KR101503127B1 - 벌크 규소를 연마하기 위한 조성물 및 방법 - Google Patents

벌크 규소를 연마하기 위한 조성물 및 방법 Download PDF

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KR101503127B1
KR101503127B1 KR1020127009596A KR20127009596A KR101503127B1 KR 101503127 B1 KR101503127 B1 KR 101503127B1 KR 1020127009596 A KR1020127009596 A KR 1020127009596A KR 20127009596 A KR20127009596 A KR 20127009596A KR 101503127 B1 KR101503127 B1 KR 101503127B1
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weight
polishing composition
acid
silica
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KR20120064706A (ko
Inventor
브라이언 레이스
존 클라크
라몬 존스
제프리 길리랜드
마이클 화이트
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캐보트 마이크로일렉트로닉스 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127009596A 2009-09-16 2010-09-13 벌크 규소를 연마하기 위한 조성물 및 방법 Active KR101503127B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/462,638 2009-09-16
US12/462,638 US8883034B2 (en) 2009-09-16 2009-09-16 Composition and method for polishing bulk silicon
PCT/US2010/048587 WO2011034808A2 (en) 2009-09-16 2010-09-13 Composition and method for polishing bulk silicon

Publications (2)

Publication Number Publication Date
KR20120064706A KR20120064706A (ko) 2012-06-19
KR101503127B1 true KR101503127B1 (ko) 2015-03-16

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KR1020127009596A Active KR101503127B1 (ko) 2009-09-16 2010-09-13 벌크 규소를 연마하기 위한 조성물 및 방법

Country Status (9)

Country Link
US (2) US8883034B2 (https=)
EP (1) EP2478064B1 (https=)
JP (1) JP5749719B2 (https=)
KR (1) KR101503127B1 (https=)
CN (1) CN102725373B (https=)
MY (1) MY169952A (https=)
SG (1) SG179158A1 (https=)
TW (1) TWI484007B (https=)
WO (1) WO2011034808A2 (https=)

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US8697576B2 (en) * 2009-09-16 2014-04-15 Cabot Microelectronics Corporation Composition and method for polishing polysilicon
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JP2013004839A (ja) * 2011-06-20 2013-01-07 Shin Etsu Handotai Co Ltd シリコンウェーハの研磨方法
US8821215B2 (en) * 2012-09-07 2014-09-02 Cabot Microelectronics Corporation Polypyrrolidone polishing composition and method
KR20160054466A (ko) 2013-09-10 2016-05-16 히타치가세이가부시끼가이샤 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체
US9340706B2 (en) * 2013-10-10 2016-05-17 Cabot Microelectronics Corporation Mixed abrasive polishing compositions
JP6250454B2 (ja) * 2014-03-27 2017-12-20 株式会社フジミインコーポレーテッド シリコン材料研磨用組成物
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US9758697B2 (en) * 2015-03-05 2017-09-12 Cabot Microelectronics Corporation Polishing composition containing cationic polymer additive
WO2016143323A1 (ja) * 2015-03-11 2016-09-15 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
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US20190153262A1 (en) * 2017-11-20 2019-05-23 Cabot Microelectronics Corporation Composition and method for polishing memory hard disks exhibiting reduced surface scratching
JP6572288B2 (ja) * 2017-11-22 2019-09-04 株式会社フジミインコーポレーテッド シリコン材料研磨用組成物
JP7575878B2 (ja) * 2020-03-24 2024-10-30 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法、および研磨方法
TWI880128B (zh) * 2020-07-20 2025-04-11 美商Ｃｍｃ材料有限責任公司 矽晶圓拋光組合物及方法
CN113182938B (zh) * 2021-03-01 2023-02-03 燕山大学 金刚石复相材料表面的加工方法

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Also Published As

Publication number Publication date
EP2478064A4 (en) 2017-07-05
CN102725373A (zh) 2012-10-10
WO2011034808A3 (en) 2011-07-28
KR20120064706A (ko) 2012-06-19
US9701871B2 (en) 2017-07-11
WO2011034808A2 (en) 2011-03-24
TWI484007B (zh) 2015-05-11
EP2478064A2 (en) 2012-07-25
US8883034B2 (en) 2014-11-11
US20110062376A1 (en) 2011-03-17
TW201129659A (en) 2011-09-01
CN102725373B (zh) 2015-05-06
JP2013505584A (ja) 2013-02-14
US20150028254A1 (en) 2015-01-29
JP5749719B2 (ja) 2015-07-15
SG179158A1 (en) 2012-05-30
EP2478064B1 (en) 2020-02-12
MY169952A (en) 2019-06-19

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