KR101690509B1 - 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템 - Google Patents

발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템 Download PDF

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Publication number
KR101690509B1
KR101690509B1 KR1020100064488A KR20100064488A KR101690509B1 KR 101690509 B1 KR101690509 B1 KR 101690509B1 KR 1020100064488 A KR1020100064488 A KR 1020100064488A KR 20100064488 A KR20100064488 A KR 20100064488A KR 101690509 B1 KR101690509 B1 KR 101690509B1
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KR
South Korea
Prior art keywords
light emitting
emitting device
circuit board
printed circuit
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100064488A
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English (en)
Korean (ko)
Other versions
KR20120003729A (ko
Inventor
이은선
문연태
Original Assignee
엘지이노텍 주식회사
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Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100064488A priority Critical patent/KR101690509B1/ko
Priority to US13/090,702 priority patent/US9062857B2/en
Priority to TW100114016A priority patent/TWI567331B/zh
Priority to EP11163595.9A priority patent/EP2405192B1/en
Priority to CN201110133099.9A priority patent/CN102315363B/zh
Priority to JP2011149312A priority patent/JP5736257B2/ja
Publication of KR20120003729A publication Critical patent/KR20120003729A/ko
Application granted granted Critical
Publication of KR101690509B1 publication Critical patent/KR101690509B1/ko
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/275Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/34Supporting elements displaceable along a guiding element
    • F21V21/35Supporting elements displaceable along a guiding element with direct electrical contact between the supporting element and electric conductors running along the guiding element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2027Guiding means, e.g. for guiding flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209Auto-mechanical connection between a component and a PCB or between two PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
KR1020100064488A 2010-07-05 2010-07-05 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템 Expired - Fee Related KR101690509B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100064488A KR101690509B1 (ko) 2010-07-05 2010-07-05 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템
US13/090,702 US9062857B2 (en) 2010-07-05 2011-04-20 Light emitting device module
TW100114016A TWI567331B (zh) 2010-07-05 2011-04-22 發光元件模組
EP11163595.9A EP2405192B1 (en) 2010-07-05 2011-04-22 Light emitting device module
CN201110133099.9A CN102315363B (zh) 2010-07-05 2011-05-18 发光器件模块
JP2011149312A JP5736257B2 (ja) 2010-07-05 2011-07-05 発光素子モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100064488A KR101690509B1 (ko) 2010-07-05 2010-07-05 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템

Publications (2)

Publication Number Publication Date
KR20120003729A KR20120003729A (ko) 2012-01-11
KR101690509B1 true KR101690509B1 (ko) 2016-12-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100064488A Expired - Fee Related KR101690509B1 (ko) 2010-07-05 2010-07-05 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템

Country Status (6)

