KR101485117B1 - 전자부품 - Google Patents

전자부품 Download PDF

Info

Publication number
KR101485117B1
KR101485117B1 KR1020137016378A KR20137016378A KR101485117B1 KR 101485117 B1 KR101485117 B1 KR 101485117B1 KR 1020137016378 A KR1020137016378 A KR 1020137016378A KR 20137016378 A KR20137016378 A KR 20137016378A KR 101485117 B1 KR101485117 B1 KR 101485117B1
Authority
KR
South Korea
Prior art keywords
electrode
surface electrode
insulating substrate
external
electrodes
Prior art date
Application number
KR1020137016378A
Other languages
English (en)
Korean (ko)
Other versions
KR20130115314A (ko
Inventor
카즈오 핫토리
타다테루 야마다
이사무 후지모토
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Publication of KR20130115314A publication Critical patent/KR20130115314A/ko
Application granted granted Critical
Publication of KR101485117B1 publication Critical patent/KR101485117B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020137016378A 2010-12-28 2011-12-27 전자부품 KR101485117B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2010-291413 2010-12-28
JP2010291413 2010-12-28
JP2011121174 2011-05-31
JPJP-P-2011-121174 2011-05-31
PCT/JP2011/080164 WO2012090986A1 (ja) 2010-12-28 2011-12-27 電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020147020944A Division KR101476391B1 (ko) 2010-12-28 2011-12-27 전자부품

Publications (2)

Publication Number Publication Date
KR20130115314A KR20130115314A (ko) 2013-10-21
KR101485117B1 true KR101485117B1 (ko) 2015-01-21

Family

ID=46383080

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020137016378A KR101485117B1 (ko) 2010-12-28 2011-12-27 전자부품
KR1020147020944A KR101476391B1 (ko) 2010-12-28 2011-12-27 전자부품

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147020944A KR101476391B1 (ko) 2010-12-28 2011-12-27 전자부품

Country Status (4)

