CN102720997B - 一种背光模组及led的封装结构 - Google Patents

一种背光模组及led的封装结构 Download PDF

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CN102720997B
CN102720997B CN201210224886.9A CN201210224886A CN102720997B CN 102720997 B CN102720997 B CN 102720997B CN 201210224886 A CN201210224886 A CN 201210224886A CN 102720997 B CN102720997 B CN 102720997B
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led
pcb
fixed
backlight module
draw
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CN102720997A (zh
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李全
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to PCT/CN2012/078647 priority patent/WO2014005351A1/zh
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Abstract

本发明公开一种背光模组及LED的封装结构，包括PCB以及设置在所述PCB上的LED，所述PCB上设置用于固定所述LED的固定结构，所述LED上设置有用于与所述固定结构对接的对接结构；所述LED通过其上的对接结构机械固定到所述PCB上的固定结构。本发明由于在PCB及LED上分别设置固定结构以及对接结构，使得LED可以直接安装到PCB上，不需要SMT焊接，在LED封装时，只需要将LED机械固定到PCB上即可；同时，通过固定结构及对接结构固定的LED是可拆卸的连接，这样方便于对LED进行更换，在LED损坏或色度偏差时，只需要取下损坏的LED并换上良好的LED即可，不需要将整个灯条返厂维修，也不需要对整个灯条进行报废处理。

