CN103972370B - 半导体光学装置 - Google Patents

半导体光学装置 Download PDF

Info

Publication number
CN103972370B
CN103972370B CN201410041531.5A CN201410041531A CN103972370B CN 103972370 B CN103972370 B CN 103972370B CN 201410041531 A CN201410041531 A CN 201410041531A CN 103972370 B CN103972370 B CN 103972370B
Authority
CN
China
Prior art keywords
semiconductor optical
stem
optical device
convex portion
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410041531.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN103972370A (zh
Inventor
畑端佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN103972370A publication Critical patent/CN103972370A/zh
Application granted granted Critical
Publication of CN103972370B publication Critical patent/CN103972370B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201410041531.5A 2013-01-31 2014-01-28 半导体光学装置 Active CN103972370B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013016560A JP5998962B2 (ja) 2013-01-31 2013-01-31 半導体光装置
JP2013-016560 2013-01-31

Publications (2)

Publication Number Publication Date
CN103972370A CN103972370A (zh) 2014-08-06
CN103972370B true CN103972370B (zh) 2017-08-08

Family

ID=51222752

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410041531.5A Active CN103972370B (zh) 2013-01-31 2014-01-28 半导体光学装置

Country Status (5)

Country Link
US (1) US9196761B2 (https=)
JP (1) JP5998962B2 (https=)
KR (1) KR101611893B1 (https=)
CN (1) CN103972370B (https=)
TW (1) TWI528600B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575271B (zh) * 2013-03-06 2017-03-21 鴻海精密工業股份有限公司 光通訊模組及用於該光通訊模組之點膠方法
CN104617212A (zh) * 2014-12-18 2015-05-13 上海大学 Led封装组件
US10732488B2 (en) * 2016-01-12 2020-08-04 Lg Innotek Co., Ltd. Holder assembly for camera module, camera module having same, and waterproof connector
JP6926497B2 (ja) * 2017-02-03 2021-08-25 三菱電機株式会社 半導体光モジュール
TWI657237B (zh) * 2018-02-21 2019-04-21 Anpec Electronics Corporation 光學偵測裝置及光學封裝結構
US11424374B2 (en) * 2019-04-19 2022-08-23 Tdk Taiwan Corp. Camera module optical system
JP7311301B2 (ja) * 2019-04-19 2023-07-19 シャープ株式会社 発光装置
US12541075B2 (en) * 2019-08-08 2026-02-03 Mitsubishi Electric Corporation Optical sensor module
FR3103056B1 (fr) * 2019-11-08 2022-07-08 St Microelectronics Grenoble 2 Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant
JP7623152B2 (ja) * 2021-02-09 2025-01-28 古河電気工業株式会社 光デバイスおよび光学部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element
CN101640192A (zh) * 2008-07-29 2010-02-03 住友电气工业株式会社 金属罩和具有该金属罩的光学装置

