KR101635962B1 - 노광 장치 - Google Patents

노광 장치 Download PDF

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Publication number
KR101635962B1
KR101635962B1 KR1020100041828A KR20100041828A KR101635962B1 KR 101635962 B1 KR101635962 B1 KR 101635962B1 KR 1020100041828 A KR1020100041828 A KR 1020100041828A KR 20100041828 A KR20100041828 A KR 20100041828A KR 101635962 B1 KR101635962 B1 KR 101635962B1
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KR
South Korea
Prior art keywords
exposure
light source
pair
light
shaped substrate
Prior art date
Application number
KR1020100041828A
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English (en)
Korean (ko)
Other versions
KR20100123611A (ko
Inventor
켄 미야케
토시히로 타카기
Original Assignee
상에이 기켄 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 상에이 기켄 가부시키가이샤 filed Critical 상에이 기켄 가부시키가이샤
Publication of KR20100123611A publication Critical patent/KR20100123611A/ko
Application granted granted Critical
Publication of KR101635962B1 publication Critical patent/KR101635962B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020100041828A 2009-05-15 2010-05-04 노광 장치 KR101635962B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009119103A JP5451175B2 (ja) 2009-05-15 2009-05-15 露光装置
JPJP-P-2009-119103 2009-05-15

Publications (2)

Publication Number Publication Date
KR20100123611A KR20100123611A (ko) 2010-11-24
KR101635962B1 true KR101635962B1 (ko) 2016-07-04

Family

ID=43073184

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100041828A KR101635962B1 (ko) 2009-05-15 2010-05-04 노광 장치

Country Status (4)

Country Link
JP (1) JP5451175B2 (zh)
KR (1) KR101635962B1 (zh)
CN (1) CN101887217B (zh)
TW (1) TWI485528B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102402131A (zh) * 2011-11-11 2012-04-04 深南电路有限公司 一种曝光系统
US8802333B2 (en) 2012-03-15 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Reflective lithography masks and systems and methods
DE102012108211A1 (de) * 2012-09-04 2014-03-06 Kleo Halbleitertechnik Gmbh Belichtungsanlage
KR101510156B1 (ko) * 2014-11-10 2015-04-08 (주)프리테크 리드프레임 제조용 노광장치
KR20240100486A (ko) * 2015-09-01 2024-07-01 가부시키가이샤 니콘 물체 유지 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 물체의 유지 방법, 및 노광 방법
JP7040981B2 (ja) * 2018-03-29 2022-03-23 株式会社オーク製作所 露光装置
CN112188747B (zh) * 2020-10-13 2021-09-07 合肥泽延微电子有限公司 一种集成电路板布线用智能定位系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114159A (ja) 1998-10-07 2000-04-21 Canon Inc 投影露光装置およびデバイス製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121048A (ja) * 1982-12-27 1984-07-12 Ibiden Co Ltd プリント配線基板の製造装置
JPH0778630B2 (ja) * 1986-07-15 1995-08-23 サンエ−技研株式会社 露光装置
JP2891769B2 (ja) * 1990-11-30 1999-05-17 ウシオ電機株式会社 フィルム露光装置
JP3559999B2 (ja) * 1994-07-29 2004-09-02 株式会社オーク製作所 マスク整合機構付露光装置およびワークの整合、露光、ならびに搬送方法。
JP2000066418A (ja) * 1998-08-17 2000-03-03 Ono Sokki Co Ltd 露光装置及び露光方法
JP2003207902A (ja) * 2002-01-11 2003-07-25 Pentax Corp 露光装置
JP2004094142A (ja) * 2002-09-04 2004-03-25 Toray Eng Co Ltd 幅広露光機
JP4218418B2 (ja) * 2003-05-23 2009-02-04 ウシオ電機株式会社 帯状ワークの両面投影露光装置
JP2005326550A (ja) * 2004-05-13 2005-11-24 Sanee Giken Kk 露光装置
JP2006098718A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
JP2006301170A (ja) * 2005-04-19 2006-11-02 Fujikura Ltd 露光装置およびその方法
JP4861778B2 (ja) * 2005-09-08 2012-01-25 富士フイルム株式会社 パターン露光方法及び装置
JP4775076B2 (ja) * 2006-03-31 2011-09-21 住友金属鉱山株式会社 露光方法及び装置
TW200745781A (en) * 2006-04-24 2007-12-16 Nsk Ltd Exposure apparatus
JP2007292933A (ja) * 2006-04-24 2007-11-08 Nsk Ltd 露光装置
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000114159A (ja) 1998-10-07 2000-04-21 Canon Inc 投影露光装置およびデバイス製造方法

Also Published As

Publication number Publication date
CN101887217A (zh) 2010-11-17
TW201107894A (en) 2011-03-01
KR20100123611A (ko) 2010-11-24
JP5451175B2 (ja) 2014-03-26
TWI485528B (zh) 2015-05-21
CN101887217B (zh) 2014-09-24
JP2010266763A (ja) 2010-11-25

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