Description

一种背光模组及LED的封装结构
技术领域
本发明涉及液晶显示领域，更具体的说，涉及一种背光模组及LED的封装结构。
背景技术
背光模组为液晶显示器面板的关键零组件之一。功能在于供应充足的亮度与分布均匀的光源，使其能正常显示影像。背光模组通常使用LED作为发光源，也有使用冷阴极管等其它作为发光源的，但是由于LED具有耗能低，寿命长等因素因而被广泛用于现有的液晶显示器中。
在LED背光模组中，作为发光单元的LED元件一般是通过SMT（电子电路表面封装技术）焊接在电路板（PCB）上构成一条lightbar（灯条），如果其中一个LED坏掉或者色度NG（not good，不好），则整条lightbar需要回PCB工厂返工或者报废，且坏掉的LED不能及时更换影响效率，灯条的返工或报废以及组装直接影响到了液晶显示器的制造成本。
发明内容
本发明所要解决的技术问题是提供一种成本低、维修方便的背光模组及LED的封装结构。
本发明的目的是通过以下技术方案来实现的：一种背光模组，包括PCB以及设置在所述PCB上的LED，所述PCB上设置用于固定所述LED的固定结构，所述LED上设置有用于与所述固定结构对接的对接结构；所述LED通过其上的对接结构机械固定到所述PCB上的固定结构；所述固定结构为设置在所述PCB上的固定支架，所述固定支架上形成一卡槽，所述对接结构为设置在LED的出光面的两侧面上的固定部，所述固定部上形成有一卡条，所述LED的两个侧面上的卡条分别与所述卡槽配合固定。
优选的，所述LED直立设在所述PCB上。将LED直立设置在PCB上，则LED的发光面与PCB表面垂直，则PCB可以不需要设置在背板的侧壁上而是平铺设置在背板的底板上，从而不需要在背板的侧壁上设置固定PCB的孔，提高背板的强度。
优选的，所述背光模组包括有背板，所述背板包括：侧壁以及底板；所述PCB平铺设置在所述底板上，所述LED直立设置在所述PCB的边缘处且其背面并紧贴所述背板的侧壁。将PCB平铺设置在背板的底板上并使得LED紧贴背板的侧壁，对于液晶显示模组的A值（LED的出光面到液晶显示模组的有效显示区边缘的距离）来说，可以增大一个PCB的厚度，提高背光模组的光学品味；另外，这样的设置使得LED直接与背板的侧壁接触，更利于散热。
优选的，所述固定结构为设置在所述PCB上的固定支架，所述固定支架上形成一卡槽，所述对接结构为设置在LED两相对侧面上的固定部，所述固定部上形成有一卡条，所述LED的两个相对侧面上的卡条分别与所述卡槽配合固定。通过卡槽与卡条的配合，可直接将LED机械固定到PCB上，不需要辅助工具，方便快捷。
优选的，所述卡槽包括：两相对设置的直立架，以及连接所述两条直立架底端的连接部，所述卡槽通过所述连接部固定到所述PCB上。卡槽的结构简单，制作方便。
优选的，所述卡槽的内壁上设置有凸部。通过设置在内壁上的凸部，提高卡槽对LED上的卡条的卡紧力，进而保证LED的安装可靠性。
优选的，所述固定结构为设置在所述PCB上的卡条，所述对接结构为与所述卡条配合的设置在LED上的卡槽。卡槽也可以设置在LED上，对应的，卡条也可以设置在PCB上。
优选的，LED的背面设置有热沉。通过在LED的背面直接设置热沉，相对于现有将热沉设置在灯条背面（即PCB背面）来说，LED可以直接通过热沉散热而不需要经过PCB传导，进而提高了灯条的散热效率。
优选的，所述LED与所述PCB接触的底部也设置有热沉。进一步提高LED的散热效率。
一种LED的封装结构，包括：设置在PCB上的固定结构、以及设置在所述LED上的对接结构；所述LED通过其上的对接结构机械固定到所述PCB上的固定结构；所述固定结构为设置在所述PCB上的固定支架，所述固定支架上形成一卡槽，所述对接结构为设置在LED的出光面的两侧面上的固定部，所述固定部上形成有一卡条，所述LED的两个侧面上的卡条分别与所述卡槽配合固定。
本发明由于在PCB及LED上分别设置固定结构以及对接结构，使得LED可以直接安装到PCB上，不需要SMT焊接，在LED封装时，只需要将LED机械固定到PCB上即可；同时，通过固定结构及对接结构进行极小固定的LED是可拆卸的连接，这样方便于对LED进行更换，在LED损坏或色度偏差时，只需要取下损坏的LED并换上良好的LED即可，不需要将整个灯条返厂维修，也不需要对整个灯条进行报废处理。
附图说明
图1是本发明实施例一中LED的封装结构的简图，
图2是本发明实施例一中LED的结构简图，
图3是本发明实施例一中PCB上的固定支架的结构简图，
图4是本发明实施例一中灯条的结构简图，
图5是本发明实施例二中LED的结构简图，
图6是本发明实施例二中LED的封装结构简图，
图7是本发明实施例一中背光模组的结构简图。
其中：1、背板，2、反射片，3、导光板，4、扩散板，11、底板，12、侧壁，100、LED，101、热沉，102、热沉，110、固定部，111、卡条，127、卡槽（图5及图6），200、PCB，210、固定支架，211、直立架，212、凸部，213、连接部，217卡槽（图3），221、卡条（图6）。
具体实施方式
如图1及图6所示为本发明所述的LED的封装结构，其包括：设置在PCB200上的固定结构以及设置在LED100上的对接结构。LED100通过对接结构机械固定到所述PCB200上的固定结构，安装方式简单，取代了原有的SMT焊接封装方式。
下面结合附图和较佳的实施例对本发明作进一步说明。
实施例一
如图1所示为本发明的优选实施例一，灯条的上LED100的封装结构包括：设置在PCB200上的固定支架210，以及设置在LED100上的固定部110；LED100呈块状结构，其直立设置在PCB200上。如图2所示，LED100两相对侧面的固定部110上形成有一凸出的卡条111，如图3所示固定支架210包括两条相对设置的直立架211以及将所述两条直立架211连接的连接部213，两条直立架211之间形成一用于卡合所述卡条111的卡槽217。这样，在需要将LED100封装到PCB200上时，只需要将LED100的两侧的卡条111直接插入PCB200上固定支架210，安装过程比较简单，不需要复杂的焊接工艺。
如图3所示，固定支架210上的直立架211上设置有凸部212，凸部212在卡槽217的内壁上形成了一个内凸的结构，当卡条111插入卡槽217内时，受到直立架211上凸部212的挤压，可提高卡槽217对LED100上的卡条111的卡紧力，进而保证LED100的安装可靠性。当然，固定支架210具有一定的弹性，才能保证卡条111能够插入卡槽217内并且使得两条直立架211能夹紧卡条111。
如图4所示，灯条上的所有LED100均是通过设置在其两侧上的固定部固定到PCB200上的固定支架上，这样，在灯条任何一个LED100出现损坏或者色度NG时，均可直接将出现损坏或者色度NG的LED100取下，不需要将灯条返厂维修或者报废。
另外，对于固定支架210以及卡条111来说，是连接LED100以及PCB200的部件，这样，LED100与PCB200的电连接可以通过固定支架210与卡条111的接触来实现。
如图7所示，在液晶显示装置的背光模组中，使用了本实施例一所述的LED100的封装结构，该背光模组包括：背板1、设置在背板1的底板11上的反射片2，设置在反射片2之上的导光板3以及设置在导光板3上的扩散板4；灯条上的PCB200平铺设置在背板1的底板11上，LED100直立设置在PCB200的边缘处其其背面紧贴在背板1的侧壁12上。这样，对于液晶显示模组的A值来说，可以增大其一个PCB厚度的距离，进而可提高背光模组的光学品味；另外，这样的设置使得LED100直接与背板1的侧壁12接触，更利于散热。
为了提高LED100的散热效率，在LED100的背面还设置了热沉101，并且，在LED100与PCB200接触的底部也设置有热沉102，进一步提高灯条的散热效率。
实施例二
如图5及图6所示，与实施例一不同的是，在LED100上设置的固定部120上形成的是卡槽127，而在PCB200上形成的是卡条221。相对于实施例1来说（如图1所示），实施例一在LED100上设置卡条111可以提高对接结构强度，而在PCB200上设置卡条221（如图6所示）的话其强度没有实施例一的高。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。

