KR101473091B1 - 기판 검사 장치 및 기판 검사 방법 - Google Patents
기판 검사 장치 및 기판 검사 방법 Download PDFInfo
- Publication number
- KR101473091B1 KR101473091B1 KR1020130022758A KR20130022758A KR101473091B1 KR 101473091 B1 KR101473091 B1 KR 101473091B1 KR 1020130022758 A KR1020130022758 A KR 1020130022758A KR 20130022758 A KR20130022758 A KR 20130022758A KR 101473091 B1 KR101473091 B1 KR 101473091B1
- Authority
- KR
- South Korea
- Prior art keywords
- etching
- substrate
- inspection
- simulation
- data
- Prior art date
Links
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012123842A JP5826707B2 (ja) | 2012-05-31 | 2012-05-31 | 基板検査装置および基板検査方法 |
JPJP-P-2012-123842 | 2012-05-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130135037A KR20130135037A (ko) | 2013-12-10 |
KR101473091B1 true KR101473091B1 (ko) | 2014-12-15 |
Family
ID=49736893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130022758A KR101473091B1 (ko) | 2012-05-31 | 2013-03-04 | 기판 검사 장치 및 기판 검사 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5826707B2 (ja) |
KR (1) | KR101473091B1 (ja) |
CN (1) | CN103454286B (ja) |
TW (1) | TWI612294B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6342738B2 (ja) * | 2014-07-24 | 2018-06-13 | 株式会社Screenホールディングス | データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム |
JP2016072335A (ja) * | 2014-09-29 | 2016-05-09 | 株式会社Screenホールディングス | プロセス監視装置およびプロセス監視方法 |
JP2016070730A (ja) * | 2014-09-29 | 2016-05-09 | 株式会社Screenホールディングス | 画像取得装置および画像取得方法 |
JP6342304B2 (ja) * | 2014-11-12 | 2018-06-13 | 株式会社Screenホールディングス | データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム |
JP6496159B2 (ja) * | 2015-02-23 | 2019-04-03 | 株式会社Screenホールディングス | パターン検査装置およびパターン検査方法 |
CN106019851B (zh) * | 2015-03-30 | 2018-05-25 | 株式会社思可林集团 | 基准位置获取方法、基准位置获取装置、图案描绘方法、图案描绘装置、以及记录程序的记录媒体 |
JP6466797B2 (ja) | 2015-07-24 | 2019-02-06 | 株式会社Screenホールディングス | データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム |
JP6466277B2 (ja) * | 2015-07-27 | 2019-02-06 | 株式会社Screenホールディングス | データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム |
KR102595300B1 (ko) * | 2016-07-04 | 2023-10-31 | 삼성전자주식회사 | 검사 방법 및 시스템, 및 이를 이용한 반도체 패키지의 제조 방법 |
JP7280068B2 (ja) * | 2019-03-12 | 2023-05-23 | 株式会社Screenホールディングス | 検査装置および検査方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06109446A (ja) * | 1992-09-30 | 1994-04-19 | Matsushita Electric Ind Co Ltd | 配線パターン検査装置 |
US20020131040A1 (en) * | 2001-01-26 | 2002-09-19 | Xinhui Niu | System and method for characterizing macro-grating test patterns in advanced lithography and etch processes |
JP2006265641A (ja) * | 2005-03-24 | 2006-10-05 | Furukawa Electric Co Ltd:The | エッチング・シミュレーション方法及びエッチング・シミュレーション装置 |
JP2011203343A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | パターン検査方法及び半導体装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2942171B2 (ja) * | 1995-06-09 | 1999-08-30 | 大日本スクリーン製造株式会社 | プリント基板のパターン検査装置 |
JP4274784B2 (ja) * | 2002-05-28 | 2009-06-10 | 新光電気工業株式会社 | 配線形成システムおよびその方法 |
US7053355B2 (en) * | 2003-03-18 | 2006-05-30 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
US7488933B2 (en) * | 2005-08-05 | 2009-02-10 | Brion Technologies, Inc. | Method for lithography model calibration |
WO2008047422A1 (fr) * | 2006-10-18 | 2008-04-24 | Casio Micronics Co., Ltd. | Procédé pour inspecter un schéma de câblages et système conçu à cet effet |
US8103979B2 (en) * | 2008-10-20 | 2012-01-24 | Advanced Micro Devices, Inc. | System for generating and optimizing mask assist features based on hybrid (model and rules) methodology |
WO2010117626A2 (en) * | 2009-03-31 | 2010-10-14 | Christophe Pierrat | Lithography modelling and applications |
JP5297930B2 (ja) * | 2009-07-29 | 2013-09-25 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
-
2012
- 2012-05-31 JP JP2012123842A patent/JP5826707B2/ja not_active Expired - Fee Related
-
2013
- 2013-03-04 KR KR1020130022758A patent/KR101473091B1/ko active IP Right Grant
- 2013-03-25 CN CN201310097215.5A patent/CN103454286B/zh not_active Expired - Fee Related
- 2013-03-26 TW TW102110570A patent/TWI612294B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06109446A (ja) * | 1992-09-30 | 1994-04-19 | Matsushita Electric Ind Co Ltd | 配線パターン検査装置 |
US20020131040A1 (en) * | 2001-01-26 | 2002-09-19 | Xinhui Niu | System and method for characterizing macro-grating test patterns in advanced lithography and etch processes |
JP2006265641A (ja) * | 2005-03-24 | 2006-10-05 | Furukawa Electric Co Ltd:The | エッチング・シミュレーション方法及びエッチング・シミュレーション装置 |
JP2011203343A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | パターン検査方法及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201348696A (zh) | 2013-12-01 |
TWI612294B (zh) | 2018-01-21 |
JP5826707B2 (ja) | 2015-12-02 |
CN103454286A (zh) | 2013-12-18 |
CN103454286B (zh) | 2016-08-03 |
JP2013250101A (ja) | 2013-12-12 |
KR20130135037A (ko) | 2013-12-10 |
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