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166550U (https=) * 1985-04-03 1986-10-16
US5274456A (en) 1987-12-28 1993-12-28 Hitachi, Ltd. Semiconductor device and video camera unit using it and their manufacturing method
JPH01227484A (ja) * 1988-03-08 1989-09-11 Canon Inc 半導体レーザー装置およびその製造方法
US5400072A (en) 1988-12-23 1995-03-21 Hitachi, Ltd. Video camera unit having an airtight mounting arrangement for an image sensor chip
JPH0330581A (ja) 1989-06-28 1991-02-08 Hitachi Ltd 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法
EP1022787B2 (de) * 1989-05-31 2012-07-11 OSRAM Opto Semiconductors GmbH Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
JPH07218773A (ja) 1994-01-28 1995-08-18 Hitachi Ltd 半導体光結合装置
US6122009A (en) * 1995-05-31 2000-09-19 Sony Corporation Image pickup apparatus fabrication method thereof image pickup adaptor apparatus signal processing apparatus signal processing method thereof information processing apparatus and information processing method
JP2001111152A (ja) 1999-10-06 2001-04-20 Rohm Co Ltd 半導体レーザ
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
JP4032291B2 (ja) 2001-05-18 2008-01-16 コニカミノルタホールディングス株式会社 撮像レンズ及び撮像装置
US7092174B2 (en) * 2001-05-18 2006-08-15 Konica Corporation Image pickup lens, image pickup apparatus and method for forming image pickup lens
JP2003133627A (ja) * 2001-10-19 2003-05-09 Sharp Corp 半導体レーザ装置
JP4017382B2 (ja) * 2001-11-30 2007-12-05 新光電気工業株式会社 撮像装置
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
US20040113047A1 (en) * 2002-12-16 2004-06-17 Hsiu Wen Tu Image sensor module
US7095621B2 (en) * 2003-02-24 2006-08-22 Avago Technologies Sensor Ip (Singapore) Pte. Ltd. Leadless leadframe electronic package and sensor module incorporating same
WO2005003835A1 (ja) * 2003-07-08 2005-01-13 Konica Minolta Opto, Inc. 撮像装置、該撮像装置を備えた携帯端末及び撮像装置の製造方法
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
JP2005209840A (ja) * 2004-01-22 2005-08-04 Konica Minolta Opto Inc 半導体レーザ装置及び光ピックアップ装置
US20060109366A1 (en) * 2004-05-04 2006-05-25 Tessera, Inc. Compact lens turret assembly
JP2006004466A (ja) * 2004-06-15 2006-01-05 Tdk Corp 対物レンズ、アクチュエータ、光ヘッド及び光記録再生装置
KR100576866B1 (ko) * 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
DE102005020908A1 (de) * 2005-02-28 2006-08-31 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
JP4233535B2 (ja) * 2005-03-29 2009-03-04 シャープ株式会社 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP4765563B2 (ja) 2005-11-07 2011-09-07 セイコーエプソン株式会社 光モジュール
JP4969834B2 (ja) 2005-11-14 2012-07-04 パナソニック株式会社 光半導体モジュール及び光半導体モジュールの製造方法
JP2007142042A (ja) * 2005-11-16 2007-06-07 Sharp Corp 半導体パッケージとその製造方法，半導体モジュール，および電子機器
JP2007311445A (ja) * 2006-05-17 2007-11-29 Stanley Electric Co Ltd 半導体発光装置及びその製造方法
JP2008028143A (ja) * 2006-07-21 2008-02-07 Sumitomo Electric Ind Ltd 光モジュール
JP2008109099A (ja) * 2006-09-26 2008-05-08 Sumitomo Electric Ind Ltd ステムと被溶接部材の溶接部構造、その溶接部構造を有する半導体デバイス、光モジュール、およびその製造方法
KR100766505B1 (ko) * 2006-10-03 2007-10-15 삼성전자주식회사 카메라 모듈 및 그 제조 방법
JP5028975B2 (ja) 2006-11-28 2012-09-19 セイコーエプソン株式会社 光源装置、プロジェクタ及びモニタ装置
JPWO2008120558A1 (ja) * 2007-03-29 2010-07-15 コニカミノルタオプト株式会社 撮像装置及びその製造方法
KR20100028555A (ko) * 2007-07-03 2010-03-12 코니카 미놀타 옵토 인코포레이티드 촬상 장치의 제조 방법, 촬상 장치 및 광학 소자
JP4949289B2 (ja) * 2008-02-13 2012-06-06 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
JP2010183002A (ja) 2009-02-09 2010-08-19 Rohm Co Ltd 半導体レーザ装置およびその製造方法
CN103688377B (zh) * 2011-05-16 2018-06-08 日亚化学工业株式会社 发光装置及其制造方法
WO2012160994A1 (ja) * 2011-05-20 2012-11-29 シャープ株式会社 集光型太陽電池及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element
CN101640192A (zh) * 2008-07-29 2010-02-03 住友电气工业株式会社 金属罩和具有该金属罩的光学装置

Also Published As

Publication number Publication date
CN103972370A (zh) 2014-08-06
TWI528600B (zh) 2016-04-01
KR101611893B1 (ko) 2016-04-12
TW201431130A (zh) 2014-08-01
KR20140098678A (ko) 2014-08-08
JP2014150098A (ja) 2014-08-21
JP5998962B2 (ja) 2016-09-28
US20140211472A1 (en) 2014-07-31
US9196761B2 (en) 2015-11-24

Similar Documents

Publication Publication Date Title
CN103972370B (zh) 半导体光学装置
CN102137573B (zh) 表面贴装器件
US7875901B2 (en) Optical device package and optical semiconductor device using the same
JP5095985B2 (ja) 多数の部品からなる反射角変成器
CN118676723A (zh) 发光装置
JP2012019239A (ja) Ｌｅｄパッケージ組立体
JP2020113718A (ja) 発光装置およびその製造方法
JP4549298B2 (ja) 半導体レーザ装置
JP2016514904A (ja) レーザ素子およびその製造方法
JP6511807B2 (ja) 半導体レーザ装置、光源装置、半導体レーザ装置の製造方法、及び光源装置の製造方法
JP2004020872A (ja) 光半導体モジュール
JP2015226017A (ja) 半導体発光装置およびその製造方法
KR19980041732A (ko) 반도체장치 및 리드 프레임
TW202518796A (zh) 光半導體裝置以及光收發器
US9746160B2 (en) Light emitting device and method of manufacturing light emitting device
US11955769B2 (en) Optical element mounting package, electronic device, and electronic module
CN117913149A (zh) 感测器封装结构及其制造方法
JPS62276515A (ja) 光電子装置およびサブキヤリア
JPWO2017038582A1 (ja) 半導体素子収納用パッケージおよび半導体装置
JP7721340B2 (ja) 保持部材
JP2004309506A (ja) 光半導体素子収納用パッケージおよび光半導体装置
WO2026071235A1 (ja) 光素子搭載用パッケージ及び発光装置
US11373961B1 (en) Stem for semiconductor package
JP2018029199A (ja) 半導体発光装置およびその製造方法
JP2005026716A (ja) レーザ装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant