CN110913596A - 一种减铜微蚀剂及其制备方法 - Google Patents
一种减铜微蚀剂及其制备方法 Download PDFInfo
- Publication number
- CN110913596A CN110913596A CN201911263870.7A CN201911263870A CN110913596A CN 110913596 A CN110913596 A CN 110913596A CN 201911263870 A CN201911263870 A CN 201911263870A CN 110913596 A CN110913596 A CN 110913596A
- Authority
- CN
- China
- Prior art keywords
- copper
- reducing
- microetching agent
- solution
- sulfuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 57
- 238000005530 etching Methods 0.000 claims abstract description 36
- 150000002391 heterocyclic compounds Chemical class 0.000 claims abstract description 27
- 238000005260 corrosion Methods 0.000 claims abstract description 24
- 230000007797 corrosion Effects 0.000 claims abstract description 24
- 239000003112 inhibitor Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 37
- 239000000243 solution Substances 0.000 claims description 20
- 229920002873 Polyethylenimine Polymers 0.000 claims description 15
- 239000003381 stabilizer Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 12
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 claims description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- NZPIQKUHZVXACL-KHPPLWFESA-N 1-[2-[(z)-octadec-9-enyl]-4,5-dihydroimidazol-1-yl]ethanol Chemical compound CCCCCCCC\C=C/CCCCCCCCC1=NCCN1C(C)O NZPIQKUHZVXACL-KHPPLWFESA-N 0.000 claims description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
- 150000003222 pyridines Chemical class 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 229910021645 metal ion Inorganic materials 0.000 abstract description 3
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 37
- -1 1-hydroxyethyl-2-oleyl-imidazolidine Chemical compound 0.000 description 10
- ZERULLAPCVRMCO-UHFFFAOYSA-N Dipropyl sulfide Chemical group CCCSCCC ZERULLAPCVRMCO-UHFFFAOYSA-N 0.000 description 4
- UOQIHUXGYYEMKX-UHFFFAOYSA-N OC(C)C=1N=C(NC1)CCCCCCCCC=C/CCCCCCCC Chemical compound OC(C)C=1N=C(NC1)CCCCCCCCC=C/CCCCCCCC UOQIHUXGYYEMKX-UHFFFAOYSA-N 0.000 description 4
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea group Chemical group NC(=S)N UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- OKDGRDCXVWSXDC-UHFFFAOYSA-N 2-chloropyridine Chemical group ClC1=CC=CC=N1 OKDGRDCXVWSXDC-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical group C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- JACMPVXHEARCBO-UHFFFAOYSA-N n-pentylpentan-1-amine Chemical group CCCCCNCCCCC JACMPVXHEARCBO-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
H<sub>2</sub>SO<sub>4</sub> | H<sub>2</sub>O<sub>2</sub> | 稳定剂 | 缓蚀剂 | 含N杂环化合物 | |
实施例1 | 50 | 6 | 30 | 1 | 5 |
实施例2 | 60 | 6 | 35 | 2 | 5 |
实施例3 | 70 | 8 | 40 | 2 | 1 |
实施例4 | 80 | 10 | 42 | 4 | 2 |
实施例5 | 90 | 12 | 44 | 6 | 3 |
实施例6 | 100 | 14 | 46 | 8 | 4 |
实施例7 | 110 | 16 | 48 | 10 | 5 |
实施例8 | 120 | 18 | 50 | 12 | 6 |
实施例9 | 130 | 20 | 60 | 10 | 5 |
实施例10 | 110 | 16 | 48 | 15 | 10 |
实施例11 | 110 | 16 | 48 | \ | \ |
实施例12 | 110 | 16 | 48 | \ | 5 |
实施例13 | 110 | 16 | 48 | 10 | \ |
实施例 | 缝隙最大宽度 | 实施例 | 缝隙最大宽度 |
11 | 34.367μm | 12 | 32.183μm |
13 | 31.729μm | 20 | 26.725μm |
21 | 28.746μm | 22 | 28.036μm |
27 | 30.278μm | 28 | 23.315μm |
29 | 26.916μm | 30 | 29.913μm |
31 | 25.473μm | 32 | 26.597μm |
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911263870.7A CN110913596A (zh) | 2019-12-10 | 2019-12-10 | 一种减铜微蚀剂及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911263870.7A CN110913596A (zh) | 2019-12-10 | 2019-12-10 | 一种减铜微蚀剂及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110913596A true CN110913596A (zh) | 2020-03-24 |
Family
