FR3103056B1 - Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant - Google Patents

Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant Download PDF

Info

Publication number
FR3103056B1
FR3103056B1 FR1912566A FR1912566A FR3103056B1 FR 3103056 B1 FR3103056 B1 FR 3103056B1 FR 1912566 A FR1912566 A FR 1912566A FR 1912566 A FR1912566 A FR 1912566A FR 3103056 B1 FR3103056 B1 FR 3103056B1
Authority
FR
France
Prior art keywords
support substrate
electronic device
mounting method
encapsulation cover
corresponding mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1912566A
Other languages
English (en)
Other versions
FR3103056A1 (fr
Inventor
Karine Saxod
Nicolas Mastromauro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR1912566A priority Critical patent/FR3103056B1/fr
Priority to US17/090,461 priority patent/US11664475B2/en
Priority to CN202011230917.2A priority patent/CN112786712A/zh
Priority to CN202022550294.9U priority patent/CN213546324U/zh
Publication of FR3103056A1 publication Critical patent/FR3103056A1/fr
Application granted granted Critical
Publication of FR3103056B1 publication Critical patent/FR3103056B1/fr
Priority to US18/136,633 priority patent/US20230253519A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/14—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
    • H01L31/141—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the semiconductor device sensitive to radiation being without a potential-jump barrier or surface barrier
    • H01L31/143—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the semiconductor device sensitive to radiation being without a potential-jump barrier or surface barrier the light source being a semiconductor device with at least one potential-jump barrier or surface barrier, e.g. light emitting diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/484—Transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers
    • G01S7/4865—Time delay measurement, e.g. time-of-flight measurement, time of arrival measurement or determining the exact position of a peak
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/125—Composite devices with photosensitive elements and electroluminescent elements within one single body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Le dispositif électronique (DIS) comprend un substrat de support (100) destiné à supporter au moins une puce électronique (50) et présentant une face avant de montage (101) et un capot d’encapsulation (200) monté sur ladite face avant (101) du substrat de support (100) par un montage comprenant au moins une surface d’appui (300) sur laquelle ledit capot (200) et ledit substrat (100) sont en contact. Au moins un cordon de colle (150) est localisé en dehors de la surface d’appui (300) pour solidariser ledit capot (200) et ledit substrat de support (100). Figure pour l’abrégé : Fig 1
FR1912566A 2019-11-08 2019-11-08 Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant Active FR3103056B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1912566A FR3103056B1 (fr) 2019-11-08 2019-11-08 Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant
US17/090,461 US11664475B2 (en) 2019-11-08 2020-11-05 Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process
CN202011230917.2A CN112786712A (zh) 2019-11-08 2020-11-06 电子设备和对应的安装方法
CN202022550294.9U CN213546324U (zh) 2019-11-08 2020-11-06 电子设备
US18/136,633 US20230253519A1 (en) 2019-11-08 2023-04-19 Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1912566A FR3103056B1 (fr) 2019-11-08 2019-11-08 Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant
FR1912566 2019-11-08

Publications (2)

Publication Number Publication Date
FR3103056A1 FR3103056A1 (fr) 2021-05-14
FR3103056B1 true FR3103056B1 (fr) 2022-07-08

Family

ID=69375608

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1912566A Active FR3103056B1 (fr) 2019-11-08 2019-11-08 Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant

Country Status (3)

Country Link
US (2) US11664475B2 (fr)
CN (2) CN213546324U (fr)
FR (1) FR3103056B1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0773673A4 (fr) * 1995-05-31 2001-05-23 Sony Corp Dispositif de saisie d'image et son procede de fabrication, adaptateur de saisie d'image, processeur de signaux, procede de traitement de signaux, processeur d'informations et procede de traitement d'informations
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
JP4096588B2 (ja) * 2002-03-22 2008-06-04 コニカミノルタホールディングス株式会社 撮像装置
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP5998962B2 (ja) * 2013-01-31 2016-09-28 三菱電機株式会社 半導体光装置
FR3073980A1 (fr) * 2017-11-23 2019-05-24 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique et procede de fabrication

Also Published As

Publication number Publication date
US20230253519A1 (en) 2023-08-10
US20210143294A1 (en) 2021-05-13
CN112786712A (zh) 2021-05-11
CN213546324U (zh) 2021-06-25
US11664475B2 (en) 2023-05-30
FR3103056A1 (fr) 2021-05-14

Similar Documents

Publication Publication Date Title
MA29242B1 (fr) Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble
TW200707625A (en) Semiconductor wafer and processing method for same
EP1427032A3 (fr) Procédé de préparer une pièce piézoélectrique et pièce piézoélectrique
FR3079668B1 (fr) Dispositif d'onde acoustique de surface sur substrat composite
FR3061758B1 (fr) Dispositif de fixation d'un accessoire a un mur par emboitage elastique
FR3103056B1 (fr) Dispositif électronique comprenant un substrat de support et un capot d’encapsulation monté sur le substrat de support, et procédé de montage correspondant
ATE475907T1 (de) Projektionsobjektiv für die halbleiter- lithographie
FR3082610B1 (fr) Procédé de détermination de données de prédistorsion en vue de la projection d’un contenu d’image par un projecteur et module de projection correspondant
DE502004009640D1 (de) Verfahren zur Herstellung eines Leistungshalbleitermoduls mit biegesteifer Grundplatte
FR2835651B1 (fr) Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase
TW200618267A (en) Optical device and optical apparatus
WO2004008229A3 (fr) Reflecteur monte sur une broche et destine a des dispositifs optiques de precision
FR3062923B1 (fr) Dispositif et procede d'etalonnage pour mesures radar
FR3086459B1 (fr) Dispositif electronique comprenant une puce optique et procede de fabrication
FR3092635B1 (fr) Élément d’appui pour ressort hélicoïdal, ensemble de suspension et dispositif de suspension comprenant cet élément d’appui
FR3085070B1 (fr) Interféromètre Fabry-Pérot et son procédé de fabrication
FR3067040B1 (fr) Dispositif destine a recevoir un depot de materiau par impression, ensemble et procede associes
MX2021003927A (es) Soporte de montaje magnetico.
FR2795199B1 (fr) Dispositif et procede de fabrication de dispositifs comprenant au moins une puce montee sur un support
FR3109466B1 (fr) Dispositif de support d’une puce électronique et procédé de fabrication correspondant
FR3086460B1 (fr) Dispositif electronique comprenant une puce optique et procede de fabrication
FR3114921B1 (fr) Dispositif pour le positionnement d'une antenne
FR3081673B1 (fr) Ensemble comprenant au moins un composant electronique, un support et un dispositif de fixation
FR3094172B1 (fr) Dispositif électronique comprenant un composant électronique monté sur un substrat de support et procédé de montage
CN109991796A (zh) 一种可调角度led近光打光灯及其光线调节方法

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20210514

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5