KR101611893B1 - 반도체 광 장치 - Google Patents

반도체 광 장치 Download PDF

Info

Publication number
KR101611893B1
KR101611893B1 KR1020140003154A KR20140003154A KR101611893B1 KR 101611893 B1 KR101611893 B1 KR 101611893B1 KR 1020140003154 A KR1020140003154 A KR 1020140003154A KR 20140003154 A KR20140003154 A KR 20140003154A KR 101611893 B1 KR101611893 B1 KR 101611893B1
Authority
KR
South Korea
Prior art keywords
cap
stem
semiconductor optical
portions
optical device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020140003154A
Other languages
English (en)
Korean (ko)
Other versions
KR20140098678A (ko
Inventor
타다요시 하타
Original Assignee
미쓰비시덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시덴키 가부시키가이샤 filed Critical 미쓰비시덴키 가부시키가이샤
Publication of KR20140098678A publication Critical patent/KR20140098678A/ko
Application granted granted Critical
Publication of KR101611893B1 publication Critical patent/KR101611893B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020140003154A 2013-01-31 2014-01-10 반도체 광 장치 Active KR101611893B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013016560A JP5998962B2 (ja) 2013-01-31 2013-01-31 半導体光装置
JPJP-P-2013-016560 2013-01-31

Publications (2)

Publication Number Publication Date
KR20140098678A KR20140098678A (ko) 2014-08-08
KR101611893B1 true KR101611893B1 (ko) 2016-04-12

Family

ID=51222752

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140003154A Active KR101611893B1 (ko) 2013-01-31 2014-01-10 반도체 광 장치

Country Status (5)

Country Link
US (1) US9196761B2 (https=)
JP (1) JP5998962B2 (https=)
KR (1) KR101611893B1 (https=)
CN (1) CN103972370B (https=)
TW (1) TWI528600B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575271B (zh) * 2013-03-06 2017-03-21 鴻海精密工業股份有限公司 光通訊模組及用於該光通訊模組之點膠方法
CN104617212A (zh) * 2014-12-18 2015-05-13 上海大学 Led封装组件
US10732488B2 (en) * 2016-01-12 2020-08-04 Lg Innotek Co., Ltd. Holder assembly for camera module, camera module having same, and waterproof connector
JP6926497B2 (ja) * 2017-02-03 2021-08-25 三菱電機株式会社 半導体光モジュール
TWI657237B (zh) * 2018-02-21 2019-04-21 Anpec Electronics Corporation 光學偵測裝置及光學封裝結構
US11424374B2 (en) * 2019-04-19 2022-08-23 Tdk Taiwan Corp. Camera module optical system
JP7311301B2 (ja) * 2019-04-19 2023-07-19 シャープ株式会社 発光装置
US12541075B2 (en) * 2019-08-08 2026-02-03 Mitsubishi Electric Corporation Optical sensor module
FR3103056B1 (fr) * 2019-11-08 2022-07-08 St Microelectronics Grenoble 2 Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant
JP7623152B2 (ja) * 2021-02-09 2025-01-28 古河電気工業株式会社 光デバイスおよび光学部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007127925A (ja) * 2005-11-07 2007-05-24 Seiko Epson Corp 光モジュール及び光モジュールの製造方法
JP2007134644A (ja) * 2005-11-14 2007-05-31 Matsushita Electric Ind Co Ltd 光透過キャップ、光半導体モジュール及び光半導体モジュールの製造方法
JP2008135508A (ja) * 2006-11-28 2008-06-12 Seiko Epson Corp 光源装置、プロジェクタ及びモニタ装置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166550U (https=) * 1985-04-03 1986-10-16
US5274456A (en) 1987-12-28 1993-12-28 Hitachi, Ltd. Semiconductor device and video camera unit using it and their manufacturing method
JPH01227484A (ja) * 1988-03-08 1989-09-11 Canon Inc 半導体レーザー装置およびその製造方法
US5400072A (en) 1988-12-23 1995-03-21 Hitachi, Ltd. Video camera unit having an airtight mounting arrangement for an image sensor chip
JPH0330581A (ja) 1989-06-28 1991-02-08 Hitachi Ltd 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法
EP1022787B2 (de) * 1989-05-31 2012-07-11 OSRAM Opto Semiconductors GmbH Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
JPH07218773A (ja) 1994-01-28 1995-08-18 Hitachi Ltd 半導体光結合装置
US6122009A (en) * 1995-05-31 2000-09-19 Sony Corporation Image pickup apparatus fabrication method thereof image pickup adaptor apparatus signal processing apparatus signal processing method thereof information processing apparatus and information processing method
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
JP2001111152A (ja) 1999-10-06 2001-04-20 Rohm Co Ltd 半導体レーザ
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
JP4032291B2 (ja) 2001-05-18 2008-01-16 コニカミノルタホールディングス株式会社 撮像レンズ及び撮像装置
US7092174B2 (en) * 2001-05-18 2006-08-15 Konica Corporation Image pickup lens, image pickup apparatus and method for forming image pickup lens
JP2003133627A (ja) * 2001-10-19 2003-05-09 Sharp Corp 半導体レーザ装置
JP4017382B2 (ja) * 2001-11-30 2007-12-05 新光電気工業株式会社 撮像装置
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
US20040113047A1 (en) * 2002-12-16 2004-06-17 Hsiu Wen Tu Image sensor module
US7095621B2 (en) * 2003-02-24 2006-08-22 Avago Technologies Sensor Ip (Singapore) Pte. Ltd. Leadless leadframe electronic package and sensor module incorporating same
WO2005003835A1 (ja) * 2003-07-08 2005-01-13 Konica Minolta Opto, Inc. 撮像装置、該撮像装置を備えた携帯端末及び撮像装置の製造方法
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
JP2005209840A (ja) * 2004-01-22 2005-08-04 Konica Minolta Opto Inc 半導体レーザ装置及び光ピックアップ装置
US20060109366A1 (en) * 2004-05-04 2006-05-25 Tessera, Inc. Compact lens turret assembly
JP2006004466A (ja) * 2004-06-15 2006-01-05 Tdk Corp 対物レンズ、アクチュエータ、光ヘッド及び光記録再生装置
KR100576866B1 (ko) * 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
DE102005020908A1 (de) * 2005-02-28 2006-08-31 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
JP4233535B2 (ja) * 2005-03-29 2009-03-04 シャープ株式会社 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP2007142042A (ja) * 2005-11-16 2007-06-07 Sharp Corp 半導体パッケージとその製造方法，半導体モジュール，および電子機器
JP2007311445A (ja) * 2006-05-17 2007-11-29 Stanley Electric Co Ltd 半導体発光装置及びその製造方法
JP2008028143A (ja) * 2006-07-21 2008-02-07 Sumitomo Electric Ind Ltd 光モジュール
JP2008109099A (ja) * 2006-09-26 2008-05-08 Sumitomo Electric Ind Ltd ステムと被溶接部材の溶接部構造、その溶接部構造を有する半導体デバイス、光モジュール、およびその製造方法
KR100766505B1 (ko) * 2006-10-03 2007-10-15 삼성전자주식회사 카메라 모듈 및 그 제조 방법
JPWO2008120558A1 (ja) * 2007-03-29 2010-07-15 コニカミノルタオプト株式会社 撮像装置及びその製造方法
KR20100028555A (ko) * 2007-07-03 2010-03-12 코니카 미놀타 옵토 인코포레이티드 촬상 장치의 제조 방법, 촬상 장치 및 광학 소자
JP4949289B2 (ja) * 2008-02-13 2012-06-06 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
JP2010034287A (ja) * 2008-07-29 2010-02-12 Sumitomo Electric Ind Ltd キャップ及び光モジュール
JP2010183002A (ja) 2009-02-09 2010-08-19 Rohm Co Ltd 半導体レーザ装置およびその製造方法
CN103688377B (zh) * 2011-05-16 2018-06-08 日亚化学工业株式会社 发光装置及其制造方法
WO2012160994A1 (ja) * 2011-05-20 2012-11-29 シャープ株式会社 集光型太陽電池及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007127925A (ja) * 2005-11-07 2007-05-24 Seiko Epson Corp 光モジュール及び光モジュールの製造方法
JP2007134644A (ja) * 2005-11-14 2007-05-31 Matsushita Electric Ind Co Ltd 光透過キャップ、光半導体モジュール及び光半導体モジュールの製造方法
JP2008135508A (ja) * 2006-11-28 2008-06-12 Seiko Epson Corp 光源装置、プロジェクタ及びモニタ装置

Also Published As

Publication number Publication date
CN103972370A (zh) 2014-08-06
TWI528600B (zh) 2016-04-01
TW201431130A (zh) 2014-08-01
KR20140098678A (ko) 2014-08-08
JP2014150098A (ja) 2014-08-21
JP5998962B2 (ja) 2016-09-28
CN103972370B (zh) 2017-08-08
US20140211472A1 (en) 2014-07-31
US9196761B2 (en) 2015-11-24

Similar Documents

Publication Publication Date Title
KR101611893B1 (ko) 반도체 광 장치
JP5457391B2 (ja) Ｌｅｄパッケージ組立体
CN102137573B (zh) 表面贴装器件
JP5095985B2 (ja) 多数の部品からなる反射角変成器
CN118676723A (zh) 发光装置
KR102146342B1 (ko) 레이저 부품 및 그 제조 방법
JP2020113718A (ja) 発光装置およびその製造方法
JP4549298B2 (ja) 半導体レーザ装置
TW588485B (en) Semiconductor laser device
US20190280460A1 (en) Semiconductor light-emitting device
JP6511807B2 (ja) 半導体レーザ装置、光源装置、半導体レーザ装置の製造方法、及び光源装置の製造方法
JP2004020872A (ja) 光半導体モジュール
KR100681655B1 (ko) 반도체 레이저
JP2015226017A (ja) 半導体発光装置およびその製造方法
JP4583662B2 (ja) 光モジュールパッケージおよびその製造方法
US7284913B2 (en) Integrated fiber attach pad for optical package
KR101164377B1 (ko) 집적형 두 파장 광 송신 모듈
US20190115719A1 (en) Semiconductor light-emitting element and semiconductor light-emitting device
WO2019146339A1 (ja) 半導体装置
JP2005026716A (ja) レーザ装置
JP2019053230A (ja) 光モジュールとその製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20190319

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000