ID=69824315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911263870.7A Pending CN110913596A (zh) | 2019-12-10 | 2019-12-10 | 一种减铜微蚀剂及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110913596A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112064026A (zh) * | 2020-08-03 | 2020-12-11 | 罗山县金硕电子材料有限公司 | 一种新型的铜面粗糙度咬蚀稳定剂及其制备方法 |
CN112342546A (zh) * | 2020-10-23 | 2021-02-09 | 珠海隆康电子科技有限公司 | 微蚀稳定剂及其制备方法 |
CN113766755A (zh) * | 2021-07-26 | 2021-12-07 | 赣州市深联电路有限公司 | 一种印制电路选择性快速差分蚀刻工艺 |
CN114807943A (zh) * | 2022-06-27 | 2022-07-29 | 深圳市板明科技股份有限公司 | 一种5g高频线路生产工艺用微蚀刻液和微蚀方法及其应用 |
CN115074734A (zh) * | 2022-08-22 | 2022-09-20 | 深圳市板明科技股份有限公司 | 一种铝基材线路板用减铜添加剂及其制备方法和使用方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009149971A (ja) * | 2007-11-27 | 2009-07-09 | Mec Kk | エッチング剤 |
CN107475715A (zh) * | 2016-06-08 | 2017-12-15 | 易案爱富科技有限公司 | 双氧水稳定剂及包含其的蚀刻组合物 |
CN109652804A (zh) * | 2019-01-30 | 2019-04-19 | 湖南互连微电子材料有限公司 | 一种新型pcb减铜蚀刻液以及制作工艺 |
-
2019
- 2019-12-10 CN CN201911263870.7A patent/CN110913596A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009149971A (ja) * | 2007-11-27 | 2009-07-09 | Mec Kk | エッチング剤 |
CN107475715A (zh) * | 2016-06-08 | 2017-12-15 | 易案爱富科技有限公司 | 双氧水稳定剂及包含其的蚀刻组合物 |
CN109652804A (zh) * | 2019-01-30 | 2019-04-19 | 湖南互连微电子材料有限公司 | 一种新型pcb减铜蚀刻液以及制作工艺 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112064026A (zh) * | 2020-08-03 | 2020-12-11 | 罗山县金硕电子材料有限公司 | 一种新型的铜面粗糙度咬蚀稳定剂及其制备方法 |
CN112342546A (zh) * | 2020-10-23 | 2021-02-09 | 珠海隆康电子科技有限公司 | 微蚀稳定剂及其制备方法 |
CN113766755A (zh) * | 2021-07-26 | 2021-12-07 | 赣州市深联电路有限公司 | 一种印制电路选择性快速差分蚀刻工艺 |
CN114807943A (zh) * | 2022-06-27 | 2022-07-29 | 深圳市板明科技股份有限公司 | 一种5g高频线路生产工艺用微蚀刻液和微蚀方法及其应用 |
CN115074734A (zh) * | 2022-08-22 | 2022-09-20 | 深圳市板明科技股份有限公司 | 一种铝基材线路板用减铜添加剂及其制备方法和使用方法 |
CN115074734B (zh) * | 2022-08-22 | 2022-11-08 | 深圳市板明科技股份有限公司 | 一种铝基材线路板用减铜添加剂及其制备方法和使用方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110913596A (zh) | 一种减铜微蚀剂及其制备方法 | |
KR100946873B1 (ko) | 에칭제와 보급액 및 이것을 이용한 구리 배선의 제조 방법 | |
KR102286510B1 (ko) | 무전해 도금용 전처리제, 및 상기 무전해 도금용 전처리제를 사용한 프린트 배선기판의 전처리방법 및 그 제조방법 | |
EP2778261B1 (en) | Method of filling through-holes | |
KR101319863B1 (ko) | 주석 전기도금액 및 주석 전기도금 방법 | |
CN104651840B (zh) | 蚀刻用组合物以及使用了其的印刷电路板的制造方法 | |
KR20160024868A (ko) | 주석 또는 주석 합금용 전기 도금액 및 그의 용도 | |
KR20140113548A (ko) | 관통홀의 필링 방법 | |
JP2013142199A (ja) | エッチング液およびそれを用いたプリント配線板の製造方法 | |
CN112064026A (zh) | 一种新型的铜面粗糙度咬蚀稳定剂及其制备方法 | |
KR20140002495A (ko) | 에칭용 액체 조성물 및 이것을 이용한 다층 프린트 배선판의 제조 방법 | |
JP2011099087A (ja) | 金属化のためのポリマー含有基体の製造 | |
JP2003138389A (ja) | エッチング剤組成物及びパターン形成方法 | |
KR100919596B1 (ko) | 에칭 첨가제 및 이를 함유하는 에칭용 조성물 | |
JP2006294797A (ja) | エッチング方法 | |
KR20140018086A (ko) | 구리 및 구리 합금의 에칭 방법 | |
JP4395148B2 (ja) | レジスト剥離剤 | |
JP4069387B2 (ja) | エッチング液 | |
KR20160062054A (ko) | 스미어 제거를 위해 유전체 재료 내의 오목 구조물의 처리 방법 | |
JP3854523B2 (ja) | レジスト剥離剤 | |
JP2003518552A (ja) | 無電解金めっき組成物及びその使用方法 | |
WO2019135338A1 (ja) | 組成物及びエッチング方法 | |
KR20100004060A (ko) | 접착층 형성액 | |
JP6600564B2 (ja) | 銅フィリングされた銅めっき層のエッチング方法 | |
JP2008513603A (ja) | ポストディップ水溶液および金属の表面処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 518000 Room 101, building 2, No. 7, Langhui Road, tangxiayong community, Yanluo street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen banming Technology Co.,Ltd. Address before: Baoan District Songgang Tangxia street Shenzhen city Guangdong province 518000 Chung Hui Lu Lang community building No. 02 7 Applicant before: SHENZHEN BOARDTECH Co.,Ltd. |
|
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Li Chenqing Inventor after: Hao Yi Inventor after: Wang Kuojun Inventor before: Li Chenqing Inventor before: Heryi Inventor before: Wang Kuojun |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200324 |