KR101497708B1 - 에칭제 - Google Patents

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Publication number
KR101497708B1
KR101497708B1 KR1020080118152A KR20080118152A KR101497708B1 KR 101497708 B1 KR101497708 B1 KR 101497708B1 KR 1020080118152 A KR1020080118152 A KR 1020080118152A KR 20080118152 A KR20080118152 A KR 20080118152A KR 101497708 B1 KR101497708 B1 KR 101497708B1
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KR
South Korea
Prior art keywords
plating layer
copper plating
etchant
etching
weight
Prior art date
Application number
KR1020080118152A
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English (en)
Korean (ko)
Other versions
KR20090054926A (ko
Inventor
마미 나까무라
다이사꾸 아끼야마
마사시 요시까이
Original Assignee
멕크 가부시키가이샤
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Application filed by 멕크 가부시키가이샤 filed Critical 멕크 가부시키가이샤
Publication of KR20090054926A publication Critical patent/KR20090054926A/ko
Application granted granted Critical
Publication of KR101497708B1 publication Critical patent/KR101497708B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020080118152A 2007-11-27 2008-11-26 에칭제 KR101497708B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2007-306017 2007-11-27
JP2007306017 2007-11-27
JP2008190032A JP5273710B2 (ja) 2007-11-27 2008-07-23 エッチング剤
JPJP-P-2008-190032 2008-07-23

Publications (2)

Publication Number Publication Date
KR20090054926A KR20090054926A (ko) 2009-06-01
KR101497708B1 true KR101497708B1 (ko) 2015-03-02

Family

ID=40741804

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080118152A KR101497708B1 (ko) 2007-11-27 2008-11-26 에칭제

Country Status (4)

Country Link
JP (2) JP5273710B2 (ja)
KR (1) KR101497708B1 (ja)
CN (1) CN101445933B (ja)
TW (1) TWI411705B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5531708B2 (ja) 2010-03-26 2014-06-25 メック株式会社 銅のエッチング液および基板の製造方法
KR101825493B1 (ko) 2010-04-20 2018-02-06 삼성디스플레이 주식회사 금속 배선용 식각액 조성물 및 이를 이용한 박막 트랜지스터 표시판의 제조방법
CN104170532B (zh) * 2012-03-16 2017-02-22 住友电木株式会社 层压板及印刷电路板的制造方法
JP6002011B2 (ja) * 2012-11-26 2016-10-05 株式会社パイロットコーポレーション ボールペン
JP5576525B1 (ja) 2013-03-29 2014-08-20 メルテックス株式会社 銅エッチング液
US9301399B2 (en) * 2013-04-23 2016-03-29 Mitsubishi Gas Chemical Company, Inc. Method of treating wiring substrate and wiring substrate manufactured by the same
JP6424559B2 (ja) 2013-11-22 2018-11-21 三菱瓦斯化学株式会社 エッチング用組成物及びそれを用いたプリント配線板の製造方法
JP2016119790A (ja) * 2014-12-22 2016-06-30 株式会社ノーリツ 力率改善回路、スイッチング電源装置およびそれを備えた給湯装置
CN104928667B (zh) * 2015-06-08 2018-07-20 华南理工大学 一种基于功能化离子液体的印制电路板处理用棕化液
CN108456885B (zh) * 2017-02-13 2022-08-23 东进世美肯株式会社 蚀刻液组合物以及利用其的金属布线形成方法
JP6746518B2 (ja) * 2017-03-10 2020-08-26 株式会社Adeka エッチング液組成物及びエッチング方法
JP6949306B2 (ja) 2017-07-14 2021-10-13 メルテックス株式会社 銅エッチング液
EP3518631A1 (en) * 2018-01-29 2019-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Anisotropic etching using highly branched polymers
CN110913596A (zh) * 2019-12-10 2020-03-24 深圳市板明科技有限公司 一种减铜微蚀剂及其制备方法
KR20220033141A (ko) * 2020-09-09 2022-03-16 동우 화인켐 주식회사 실리콘 식각액 조성물, 이를 이용한 패턴 형성 방법 및 어레이 기판의 제조 방법, 및 이에 따라 제조된 어레이 기판
CA3110357A1 (en) * 2021-02-25 2022-08-25 Sixring Inc. Modified sulfuric acid and uses thereof
KR20220126436A (ko) * 2021-03-09 2022-09-16 주식회사 이엔에프테크놀로지 디스플레이 기판용 식각액
CN114016031B (zh) * 2021-10-22 2024-05-17 深圳市松柏实业发展有限公司 快速蚀刻液及其制备方法
CN115141629B (zh) * 2022-06-15 2023-06-02 湖北兴福电子材料股份有限公司 TiN去除液