Country Link
JP (2) JP5376069B2 (ja)
KR (2) KR101485117B1 (ja)
CN (2) CN103299382B (ja)
WO (1) WO2012090986A1 (ja)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5655818B2 (ja) * 2012-06-12 2015-01-21 株式会社村田製作所 チップ部品構造体
WO2013187186A1 (ja) 2012-06-14 2013-12-19 株式会社 村田製作所 電子部品及びその製造方法
JP5532087B2 (ja) * 2012-08-06 2014-06-25 株式会社村田製作所 実装構造
JP5888281B2 (ja) * 2012-08-10 2016-03-16 株式会社村田製作所 実装ランド構造体及び積層コンデンサの実装構造体
JP6014581B2 (ja) * 2013-02-18 2016-10-25 太陽誘電株式会社 インターポーザ付き積層セラミックコンデンサと、積層セラミックコンデンサ用インターポーザ
JP5725062B2 (ja) 2013-03-15 2015-05-27 株式会社村田製作所 電子部品、それに含まれる基板型の端子、および、電子部品の実装構造
JP5794256B2 (ja) * 2013-03-19 2015-10-14 株式会社村田製作所 電子部品および電子部品連
JP5803997B2 (ja) * 2013-07-23 2015-11-04 株式会社村田製作所 電子部品の製造方法
JP5803998B2 (ja) 2013-07-23 2015-11-04 株式会社村田製作所 電子部品の製造方法及び基板型の端子の製造方法
KR101525689B1 (ko) * 2013-11-05 2015-06-03 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
KR101525696B1 (ko) 2013-11-14 2015-06-03 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
KR101514565B1 (ko) 2013-11-14 2015-04-22 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
JP6248644B2 (ja) * 2014-01-17 2017-12-20 Tdk株式会社 電子部品
KR20150089277A (ko) * 2014-01-27 2015-08-05 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
JP6011573B2 (ja) 2014-03-24 2016-10-19 株式会社村田製作所 電子部品
JP6024693B2 (ja) 2014-03-24 2016-11-16 株式会社村田製作所 電子部品
KR101963273B1 (ko) * 2014-09-18 2019-03-28 삼성전기주식회사 인터포저, 인터포저를 포함하는 전자 부품 및 인터포저를 포함하는 전자 부품의 실장 기판
JP2016072603A (ja) * 2014-09-26 2016-05-09 株式会社村田製作所 電子部品
US9997295B2 (en) * 2014-09-26 2018-06-12 Murata Manufacturing Co., Ltd. Electronic component
JP6379996B2 (ja) * 2014-10-24 2018-08-29 株式会社村田製作所 電子部品、回路モジュール及び回路基板
KR102139763B1 (ko) * 2015-01-08 2020-07-31 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
KR102214642B1 (ko) * 2015-01-20 2021-02-10 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
JP2017005221A (ja) * 2015-06-16 2017-01-05 株式会社村田製作所 複合電子部品
KR102004804B1 (ko) 2017-08-28 2019-07-29 삼성전기주식회사 복합 전자부품, 그 실장 기판
KR102463337B1 (ko) * 2017-09-20 2022-11-04 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
KR102538906B1 (ko) 2017-09-27 2023-06-01 삼성전기주식회사 복합 전자부품 및 그 실장 기판
KR102516765B1 (ko) * 2017-09-27 2023-03-31 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
KR102426211B1 (ko) 2017-10-02 2022-07-28 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
KR102473414B1 (ko) 2017-10-12 2022-12-02 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
US10892212B2 (en) * 2017-11-09 2021-01-12 Stmicroelectronics, Inc. Flat no-lead package with surface mounted structure
CN108257878A (zh) * 2018-01-11 2018-07-06 郑州云海信息技术有限公司 一种增强qfn封装焊接效果的方法及qfn封装
KR102609148B1 (ko) * 2018-02-13 2023-12-05 삼성전기주식회사 전자 부품 및 그 실장 기판
KR102505433B1 (ko) 2018-04-20 2023-03-03 삼성전기주식회사 전자 부품
CN108831871A (zh) * 2018-06-08 2018-11-16 郑州云海信息技术有限公司 一种提升qfn封装零件焊接质量的设计方法
KR102538898B1 (ko) * 2018-06-08 2023-06-01 삼성전기주식회사 전자 부품
KR20190121179A (ko) 2018-09-13 2019-10-25 삼성전기주식회사 전자 부품
KR102032759B1 (ko) 2018-09-14 2019-10-17 삼성전기주식회사 전자 부품
KR102584973B1 (ko) 2018-09-28 2023-10-05 삼성전기주식회사 복합 전자부품
CN113303033B (zh) * 2019-01-28 2024-02-13 三菱电机株式会社 基板组件以及空气调和装置
KR102109639B1 (ko) * 2019-06-07 2020-05-12 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
KR102283080B1 (ko) 2019-12-30 2021-07-30 삼성전기주식회사 전자 부품
JP2021174837A (ja) * 2020-04-23 2021-11-01 株式会社村田製作所 積層セラミックコンデンサ
JP2022061645A (ja) * 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323959A (ja) 1999-05-14 2000-11-24 Murata Mfg Co Ltd 圧電部品
JP2005130341A (ja) 2003-10-27 2005-05-19 Murata Mfg Co Ltd 圧電部品及びその製造方法、通信装置
WO2010134335A1 (ja) 2009-05-19 2010-11-25 ルビコン株式会社 表面実装用のデバイスおよびコンデンサー素子

