KR101538203B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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KR101538203B1
KR101538203B1 KR1020120087610A KR20120087610A KR101538203B1 KR 101538203 B1 KR101538203 B1 KR 101538203B1 KR 1020120087610 A KR1020120087610 A KR 1020120087610A KR 20120087610 A KR20120087610 A KR 20120087610A KR 101538203 B1 KR101538203 B1 KR 101538203B1
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South Korea
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mold
substrate
holding unit
control
pattern
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Korean (ko)
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KR20130018173A (ko
Inventor
유스께 다나까
히로또시 도리이
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020120087610A 2011-08-11 2012-08-10 임프린트 장치 및 물품 제조 방법 Active KR101538203B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011175897 2011-08-11
JPJP-P-2011-175897 2011-08-11

Publications (2)

Publication Number Publication Date
KR20130018173A KR20130018173A (ko) 2013-02-20
KR101538203B1 true KR101538203B1 (ko) 2015-07-20

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KR1020120087610A Active KR101538203B1 (ko) 2011-08-11 2012-08-10 임프린트 장치 및 물품 제조 방법

Country Status (5)

Country Link
US (1) US9280047B2 (enExample)
JP (1) JP6061524B2 (enExample)
KR (1) KR101538203B1 (enExample)
CN (1) CN102929099B (enExample)
TW (1) TWI601619B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200031037A (ko) * 2018-09-13 2020-03-23 캐논 가부시끼가이샤 평탄화 장치, 평탄화 방법 및 물품 제조 방법

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JP6550178B2 (ja) * 2013-04-24 2019-07-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6412317B2 (ja) * 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6368075B2 (ja) * 2013-06-26 2018-08-01 キヤノン株式会社 モールド
CN104281019B (zh) * 2013-07-08 2016-02-17 中芯国际集成电路制造(上海)有限公司 光刻的迭对值校准方法
JP6538695B2 (ja) * 2013-12-31 2019-07-03 キャノン・ナノテクノロジーズ・インコーポレーテッド パーシャルフィールドインプリントのための非対称的なテンプレート形状の調節
JP6273860B2 (ja) * 2014-01-27 2018-02-07 大日本印刷株式会社 インプリントモールド及び半導体デバイスの製造方法
JP2015170815A (ja) * 2014-03-10 2015-09-28 キヤノン株式会社 インプリント装置、アライメント方法及び物品の製造方法
JP6497849B2 (ja) * 2014-04-15 2019-04-10 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6497938B2 (ja) 2015-01-05 2019-04-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法。
JP6553926B2 (ja) * 2015-04-09 2019-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
DE102015108327A1 (de) 2015-05-27 2016-12-01 Technische Universität Darmstadt Vorrichtung und Verfahren zum Erzeugen einer Abformung einer Oberflächeneigenschaft
JP6732419B2 (ja) * 2015-09-02 2020-07-29 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP6647027B2 (ja) * 2015-12-03 2020-02-14 キヤノン株式会社 インプリント装置および物品製造方法
JP6655988B2 (ja) * 2015-12-25 2020-03-04 キヤノン株式会社 インプリント装置の調整方法、インプリント方法および物品製造方法
JP6942491B2 (ja) * 2016-03-15 2021-09-29 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6748461B2 (ja) * 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法
JP6700936B2 (ja) * 2016-04-25 2020-05-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7022615B2 (ja) * 2018-02-26 2022-02-18 キヤノン株式会社 インプリント方法、インプリント装置、モールドの製造方法、および、物品の製造方法
CN109624491A (zh) * 2018-11-29 2019-04-16 颍上县艺豪服饰辅料有限公司 一种服装印花装置
JP7190942B2 (ja) * 2019-03-08 2022-12-16 キヤノン株式会社 インプリントシステム、管理装置、および物品製造方法
JP7317575B2 (ja) * 2019-05-28 2023-07-31 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7414627B2 (ja) * 2020-04-15 2024-01-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7712832B2 (ja) * 2021-09-21 2025-07-24 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP2023085012A (ja) 2021-12-08 2023-06-20 キヤノン株式会社 インプリント方法、および物品製造方法
JP7777102B2 (ja) * 2023-06-01 2025-11-27 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
CN120176900B (zh) * 2025-03-12 2025-11-14 江门市新会区先锋五金制品有限公司 用于检测锅底压花设备运行状态的方法和设备

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JP4290177B2 (ja) * 2005-06-08 2009-07-01 キヤノン株式会社 モールド、アライメント方法、パターン形成装置、パターン転写装置、及びチップの製造方法
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CN101059650A (zh) 2006-04-18 2007-10-24 佳能株式会社 图案转印设备、压印设备和图案转印方法
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KR20100131375A (ko) * 2009-06-05 2010-12-15 가부시끼가이샤 도시바 패턴 형성 장치 및 패턴 형성 방법
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200031037A (ko) * 2018-09-13 2020-03-23 캐논 가부시끼가이샤 평탄화 장치, 평탄화 방법 및 물품 제조 방법
KR102571412B1 (ko) 2018-09-13 2023-08-28 캐논 가부시끼가이샤 평탄화 장치, 평탄화 방법 및 물품 제조 방법

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Publication number Publication date
KR20130018173A (ko) 2013-02-20
US20130037981A1 (en) 2013-02-14
CN102929099B (zh) 2016-08-24
JP2013055327A (ja) 2013-03-21
TWI601619B (zh) 2017-10-11
CN102929099A (zh) 2013-02-13
JP6061524B2 (ja) 2017-01-18
TW201311425A (zh) 2013-03-16
US9280047B2 (en) 2016-03-08

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