KR101581984B1 - 도전 접속 재료 및 그것을 이용한 단자간 접속 방법 및 접속 단자의 제조 방법 - Google Patents
도전 접속 재료 및 그것을 이용한 단자간 접속 방법 및 접속 단자의 제조 방법 Download PDFInfo
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- KR101581984B1 KR101581984B1 KR1020117006703A KR20117006703A KR101581984B1 KR 101581984 B1 KR101581984 B1 KR 101581984B1 KR 1020117006703 A KR1020117006703 A KR 1020117006703A KR 20117006703 A KR20117006703 A KR 20117006703A KR 101581984 B1 KR101581984 B1 KR 101581984B1
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- resin composition
- weight
- metal foil
- resin
- conductive
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Images
Classifications
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J9/02—Electrically-conducting adhesives
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
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- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/0405—Solder foil, tape or wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Landscapes
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- Physics & Mathematics (AREA)
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- Conductive Materials (AREA)
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JPJP-P-2008-228907 | 2008-09-05 | ||
JP2008228907 | 2008-09-05 | ||
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JPJP-P-2009-152188 | 2009-06-26 |
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KR20110063483A KR20110063483A (ko) | 2011-06-10 |
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EP (1) | EP2357876A4 (fr) |
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CN (1) | CN102144432B (fr) |
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WO (1) | WO2010027017A1 (fr) |
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JP4924773B2 (ja) * | 2009-12-24 | 2012-04-25 | 住友ベークライト株式会社 | 導電接続材料、電子部品の製造方法、導電接続材料付き電子部材および電子部品 |
US20120319268A1 (en) * | 2010-01-29 | 2012-12-20 | Tomohiro Kagimoto | Conductive connection sheet, method for connecting terminals, method for forming connection terminal, semiconductor device, and electronic device |
JP5564964B2 (ja) * | 2010-01-29 | 2014-08-06 | 住友ベークライト株式会社 | 導電接続シート、端子間の接続方法、接続端子の形成方法、半導体装置および電子機器 |
RS62746B1 (sr) * | 2010-09-02 | 2022-01-31 | Sumitomo Bakelite Co | Kompozicija smole za fiksiranje za upotrebu u rotoru |
JP5831122B2 (ja) * | 2010-10-18 | 2015-12-09 | 三菱化学株式会社 | 三次元集積回路用の層間充填材組成物、塗布液及び三次元集積回路の製造方法 |
DE102011009006A1 (de) * | 2011-01-20 | 2012-07-26 | Schlenk Metallfolien Gmbh & Co. Kg | Verfahren zum Herstellen von vorverzinnten Verbindern für PV-Zellen |
US9490046B2 (en) * | 2013-05-23 | 2016-11-08 | Sekisui Chemical Co., Ltd. | Conductive material and connected structure |
JP6291738B2 (ja) | 2013-07-25 | 2018-03-14 | 富士通株式会社 | 回路基板、回路基板の製造方法及び電子機器 |
CN105900180B (zh) * | 2014-06-05 | 2018-07-06 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
WO2016043265A1 (fr) * | 2014-09-18 | 2016-03-24 | 積水化学工業株式会社 | Pate electriquement conductrice, structure assemblee et procede de fabrication d'une structure assemblee |
US10388583B2 (en) * | 2014-10-10 | 2019-08-20 | Namics Corporation | Thermosetting resin composition and method of producing same |
JP6746898B2 (ja) | 2014-11-17 | 2020-08-26 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法 |
EP3257109B1 (fr) * | 2015-02-11 | 2022-06-22 | Alpha Assembly Solutions Inc. | Bande de connexion électrique |
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2009
- 2009-09-03 WO PCT/JP2009/065414 patent/WO2010027017A1/fr active Application Filing
- 2009-09-03 US US13/061,952 patent/US20110311790A1/en not_active Abandoned
- 2009-09-03 CN CN200980134350.4A patent/CN102144432B/zh not_active Expired - Fee Related
- 2009-09-03 KR KR1020117006703A patent/KR101581984B1/ko not_active IP Right Cessation
- 2009-09-03 JP JP2010527814A patent/JPWO2010027017A1/ja not_active Withdrawn
- 2009-09-03 EP EP09811542A patent/EP2357876A4/fr not_active Withdrawn
- 2009-09-04 TW TW098129811A patent/TWI523042B/zh not_active IP Right Cessation
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Also Published As
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TW201017691A (en) | 2010-05-01 |
TWI523042B (zh) | 2016-02-21 |
CN102144432B (zh) | 2015-09-30 |
EP2357876A4 (fr) | 2012-04-25 |
EP2357876A1 (fr) | 2011-08-17 |
US20110311790A1 (en) | 2011-12-22 |
WO2010027017A1 (fr) | 2010-03-11 |
JPWO2010027017A1 (ja) | 2012-02-02 |
KR20110063483A (ko) | 2011-06-10 |
CN102144432A (zh) | 2011-08-03 |
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