Claims (8)

1.一种背光模组，包括PCB以及设置在所述PCB上的LED，所述PCB上设置用于固定所述LED的固定结构，所述LED上设置有用于与所述固定结构对接的对接结构；所述LED通过其上的对接结构机械固定到所述PCB上的固定结构；其特征在于，所述固定结构为设置在所述PCB上的固定支架，所述固定支架上形成一卡槽，所述对接结构为设置在LED的出光面的两侧面上的固定部，所述固定部上形成有一卡条，所述LED的两个侧面上的卡条分别与所述卡槽配合固定。
2.如权利要求1所述的一种背光模组，其特征在于，所述LED直立设置在所述PCB上。
3.如权利要求2所述的一种背光模组，其特征在于，所述背光模组包括有背板，所述背板包括：侧壁以及底板；所述PCB平铺设置在所述底板上，所述LED直立设置在所述PCB的边缘处且其背面并紧贴所述背板的侧壁。
4.如权利要求1所述的一种背光模组，其特征在于，所述卡槽包括：两相对设置的直立架，以及连接所述两条直立架底端的连接部，所述卡槽通过所述连接部固定到所述PCB上。
5.如权利要求4所述的一种背光模组，其特征在于，所述卡槽的内壁上设置有凸部。
6.如权利要求1所述的一种背光模组，其特征在于，所述LED的背面设置有热沉。
7.如权利要求6所述的一种背光模组，其特征在于，所述LED的底部也设置有热沉。
8.一种LED的封装结构，包括：设置在PCB上的固定结构、以及设置在所述LED上的对接结构；所述LED通过其上的对接结构机械固定到所述PCB上的固定结构；其特征在于，所述固定结构为设置在所述PCB上的固定支架，所述固定支架上形成一卡槽，所述对接结构为设置在LED的出光面的两侧面上的固定部，所述固定部上形成有一卡条，所述LED的两个侧面上的卡条分别与所述卡槽配合固定。
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