Country Link
US (1) US9062857B2 (enExample)
EP (1) EP2405192B1 (enExample)
JP (1) JP5736257B2 (enExample)
KR (1) KR101690509B1 (enExample)
CN (1) CN102315363B (enExample)
TW (1) TWI567331B (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120262647A1 (en) * 2011-04-14 2012-10-18 Che-Chang Hu Liquid Crystal Display and Backlight Module Employed Therein
TWI442000B (zh) * 2011-07-19 2014-06-21 Wistron Corp 燈條結構及其光源裝置
KR101835529B1 (ko) * 2011-08-09 2018-03-08 삼성디스플레이 주식회사 표시 장치 및 이에 사용되는 광원 패키지
JP5842132B2 (ja) * 2011-09-21 2016-01-13 パナソニックIpマネジメント株式会社 照明器具
EP2672177A1 (en) * 2012-06-07 2013-12-11 Koninklijke Philips N.V. LED lighting device and LED lighting arrangement
WO2013161152A1 (ja) * 2012-04-25 2013-10-31 パナソニック株式会社 ランプ及び照明装置
KR200468824Y1 (ko) 2012-05-16 2013-09-06 이점순 복수의 엘이디 바를 연결시켜 사용하기 위한 엘이디 바 커넥터 및 이를 이용한 엘이디 바 세트
WO2014006805A1 (ja) * 2012-07-02 2014-01-09 パナソニック株式会社 ランプ及び照明装置
CN102720997B (zh) * 2012-07-02 2014-10-29 深圳市华星光电技术有限公司 一种背光模组及led的封装结构
US9134477B2 (en) 2012-07-02 2015-09-15 Quan Li Backlight module and LED packaging having fixed structure
KR101382793B1 (ko) * 2012-07-04 2014-04-08 현대자동차주식회사 정션박스용 인쇄회로기판의 열방출 장치
JP5851608B2 (ja) * 2012-07-04 2016-02-03 シャープ株式会社 エッジライト型面光源装置
US9200774B2 (en) * 2012-08-07 2015-12-01 Valeo North America, Inc. Vehicle reflector assembly with circuit board retention plate
US9030642B2 (en) 2012-09-11 2015-05-12 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal display device
CN102799023B (zh) * 2012-09-11 2015-02-04 深圳市华星光电技术有限公司 液晶显示装置
FR2995721B1 (fr) * 2012-09-17 2014-11-21 Commissariat Energie Atomique Capot pour dispositif a rainure et a puce, dispositif equipe du capot, assemblage du dispositif avec un element filaire et procede de fabrication
TWI540768B (zh) * 2012-12-21 2016-07-01 鴻海精密工業股份有限公司 發光晶片組合及其製造方法
US9004719B2 (en) * 2013-03-14 2015-04-14 The Sloan Company, Inc. Trim cap illuminated channel letter lighting system and letter construction system
US10010690B1 (en) 2013-03-15 2018-07-03 Monitoring For Life, Llc Endotracheal tube apparatus
GB201316830D0 (en) * 2013-09-23 2013-11-06 Gew Ec Ltd LED ink curing apparatus
US20170033521A1 (en) * 2013-11-21 2017-02-02 Elmer A. Wessel Power Assembly
US10112024B2 (en) * 2014-01-17 2018-10-30 Monitoring For Life Llc Medical tube apparatus
JP6277546B2 (ja) * 2014-02-25 2018-02-14 パナソニックIpマネジメント株式会社 照明器具
KR101607743B1 (ko) * 2014-03-07 2016-03-31 노연주 Led 패키지, led 패키지 결합용 플레이트, led 패키지 결합용 플레이트 세트
CN106461169B (zh) * 2014-05-30 2019-12-31 亮锐控股有限公司 安装在弯曲引线框架上的led
ES2839150T3 (es) 2014-09-12 2021-07-05 Ledil Oy Sistema de placa de circuito
DE102014225245A1 (de) * 2014-12-09 2016-06-09 BSH Hausgeräte GmbH Haushaltsgerät mit einer Beleuchtungseinrichtung
CN105811168B (zh) * 2014-12-30 2020-11-10 法雷奥汽车内部控制(深圳)有限公司 Pcb板-天线连接结构
KR20160096286A (ko) * 2015-02-04 2016-08-16 삼성디스플레이 주식회사 Led 레일 및 이를 구비하는 광 경화 장치
EP3314163B1 (en) * 2015-06-29 2019-08-21 OSRAM GmbH A lighting device and corresponding method
DE102015120490A1 (de) * 2015-11-26 2017-06-01 Christian Engelmann Beleuchtungssystem
KR20170087118A (ko) 2016-01-19 2017-07-28 삼성디스플레이 주식회사 광 발생 부재, 그것을 포함하는 표시 장치, 및 그것의 제조 방법
KR101866012B1 (ko) * 2016-02-18 2018-06-08 공학봉 캡형 조명 블록
ITUB20161256A1 (it) * 2016-03-02 2017-09-02 Stefano Bertozzi Lampada led componibile
US10168032B2 (en) 2016-12-02 2019-01-01 Les Produits Sunforce Inc. Exterior lamp mounting adaptor
US10520177B2 (en) 2016-12-02 2019-12-31 Les Produits Sunforce Inc. Exterior lamp mounting adaptor with integrated electrical interface
CN108320679A (zh) * 2017-01-16 2018-07-24 欧司朗股份有限公司 安装型材、能够发光的可分离标牌模块及发光系统
FR3068109B1 (fr) * 2017-06-27 2019-10-04 Valeo Vision Dispositif et systeme d'eclairage pour vehicule automobile utilisant une diode electroluminescente organique
KR102445809B1 (ko) * 2017-11-16 2022-09-21 쓰리엠 이노베이티브 프로퍼티즈 캄파니 신호등용 반사 패널
CN108916668A (zh) * 2018-05-31 2018-11-30 苏州盛威佳鸿电子科技有限公司 一种滑动组合式led照明灯
KR102664913B1 (ko) * 2018-09-11 2024-05-14 엘지이노텍 주식회사 조명 모듈 및 이를 구비한 조명 어셈블리
CN109737320B (zh) * 2018-11-19 2021-06-22 东洋工业(广东)有限公司 一种led光源的制造方法
CN109860371B (zh) * 2019-01-23 2024-11-08 佛山市国星光电股份有限公司 支架结构、支架阵列和led器件
CN111076113B (zh) * 2019-11-26 2021-07-20 伍库照明科技(昆山)有限公司 一种特殊配光的洗墙灯具
KR102158850B1 (ko) * 2019-11-26 2020-09-24 (주)하나텍시스템 교통 신호등
EP3851741B1 (en) * 2020-01-17 2024-10-23 Tridonic GmbH & Co. KG Electronic device for operating a light source
EP4223647A1 (en) * 2022-02-08 2023-08-09 Goodrich Lighting Systems GmbH & Co. KG Aircraft light and aircraft comprising at least one aircraft light
CA3199089A1 (en) 2022-05-05 2023-11-05 Les Produits Sunforce Inc. Four head spotlight
CN119123344B (zh) * 2024-11-18 2025-02-11 深圳市两岸半导体科技有限公司 一种led植物灯光源