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060980A (ja) * 2000-08-23 2002-02-28 Nippon Peroxide Co Ltd 銅及び銅合金の表面粗面化処理液
KR20050110699A (ko) * 2003-03-25 2005-11-23 아토테크더치랜드게엠베하 구리 표면 에칭용 용액 및 구리 표면 상에 금속을침착시키는 방법
KR20070112273A (ko) * 2005-04-14 2007-11-22 쇼와 덴코 가부시키가이샤 연마 조성물
KR20080061386A (ko) * 2005-09-30 2008-07-02 캐보트 마이크로일렉트로닉스 코포레이션 표면 평탄화를 위한 조성물 및 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2884935B2 (ja) * 1992-08-17 1999-04-19 日立化成工業株式会社 ニッケル又はニッケル合金のエッチング液及びこのエッチング液を用いる方法並びにこのエッチング液を用いて配線板を製造する方法
JPH11140669A (ja) * 1997-11-04 1999-05-25 Ebara Densan Ltd エッチング液
JP2005150757A (ja) * 1998-08-31 2005-06-09 Hitachi Chem Co Ltd 金属用研磨液及び研磨方法
JP2003338676A (ja) * 2002-05-20 2003-11-28 Mec Kk 銅配線基板の製造方法
TWI282360B (en) * 2002-06-03 2007-06-11 Hitachi Chemical Co Ltd Polishing composition and polishing method thereof
JP2004031446A (ja) * 2002-06-21 2004-01-29 Hitachi Chem Co Ltd 研磨液及び研磨方法
JP4241018B2 (ja) * 2002-12-06 2009-03-18 メック株式会社 エッチング液
JP4434632B2 (ja) * 2003-06-10 2010-03-17 三菱瓦斯化学株式会社 プリント配線板の製造方法
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
JP4280171B2 (ja) * 2004-01-27 2009-06-17 日本パーオキサイド株式会社 銅及び銅合金の表面粗化処理液
JP4488188B2 (ja) * 2004-06-29 2010-06-23 三菱瓦斯化学株式会社 セミアディティブ法プリント配線基板製造用エッチング液
JP4430990B2 (ja) * 2004-06-29 2010-03-10 株式会社荏原電産 セミアディティブ工法用回路形成エッチング液
JP2006210492A (ja) * 2005-01-26 2006-08-10 Hitachi Chem Co Ltd プリント配線板の製造方法
WO2007047454A2 (en) * 2005-10-14 2007-04-26 Applied Materials, Inc. Process and composition for electrochemical mechanical polishing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060980A (ja) * 2000-08-23 2002-02-28 Nippon Peroxide Co Ltd 銅及び銅合金の表面粗面化処理液
KR20050110699A (ko) * 2003-03-25 2005-11-23 아토테크더치랜드게엠베하 구리 표면 에칭용 용액 및 구리 표면 상에 금속을침착시키는 방법
KR20070112273A (ko) * 2005-04-14 2007-11-22 쇼와 덴코 가부시키가이샤 연마 조성물
KR20080061386A (ko) * 2005-09-30 2008-07-02 캐보트 마이크로일렉트로닉스 코포레이션 표면 평탄화를 위한 조성물 및 방법

Also Published As

Publication number Publication date
TWI411705B (zh) 2013-10-11
TW200923130A (en) 2009-06-01
JP5273710B2 (ja) 2013-08-28
CN101445933B (zh) 2013-04-10
JP5505847B2 (ja) 2014-05-28
JP2013167024A (ja) 2013-08-29
CN101445933A (zh) 2009-06-03
KR20090054926A (ko) 2009-06-01
JP2009149971A (ja) 2009-07-09

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