 1994-11-21 2001-10-02 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3900947B2 (ja) * 2002-01-30 2007-04-04 大日本インキ化学工業株式会社 燃料電池用セパレータの製造方法、燃料電池セパレータおよび燃料電池
JP4024714B2 (ja) * 2002-06-18 2007-12-19 株式会社名機製作所 プレス成形装置の制御方法およびプレス成形方法
JP4262468B2 (ja) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
SG161252A1 (en) * 2007-03-13 2010-05-27 Towa Corp Method of compression molding for electronic part and apparatus therefor
JP5153509B2 (ja) * 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び金型装置
JP2011218681A (ja) * 2010-04-09 2011-11-04 Sumitomo Heavy Ind Ltd 樹脂成形装置及び樹脂成形方法
JP5827499B2 (ja) * 2010-06-11 2015-12-02 株式会社半導体エネルギー研究所 装置の表面処理方法
JP5576197B2 (ja) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
TWI585908B (zh) * 2010-11-25 2017-06-01 山田尖端科技股份有限公司 樹脂模塑裝置與樹脂模塑方法
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120880A (ja) 2004-10-22 2006-05-11 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP2013039693A (ja) 2011-08-12 2013-02-28 Apic Yamada Corp 樹脂供給装置、樹脂モールド装置および樹脂供給方法

Also Published As

Publication number Publication date
JP2015222760A (ja) 2015-12-10
JP6310773B2 (ja) 2018-04-11
CN105082432A (zh) 2015-11-25
TWI575616B (zh) 2017-03-21
TW201604974A (zh) 2016-02-01
KR20150135129A (ko) 2015-12-02
CN105082432B (zh) 2017-09-29

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