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139851U (ja) * 2007-12-11 2008-03-06 呉祖耀 Ledライト
JP2009200011A (ja) * 2008-02-25 2009-09-03 Sony Corp 光源ユニット、および光源装置ならびに表示装置
JP2010034262A (ja) * 2008-07-29 2010-02-12 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471415A (en) 1983-06-20 1984-09-11 Wilbrecht Electronics, Inc. Mounting bar for spacing indicator lights
JPS62163977U (enExample) * 1986-04-09 1987-10-17
US4999755A (en) 1990-06-07 1991-03-12 Lin Tak Huei Tube light
US5975716A (en) 1998-05-12 1999-11-02 Wilbrecht Electronics, Inc. Mounting bar for spacing indicator lights used in electronic equipment
JP2001126830A (ja) * 1999-10-22 2001-05-11 Matsushita Electric Works Ltd 配線ダクト接続装置
US7033060B2 (en) * 2003-05-23 2006-04-25 Gelcore Llc Method and apparatus for irradiation of plants using light emitting diodes
CN2690732Y (zh) * 2004-03-22 2005-04-06 张伟 具有多个发光二极管的螺丝灯泡
US20060082315A1 (en) 2004-10-20 2006-04-20 Timothy Chan Method and system for attachment of light emmiting diodes to circuitry for use in lighting
US20070252161A1 (en) 2006-03-31 2007-11-01 3M Innovative Properties Company Led mounting structures
JP2007311561A (ja) * 2006-05-18 2007-11-29 Showa Denko Kk 表示装置、発光装置、および固体発光素子基板
KR20080057881A (ko) * 2006-12-21 2008-06-25 엘지전자 주식회사 인쇄회로기판, 이를 포함하는 발광 장치 및 그 제조 방법
TWM337696U (en) * 2008-02-13 2008-08-01 Ya-Hui Chen Package assembly of luminosity
CN201166344Y (zh) * 2008-02-20 2008-12-17 陈雅惠 发光体组装结构
DE202008011979U1 (de) * 2008-04-01 2008-12-11 Lebensstil Technology Co., Ltd. Montageanordnung eines Leuchtkörpers
TWM340560U (en) * 2008-04-01 2008-09-11 Ya-Hui Chen Serially connected and assembled structure of light-emitting body
KR100898548B1 (ko) 2008-12-19 2009-05-19 주식회사 지앤에이치 조명기구용 엘이디모듈
JP4764960B1 (ja) * 2010-02-10 2011-09-07 パナソニック株式会社 Ledランプ及び照明装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139851U (ja) * 2007-12-11 2008-03-06 呉祖耀 Ledライト
JP2009200011A (ja) * 2008-02-25 2009-09-03 Sony Corp 光源ユニット、および光源装置ならびに表示装置
JP2010034262A (ja) * 2008-07-29 2010-02-12 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ

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US20120002427A1 (en) 2012-01-05
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