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62184727U (ja) * 1986-05-15 1987-11-24
JPS62186462U (ja) * 1986-05-20 1987-11-27
JPS63187320U (ja) * 1987-05-22 1988-11-30
JPH01155668U (ja) * 1988-04-19 1989-10-25
JPH0677631A (ja) * 1992-08-28 1994-03-18 Matsushita Electric Ind Co Ltd チップ部品のアルミ基板への実装方法
JPH06132763A (ja) * 1992-10-20 1994-05-13 Rohm Co Ltd 圧電発振子
JPH06151231A (ja) * 1992-10-29 1994-05-31 Toshiba Lighting & Technol Corp 電気部品
JP3070364B2 (ja) * 1992-11-25 2000-07-31 松下電器産業株式会社 セラミック電子部品の製造方法
JP2716342B2 (ja) * 1993-06-28 1998-02-18 日本電気株式会社 チップ型積層セラミックコンデンサ
JPH07111380A (ja) * 1993-10-14 1995-04-25 Murata Mfg Co Ltd 表面実装用電子部品
JPH08222478A (ja) * 1995-02-16 1996-08-30 Murata Mfg Co Ltd チップ型電子部品
JP3061031B2 (ja) * 1998-04-17 2000-07-10 日立エーアイシー株式会社 プリント配線基板
JP2000012367A (ja) * 1998-06-19 2000-01-14 Sony Corp 電子チップ部品およびその製造方法
US7307829B1 (en) * 2002-05-17 2007-12-11 Daniel Devoe Integrated broadband ceramic capacitor array
JP4827157B2 (ja) * 2002-10-08 2011-11-30 Ｔｄｋ株式会社 電子部品
JP2004335657A (ja) * 2003-05-06 2004-11-25 Tdk Corp 底面電極チップ部品の表面実装用ランドパターン、表面実装方法、緩衝基板及び電子部品
WO2005072033A1 (ja) * 2004-01-27 2005-08-04 Matsushita Electric Industrial Co., Ltd. 回路基板およびチップ部品実装方法
JP4562516B2 (ja) * 2004-12-24 2010-10-13 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2006186167A (ja) * 2004-12-28 2006-07-13 Tdk Corp 電子部品
US8174116B2 (en) * 2007-08-24 2012-05-08 Nec Corporation Spacer, and its manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323959A (ja) 1999-05-14 2000-11-24 Murata Mfg Co Ltd 圧電部品
JP2005130341A (ja) 2003-10-27 2005-05-19 Murata Mfg Co Ltd 圧電部品及びその製造方法、通信装置
WO2010134335A1 (ja) 2009-05-19 2010-11-25 ルビコン株式会社 表面実装用のデバイスおよびコンデンサー素子

Also Published As

Publication number Publication date
KR101476391B1 (ko) 2014-12-24
JP5376069B2 (ja) 2013-12-25
KR20140107622A (ko) 2014-09-04
JP2014042037A (ja) 2014-03-06
KR20130115314A (ko) 2013-10-21
JP5725112B2 (ja) 2015-05-27
CN107240496A (zh) 2017-10-10
JPWO2012090986A1 (ja) 2014-06-05
WO2012090986A1 (ja) 2012-07-05
CN107240496B (zh) 2019-06-07
CN103299382A (zh) 2013-09-11
CN103299382B (zh) 2017-05-24

Similar Documents

Publication Publication Date Title
KR101485117B1 (ko) 전자부품
US9552923B2 (en) Electronic component
US9241408B2 (en) Electronic component
KR101506256B1 (ko) 칩 부품 구조체 및 제조방법
US9042114B2 (en) Electronic component
JP5126379B2 (ja) チップ部品構造体
US9620288B2 (en) Chip-component structure
KR101552247B1 (ko) 실장 랜드 구조체 및 적층 콘덴서의 실장 구조체
JP6694235B2 (ja) 電子部品
JP5532087B2 (ja) 実装構造
JP5459368B2 (ja) チップ部品構造体
JP2002353071A (ja) 複合電子部品及びその製造方法
US7218002B2 (en) Electronic device and intermediate product of electronic device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
A107 Divisional application of patent
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180105

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190107

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20200103

Year of fee payment: 6